JP2011155108A - Light irradiation device - Google Patents
Light irradiation device Download PDFInfo
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- JP2011155108A JP2011155108A JP2010015218A JP2010015218A JP2011155108A JP 2011155108 A JP2011155108 A JP 2011155108A JP 2010015218 A JP2010015218 A JP 2010015218A JP 2010015218 A JP2010015218 A JP 2010015218A JP 2011155108 A JP2011155108 A JP 2011155108A
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- mask
- rod
- light
- support frame
- holding means
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- 239000000758 substrate Substances 0.000 description 21
- 239000004973 liquid crystal related substance Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0275—Photolithographic processes using lasers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
Abstract
Description
本発明は、光照射装置に係わり、特に、半導体、プリント基板、液晶基板等のパターン形成に用いられる露光装置や、液晶パネル等のパネルを貼り合せる貼り合せ装置などにおいて、マスク保持手段に保持されたマスクを介して被照射物に光を照射する光照射装置に関する。 The present invention relates to a light irradiation apparatus, and in particular, is held by a mask holding means in an exposure apparatus used for pattern formation of a semiconductor, a printed circuit board, a liquid crystal substrate or the like, or a bonding apparatus for bonding a panel such as a liquid crystal panel. The present invention relates to a light irradiation apparatus that irradiates an object to be irradiated with light through a mask.
半導体、プリント基板、液晶基板等を製造するための露光工程において、パターンを形成したマスクを介して紫外線（露光光）を含む光を照射し、マスクパターンをワークに転写する露光装置が用いられる。このような露光装置として、マスクとワークを接近させてマスクパターンをワーク上に転写するプロキシミティ露光装置がある。また、液晶パネルを貼り合せる貼り合せ装置においても、プロキシミティ露光装置を利用した貼り合せが行われている。 In an exposure process for manufacturing a semiconductor, a printed circuit board, a liquid crystal substrate, and the like, an exposure apparatus is used that irradiates light including ultraviolet rays (exposure light) through a mask on which a pattern is formed, and transfers the mask pattern onto a workpiece. As such an exposure apparatus, there is a proximity exposure apparatus that moves a mask pattern onto a work by bringing the mask and the work close to each other. Also, in a bonding apparatus for bonding a liquid crystal panel, bonding using a proximity exposure apparatus is performed.
例えば、液晶パネルの貼り合せには次のような方法が採られる。まず、光透過性基板上に、光（紫外線）硬化樹脂であるシール剤の囲みを形成し、その中に液晶を滴下する。次に、その上に、もう１枚の光透過性基板を載せ、光透過性基板越しに、紫外線を含む光をシール剤に照射する。これにより、２枚の光透過性基板が貼り合わされる。液晶は紫外線が照射されると特性変化を起こすため、シール部以外には紫外線が照射されないように、シール部以外の部分を遮光したマスクを用い、遮光マスクを介して、遮光マスクと貼り合せを行う光透過性基板を近接させて光（紫外線）を照射する。 For example, the following method is used for bonding the liquid crystal panels. First, an enclosure of a sealing agent that is a light (ultraviolet) curable resin is formed on a light-transmitting substrate, and liquid crystal is dropped therein. Next, another light-transmitting substrate is placed thereon, and light containing ultraviolet rays is irradiated onto the sealing agent through the light-transmitting substrate. As a result, the two light transmissive substrates are bonded together. Since the liquid crystal changes its characteristics when irradiated with ultraviolet rays, use a mask that shields the part other than the seal part so that it is not irradiated with ultraviolet light. Light (ultraviolet rays) is irradiated with the light transmitting substrate to be brought close to the substrate.
ところで、近年では、液晶基板は１辺が２ｍを超えるものもあり年々大型化している。このような液晶基板を貼り合せるための光照射は、基板全体を一括して行われる。そのため、上記の遮光マスクも基板に応じて大型化している。 By the way, in recent years, the size of liquid crystal substrates has been increasing year by year, with one side exceeding 2 m. The light irradiation for bonding such a liquid crystal substrate is performed on the whole substrate collectively. For this reason, the above-described light-shielding mask is also enlarged according to the substrate.
従来、マスクは、その周辺部をマスクステージにより保持して使用される。しかし、マスクが大型化すると、自重によるたわみが発生し、露光精度に悪い影響を与える。そこで、マスクが大型化してもたわむことなく保持するために、マスクの全面を光透過性のマスク保持手段で保持することが、例えば、特許文献１に記載されている。また、特許文献２や特許文献３には、液晶パネルの貼り合せ装置において、光透過性のマスク保持手段を用い、マスクを全面で吸着することによりたわむことなく保持する構造が開示されている。 Conventionally, a mask is used with its peripheral part held by a mask stage. However, when the mask becomes larger, deflection due to its own weight occurs, which adversely affects exposure accuracy. Therefore, for example, Patent Document 1 describes that the entire surface of the mask is held by a light-transmitting mask holding means in order to hold the mask without being bent even when the mask is enlarged. Patent Documents 2 and 3 disclose a structure in which a light-transmitting mask holding unit is used in a liquid crystal panel bonding apparatus to hold the mask without being bent by adsorbing the entire surface.
