TWI438390B - External heat conducting element - Google Patents
External heat conducting element Download PDFInfo
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- TWI438390B TWI438390B TW100115535A TW100115535A TWI438390B TW I438390 B TWI438390 B TW I438390B TW 100115535 A TW100115535 A TW 100115535A TW 100115535 A TW100115535 A TW 100115535A TW I438390 B TWI438390 B TW I438390B
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Description
本發明係關於一種外接式導熱件,尤其係一種用於散熱裝置的外接式導熱件。The invention relates to an external heat conducting member, in particular to an external heat conducting member for a heat dissipating device.
一般電腦主機中裝配的硬體裝置,例如顯示卡或中央處理器等,上述硬體裝置在運行的同時亦會產生出一定的熱能。而電腦內的硬體裝置所產生的熱能必須透過散熱風扇、散熱片、水冷或冷媒等方式來進行散熱。A hardware device such as a display card or a central processing unit is generally installed in a computer main body, and the above-mentioned hardware device generates a certain amount of thermal energy while being operated. The heat generated by the hardware device in the computer must be dissipated through a cooling fan, a heat sink, water cooling or a refrigerant.
現今主流的散熱方法是透過散熱風扇與散熱片的組合進行散熱。而被安裝在硬體上的散熱風扇與散熱片係具有一定的厚度。因此當安裝兩個以上的硬體時,因為受到散熱風扇與散熱片的厚度影響,導致硬體之間沒有了足夠的空間使空氣流動。The current mainstream cooling method is to dissipate heat through a combination of a cooling fan and a heat sink. The cooling fan and the heat sink system mounted on the hardware have a certain thickness. Therefore, when two or more hard bodies are mounted, there is not enough space between the hardware to allow air to flow because of the thickness of the heat radiating fan and the heat sink.
一般而言,為了使各個硬體裝置之間有足夠的間距進行散熱,電腦主機板的介面插槽(例如:PCI或PCI-E)之間會保留一定的距離。然而,隨著科技的進步,硬體裝置的處理效能相對的提升,而硬體裝置所產生的熱能也相對的增加。In general, in order to allow sufficient space between the various hardware devices for heat dissipation, a certain distance is reserved between the interface slots of the computer motherboard (for example, PCI or PCI-E). However, with the advancement of technology, the processing performance of the hardware device is relatively improved, and the thermal energy generated by the hardware device is relatively increased.
為了因應硬體裝置所增加的熱能,自然必須提供硬體裝置更有效率的散熱手段。而目前仍多以散熱風扇與散熱片作為主流,因此為了配合提高散熱效率,散熱風扇與散熱片也勢必需要增加其數量與體積,如此一來也增加了硬體裝制的厚度與體積,導致電腦設備無法進一步的小型化,並不符合目前的市場趨勢。In order to cope with the increased thermal energy of the hardware device, it is naturally necessary to provide a more efficient means of dissipating heat from the hardware device. At present, the cooling fan and the heat sink are still mostly used as the mainstream. Therefore, in order to improve the heat dissipation efficiency, the heat dissipation fan and the heat sink are also required to increase the number and volume thereof, which also increases the thickness and volume of the hardware assembly, resulting in Computer equipment cannot be further miniaturized and does not meet current market trends.
請參照第1圖所示,係為習知之顯示卡的立體組合圖。習用顯示卡一般會搭載散熱用的散熱風扇與散熱片,但如果需要裝配兩張顯示卡時,在二顯示卡之間將會呈現緊鄰的狀態,此時二顯示卡之間的空間相對地狹小,而這樣的空間並不能使空氣順利的流動。因此,由於空氣流動緩慢或滯留,而造成顯示卡所產生的熱能無法快速地被氣流帶離,過熱的顯示卡將可能發生熱當或損壞。Please refer to FIG. 1 for a stereoscopic combination diagram of a conventional display card. The conventional display card usually has a cooling fan and a heat sink for heat dissipation. However, if two display cards need to be assembled, the next display card will be in a close state, and the space between the two display cards is relatively small. And such a space does not allow the air to flow smoothly. Therefore, due to the slow or stagnant air flow, the thermal energy generated by the display card cannot be quickly taken away by the airflow, and the overheated display card may be thermally damaged or damaged.
