TWI443721B - 圖案化基板之最佳清潔設備與方法 - Google Patents

圖案化基板之最佳清潔設備與方法 Download PDF

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Publication number
TWI443721B
TWI443721B TW097139858A TW97139858A TWI443721B TW I443721 B TWI443721 B TW I443721B TW 097139858 A TW097139858 A TW 097139858A TW 97139858 A TW97139858 A TW 97139858A TW I443721 B TWI443721 B TW I443721B
Authority
TW
Taiwan
Prior art keywords
cleaning
wafer
cleaning head
patterned wafer
head
Prior art date
Application number
TW097139858A
Other languages
English (en)
Chinese (zh)
Other versions
TW200929343A (en
Inventor
約翰Ｍ 德賴瑞厄斯
艾瑞克Ｍ 弗利爾
麥可 瑞夫肯
傑弗瑞 馬克思
Original Assignee
蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW200929343A publication Critical patent/TW200929343A/zh
Application granted granted Critical
Publication of TWI443721B publication Critical patent/TWI443721B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW097139858A 2007-10-18 2008-10-17 圖案化基板之最佳清潔設備與方法 TWI443721B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US98106007P 2007-10-18 2007-10-18

Publications (2)

Publication Number Publication Date
TW200929343A TW200929343A (en) 2009-07-01
TWI443721B true TWI443721B (zh) 2014-07-01

Family

ID=40562222

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097139858A TWI443721B (zh) 2007-10-18 2008-10-17 圖案化基板之最佳清潔設備與方法

Country Status (6)

Country Link
US (1) US20090101166A1 (https=)
JP (1) JP5444233B2 (https=)
KR (1) KR20100076032A (https=)
CN (1) CN101828252B (https=)
TW (1) TWI443721B (https=)
WO (1) WO2009051763A2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8105997B2 (en) * 2008-11-07 2012-01-31 Lam Research Corporation Composition and application of a two-phase contaminant removal medium
CN111370298A (zh) * 2020-04-16 2020-07-03 上海华虹宏力半导体制造有限公司 半导体衬底清洗方法及调整方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2956494A (en) * 1956-01-13 1960-10-18 Kelvin & Hughes Ltd Application of liquid to surfaces
JP3511442B2 (ja) * 1996-12-18 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、省液型の液体供給ノズル装置及びウエット処理装置
JPH10294261A (ja) * 1997-04-18 1998-11-04 Sony Corp レジスト塗布装置
US5870793A (en) * 1997-05-02 1999-02-16 Integrated Process Equipment Corp. Brush for scrubbing semiconductor wafers
US7389783B2 (en) * 2002-09-30 2008-06-24 Lam Research Corporation Proximity meniscus manifold
US8236382B2 (en) * 2002-09-30 2012-08-07 Lam Research Corporation Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same
US7392815B2 (en) * 2003-03-31 2008-07-01 Lam Research Corporation Chamber for wafer cleaning and method for making the same
US7799141B2 (en) * 2003-06-27 2010-09-21 Lam Research Corporation Method and system for using a two-phases substrate cleaning compound
US8522801B2 (en) * 2003-06-27 2013-09-03 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US20050126605A1 (en) * 2003-12-15 2005-06-16 Coreflow Scientific Solutions Ltd. Apparatus and method for cleaning surfaces
US8522799B2 (en) * 2005-12-30 2013-09-03 Lam Research Corporation Apparatus and system for cleaning a substrate

Also Published As

Publication number Publication date
KR20100076032A (ko) 2010-07-05
TW200929343A (en) 2009-07-01
WO2009051763A3 (en) 2009-06-04
WO2009051763A2 (en) 2009-04-23
CN101828252B (zh) 2012-11-14
JP2011501434A (ja) 2011-01-06
US20090101166A1 (en) 2009-04-23
JP5444233B2 (ja) 2014-03-19
CN101828252A (zh) 2010-09-08

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MM4A Annulment or lapse of patent due to non-payment of fees