JP2011129256A - Electronic component and manufacturing method of the electronic component - Google Patents

Electronic component and manufacturing method of the electronic component Download PDF

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JP2011129256A
JP2011129256A JP2009283698A JP2009283698A JP2011129256A JP 2011129256 A JP2011129256 A JP 2011129256A JP 2009283698 A JP2009283698 A JP 2009283698A JP 2009283698 A JP2009283698 A JP 2009283698A JP 2011129256 A JP2011129256 A JP 2011129256A
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metal part
metal
contact
resin
electronic component
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JP5013296B2 (en
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Kiyoshi Asai
浅井　　清
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SMK Corp
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SMK Corp
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Priority to JP2009283698A priority Critical patent/JP5013296B2/en
Priority to KR1020100045331A priority patent/KR101284641B1/en
Priority to TW099129702A priority patent/TWI437782B/en
Priority to CN2010105711410A priority patent/CN102148442B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K3/00—Details of windings
    • H02K3/04—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K3/00—Details of windings
    • H02K3/46—Fastening of windings on the stator or rotor structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Connecting Device With Holders (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To fix platy metal components used for an electronic component, without fail, without increasing the thickness of the electric component. <P>SOLUTION: Pointed parts 207 are formed at an end part of the front and rear rolling surfaces of platy metal components, such as, a socket housing 102 or a contact 103 (a first rolling surface 201, a second rolling surface 202). The pointed parts 207 are provided at a site extending from the first rolling surface 201 over an end surface 203 of the metal component, and a site from the second rolling surface 202 extending over an end surface 203, respectively. The thickness of the endmost part of the metal component is made thinner than a predetermined thickness of the metal component. Resin 151 hardens to have a shape continuing to surround the end surface 203 side of the metal component and the pointed parts 207 and pinches the metal component in its thickness direction. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、板状の金属部品を樹脂で固定して形成される電子部品、及び、この電子部品の製造方法に関する。   The present invention relates to an electronic component formed by fixing a plate-shaped metal component with a resin, and a method for manufacturing the electronic component.

従来、接点等に用いられる板状の金属部品を固定して、各種の電子機器に用いる電子部品を製造することが行われている。このような電子部品を製造するに際し、電子部品の小型化を図りつつも、板状の金属部品が外れないように確実に固定することが求められる。   2. Description of the Related Art Conventionally, it has been performed to manufacture electronic components used in various electronic devices by fixing plate-like metal components used for contacts and the like. When manufacturing such an electronic component, it is required to securely fix the plate-shaped metal component so as not to come off while reducing the size of the electronic component.

ここで、金属部品が外れないように確実に固定するために、第一の例として、金属パターン板に面打ち加工を施してこの金属パターン板の端面を台形状にし、一方の圧延面のみが露出するように金属パターン板を絶縁樹脂で覆って、金属パターン板が絶縁樹脂から抜けるのを防ぐことが知られている（例えば、特許文献１の段落００１２及び図５）。   Here, in order to securely fix the metal part so as not to come off, as a first example, the metal pattern plate is subjected to a beveling process so that the end surface of the metal pattern plate is trapezoidal, and only one rolling surface is provided. It is known that the metal pattern plate is covered with an insulating resin so as to be exposed to prevent the metal pattern plate from coming out of the insulating resin (for example, paragraph 0012 and FIG. 5 of Patent Document 1).

また、第二の例として、金属部品の表面所要域にアンカ孔や切り起こし片の凹凸を設け樹脂の射出成形に当たって該凹凸領域で金属部品と樹脂とを噛み合せることが知られている（例えば、特許文献２の段落０００５）。   In addition, as a second example, it is known that an uneven portion of an anchor hole or a cut and raised piece is provided in a required surface area of a metal part, and the metal part and the resin are meshed in the uneven area when the resin is injection molded (for example, (Patent Document 2, paragraph 0005).

また、第三の例として、被取付対象物（例えば、ケース体）に金属部品を圧入することも考えられる。   As a third example, it is also conceivable to press-fit a metal part into an attachment target (for example, a case body).

特開平０６−２７６７０７号公報Japanese Patent Laid-Open No. 06-276707 特開平０６−０３９８７６号公報Japanese Patent Application Laid-Open No. 06-039876

しかしながら、第一の例に示される技術は、金属パターン板の一方の面とこれに隣り合う端面とを樹脂で覆って、金属パターン板を固定するものである。このため、金属パターン板と樹脂とで構成される薄型コイル装置（電子部品）の厚さが金属パターン板よりも大きくなってしまう。   However, the technique shown in the first example is to fix the metal pattern plate by covering one surface of the metal pattern plate and the end surface adjacent thereto with resin. For this reason, the thickness of the thin coil apparatus (electronic component) comprised with a metal pattern board and resin will become larger than a metal pattern board.

また、第二の例では、金属側に形成する凹凸の形状や配置位置等の構造的検討が必要となる。また、この例では、凹凸の配置位置以外の領域が大きくなる。この領域では、金属部品と射出成形樹脂間の接着が弱く、浮きが生じやすい。このため、特許文献１に記載されているように、「インモールド成形を行わしめる金属部品（２１）の少なくとも樹脂との接合面に接着剤（２２）をほぼ均一にした厚さに塗布」する工程が必要となる（特許文献２の段落０００９、００１１、００１５）。さらに、この場合、金属部品に凹凸を形成するため、製造される電子部品を小型化、薄型化することができない。   Further, in the second example, it is necessary to examine the structure such as the shape and arrangement position of the unevenness formed on the metal side. In this example, the area other than the arrangement position of the unevenness becomes large. In this region, the adhesion between the metal part and the injection-molded resin is weak, and floating tends to occur. For this reason, as described in Patent Document 1, “apply the adhesive (22) to a substantially uniform thickness on at least the joint surface with the resin of the metal part (21) to be molded in-mold”. A process is required (paragraphs 0009, 0011, and 0015 of Patent Document 2). Further, in this case, since the metal parts are uneven, the manufactured electronic parts cannot be reduced in size and thickness.

また、第三の例では、被取付対象物には、金属部品を挟み込むための所定の厚みが必要となり、製造される電子部品が大型化してしまう。   Further, in the third example, the attached object requires a predetermined thickness for sandwiching the metal part, and the manufactured electronic part becomes large.

本発明の目的は、上記の点を鑑みてなされたものであり、電子部品の厚みを増すことなく、この電子部品に用いる板状の金属部品を確実に固定することを目的とする。   An object of the present invention is made in view of the above points, and an object of the present invention is to reliably fix a plate-like metal component used for an electronic component without increasing the thickness of the electronic component.

本発明の電子部品は、（ａ）所定厚さだけ互いに離れた表裏の圧延面を形成する板状の金属部品と、（ｂ）一方の前記圧延面から前記金属部品の端面にかける箇所と他方の前記圧延面から前記端面にかける箇所とのそれぞれに設けられ、前記金属部品の最端の厚さを前記所定厚さよりも薄くする先細部と、（ｃ）前記金属部品の前記端面側と前記先細部と取り囲む形状に連なって硬化し前記金属部品を挟む樹脂と、を備える。   The electronic component according to the present invention includes (a) a plate-like metal component that forms a rolled surface on the front and back surfaces separated from each other by a predetermined thickness, and (b) a portion that extends from one rolled surface to the end surface of the metal component and the other. Each end of the metal part is made thinner than the predetermined thickness; (c) the end face side of the metal part; And a resin that is cured in a shape that surrounds the taper and sandwiches the metal part.

本発明の電子部品の製造方法は、（ｉ）所定厚さだけ互いに離れた表裏の圧延面を形成する板状の金属部品に対して、一方の前記圧延面から前記金属部品の端面にかける箇所と他方の前記圧延面から前記端面にかける箇所とのそれぞれに、前記金属部品の最端の厚さを前記所定厚さよりも薄くする先細部を形成する工程と、（ｉｉ）前記金属部品の前記端面側と前記先細部とを取り囲む箇所に液状の樹脂を配置しこれらを連ねて硬化させ、前記樹脂に前記金属部品を挟みこませる工程と、を備える。   The method of manufacturing an electronic component according to the present invention includes: (i) a plate-like metal part that forms front and back rolled surfaces separated from each other by a predetermined thickness, and a portion that is applied from one of the rolled surfaces to the end surface of the metal component. Forming a taper that makes the thickness of the outermost end of the metal part thinner than the predetermined thickness at each of the portions from the other rolled surface to the end face, and (ii) the metal part A step of placing a liquid resin at a portion surrounding the end face side and the tapered portion, curing them in a continuous manner, and sandwiching the metal part in the resin.

本発明によれば、先細部に迫り出した樹脂が板状の金属部品をその厚さ方向に挟んで保持するため、電子部品の厚みを増すことなく、この電子部品に用いる板状の金属部品を確実に固定することができる。   According to the present invention, since the resin approaching the fine details holds the plate-like metal component in the thickness direction, the plate-like metal component used for the electronic component is not increased without increasing the thickness of the electronic component. Can be securely fixed.

カメラモジュールソケット（電子部品）の外観斜視図である。It is an external appearance perspective view of a camera module socket (electronic component). （ａ）は、カメラモジュールソケットの背面図である。（ｂ）は、カメラモジュールソケットの左側面図である。（ｃ）は、カメラモジュールソケットの平面図である。（ｄ）は、カメラモジュールソケットの右側面図である。（ｅ）は、カメラモジュールソケットの背面図である。（ｆ）は、カメラモジュールソケットの正面図である。(A) is a rear view of a camera module socket. (B) is a left side view of the camera module socket. (C) is a top view of a camera module socket. (D) is a right side view of the camera module socket. (E) is a rear view of a camera module socket. (F) is a front view of a camera module socket. カメラモジュールソケットの底面の一部を示す斜視図である。It is a perspective view which shows a part of bottom face of a camera module socket. 樹脂が射出注入される前のカメラモジュールソケットの一部を示す斜視図である。It is a perspective view which shows a part of camera module socket before resin is inject-injected. コンタクトの平面図である。It is a top view of a contact. 樹脂を射出注入して硬化させた状態の、図５のＡ−Ａ線断面図である。It is the sectional view on the AA line of FIG. 5 of the state which injected and injected resin and hardened. 樹脂を射出注入して硬化させた状態の、ソケットハウジングに形成された凹孔の断面図である。It is sectional drawing of the concave hole formed in the socket housing of the state which injected and injected resin and was hardened. コンタクトに設けられた先細部の変形例を示す断面図である。It is sectional drawing which shows the modification of the taper provided in the contact. コンタクトに形成された凹孔の変形例を示す断面図である。It is sectional drawing which shows the modification of the concave hole formed in the contact.

実施の一形態を、図１ないし図９に基づいて説明する。本実施の形態は、カメラモジュールソケット１０１への適用例である。そして、本実施の形態では、カメラモジュールソケット１０１が、特許請求の範囲における「電子部品」に相当する。また、本実施の形態では、ソケットハウジング１０２及びコンタクト１０３は、いずれも、特許請求の範囲における「金属部品」に相当する。図１は、カメラモジュールソケット１０１（電子部品）の斜視図である。図２（ａ）は、カメラモジュールソケット１０１の背面図である。図２（ｂ）は、カメラモジュールソケット１０１の左側面図である。図２（ｃ）は、カメラモジュールソケット１０１の平面図である。図２（ｄ）は、カメラモジュールソケット１０１の右側面図である。図２（ｅ）は、カメラモジュールソケット１０１の背面図である。図２（ｆ）は、カメラモジュールソケット１０１の正面図である。   One embodiment will be described with reference to FIGS. This embodiment is an application example to the camera module socket 101. In this embodiment, the camera module socket 101 corresponds to an “electronic component” in the claims. In the present embodiment, both the socket housing 102 and the contacts 103 correspond to “metal parts” in the claims. FIG. 1 is a perspective view of a camera module socket 101 (electronic component). FIG. 2A is a rear view of the camera module socket 101. FIG. 2B is a left side view of the camera module socket 101. FIG. 2C is a plan view of the camera module socket 101. FIG. 2D is a right side view of the camera module socket 101. FIG. 2E is a rear view of the camera module socket 101. FIG. 2F is a front view of the camera module socket 101.

カメラモジュールソケット１０１は、デジタルカメラ等の電子機器に備わる小型のカメラモジュール（図示せず）に嵌合されて用いられる。カメラモジュールソケット１０１は、直方体形状のソケットハウジング１０２を基本とする。このソケットハウジング１０２は、カメラモジュールと接触することでアースできるよう、良導体の金属部材で形成される。ソケットハウジング１０２は、直方体形状の内空間を形成する側壁１０２ａを有し、一方の面を開口させ、他方の面（底面）に複数のコンタクト１０３を配置する。   The camera module socket 101 is used by being fitted into a small camera module (not shown) provided in an electronic device such as a digital camera. The camera module socket 101 is based on a rectangular parallelepiped socket housing 102. The socket housing 102 is formed of a metal member having a good conductor so that it can be grounded by coming into contact with the camera module. The socket housing 102 has a side wall 102a that forms a rectangular parallelepiped inner space, opens one surface, and arranges a plurality of contacts 103 on the other surface (bottom surface).

コンタクト１０３は、バネ性を有する良導体の金属板をプレスし、その一部を折曲して形成される。コンタクト１０３は、平面視において細長い矩形形状に見える。このコンタクト１０３の一方の端部からは、接触部１０４が、このコンタクト１０３の内側方向に延出する。接触部１０４は、ソケットハウジング１０２の底面からソケットハウジング１０２の開口側に折曲されて起立する。これにより、コンタクト１０３には、起立する前の接触部１０４があった箇所に、開口部１０４ａを形成する。また、コンタクト１０３の他端からは、基板接続部１０５が突出する。基板接続部１０５は、ソケットハウジング１０２の側壁１０２ａから外方へ突出し、ハンダ付け等によって電子機器に備わる電子回路基板（図示せず）に固定される。コンタクト１０３は、カメラモジュールソケット１０１の底面で、その長辺同士を向かい合わせるように列状に並ぶコンタクト列１０３ａを二列形成する。   The contact 103 is formed by pressing a metal plate of a good conductor having spring properties and bending a part thereof. The contact 103 looks like an elongated rectangular shape in plan view. From one end portion of the contact 103, a contact portion 104 extends inward of the contact 103. The contact portion 104 is bent from the bottom surface of the socket housing 102 to the opening side of the socket housing 102 and stands up. As a result, an opening 104a is formed in the contact 103 at a location where the contact portion 104 before rising was present. Further, the board connecting portion 105 protrudes from the other end of the contact 103. The board connecting portion 105 protrudes outward from the side wall 102a of the socket housing 102, and is fixed to an electronic circuit board (not shown) provided in the electronic device by soldering or the like. The contacts 103 form two contact rows 103a arranged in a row on the bottom surface of the camera module socket 101 so that the long sides thereof face each other.