因此要如何有效的利用電腦主機中的空間,並且使熱能不致累積在電子裝置上,藉此來防止電子裝置的熱當或損壞,即為從事此行業之相關廠商所亟欲研究改善的課題。Therefore, how to effectively utilize the space in the computer mainframe and prevent the thermal energy from accumulating on the electronic device, thereby preventing the heat or damage of the electronic device, is a problem that the relevant manufacturers engaged in the industry are eager to study and improve.
有鑒於此,發明人為克服上述的種種問題與缺失,乃收集相關資料,並以從事此行業累積的多年經驗,經由不斷試驗與改良,使設計出此種外接式導熱件之發明專利。In view of this, in order to overcome the above problems and shortcomings, the inventors collected related materials, and through years of experience in the industry, through continuous experimentation and improvement, the invention patent of such external heat conducting parts was designed.
本發明的之一目的在於解決電子裝置熱量累積的問題。One of the objects of the present invention is to solve the problem of heat accumulation of an electronic device.
本發明的之另一目的在於防止電子裝置熱當或損壞的問題。Another object of the present invention is to prevent the problem of heat or damage to the electronic device.
為達到上述的目的,本發明提供一種外接式導熱件,用於多個散熱裝置,且散熱裝置分別具有一導熱管,外接式導熱件包括一本體以及多個連接部。連接部係設置於本體兩相對端,且連接部分別供連接散熱裝置之導熱管上。In order to achieve the above object, the present invention provides an external heat conducting member for a plurality of heat dissipating devices, and the heat dissipating device respectively has a heat conducting tube, and the external heat conducting member comprises a body and a plurality of connecting portions. The connecting portion is disposed at opposite ends of the body, and the connecting portion is respectively connected to the heat pipe of the heat sink.
本發明的功效在於,使原本因為空間狹小而順利進行散熱的散熱裝置,能夠透過外接式散熱件傳導熱量至其它散熱裝置上,並透過其它散熱裝置進行散熱。透過外接式導熱件能夠有效降低電子裝置的熱量累積,並且防止電子裝置熱當或損壞。The utility model has the advantages that the heat dissipating device which can smoothly dissipate heat due to the narrow space can conduct heat to the other heat dissipating device through the external heat dissipating member, and dissipate heat through the other heat dissipating device. The external heat conduction member can effectively reduce the heat accumulation of the electronic device and prevent the electronic device from being hot or damaged.
為詳細說明本發明之技術內容、構造特徵、所達成之目的以及功效,以下茲舉實施例並配合圖式詳予說明。In order to explain the technical content, structural features, objects and effects of the present invention in detail, the embodiments are described in detail below.
請參照第2及3A圖所示,分別係為本發明之外接式導熱件的使用狀態表示圖,以及本發明第一實施例之外接式導熱件的外觀圖。在本實施例中,本發明之外接式導熱件100係用於多個散熱裝置200上。散熱裝置200分別定義有一第一散熱裝置210以及一第二散熱裝置220,且第一散熱裝置210與第二散熱裝置220分別具有一或多個導熱管230。外接式導熱件100也可與導熱管230為一體成形,在本發明中並不對此設限。Referring to FIGS. 2 and 3A, respectively, FIG. 2 is a view showing a state of use of the external heat transfer member of the present invention, and an external view of the external heat transfer member according to the first embodiment of the present invention. In the present embodiment, the external heat conducting member 100 of the present invention is used for a plurality of heat sinks 200. The heat sink 200 defines a first heat sink 210 and a second heat sink 220, respectively, and the first heat sink 210 and the second heat sink 220 respectively have one or more heat pipes 230. The external heat conducting member 100 may also be integrally formed with the heat pipe 230, which is not limited in the present invention.
