TWI437782B - Electric part and manufacturing method for it - Google Patents

Description

Method for manufacturing electronic parts and electronic parts

The present invention relates to an electronic component in which a plate-shaped metal component is fixed by a resin, and a method of manufacturing the electronic component.

Conventionally, it is known to fix a plate-shaped metal component used for a contact or the like, and to manufacture electronic components used in various electronic devices. When manufacturing such an electronic component, it is required to achieve a miniaturization of the electronic component and to securely fix the plate-shaped metal component without falling off.

Here, in order to securely fix the metal component so as not to fall off, in the first known example, the end surface of the metal pattern plate is formed into a trapezoidal shape by press working on the metal pattern plate, and only one of the rolled faces is exposed. In the manner of covering the metal pattern plate with an insulating resin, the metal pattern plate is prevented from falling off from the insulating resin (for example, paragraphs 0012 and 5 in Patent Document 1).

In the second example, the anchor hole and the unevenness of the cut and raised piece are provided in the desired surface of the metal part to make contact with the injection molding of the resin, and the metal part and the resin are meshed by the uneven surface (for example, Patent Document 2) Paragraph 0005).

In the third example, the metal part is pressed into the object to be mounted (for example, a casing).

[Advanced technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 06-276707

[Patent Document 2] Japanese Laid-Open Patent Publication No. 06-039876

However, in the technique shown in the first example, one surface of the metal pattern plate and the end surface adjacent thereto are covered with a resin, and the metal pattern plate is fixed. Therefore, the thickness of the thin coil device (electronic component) composed of the metal pattern plate and the resin becomes larger than that of the metal pattern plate.

Further, in the second example, it is necessary to review the structure of the concavities and convexities formed on the metal side, the arrangement position, and the like. Further, in this example, the area other than the arrangement position of the concavities and convexities becomes large. In this field, the joint between the metal part and the injection molding resin is weak, and floating is likely to occur. Therefore, as described in Patent Document 1, it is necessary to perform a process of "coating the bonding agent (22) at a substantially uniform thickness on at least the bonding surface of the metal component (21) in which the internal molding is performed (Patent Document 2) Paragraphs 0009, 0101, 0015). Further, in this case, since irregularities are formed in the metal parts, it is impossible to reduce the size and thickness of the electronic parts to be manufactured.

Further, in the third example, in the object to be mounted, it is required to have a predetermined thickness for the metal part to be inserted, and the electronic component to be manufactured is increased in size.

In view of the above, it is an object of the present invention to reliably fix a plate-shaped metal component used for the electronic component without increasing the thickness of the electronic component.

The electronic component of the present invention comprises: (a) a metal component, a plate shape having a predetermined thickness to form a rolling surface of the front and back, and (b) a tip end thinner portion, each of which is disposed across the rolling surface from one of the rolling faces The end surface of the metal part and the rolling surface from the other side straddle the end surface such that the thickness of the end of the metal part is thinner than the predetermined thickness; and (c) resin to the side surface side of the metal part And the metal part is caught by the manner in which the shape of the front end thin portion is joined and hardened.

A method of manufacturing an electronic component according to the present invention includes: (i) a plate-shaped metal component that forms a rolling surface having a front and back that is apart from each other by a predetermined thickness, and each of which faces an end surface of the metal component from one of the rolling faces And a process of forming a tip end thinner portion of the metal part that is thinner than the predetermined thickness from the other end surface of the rolled surface, and (ii) the aforementioned end surface side of the metal part And a process in which the liquid-like resin is disposed around the tip end thin portion and the joints are hardened, and the metal member is held by the resin.

According to the present invention, since the resin protruding toward the tip end portion is held in the thickness direction of the plate-shaped metal member, the thickness of the electronic component is not increased, and the plate-shaped metal member used for the electronic component can be surely fixed.

An embodiment of the implementation will be described with reference to Figs. 1 to 9 . This embodiment is an application example for the camera module socket 101. Further, in the present embodiment, the camera module socket 101 is an "electronic component" equivalent to the scope of the patent application. Moreover, in the present embodiment, the socket housing 102 and the contact member 103 are equivalent to the "metal parts" in the scope of the patent application. Fig. 1 is a perspective view of a camera module socket 101 (electronic component). Fig. 2(a) is a rear view of the camera module socket 101. Fig. 2(b) is a left side view of the camera module socket 101. Fig. 2(c) is a plan view of the camera module socket 101. Fig. 2(d) is a right side view of the camera module socket 101. Fig. 2(e) is a rear view of the camera module socket 101. Fig. 2(f) is a front view of the camera module socket 101.

The camera module socket 101 is used in a small camera module (not shown) that is fitted to an electronic device such as a digital camera. The camera module socket 101 is based on a socket housing 102 having a rectangular parallelepiped shape. The socket housing 102 is formed of a good conductor (conductive) metal member by being in contact with the camera module. The socket housing 102 is a side wall 102a having an inner space forming a rectangular parallelepiped shape, and one surface is opened, and a plurality of contacts 103 are disposed on the other surface (bottom surface).

The contact member 103 is formed by molding a metal plate having a good conductor having elasticity and bending a part thereof. The contact member 103 has a rectangular shape which is regarded as an elongated plane. The contact portion 104 extends from one end portion of the contact member 103 toward the inner side of the contact member 103. The contact portion 104 is bent and raised from the bottom surface of the socket housing 102 toward the opening side of the socket housing 102. Thereby, in the contact 103, the opening portion 104a is formed at the contact portion 104 before standing. Further, the substrate connecting portion 105 protrudes from the other end of the contact 103. The board connecting portion 105 protrudes outward from the side wall 102a of the socket housing 102, and is fixed to an electronic circuit board (not shown) provided in the electronic device by soldering or the like. The contact member 103 is formed in two rows on the bottom surface of the camera module socket 101, and the contact row 103a in which the long sides thereof face each other in a row.

The first latch 106 and the second latch 107 are formed in each of the four side walls 102a of the socket housing 102. The first latch 106 and the second latch 107 both hang down from the upper wire portion 102aa of the side wall 102a, whereby the vicinity of the upper wire portion 102aa is bent toward the inner side of the socket housing 102. Further, each of the first latch 106 and the second latch 107 has a retaining portion 108 which is formed to be bent toward the side wall 102a at the lower end portion thereof. The retaining portion 108 catches a locking claw (not shown) in the camera module 301 (refer to FIG. 3) into which the opening of the socket housing 102 is inserted, and stops the camera module 301. Further, the terminal portion (not shown) of the camera module 301 that has been stopped is in contact with the contact portion 104.

FIG. 3 is a perspective view showing a part of the bottom surface of the camera module socket 101. In the camera module socket 101, the resin 151 which is liquefied by heating and melting is ejected toward the space between the socket housing 102 and the contact member 103 and toward the contact member 103, whereby the resin 151 is hardened. The positional relationship of the socket housing 102 and the contact member 103 is fixed.

Fig. 4 is a perspective view showing a part of the camera module socket 101 before the resin 151 is injected and injected. Fig. 5 is a plan view of the contact member 103. Fig. 7 is a cross-sectional view taken along line A-A of Fig. 5 showing a state in which the resin 151 is injected and hardened. The contact member 103 has a plate shape and has a calendering surface of the front and back. Among these rolling surfaces, the rolling surface that faces the opening side of the socket housing 102 is also referred to as a first rolling surface 201 hereinafter. Further, the rolling surface on the side different from the first rolling surface 201 is also referred to as a second rolling surface 202 hereinafter. The first rolling surface 201 and the second rolling surface 202 are separated only by the thickness distance d (refer to FIG. 6). The first rolling surface 201, the end surface 203 of the contact 103, and the second rolling surface 202 are continuous.

The contact member 103 is a recessed hole 204 formed in a keyhole shape. The recessed hole 204 has a large diameter portion 205 and a small diameter portion 206. The large diameter portion 205 is opened in a substantially circular shape in the contact member 103, and penetrates the second rolling surface 202 from the first rolling surface 201. The small diameter portion 206 connects the end surface 203 and the large diameter portion 205. The recessed hole 204 is provided at two opposite sides of the two long sides of the end portion of the contact member 103 on the substrate connecting portion 105 side, and on the opposite side of the substrate connecting portion 105 of the contact member 103. End field (see also Figure 1).

