CN101828252B - 用于优化图案化晶片清洁的设备和方法 - Google Patents

用于优化图案化晶片清洁的设备和方法 Download PDF

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Publication number
CN101828252B
CN101828252B CN200880113115.4A CN200880113115A CN101828252B CN 101828252 B CN101828252 B CN 101828252B CN 200880113115 A CN200880113115 A CN 200880113115A CN 101828252 B CN101828252 B CN 101828252B
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CN
China
Prior art keywords
cleaning
cleaning head
wafer
patterned wafer
channels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200880113115.4A
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English (en)
Chinese (zh)
Other versions
CN101828252A (zh
Inventor
约翰·M·德拉里奥斯
埃里克·M·弗里尔
迈克尔·拉夫金
杰弗里·马克斯
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Cleaning Or Drying Semiconductors (AREA)
CN200880113115.4A 2007-10-18 2008-10-15 用于优化图案化晶片清洁的设备和方法 Expired - Fee Related CN101828252B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US98106007P 2007-10-18 2007-10-18
US60/981,060 2007-10-18
PCT/US2008/011830 WO2009051763A2 (en) 2007-10-18 2008-10-15 Apparatus and methods for optimizing cleaning of patterned substrates

Publications (2)

Publication Number Publication Date
CN101828252A CN101828252A (zh) 2010-09-08
CN101828252B true CN101828252B (zh) 2012-11-14

Family

ID=40562222

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880113115.4A Expired - Fee Related CN101828252B (zh) 2007-10-18 2008-10-15 用于优化图案化晶片清洁的设备和方法

Country Status (6)

Country Link
US (1) US20090101166A1 (https=)
JP (1) JP5444233B2 (https=)
KR (1) KR20100076032A (https=)
CN (1) CN101828252B (https=)
TW (1) TWI443721B (https=)
WO (1) WO2009051763A2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8105997B2 (en) * 2008-11-07 2012-01-31 Lam Research Corporation Composition and application of a two-phase contaminant removal medium
CN111370298A (zh) * 2020-04-16 2020-07-03 上海华虹宏力半导体制造有限公司 半导体衬底清洗方法及调整方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10294261A (ja) 1997-04-18 1998-11-04 Sony Corp レジスト塗布装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2956494A (en) * 1956-01-13 1960-10-18 Kelvin & Hughes Ltd Application of liquid to surfaces
JP3511442B2 (ja) * 1996-12-18 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、省液型の液体供給ノズル装置及びウエット処理装置
US5870793A (en) * 1997-05-02 1999-02-16 Integrated Process Equipment Corp. Brush for scrubbing semiconductor wafers
US7389783B2 (en) * 2002-09-30 2008-06-24 Lam Research Corporation Proximity meniscus manifold
US8236382B2 (en) * 2002-09-30 2012-08-07 Lam Research Corporation Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same
US7392815B2 (en) * 2003-03-31 2008-07-01 Lam Research Corporation Chamber for wafer cleaning and method for making the same
US7799141B2 (en) * 2003-06-27 2010-09-21 Lam Research Corporation Method and system for using a two-phases substrate cleaning compound
US8522801B2 (en) * 2003-06-27 2013-09-03 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US20050126605A1 (en) * 2003-12-15 2005-06-16 Coreflow Scientific Solutions Ltd. Apparatus and method for cleaning surfaces
US8522799B2 (en) * 2005-12-30 2013-09-03 Lam Research Corporation Apparatus and system for cleaning a substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10294261A (ja) 1997-04-18 1998-11-04 Sony Corp レジスト塗布装置

Also Published As

Publication number Publication date
KR20100076032A (ko) 2010-07-05
TW200929343A (en) 2009-07-01
WO2009051763A3 (en) 2009-06-04
WO2009051763A2 (en) 2009-04-23
JP2011501434A (ja) 2011-01-06
US20090101166A1 (en) 2009-04-23
JP5444233B2 (ja) 2014-03-19
TWI443721B (zh) 2014-07-01
CN101828252A (zh) 2010-09-08

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Granted publication date: 20121114

Termination date: 20151015

EXPY Termination of patent right or utility model