且在本實施例中,所述的散熱裝置200係以顯示卡作一示範,但並非係用以限定本發明的實施方式。本發明所述之散熱裝置200也可以為中央處理器、硬碟、記憶體、網路卡、音效卡、光碟機或電源供應器,或是任何需要散熱之裝置,在本發明中並不對此設限。In the embodiment, the heat dissipating device 200 is exemplified by a display card, but is not intended to limit the embodiments of the present invention. The heat sink 200 of the present invention may also be a central processing unit, a hard disk, a memory, a network card, a sound card, a CD player or a power supply, or any device that requires heat dissipation, which is not in the present invention. Set limits.
如第2圖及第3A圖所示,本發明之外接式導熱件100包括一本體110以及多個連接部120。在本實施例中所述之本體110係為中空管狀,且本體110較佳為可撓曲材質或金屬材質所製成,但本體110也可以為不可撓曲材質或其它具有導熱性質的材質,而本體110也可以為實心柱狀,在本發明中並不對此設限。連接部120係設置於本體110的兩相對端,且各個連接部120係分別連接於散熱裝置200的導熱管230上。As shown in FIGS. 2 and 3A, the external heat conducting member 100 of the present invention includes a body 110 and a plurality of connecting portions 120. The body 110 is hollow tubular, and the body 110 is preferably made of a flexible material or a metal material, but the body 110 may also be an inflexible material or other material having thermal conductivity. The body 110 may also be a solid column, which is not limited in the present invention. The connecting portions 120 are disposed at opposite ends of the body 110, and the connecting portions 120 are respectively connected to the heat pipes 230 of the heat sink 200.
又,在本實施例中,所述之本體110係可藉由材質變化特性,變換外接式導熱件100之長度,但基於使用上的便利性,本體110也可以為兩套管相互套設,供變換外接式導熱件100之長度,也就是說,只要符合本發明的目的與達成的功效,可以任意的改變本體110的外型與結構,在本發明中並不對此設限。In addition, in the embodiment, the body 110 can change the length of the external heat conducting member 100 by changing the material. However, based on the convenience in use, the body 110 can also sleeve the two sleeves. The length of the external heat conducting member 100 is changed, that is, the shape and structure of the body 110 can be arbitrarily changed as long as the object of the present invention and the achieved effect are met, and the present invention is not limited thereto.
請參照第3A至3C圖,如圖所示之本發明第一實施例、第二實施例及第三實施例之外接式導熱件之外觀圖。連接器120可以為夾子、扣環或勾子,使連接器120可以穩定地固定在導熱管230上。Referring to Figures 3A to 3C, there are shown external views of the external heat conducting members of the first, second and third embodiments of the present invention. The connector 120 can be a clip, a buckle or a hook so that the connector 120 can be stably fixed to the heat pipe 230.
請參照第3D圖所示,係為本發明第四實施例之外接式導熱件之外觀圖。在本實施例中,進一步也可以在連接部120設有一接合裝置130,接合裝置130係固定連接至連接部120與導熱管230上。在本實施例中,所述之接合裝置130係以螺栓或螺釘作一示範。Please refer to FIG. 3D, which is an external view of the external heat conducting member according to the fourth embodiment of the present invention. In this embodiment, an engaging device 130 may be further disposed on the connecting portion 120, and the engaging device 130 is fixedly coupled to the connecting portion 120 and the heat pipe 230. In the present embodiment, the engaging device 130 is exemplified by a bolt or a screw.
請參照第3E圖所示,係為本發明第四實施例之外接式導熱件使用狀態示意圖。連接部200連接至導熱管230,並透過接合裝置130將連接部200固定在導熱管230上。Please refer to FIG. 3E, which is a schematic view showing the use state of the external heat conducting member according to the fourth embodiment of the present invention. The connecting portion 200 is connected to the heat pipe 230 and fixes the connecting portion 200 to the heat pipe 230 through the joint device 130.