マスク保持手段により、マスクを保持すれば、マスクには、従来のようにマスクをマスクステージに取り付ける（保持する）ための保持しろを設ける必要がない。そのため、マスクを、露光する基板（ワーク）と同程度にまで小型化することができる。特に、液晶パネルの貼り合せ装置においては、マスクを製作する基板材料として液晶パネル基板を転用し、コストダウンを図ることができる。 If the mask is held by the mask holding means, it is not necessary to provide a holding margin for attaching (holding) the mask to the mask stage as in the prior art. Therefore, the mask can be downsized to the same extent as the substrate (workpiece) to be exposed. In particular, in a liquid crystal panel bonding apparatus, a liquid crystal panel substrate can be diverted as a substrate material for manufacturing a mask, thereby reducing costs.
上記したように、液晶基板は年々大型化し、最近は、例えば、２２００ｍｍ×２５００ｍｍからそれ以上の大きさのものも使用されるようになってきた。このように基板が大型化すると、その分マスクも大型化し、マスクを保持するための光透過性のマスク保持手段も大型化する。光透過性のマスク保持手段は、具体的には、１枚の大きなガラスである。マスクのたわみを許容範囲（例えば２ｍｍ以下）に保つためには、マスク保持手段の自重たわみも上記許容範囲（２ｍｍ）以下に保たなければならない。したがって、上記のような大きさでマスク保持手段を製作すると、厚さは約２０ｍｍ、重量は３００ｋｇ以上になる。つまり、マスク保持手段を製作するコストは高価となり、これを搭載する装置の重量が重くなる。また、今後も液晶基板の大型化によるマスクの大型化が予想されるが、今以上の大きさのマスク保持手段は、製作自体が困難である。 As described above, the liquid crystal substrate has become larger year by year, and recently, for example, a substrate having a size of 2200 mm × 2500 mm or more has been used. Thus, when the substrate is enlarged, the mask is also enlarged correspondingly, and the light-transmitting mask holding means for holding the mask is also enlarged. Specifically, the light-transmitting mask holding means is one large glass. In order to keep the deflection of the mask within a permissible range (for example, 2 mm or less), the self-weight deflection of the mask holding means must be kept within the permissible range (2 mm). Therefore, when the mask holding means is manufactured in the above size, the thickness is about 20 mm and the weight is 300 kg or more. That is, the cost for manufacturing the mask holding means is expensive, and the weight of the apparatus on which the mask holding means is mounted increases. In the future, it is expected that the size of the mask will be increased due to the increase in the size of the liquid crystal substrate.
本発明の目的は、上記の問題点に鑑み、安価で、できるだけ装置重量を重くしないマスク保持手段を製作すると共に、今後大型化するであろうマスクも保持することのできるマスク保持手段を備えた光照射装置を提供することにある。 In view of the above problems, the object of the present invention is to manufacture a mask holding means that is inexpensive and does not increase the weight of the apparatus as much as possible, and has a mask holding means that can hold a mask that will increase in size in the future. The object is to provide a light irradiation device.
本発明は、上記の課題を解決するために、次のような手段を採用した。
第１の手段は、パターンが形成されたマスクを、光透過性のマスク保持手段により吸着保持し、光照射部から出射する光を、前記マスクを介して被照射物に照射する光照射装置において、前記マスク保持手段は、マスクの一方の長さよりも長く、下表面にマスクを吸着保持するための真空吸着溝または真空吸着孔が形成された、光透過性の棒状部材と、前記棒状部材を下から支持する支持フレームとを備えていることを特徴とする光照射装置である。
第２の手段は、第１の手段において、前記棒状部材は、断面の高さが幅よりも長いことを特徴とする光照射装置である。
第３の手段は、第１の手段または第２の手段において、前記棒状部材は、前記支持フレームに取付けられた位置決め部材により位置決めされて前記支持フレームに支持されており、前記位置決め部材は前記棒状部材が上方向に移動することを規制しないことを特徴とする光照射装置である。
第４の手段は、第３の手段において、前記位置決め部材は、前記支持フレーム上で水平方向への位置が可変可能に取付けられていることを特徴とする光照射装置である。
The present invention employs the following means in order to solve the above problems.
The first means is a light irradiation apparatus that sucks and holds a mask on which a pattern is formed by a light transmissive mask holding means, and irradiates an object to be irradiated with light emitted from a light irradiation section through the mask. The mask holding means includes a light-transmitting rod-like member having a vacuum suction groove or vacuum suction hole formed on the lower surface, which is longer than one length of the mask, and for holding the mask by suction, and the rod-like member. It is a light irradiation apparatus provided with the support frame supported from the bottom.
The second means is the light irradiating apparatus according to the first means, wherein the bar-like member has a cross-sectional height longer than a width.
According to a third means, in the first means or the second means, the rod-like member is positioned by a positioning member attached to the support frame and supported by the support frame, and the positioning member is the rod-like member. It is a light irradiation apparatus characterized by not restrict | limiting a member moving to an upward direction.
