TWI440527B - - Google Patents

Info

Publication number
TWI440527B
TWI440527B TW100115538A TW100115538A TWI440527B TW I440527 B TWI440527 B TW I440527B TW 100115538 A TW100115538 A TW 100115538A TW 100115538 A TW100115538 A TW 100115538A TW I440527 B TWI440527 B TW I440527B
Authority
TW
Taiwan
Application number
TW100115538A
Other versions
TW201143979A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201143979A publication Critical patent/TW201143979A/zh
Application granted granted Critical
Publication of TWI440527B publication Critical patent/TWI440527B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW100115538A 2010-05-10 2011-05-04 Cmp pad dressers with hybridized conditioning and related methods TW201143979A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33316210P 2010-05-10 2010-05-10

Publications (2)

Publication Number Publication Date
TW201143979A TW201143979A (en) 2011-12-16
TWI440527B true TWI440527B (zh) 2014-06-11

Family

ID=44902244

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100115538A TW201143979A (en) 2010-05-10 2011-05-04 Cmp pad dressers with hybridized conditioning and related methods

Country Status (3)

Country Link
US (1) US20110275288A1 (zh)
CN (1) CN102240973A (zh)
TW (1) TW201143979A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI769907B (zh) * 2021-08-03 2022-07-01 中國砂輪企業股份有限公司 複合修整器

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US9011563B2 (en) 2007-12-06 2015-04-21 Chien-Min Sung Methods for orienting superabrasive particles on a surface and associated tools
JP5255860B2 (ja) * 2008-02-20 2013-08-07 新日鉄住金マテリアルズ株式会社 研磨布用ドレッサー
WO2012040373A2 (en) 2010-09-21 2012-03-29 Ritedia Corporation Diamond particle mololayer heat spreaders and associated methods
TWI487019B (en) 2011-05-23 2015-06-01 Cmp pad dresser having leveled tips and associated methods
US8709114B2 (en) * 2012-03-22 2014-04-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
JP2014147993A (ja) * 2013-01-31 2014-08-21 Shin Etsu Handotai Co Ltd ドレッシングプレート及びドレッシングプレートの製造方法
TWI511841B (zh) * 2013-03-15 2015-12-11 Kinik Co 貼合式化學機械硏磨修整器及其製法
TWI564116B (zh) * 2013-08-12 2017-01-01 Sapphire polishing pad dresser with multiple trimmed pellets
JP5954293B2 (ja) * 2013-10-17 2016-07-20 信越半導体株式会社 研磨用の発泡ウレタンパッドのドレッシング装置
TWI623382B (zh) * 2015-10-27 2018-05-11 中國砂輪企業股份有限公司 Hybrid chemical mechanical polishing dresser
US10471567B2 (en) * 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
JP6991043B2 (ja) * 2017-11-22 2022-02-03 東京エレクトロン株式会社 基板載置台
CN109866108A (zh) * 2017-12-01 2019-06-11 咏巨科技有限公司 抛光垫修整装置及其制造方法以及抛光垫修整方法
CN108098590A (zh) * 2017-12-21 2018-06-01 东莞华晶粉末冶金有限公司 一种研磨抛光垫的修整器及其修整方法
CN110052962A (zh) * 2019-04-25 2019-07-26 西安奕斯伟硅片技术有限公司 一种抛光垫修整器、加工装置及方法
CN114603483A (zh) * 2022-03-23 2022-06-10 长鑫存储技术有限公司 研磨垫修整器及化学机械研磨装置
CN117798814B (zh) * 2024-03-01 2024-05-28 浙江大学杭州国际科创中心 一种抛光垫、抛光垫的制备方法及抛光方法
CN118528176A (zh) * 2024-07-23 2024-08-23 浙江求是半导体设备有限公司 一种抛光垫修整装置、最终抛设备及修整方法

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Publication number Priority date Publication date Assignee Title
US2451295A (en) * 1944-11-08 1948-10-12 Super Cut Abrasive wheel
US7491116B2 (en) * 2004-09-29 2009-02-17 Chien-Min Sung CMP pad dresser with oriented particles and associated methods
TW383644U (en) * 1999-03-23 2000-03-01 Vanguard Int Semiconduct Corp Dressing apparatus
US7201645B2 (en) * 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
JP4216025B2 (ja) * 2002-09-09 2009-01-28 株式会社リード 研磨布用ドレッサー及びそれを用いた研磨布のドレッシング方法
US6949012B2 (en) * 2002-12-10 2005-09-27 Intel Corporation Polishing pad conditioning method and apparatus
JP4234991B2 (ja) * 2002-12-26 2009-03-04 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法及びその製造方法によって製造される情報記録媒体用ガラス基板
TWI286963B (en) * 2004-03-10 2007-09-21 Read Co Ltd Dresser for polishing cloth and method for manufacturing thereof
US7658666B2 (en) * 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
US7150677B2 (en) * 2004-09-22 2006-12-19 Mitsubishi Materials Corporation CMP conditioner
KR100693251B1 (ko) * 2005-03-07 2007-03-13 삼성전자주식회사 연마 속도와 연마 패드의 조도를 향상시킬 수 있는 패드 컨디셔너 및 이를 이용하는 화학기계적 연마 장치
US8393934B2 (en) * 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
KR100723436B1 (ko) * 2005-12-29 2007-05-30 삼성전자주식회사 연마패드의 컨디셔너 및 이를 구비하는 화학기계적연마장치
US7241206B1 (en) * 2006-02-17 2007-07-10 Chien-Min Sung Tools for polishing and associated methods
KR20100087297A (ko) * 2007-09-28 2010-08-04 치엔 민 성 모자이크 연마 세그먼트를 포함한 ｃｍｐ 패드 컨디셔너 및 해당 방법
TW201016387A (en) * 2008-10-22 2010-05-01 jian-min Song CMP Pad Dressers with Hybridized abrasive surface and related methods

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI769907B (zh) * 2021-08-03 2022-07-01 中國砂輪企業股份有限公司 複合修整器

Also Published As

Publication number Publication date
TW201143979A (en) 2011-12-16
CN102240973A (zh) 2011-11-16
US20110275288A1 (en) 2011-11-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees