CN104615215B - A kind of radiator structure applied to computer processor - Google Patents
A kind of radiator structure applied to computer processor Download PDFInfo
- Publication number
- CN104615215B CN104615215B CN201310535461.4A CN201310535461A CN104615215B CN 104615215 B CN104615215 B CN 104615215B CN 201310535461 A CN201310535461 A CN 201310535461A CN 104615215 B CN104615215 B CN 104615215B
- Authority
- CN
- China
- Prior art keywords
- processor
- heat conducting
- fixed seat
- conducting pipe
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/203—Heat conductive hinge
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a kind of radiator structure applied to computer processor, it is fixedly connected between chassis shell body and processor, radiator structure includes more heat conducting pipes, for the housing fixed seat that is fixed on heat conducting pipe in chassis shell body and for heat conducting pipe to be fixed into processor fixed seat on a processor, heat conducting pipe one end connects housing fixed seat, heat conducting pipe other end connection processor fixed seat.As the constantly lifting of processor computing clock frequency can produce high power consumption and high fever simultaneously, heat can be conducted to the heat conducting pipe by processor fixed seat, and then conducted heat to by housing fixed seat in chassis shell body, so that the radiating efficiency of processor is higher, and operating temperature is free from the influence of the external environment, it is not only advantageous to ensure the normal work of processor, improve the performance of computer, colleague, also so that computer can adapt to the work of higher environment, this radiator structure is simple in construction, cost is low, space in computer can be saved, noise will not be produced, good heat dissipation effect.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of radiator structure applied to computer processor.
Background technology
At present, general computer processor radiator is to add radiator fan to form using radiator on the market, says that radiator is used
Fastener is installed on a processor, and radiator fan is installed on a heat sink and connects power supply, and when computer is run, radiator is continuous
Processor surface high-temp is taken out of, these heats are blown away immediately by radiator fan, processor radiating and cooling is embodied as with this
Purpose.At present the problem of is, as the constantly lifting of processor computing clock frequency produces high power consumption and high fever simultaneously, can influence be
The stabilization and service life of system product, do not find optimal solution route, are forced the volume of radiator and radiator fan to get over so far
Do bigger, caused noise also therefore exacerbation.
The content of the invention
It is an object of the invention to overcome the defect of prior art, there is provided it is a kind of it is simple in construction, cost is low, it is noiseless,
The radiator structure applied to computer processor of good heat dissipation effect.
What the present invention was realized in：A kind of radiator structure applied to computer processor, it is fixedly connected on chassis shell body
Between processor, the radiator structure includes more heat conducting pipes, for the heat conducting pipe to be fixed on into the chassis shell body
Housing fixed seat and for the heat conducting pipe to be fixed into processor fixed seat on a processor, heat conducting pipe one end connection
The housing fixed seat, the heat conducting pipe other end connect the processor fixed seat；Offered in the processor fixed seat
The multiple fixing grooves corresponding with the heat conducting pipe, each heat conducting pipe are correspondingly weldingly fixed in the fixing groove；It is described
Plane where heat conducting pipe is developed with plane where the processor fixed seat.
Further, the housing fixed seat is fixedly mounted in the chassis shell body using screw, the heat conducting pipe weldering
Connect and be fixed in the housing fixed seat.
Further, the heat conducting pipe is copper pipe.
The present invention provides a kind of radiator structure applied to computer processor, and connecting housing by heat conducting pipe one end fixes
Seat, heat conducting pipe other end connection processor fixed seat, processor is fixed in processor fixed seat, with processor computing
Clock frequency constantly lifting can produce high power consumption and high fever simultaneously, and heat can be conducted by processor fixed seat to the heat conducting pipe
On, and then conducted heat to by housing fixed seat in chassis shell body so that the radiating efficiency of processor is higher, and the temperature that works
Spend free from the influence of the external environment, be not only advantageous to ensure the normal work of processor, improve the performance of computer, colleague, also make
The work that computer can adapt to higher environment is obtained, this radiator structure is simple in construction, cost is low, can save space in computer, will not
Produce noise, good heat dissipation effect.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is the stereogram that radiator structure provided in an embodiment of the present invention is arranged in chassis shell body；
Fig. 2 is another stereogram that radiator structure provided in an embodiment of the present invention is arranged in chassis shell body.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Such as Fig. 1-Fig. 2, the embodiment of the present invention provides a kind of radiator structure 1 applied to computer processor, is fixedly connected on
Between chassis shell body 2 and processor (not shown), the radiator structure 1 includes more heat conducting pipes 11, for by the heat conducting pipe
11 housing fixed seats 12 being fixed in the chassis shell body 2 and for the heat conducting pipe 11 to be fixed into processing on a processor
Device fixed seat 13, described one end of heat conducting pipe 11 connect the housing fixed seat 12, and the other end of heat conducting pipe 11 connects the place
Manage device fixed seat 13.Processor is fixed in processor fixed seat 13, as processor computing clock frequency is constantly lifted
High power consumption and high fever can be produced simultaneously, heat can be conducted to the heat conducting pipe 11 by processor fixed seat 13, and then pass through shell
Body fixed seat 12 is conducted heat in chassis shell body 2 so that the radiating efficiency of processor is higher, and operating temperature is not by the external world
The influence of environment, it is not only advantageous to ensure the normal work of processor, improves the performance of computer, colleague also enables computer
The work of higher environment is adapted to, this radiator structure 1 is simple in construction, cost is low, can save space in computer, will not produce noise,
Good heat dissipation effect.