A portion of the contact member 103 that forms the edge of the small diameter portion 206 is formed with a tip end thin portion 207. The tip end thin portion 207 is an inclined surface, and is provided at a position that extends from the first rolling surface 201 across the end surface 203 and from the second rolling surface 202 to the end surface 203. These tip end thinner portions 207 are provided on the first rolling surface 201 and the second rolling surface 202, respectively, and are provided so that the contact members 103 are held facing each other. The tip end thin portion 207 is inclined toward the inner side of the contact member 103 such that the thickness of the end portion of the contact member 103 is thinner than the thickness distance d. One example of such a tip end thin portion 207 is formed by stamping. An example of the thickness of the end portion of the contact member 103 is one-third of the thickness distance of the contact member 103 (the separation distance between the first rolling surface 201 and the second rolling surface 202).

The recessed hole 204 is also provided in the socket housing 102 as shown in FIG. In this case, the recessed hole 204 provided in the socket housing 102 communicates with the inner space and the outer space partitioned by the socket housing 102, and the small diameter portion 206 is provided in the socket housing 102 so as to communicate with the lower end of the socket housing 102. Further, a portion of the socket housing 102 where the edge of the small diameter portion 206 is formed is also formed with a tip end portion 207.

Refer to Figure 6. The resin 151 is in a state of being liquefied by heating and melting, and the socket housing 102 and the contact 103 are placed in a state of being housed in a mold (not shown). It is important here that the liquefied resin 151 is disposed in the space region adjacent to the end surface 203 of the contact member 103 and the space region adjacent to the tip end portion 207, and the shape is surrounded by the end surface 203 and the tip end portion 207. The point of hardening in the connected state. As a result, the hardened resin 151 is in profile The shape of the word is shaped to hold the contact member 103 from its thickness.

However, as shown in FIG. 3 and FIG. 6, the resin 151 is molded in a state in which the first rolling surface 201 and the second rolling surface 202 of the contact member 103 protrude in the thickness direction of the contact member 103. Thereby, the contact 103 can be prevented from being short-circuited with the camera module 301 inserted into the socket housing 102. Further, it is also possible to prevent short-circuiting with the metal body 302 disposed on the outer side of the camera module socket 101 and close to the contact 103.

Fig. 7 is a cross-sectional view showing a recessed hole 204 formed in the socket housing 102 in a hardened state in which the resin 151 is injected and injected. The resin 151 which is hardened in the recess 204 formed in the socket housing 102 is formed on one side with the socket housing 102. Even if the resin 151 is not formed to protrude from the surface (rolling surface) of the socket housing 102, as long as a profile is formed In the shape of a word, the socket housing 102 can be held in its thickness direction.

Thus, in the camera module socket 101 of the present embodiment, the front end thin portion 207 protrudes and is sectioned. The resin 151 shaped in a word shape holds the plate-shaped contact member 103 and the socket housing 102 in a thickness direction thereof. Therefore, the thickness of the plate-shaped contact member 103 and the socket housing 102 is not increased, and the metal member such as the plate-like contact member 103 and the socket housing 102 used in the camera module socket 101 can be surely fixed.

Further, in the camera module socket 101 of the present embodiment, the keyhole-shaped recessed holes 204 are formed in the socket housing 102 and the contact member 103, and since the resin 151 is hardened therein, the resin 151 is not only removed from the metal plate. The thickness direction does not fall off from the plane direction.

Further, in the camera module socket 101 of the present embodiment, since the tip end thin portion 207 is formed at the edge of the socket housing 102 and the contact member 103 for forming the small diameter portion 206 of the keyhole-shaped recess hole 204, Therefore, the connection between the socket housing 102 and the contact member 103 by forming the tip end portion 207 slightly can stabilize the resin 151, and the efficiency of manufacturing the camera module socket 101 can be achieved.