A fourth means is the light irradiation apparatus according to the third means, wherein the positioning member is mounted on the support frame such that the position in the horizontal direction is variable.
請求項１記載の発明によれば、マスク保持手段を棒状部材で構成してマスクを保持するので、マスク保持手段は軽量化され、光照射装置の製作のコストも安価になる。
請求項２記載の発明によれば、棒状部材の自重によるたわみを少なくすることができる。
請求項３記載の発明によれば、棒状部材は、上方向の移動は規制されていないので、マスクを棒状部材の下面に、下面側から接近させて保持させる時、棒状部材を持上げることができるため、マスクを棒状部材の下面全体にわたって密着させることができるので、棒状部材はマスクを確実に吸着保持することができる。
請求項４記載の発明によれば、棒状部材を位置決めする位置決め部材は、水平方向に位置が変えられるので、光を効率よく透過させたい位置に棒状部材が来る場合は、棒状部材の位置を微調整することができる。
According to the first aspect of the present invention, since the mask holding means is constituted by a rod-like member to hold the mask, the mask holding means is reduced in weight and the manufacturing cost of the light irradiation device is reduced.
According to the second aspect of the present invention, it is possible to reduce the deflection due to the weight of the rod-shaped member.
According to the invention described in claim 3, since the upward movement of the rod-shaped member is not restricted, the rod-shaped member can be lifted when the mask is held close to the lower surface of the rod-shaped member from the lower surface side. Since it can do, since a mask can be stuck to the whole lower surface of a rod-shaped member, a rod-shaped member can adsorb-hold a mask reliably.
According to the fourth aspect of the present invention, the position of the positioning member for positioning the rod-shaped member can be changed in the horizontal direction. Can be adjusted.
本発明の一実施形態を図１〜図１０を用いて説明する。
図１は、本発明に係るマスク保持手段を備えた光照射装置の概略構成を示す図である。
同図に示すように、光を出射する光照射部１の内部には、紫外線を含む光を放射する複数の棒状のランプ２と、ランプ２から放射される光を反射する反射ミラー３とを備える。マスク保持手段４は、図２において詳述する光透過性の複数の棒状部材４１と、複数の棒状部材４１を支持する支持フレーム４４とを備える。マスク保持手段４の継手４３には、配管７が接続される。配管７には真空源である真空ポンプ９とエアー源である圧縮エアー供給源１０とが、切換えバルブ１１を介して接続される。管路７への真空とエアーの供給は、切換えバルブ１１により切り換えて行う。真空は、配管７から、継手４３を介して各棒状部材４１の下側表面に形成されている真空吸着溝４２に供給され、棒状部材４１の下面にマスク５が保持される。マスク５には露光を行うパターンが形成されている。マスク５をマスク保持手段４の棒状部材４１から取り外す場合は、切換えバルブ１１を切換え、配管７にエアーを供給することによって行う。
An embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a diagram showing a schematic configuration of a light irradiation apparatus provided with a mask holding means according to the present invention.
As shown in the figure, a light irradiation unit 1 that emits light includes a plurality of rod-shaped lamps 2 that emit light including ultraviolet rays, and a reflection mirror 3 that reflects light emitted from the lamp 2. Prepare. The mask holding means 4 includes a plurality of light transmissive rod-like members 41 described in detail in FIG. 2 and a support frame 44 that supports the plurality of rod-like members 41. A pipe 7 is connected to the joint 43 of the mask holding means 4. A vacuum pump 9 as a vacuum source and a compressed air supply source 10 as an air source are connected to the pipe 7 via a switching valve 11. Supply of vacuum and air to the pipe line 7 is switched by a switching valve 11. The vacuum is supplied from the pipe 7 to the vacuum suction groove 42 formed on the lower surface of each bar member 41 through the joint 43, and the mask 5 is held on the lower surface of the bar member 41. A pattern for performing exposure is formed on the mask 5. When removing the mask 5 from the rod-shaped member 41 of the mask holding means 4, the switching valve 11 is switched and air is supplied to the pipe 7.