請參照第3F圖所示,係為本發明第五實施例之外接式導熱件使用狀態示意圖。接合裝置130也可以為導熱膠或焊錫,透過導熱膠或焊錫將連接部200直接固定在導熱管230上,在本發明中並不對此設限。Please refer to FIG. 3F, which is a schematic view showing the use state of the external heat conducting member according to the fifth embodiment of the present invention. The bonding device 130 may also be a thermal conductive adhesive or a solder, and the connecting portion 200 is directly fixed to the heat transfer tube 230 through a thermal conductive adhesive or solder, which is not limited in the present invention.
請再繼續參照第2圖,上述之外接式導熱件100係透過連接部120分別連接至第一散熱裝置210與第二散熱裝置220的導熱管230上。當第一散熱裝置210與第二散熱裝置220運作時,第一散熱裝置210所產生的熱能,通過導熱管230傳導至外接式導熱件100之連接部120。且連接於第一散熱裝置210之連接部120所接收的熱能通過本體110傳導至另一連接部120。此時熱能透過另一連接部120傳導至第二散熱裝置220之導熱管230上。Referring to FIG. 2 again, the external heat conducting member 100 is connected to the heat transfer tubes 230 of the first heat sink 210 and the second heat sink 220 through the connecting portion 120. When the first heat sink 210 and the second heat sink 220 operate, the heat energy generated by the first heat sink 210 is conducted to the connecting portion 120 of the external heat conducting member 100 through the heat pipe 230. The heat energy received by the connecting portion 120 connected to the first heat sink 210 is conducted to the other connecting portion 120 through the body 110. At this time, thermal energy is transmitted to the heat transfer tube 230 of the second heat sink 220 through the other connecting portion 120.
藉由外接式導熱件100連接第一散熱裝置210與第二散熱裝置220的導熱管230,使第一散熱裝置210所產生的熱能能夠傳導至第二散熱裝置220來進行散熱。The heat conduction tubes 230 of the first heat dissipation device 210 and the second heat dissipation device 220 are connected by the external heat conduction member 100, so that the heat energy generated by the first heat dissipation device 210 can be transmitted to the second heat dissipation device 220 for heat dissipation.
雖然本發明之實施例揭露如上所述,然並非用以限定本發明,任何熟習相關技藝者,在不脫離本發明之精神和範圍內,舉凡依本發明申請範圍所述之形狀、構造、特徵及數量當可做些許之變更,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.
100...外接式導熱件100. . . External heat conductor
110...本體110. . . Ontology
120...連接部120. . . Connection
130...接合裝置130. . . Jointing device
200...散熱裝置200. . . Heat sink
210...第一導熱裝置210. . . First heat conducting device
220...第二導熱裝置220. . . Second heat conducting device
230...導熱管230. . . Heat pipe
第1圖係為習知之顯示卡的立體組合圖。Figure 1 is a perspective assembled view of a conventional display card.
第2圖係為本發明之外接式導熱件的使用狀態表示圖。Fig. 2 is a view showing the state of use of the external heat transfer member of the present invention.
第3A圖係為本發明第一實施例之外接式導熱件之外觀圖。Fig. 3A is an external view of the external heat conducting member of the first embodiment of the present invention.
第3B圖係為本發明第二實施例之外接式導熱件之外觀圖。Fig. 3B is an external view of the external heat conducting member of the second embodiment of the present invention.
第3C圖係為本發明第三實施例之外接式導熱件之外觀圖。Fig. 3C is an external view of the external heat conducting member of the third embodiment of the present invention.
第3D圖係為本發明第四實施例之外接式導熱件之外觀圖。Fig. 3D is an external view of the external heat conducting member of the fourth embodiment of the present invention.
第3E圖係為本發明第四實施例之外接式導熱件使用狀態示意圖。FIG. 3E is a schematic view showing the state of use of the external heat conducting member according to the fourth embodiment of the present invention.
第3F圖係為本發明第五實施例之外接式導熱件使用狀態示意圖。FIG. 3F is a schematic view showing the state of use of the external heat conducting member according to the fifth embodiment of the present invention.
110...本體110. . . Ontology
200...散熱裝置200. . . Heat sink
210...第一散熱裝置210. . . First heat sink
220...第二散熱裝置220. . . Second heat sink
230...導熱管230. . . Heat pipe
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