Further, as shown in Figure 1, Figure 2, offered in the processor fixed seat 13 corresponding with the heat conducting pipe 11 more
Individual fixing groove 131, the processor fixed seat 13 are molded using copper or aluminium material, its good heat conductivity；It is described in the present embodiment
Heat conducting pipe 11 has two, and the processor fixed seat 13 is provided with two fixing grooves 131, and each heat conducting pipe 11 is right
It should be weldingly fixed in the fixing groove 131, welding is firm, the place plane of heat conducting pipe 11 and the processor fixed seat 13
Place plane is developed, it is ensured that good heat conductivility, while save space.It should be noted that the number of the heat conducting pipe 11
Amount flexible design, the fixing groove 131 can design according to the quantity of the heat conducting pipe 11 is corresponding according to demand.Further, institute
It is copper pipe to state heat conducting pipe 11, and its good heat conduction effect, cost are low.
Further, as shown in Figure 1, Figure 2, the housing fixed seat 12 is fixedly mounted in the chassis shell body 2 using screw,
Such a mounting means is easy for installation, easy to disassemble；The heat conducting pipe 11 is weldingly fixed in the housing fixed seat 12 so that knot
Structure is relatively more firm；The housing fixed seat 12 is molded using copper or aluminium material, its good heat conductivity.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.
Claims (3)
1. a kind of radiator structure applied to computer processor, being fixedly connected between chassis shell body and processor, its feature exists
In the radiator structure includes more heat conducting pipes, the housing for the heat conducting pipe to be fixed in the chassis shell body is fixed
Seat and for the heat conducting pipe to be fixed into processor fixed seat on a processor, described heat conducting pipe one end connects the housing and consolidated
Reservation, the heat conducting pipe other end connect the processor fixed seat；Offered in the processor fixed seat and the heat conduction
Corresponding multiple fixing grooves are managed, each heat conducting pipe is correspondingly weldingly fixed in the fixing groove；Where the heat conducting pipe
Plane is developed with plane where the processor fixed seat.
2. it is applied to the radiator structure of computer processor as claimed in claim 1, it is characterised in that：The housing fixed seat is adopted
It is screwed in the chassis shell body, the heat conducting pipe is weldingly fixed in the housing fixed seat.
3. the radiator structure applied to computer processor as described in claim any one of 1-2, it is characterised in that：The heat conduction
Manage as copper pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310535461.4A CN104615215B (en) | 2013-11-01 | 2013-11-01 | A kind of radiator structure applied to computer processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310535461.4A CN104615215B (en) | 2013-11-01 | 2013-11-01 | A kind of radiator structure applied to computer processor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104615215A CN104615215A (en) | 2015-05-13 |
| CN104615215B true CN104615215B (en) | 2018-02-23 |
Family
ID=53149709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310535461.4A Expired - Fee Related CN104615215B (en) | 2013-11-01 | 2013-11-01 | A kind of radiator structure applied to computer processor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104615215B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115373477A (en) * | 2021-05-18 | 2022-11-22 | 北京图森智途科技有限公司 | Mounting method of heat dissipation system and related computing device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6459575B1 (en) * | 2001-05-15 | 2002-10-01 | Hewlett-Packard Company | Cooling module for portable computer |
| CN2842542Y (en) * | 2005-08-08 | 2006-11-29 | 东莞东城柏洲边赐得利五金厂 | Cooling device without fan |
| CN201429818Y (en) * | 2009-07-03 | 2010-03-24 | 济南腾越电子有限公司 | External circulating heat radiator for ruggedized computer |
| CN202058080U (en) * | 2011-03-29 | 2011-11-30 | 天津天感科技有限公司 | Small-sized industrial control computer with improved heat radiation effect |
| CN202120894U (en) * | 2011-07-22 | 2012-01-18 | 惠州智科实业有限公司 | Double heat exchange device |
| CN203552161U (en) * | 2013-11-01 | 2014-04-16 | 惠州智科实业有限公司 | Heat dissipation structure applied to computer processor |
-
2013
- 2013-11-01 CN CN201310535461.4A patent/CN104615215B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6459575B1 (en) * | 2001-05-15 | 2002-10-01 | Hewlett-Packard Company | Cooling module for portable computer |
| CN2842542Y (en) * | 2005-08-08 | 2006-11-29 | 东莞东城柏洲边赐得利五金厂 | Cooling device without fan |
| CN201429818Y (en) * | 2009-07-03 | 2010-03-24 | 济南腾越电子有限公司 | External circulating heat radiator for ruggedized computer |
| CN202058080U (en) * | 2011-03-29 | 2011-11-30 | 天津天感科技有限公司 | Small-sized industrial control computer with improved heat radiation effect |
| CN202120894U (en) * | 2011-07-22 | 2012-01-18 | 惠州智科实业有限公司 | Double heat exchange device |
| CN203552161U (en) * | 2013-11-01 | 2014-04-16 | 惠州智科实业有限公司 | Heat dissipation structure applied to computer processor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104615215A (en) | 2015-05-13 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180223 Termination date: 20211101 |
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| CF01 | Termination of patent right due to non-payment of annual fee |