ワークステージ６には、被照射物としての光照射が行なわれるワークＷが載置される。ワークステージ６の表面には、ワークＷを保持するための真空吸着溝（不図示）が形成されており、真空ポンプ（不図示）から真空が供給される。ワークステージ６には、ワークステージ移動機構８が取り付けられており、制御部（不図示）からの指令信号により、ワークステージ６は、マスク５に対して接近したり離間したりする方向（図面上下方向）に移動する。ワークステージ移動機構８は、後述するように、ワークステージ６上に置いたマスク５をマスク保持手段４に取り付けるためにワークステージ６を上昇させる際、また、マスク５とワークＷの間隔をあらかじめ設定された値にして光照射処理を行う際などに動作する。光照射部１から出射した光は、マスク５を介してワークステージ６上のワークＷに照射されるが、光透過性の棒状部材４１を通過した後マスク５を介してワークＷに照射される成分もある。ワークＷは、例えば、貼り合わせを行なう液晶パネルであり、２枚のガラス基板の間に形成された、光（紫外線）硬化樹脂であるシール剤の囲みの中に液晶が挟みこまれている。シール剤に紫外線を含む光をマスク５の光透過部５１を介して照射することにより、樹脂が硬化し２枚のガラス基板が貼り合わされる。マスク５には、光照射時、紫外線が液晶に照射されると特性変化起こすので、シール部以外に紫外線が照射されないように遮光部５２が形成されている。 A workpiece W to be irradiated with light as an object to be irradiated is placed on the workpiece stage 6. A vacuum suction groove (not shown) for holding the workpiece W is formed on the surface of the work stage 6, and a vacuum is supplied from a vacuum pump (not shown). A work stage moving mechanism 8 is attached to the work stage 6, and the work stage 6 moves toward and away from the mask 5 according to a command signal from a control unit (not shown) (up and down in the drawing). Direction). As will be described later, the work stage moving mechanism 8 sets the interval between the mask 5 and the work W in advance when the work stage 6 is lifted to attach the mask 5 placed on the work stage 6 to the mask holding means 4. It operates when the light irradiation process is performed with the set value. The light emitted from the light irradiation unit 1 is applied to the work W on the work stage 6 through the mask 5, but is applied to the work W through the mask 5 after passing through the light-transmitting rod-like member 41. There are also ingredients. The workpiece W is, for example, a liquid crystal panel for bonding, and a liquid crystal is sandwiched between a sealing agent that is a light (ultraviolet) curable resin formed between two glass substrates. By irradiating the sealant with light containing ultraviolet rays through the light transmitting portion 51 of the mask 5, the resin is cured and the two glass substrates are bonded together. The mask 5 is formed with a light-shielding portion 52 so that ultraviolet rays are not irradiated except for the seal portion because the characteristics change when the liquid crystal is irradiated with the ultraviolet rays during the light irradiation.
図２（ａ）は、図１に示したマスク保持手段４の構成を示す斜視図、図２（ｂ）は、図２（ａ）のＡ−Ａから見た棒状部材４１の断面図である。
同図に示すように、棒状部材４１は、光透過性の棒状の部材で、材質は例えば石英であり、下面にはマスク５を保持するための真空を供給する真空吸着溝４２が形成されている。なお、真空吸着溝は真空吸着孔でもよい。継手４３は、棒状部材４１に取り付けられ、真空供給路４５と配管７とを接続する。真空は、継手４３に接続された配管７から、棒状部材４１に形成された真空供給路４５を通って真空吸着溝４２に供給される。
2A is a perspective view showing the configuration of the mask holding means 4 shown in FIG. 1, and FIG. 2B is a cross-sectional view of the rod-like member 41 as seen from AA in FIG. 2A. .
As shown in the figure, the rod-shaped member 41 is a light-transmitting rod-shaped member made of, for example, quartz, and a vacuum suction groove 42 for supplying a vacuum for holding the mask 5 is formed on the lower surface. Yes. The vacuum suction groove may be a vacuum suction hole. The joint 43 is attached to the rod-shaped member 41 and connects the vacuum supply path 45 and the pipe 7. The vacuum is supplied from the pipe 7 connected to the joint 43 to the vacuum suction groove 42 through the vacuum supply path 45 formed in the rod-like member 41.
図２（ａ）に示すように、棒状部材４１は複数設けられるが、全ての棒状部材４１に真空吸着溝４２が形成され、各棒状部材４１に配管７が接続され真空が供給される。棒状部材４１は、マスク５の一方の長さ（例えば２ｍ）よりも長く、厚さは自重によるたわみがマスクのたわみの許容範囲内（例えば２ｍｍ以下）になるように設定する。なお、液晶パネルの貼り合せに用いるマスクは通常長方形であり、上記マスクの一方向の長さとは、マスクの短い方の辺の長さ（幅方向の長さ）のことを示すことが多い。図２（ｂ）に示すように、棒状部材の断面寸法は、例えば、高さは約３２ｍｍ、幅は約３０ｍｍである。このように、棒状部材４１の自重によるたわみを少なくするために、断面の高さ方向の寸法は、幅方向の寸法よりも長いことが望ましい。 As shown in FIG. 2A, a plurality of rod-like members 41 are provided, but the vacuum suction grooves 42 are formed in all the rod-like members 41, and the pipe 7 is connected to each rod-like member 41 to supply a vacuum. The rod-shaped member 41 is longer than one length (for example, 2 m) of the mask 5, and the thickness is set so that the deflection due to its own weight is within an allowable range of the deflection of the mask (for example, 2 mm or less). Note that the mask used for bonding the liquid crystal panel is usually rectangular, and the length in one direction of the mask often indicates the length of the shorter side of the mask (length in the width direction). As shown in FIG. 2B, the cross-sectional dimensions of the rod-shaped member are, for example, a height of about 32 mm and a width of about 30 mm. Thus, in order to reduce the deflection due to the weight of the rod-like member 41, it is desirable that the dimension in the height direction of the cross section is longer than the dimension in the width direction.