Fig. 8 is a cross-sectional view showing a modification of the tip end portion 207 provided in the contact member 103. The tip end thin portion 207 is not limited to the inclined surface inclined from the first rolling surface 201 and the second rolling surface 202 as shown in FIGS. 6 and 7 , and the shape in which the contact 103 is caught from the thickness direction thereof may be used. . In one example, as shown in Fig. 8, the tip end thinner portion 207 is provided on each of the first rolling surface 201 and the second rolling surface 202 of the contact member 103, and a slit extending from the end surface 203 toward the plane of the contact member 103 is also formed. can. Further, it is of course possible to form such a tip end portion 207 in the socket housing 102.

Fig. 9 is a cross-sectional view showing a modification of the recess 204 formed in the contact 103. The recessed hole 204 is not limited to the keyhole shape in which the large diameter portion 205 and the small diameter portion 206 are connected, and the interval between the hole portions in the vicinity of the end surface 203 of the contact 103 may be narrow. As an example, as shown in FIG. 9, the large diameter portion 205 may be formed in a triangular shape having a small diameter portion 206. Further, it is of course also possible to form such a recessed hole 204 in the socket housing 102.

101. . . Camera module socket (electronic parts)

102. . . Socket housing (metal parts)

102a. . . Side wall

102aa. . . Online department

103. . . Contact (metal part)

103a. . . Contact column

104. . . Contact

104a. . . Opening

105. . . Substrate connection

106. . . Card lock

107. . . Card lock

108. . . Stopping part

151. . . Resin

201. . . First rolling surface

202. . . Second rolling surface

203. . . End face

204. . . Concave hole

205. . . Most of the path

206. . . Small section

207. . . Apex finer

301. . . Camera module

302. . . Metal body

d. . . Thickness distance

[Fig. 1] An external perspective view of a camera module socket (electronic component).

[Fig. 2] (a) is a rear view of the camera module socket. (b) is the left side view of the camera module socket. (c) is a plan view of the camera module socket. (d) is the right side view of the camera module socket. (e) is a rear view of the camera module socket. (f) is a front view of the camera module socket.

[Fig. 3] A perspective view showing a part of the bottom surface of the camera module socket.

[Fig. 4] A perspective view showing a part of the camera module socket before the resin is injected and injected.

[Fig. 5] A plan view of the contact.

[Fig. 6] A cross-sectional view taken along line A-A of Fig. 5 showing a state in which resin is injected and hardened.

[Fig. 7] A cross-sectional view of a recess formed in a socket housing in a state in which resin is injected and hardened.

[Fig. 8] A cross-sectional view showing a modification of the tip end portion of the contact member.

[Fig. 9] A cross-sectional view showing a modification of the concave hole formed in the contact.

101. . . Camera module socket (electronic parts)

102. . . Socket housing (metal parts)

103. . . Contact (metal part)

105. . . Substrate connection

201. . . Calendering surface

204. . . Concave hole

205. . . Most of the path

206. . . Small section

207. . . Apex finer

Claims (3)

An electronic component comprising: a plate-shaped metal part, forming a rolling surface of a front and back having a predetermined thickness away from each other; and a tip end thinner portion respectively disposed at an end surface of the metal part from one of the rolling surfaces and from the end surface of the metal part The other rolling surface is formed so as to extend across the end surface such that the thickness of the end of the metal part is thinner than the predetermined thickness; and the resin is hardened by a shape in which the end surface side of the metal part and the thin end of the tip end are surrounded. The metal part is clamped, and the metal part is a recessed hole having a keyhole shape, and the recessed hole has a large diameter portion penetrating through each of the rolling surfaces, and a diameter connecting the end surface and the large diameter portion The small portion, the tip end thin portion, is formed at an edge portion of the metal member forming the small diameter portion. The electronic component according to claim 1, wherein the tip end thin portion is an inclined surface that is inclined from the rolling surface toward an inner side of the metal plate. The electronic component according to claim 1 or 2, wherein the resin protrudes from at least one of the rolling faces toward a thickness direction of the metal component.