図２（ａ）に示すように、支持フレーム４４は、四角い枠状に形成され、複数の棒状部材４１の両端を下面側から支持する。棒状部材４１は、基本的には支持フレーム４４上に載っている状態にあり、垂直上方向への移動は規制されていない。 As shown in FIG. 2A, the support frame 44 is formed in a square frame shape, and supports both ends of the plurality of rod-like members 41 from the lower surface side. The rod-shaped member 41 is basically in a state of being placed on the support frame 44, and movement in the vertical upward direction is not restricted.
図３は、棒状部材４１が、支持フレーム４４上に支持され、位置決め部材４６によって位置決めされる状態を拡大して示した斜視図である。
同図に示すように、棒状部材４１の端部は、支持フレーム４４と位置決め部材４６によって形成された凹部４７に嵌め込まれている。凹部４７の大きさは棒状部材４１の幅に応じて形成する。位置決め部材４６は支持フレーム４４にねじ４８により固定される。棒状部材４１は凹部４７に嵌り込むことによって、水平方向の移動が規制され、支持フレーム４５上での水平方向の位置が決まる。また棒状部材４１が位置ずれを起こして支持フレーム４４から落下することも防ぐ。なお、位置決め部材４６は、上記のように棒状部材４１の水平方向の移動は規制するが、上方向（垂直方向）の移動は規制しない。
FIG. 3 is an enlarged perspective view showing a state in which the rod-like member 41 is supported on the support frame 44 and positioned by the positioning member 46.
As shown in the figure, the end of the rod-shaped member 41 is fitted in a recess 47 formed by a support frame 44 and a positioning member 46. The size of the recess 47 is formed according to the width of the rod-shaped member 41. The positioning member 46 is fixed to the support frame 44 with screws 48. When the rod-like member 41 is fitted into the recess 47, the horizontal movement is restricted, and the horizontal position on the support frame 45 is determined. Further, the rod-like member 41 is prevented from being displaced from the support frame 44 due to a positional shift. The positioning member 46 restricts the horizontal movement of the rod-like member 41 as described above, but does not restrict the upward (vertical) movement.
露光を行うパターンが形成されたマスク５は、棒状部材４１の下面に真空吸着保持され、マスク５は棒状部材４１に吸着保持されると、支持フレーム４５の四角い枠の中に収まるような形になる。上記したように、棒状部材４１の長さはマスク５の一方の長さよりも長いので、棒状部材４１はマスク５を横断して保持する。図２（ａ）においては、棒状部材４１は３本の場合を示しているが、棒状部材４１の本数や間隔は、保持されたマスク５の自重たわみが許容範囲（例えば２ｍｍ以下）になるように設計する。実際には、マスク５の１辺が２ｍ以上になると、棒状部材４１の本数は８本からそれ以上必要となる。 The mask 5 on which the pattern to be exposed is formed is vacuum-sucked and held on the lower surface of the rod-like member 41. When the mask 5 is sucked and held on the rod-like member 41, the mask 5 fits into the square frame of the support frame 45. Become. As described above, since the length of the bar-shaped member 41 is longer than one length of the mask 5, the bar-shaped member 41 is held across the mask 5. In FIG. 2A, the number of the rod-shaped members 41 is three, but the number and interval of the rod-shaped members 41 are such that the deflection of the held mask 5 is within an allowable range (for example, 2 mm or less). To design. Actually, when one side of the mask 5 is 2 m or more, the number of the rod-shaped members 41 is required from eight to more.
上記したように、棒状部材４１は光透過性の、例えば、石英であるが、棒状部材４１が存在する位置と存在しない位置とでは、多少マスク５から出射した光の量が変化する。マスク５から出射する光量の変化は、棒状部材４１がマスク５の遮光部５２が形成されている位置にある場合は特に問題にならないが、棒状部材４１がマスク５の光透過部５１の上になることも考えられる。そのため、棒状部材４１の位置を、マスク５のたわみ量に影響を与えない範囲でずらせるようにしておく。そのために、図３に示すように、位置決め部材４６のねじ４８が通過するねじ孔４９は長孔になっている。これにより、位置決め部材４６は、支持フレーム４４上を多少移動して固定することが可能となり、位置決め部材４６を移動することにより、マスク５に対する棒状部材４１の位置を微調整することができる。 As described above, the rod-shaped member 41 is light transmissive, for example, quartz. However, the amount of light emitted from the mask 5 slightly varies between the position where the rod-shaped member 41 exists and the position where the rod-shaped member 41 does not exist. The change in the amount of light emitted from the mask 5 is not particularly problematic when the rod-shaped member 41 is at the position where the light-shielding portion 52 of the mask 5 is formed, but the rod-shaped member 41 is placed on the light transmitting portion 51 of the mask 5. It is also possible to become. For this reason, the position of the rod-shaped member 41 is shifted in a range that does not affect the amount of deflection of the mask 5. Therefore, as shown in FIG. 3, the screw hole 49 through which the screw 48 of the positioning member 46 passes is a long hole. Thereby, the positioning member 46 can be moved and fixed on the support frame 44 to some extent, and the position of the rod-shaped member 41 with respect to the mask 5 can be finely adjusted by moving the positioning member 46.
図４は、実施例に即した、マスク保持手段４（継手４３、配管７は省略）とワークステージ６との関係を示した斜視図である。
同図において、マスク保持手段４に保持されるマスクは１辺２ｍ以上であり、棒状部材４１は８本設けられる。棒状部材４１の１本の重量は約６ｋｇである。８本合わせても約５０ｋｇであり、従来用いられていた一枚物のガラス板であるマスク保持手段の重量（約３００ｋｇ）に対して約１／６の重量となり、光照射装置全体の軽量化を図ることができる。また、従来のマスクを全面吸着するマスク保持手段は、マスクを保持する面はマスクの大きさである２ｍ四方に渡って平面精度良く加工しなければならず、材料費も含めて製作コストが高価であったが、本願発明によれば、マスク保持手段４が主として棒状部材４１で構成されるので、従来よりも加工が容易となり、また、使用するガラス材料も少なくて済み、製作コストを安価にすることができる。
FIG. 4 is a perspective view showing the relationship between the mask holding means 4 (the joint 43 and the piping 7 are omitted) and the work stage 6 according to the embodiment.
In the figure, the mask held by the mask holding means 4 has a side of 2 m or more, and eight rod-like members 41 are provided. The weight of one rod-shaped member 41 is about 6 kg. The total weight is about 50 kg, which is about 1/6 of the weight of the mask holding means (about 300 kg) that has been used in the past. Can be achieved. In addition, the conventional mask holding means for adsorbing the entire mask has to process the surface holding the mask over a 2 m square, which is the size of the mask, with high planar accuracy, and the manufacturing cost including the material cost is high. However, according to the present invention, since the mask holding means 4 is mainly composed of the rod-like member 41, the processing becomes easier than before, and less glass material is used, and the manufacturing cost is reduced. can do.
次に、マスク保持手段４の棒状部材４１にマスク５を取り付ける工程を図５〜図９を用いて説明する。
まず、図５に示すように、ワークステージ６上に、マスク保持手段４に取り付けるマスク５を置く。マスク保持手段４の各棒状部材４１の真空吸着溝４２には、真空ポンプ９からの真空が供給される。支持フレーム４４により支持されている棒状部材４１には、自重により１ｍｍ〜２ｍｍ程度の許容範囲内のたわみが生じている。
次に、図６に示すように、マスク５を載せたワークステージ６が、ワークステージ移動機構８により上昇する。マスク５は棒状部材４１の下面の一部（自重により最もたわんだ部分）に接触する。しかし、この状態ではマスク５は棒状部材４１には吸着保持されない。
次に、図７に示すように、ワークステージ６を更に上昇させる。上記したように、棒状部材４１は支持フレーム４４に対して上方向の移動は規制されていないので、棒状部材４１はマスク５の上に載った状態で支持フレーム４４から離れ上昇する。上記したように、棒状部材４１は、８本合わせても５０ｋｇである。そのため、ワークステージ移動機構８によって、棒状部材４１を載せた状態でワークステージ６を容易に上昇させることが可能である。棒状部材４１は下面全体をワークステージ６に載ったマスク５により支えられるため、自重によるたわみはなくなる。したがって、棒状部材４１の真空吸着溝４２が形成された下面は、マスク５全面に接触する。これによりマスク５は棒状部材４１により真空吸着保持される。図８は、このときの、棒状部材４１が、位置決め部材４６によって水平方向に位置決めされつつ支持フレーム４４から離間（上昇）している状態を拡大して示した斜視図である。
次に、図９に示すように、ワークステージ６は下降する。これによって、棒状部材４１はマスク５を吸着保持した状態で支持フレーム４４上に載せることができる。
Next, the process of attaching the mask 5 to the rod-shaped member 41 of the mask holding means 4 will be described with reference to FIGS.
First, as shown in FIG. 5, a mask 5 to be attached to the mask holding means 4 is placed on the work stage 6. A vacuum from the vacuum pump 9 is supplied to the vacuum suction groove 42 of each rod-like member 41 of the mask holding means 4. The rod-like member 41 supported by the support frame 44 has a deflection within an allowable range of about 1 mm to 2 mm due to its own weight.
Next, as shown in FIG. 6, the work stage 6 on which the mask 5 is placed is raised by the work stage moving mechanism 8. The mask 5 is in contact with a part of the lower surface of the rod-like member 41 (the most bent part due to its own weight). However, in this state, the mask 5 is not attracted and held by the rod-shaped member 41.
Next, as shown in FIG. 7, the work stage 6 is further raised. As described above, since the upward movement of the bar-shaped member 41 is not restricted with respect to the support frame 44, the bar-shaped member 41 rises away from the support frame 44 while being placed on the mask 5. As described above, the eight rod-like members 41 are 50 kg even if they are combined. Therefore, the work stage 6 can be easily raised by the work stage moving mechanism 8 with the rod-like member 41 placed thereon. Since the rod-like member 41 is supported by the mask 5 mounted on the work stage 6 on the entire lower surface, the deflection due to its own weight is eliminated. Therefore, the lower surface of the rod-shaped member 41 where the vacuum suction groove 42 is formed contacts the entire surface of the mask 5. Thereby, the mask 5 is vacuum-sucked and held by the rod-shaped member 41. FIG. 8 is an enlarged perspective view showing a state in which the rod-like member 41 is separated (raised) from the support frame 44 while being positioned in the horizontal direction by the positioning member 46 at this time.
Next, as shown in FIG. 9, the work stage 6 is lowered. As a result, the rod-like member 41 can be placed on the support frame 44 with the mask 5 held by suction.
ここで、棒状部材４１が支持フレーム４４に対して、上方向への移動が規制されない理由を図１０を用いて説明する。
図１０（ａ）に示すように、棒状部材４１が固定部材Ｘにより、支持フレーム４４に対して上方向の移動が規制されていると、棒状部材４１にマスク５を吸着させる時、棒状部材４１が破損することがある。つまり、図５に示したように、支持フレーム４４上の棒状部材４１は自重によりわずかではあるがたわんでいる。マスク５を吸着させるために、マスク５をワークステージ６に載せた状態で上昇させた時、マスク５は棒状部材４１の下面の一部（自重により最もたわんだ部分）に接触する。しかし、この状態では、図６に示したように、マスク５は棒状部材４１には吸着保持されない。そこで、さらにワークステージ６を上昇させると、図１０（ｂ）に示すように、棒状部材４１はワークステージ６に押されてワークステージ６上のマスク５の平面に沿い、たわみがなくなる。しかし、この時、棒状部材４１の固定部材Ｘにより押さえ付けられた部分には、強い力が加わる。上記したように、棒状部材４１は、例えば石英であり、部分的に強い力が加わると、場合によっては欠けや折れといった破損が生じることがある。これを防ぐためには、図１０（ｃ）に示すように、マスク５とワークステージ６との間にクッションのような弾性部材Ｙを置き、棒状部材４１のたわみに合わせて、マスク５が曲がるようにすることも考えられる。しかし、本発明のように、棒状部材４１が支持フレーム４４に対して上方向（垂直方向）に移動することを規制しないようにしておけば、棒状部材４１の破損の心配はなく、また、マスク５とワークステージ６の間に弾性部材Ｙを配置する必要もなく、マスク５をマスク保持手段４の棒状部材４１に吸着保持させることができる。
Here, the reason why the upward movement of the rod-shaped member 41 with respect to the support frame 44 is not regulated will be described with reference to FIG.
As shown in FIG. 10A, when the upward movement of the rod-shaped member 41 with respect to the support frame 44 is restricted by the fixing member X, the rod-shaped member 41 is used when the mask 5 is adsorbed to the rod-shaped member 41. May be damaged. That is, as shown in FIG. 5, the rod-like member 41 on the support frame 44 is slightly bent due to its own weight. When the mask 5 is raised while being placed on the work stage 6 in order to attract the mask 5, the mask 5 comes into contact with a part of the lower surface of the rod-like member 41 (the most bent part by its own weight). However, in this state, as shown in FIG. 6, the mask 5 is not attracted and held by the rod-shaped member 41. Therefore, when the work stage 6 is further raised, the rod-like member 41 is pushed by the work stage 6 along the plane of the mask 5 on the work stage 6 as shown in FIG. However, at this time, a strong force is applied to the portion of the rod-like member 41 pressed by the fixing member X. As described above, the rod-shaped member 41 is, for example, quartz, and when a strong force is applied partially, breakage such as chipping or breakage may occur in some cases. In order to prevent this, as shown in FIG. 10C, an elastic member Y such as a cushion is placed between the mask 5 and the work stage 6 so that the mask 5 bends in accordance with the deflection of the rod-like member 41. It can also be considered. However, if the rod-like member 41 is not restricted from moving upward (vertical direction) with respect to the support frame 44 as in the present invention, there is no fear of the rod-like member 41 being damaged, and the mask There is no need to dispose the elastic member Y between 5 and the work stage 6, and the mask 5 can be sucked and held by the rod-like member 41 of the mask holding means 4.
１ 光照射部
２ 棒状のランプ
３ 反射ミラー
４ マスク保持手段
４１ 棒状部材
４２ 真空吸着溝
４３ 継手
４４ 支持フレーム
４５ 真空供給路
４６ 位置決め部材
４７ 凹部
４８ ねじ
４９ ねじ孔
５ マスク
５１ 光透過部
５２ 遮光部
６ ワークステージ
７ 配管
８ ワークステージ移動機構
９ 真空ポンプ
１０ 圧縮エアー供給源
１１ 切換えバルブ
Ｗ ワーク
Ｘ 固定部材
Ｙ 弾性部材
DESCRIPTION OF SYMBOLS 1 Light irradiation part 2 Bar-shaped lamp 3 Reflection mirror 4 Mask holding means 41 Bar-shaped member 42 Vacuum suction groove 43 Joint 44 Support frame 45 Vacuum supply path 46 Positioning member 47 Recess 48 Screw 49 Screw hole 5 Mask 51 Light transmission part 52 Light-shielding part 6 Work stage 7 Piping 8 Work stage moving mechanism 9 Vacuum pump 10 Compressed air supply source 11 Switching valve W Work X Fixing member Y Elastic member
Claims (4)
前記マスク保持手段は、マスクの一方向の長さよりも長く、下表面にマスクを吸着保持するための真空吸着溝または真空吸着孔が形成された、光透過性の棒状部材と、前記棒状部材を下から支持する支持フレームとを備えている
ことを特徴とする光照射装置。 In the light irradiation apparatus that holds the mask on which the pattern is formed by light-transmitting mask holding means, and irradiates the irradiated object with the light emitted from the light irradiation unit through the mask.
The mask holding means includes a light-transmitting rod-like member having a vacuum suction groove or vacuum suction hole formed on the lower surface, which is longer than the length in one direction of the mask, and is formed on the lower surface. A light irradiation device comprising: a support frame supported from below.
ことを特徴とする請求項１記載の光照射装置。 The light irradiation apparatus according to claim 1, wherein the rod-shaped member has a cross-section having a height higher than a width.
ことを特徴とする請求項１または請求項２記載の光照射装置。 The rod-shaped member is positioned by a positioning member attached to the support frame and supported by the support frame, and the positioning member does not restrict the rod-shaped member from moving upward. Item 3. The light irradiation device according to item 1 or 2.
ことを特徴とする請求項３記載の光照射装置。 The light irradiation apparatus according to claim 3, wherein the positioning member is mounted on the support frame so that a position in a horizontal direction is variable.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010015218A JP5472616B2 (en) | 2010-01-27 | 2010-01-27 | Light irradiation device |
| TW099138354A TWI444784B (en) | 2010-01-27 | 2010-11-08 | Light irradiation device |
| KR1020100126276A KR20110088362A (en) | 2010-01-27 | 2010-12-10 | Light irradiating apparatus |
| CN201110027654.XA CN102135732B (en) | 2010-01-27 | 2011-01-26 | Light irradiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2010015218A JP5472616B2 (en) | 2010-01-27 | 2010-01-27 | Light irradiation device |
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| Publication Number | Publication Date |
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| JP2011155108A true JP2011155108A (en) | 2011-08-11 |
| JP5472616B2 JP5472616B2 (en) | 2014-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010015218A Active JP5472616B2 (en) | 2010-01-27 | 2010-01-27 | Light irradiation device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5472616B2 (en) |
| KR (1) | KR20110088362A (en) |
| CN (1) | CN102135732B (en) |
| TW (1) | TWI444784B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016107001A1 (en) | 2016-04-15 | 2017-10-19 | Ist Metz Gmbh | Apparatus for exposing a substrate |
| CN113555772A (en) * | 2020-04-23 | 2021-10-26 | 普罗科技有限公司 | Flip chip bonding apparatus using vertical cavity surface emitting laser element |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6663252B2 (en) * | 2016-03-01 | 2020-03-11 | 株式会社アドテックエンジニアリング | Exposure equipment for printed circuit boards |
| JP6622661B2 (en) * | 2016-06-29 | 2019-12-18 | 東京応化工業株式会社 | Support body separating apparatus and support body separating method |
| JP6986317B2 (en) * | 2017-12-05 | 2021-12-22 | 株式会社アドテックエンジニアリング | Mask unit and exposure equipment |
| JP7383341B2 (en) * | 2019-11-27 | 2023-11-20 | 株式会社オーク製作所 | Direct exposure equipment and substrate exposure method |
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- 2010-01-27 JP JP2010015218A patent/JP5472616B2/en active Active
- 2010-11-08 TW TW099138354A patent/TWI444784B/en active
- 2010-12-10 KR KR1020100126276A patent/KR20110088362A/en not_active Application Discontinuation
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| JP2004077583A (en) * | 2002-08-12 | 2004-03-11 | Ushio Inc | Laminate device for display panel |
| JP2006066585A (en) * | 2004-08-26 | 2006-03-09 | Ushio Inc | Irradiation device |
| JP2008191195A (en) * | 2007-02-01 | 2008-08-21 | Ushio Inc | Apparatus and method for laminating liquid crystal panel |
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| DE102016107001A1 (en) | 2016-04-15 | 2017-10-19 | Ist Metz Gmbh | Apparatus for exposing a substrate |
| WO2017178651A1 (en) | 2016-04-15 | 2017-10-19 | Ist Metz Gmbh | Device for exposure of a substrate |
| CN113555772A (en) * | 2020-04-23 | 2021-10-26 | 普罗科技有限公司 | Flip chip bonding apparatus using vertical cavity surface emitting laser element |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI444784B (en) | 2014-07-11 |
| CN102135732A (en) | 2011-07-27 |
| KR20110088362A (en) | 2011-08-03 |
| TW201126276A (en) | 2011-08-01 |
| JP5472616B2 (en) | 2014-04-16 |
| CN102135732B (en) | 2014-08-06 |
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