ソケットハウジング１０２の四方の側壁１０２ａのそれぞれには、第１のラッチ１０６と第２のラッチ１０７とが形成される。第１のラッチ１０６も第２のラッチ１０７も、側壁１０２ａの上縁部１０２ａａから垂下し、この上縁部１０２ａａの近傍部分でソケットハウジング１０２の内側に向けて折曲される。さらに、第１のラッチ１０６も第２のラッチ１０７も、その下端部分に、側壁１０２ａ側に折曲させて形成された抜止部１０８を有する。抜止部１０８は、ソケットハウジング１０２の開口から挿入されたカメラモジュール３０１（図３参照）に備わる係止爪（図示せず）に引っかかり、このカメラモジュール３０１の抜止めをする。そして、抜止めされたカメラモジュール３０１に備わる端子部（図示せず）は、接触部１０４に接触する。   A first latch 106 and a second latch 107 are formed on each of the four side walls 102 a of the socket housing 102. Both the first latch 106 and the second latch 107 hang down from the upper edge portion 102aa of the side wall 102a, and are bent toward the inside of the socket housing 102 in the vicinity of the upper edge portion 102aa. Further, both the first latch 106 and the second latch 107 have a retaining portion 108 formed at the lower end portion thereof by being bent toward the side wall 102a. The retaining portion 108 is caught by a locking claw (not shown) provided in the camera module 301 (see FIG. 3) inserted from the opening of the socket housing 102, and prevents the camera module 301 from being removed. Then, a terminal portion (not shown) provided in the camera module 301 that has been prevented from coming into contact comes into contact with the contact portion 104.

図３は、カメラモジュールソケット１０１の底面の一部を示す斜視図である。カメラモジュールソケット１０１では、加熱溶融によって液化した樹脂１５１をソケットハウジング１０２とコンタクト１０３との間、及び、コンタクト１０３同士の間の空間に射出し、この樹脂１５１が硬化することによって、ソケットハウジング１０２とコンタクト１０３との位置関係が固定される。   FIG. 3 is a perspective view showing a part of the bottom surface of the camera module socket 101. In the camera module socket 101, the resin 151 liquefied by heating and melting is injected into the space between the socket housing 102 and the contact 103 and between the contacts 103, and the resin 151 is cured, whereby the socket housing 102 The positional relationship with the contact 103 is fixed.

図４は、樹脂１５１が射出注入される前のカメラモジュールソケット１０１の一部を示す斜視図である。図５は、コンタクト１０３の平面図である。図７は、樹脂１５１を射出注入して硬化させた状態の、図５のＡ−Ａ線断面図である。コンタクト１０３は、板状であって、表裏の圧延面を有する。これらの圧延面のうち、ソケットハウジング１０２の開口側を向く圧延面を、以下、第１の圧延面２０１と呼ぶことがある。また、第１の圧延面２０１とは異なる側の圧延面を、以下、第２の圧延面２０２と呼ぶことがある。第１の圧延面２０１と第２の圧延面２０２とは、厚さ距離ｄ（図６参照）だけ離間している。第１の圧延面２０１と、コンタクト１０３の端面２０３と、第２の圧延面２０２とは、連続している。   FIG. 4 is a perspective view showing a part of the camera module socket 101 before the resin 151 is injected and injected. FIG. 5 is a plan view of the contact 103. 7 is a cross-sectional view taken along line AA of FIG. 5 in a state where the resin 151 is injected and cured. The contact 103 is plate-shaped and has front and back rolling surfaces. Of these rolling surfaces, the rolling surface facing the opening side of the socket housing 102 may be hereinafter referred to as a first rolling surface 201. In addition, a rolling surface on a side different from the first rolling surface 201 may be hereinafter referred to as a second rolling surface 202. The first rolling surface 201 and the second rolling surface 202 are separated by a thickness distance d (see FIG. 6). The first rolling surface 201, the end surface 203 of the contact 103, and the second rolling surface 202 are continuous.

コンタクト１０３は、鍵穴状の凹孔２０４を形成する。凹孔２０４は、径大部２０５と径小部２０６とを有する。径大部２０５は、コンタクト１０３に略真円形状に開口し、第１の圧延面２０１から第２の圧延面２０２に貫通している。径小部２０６は、端面２０３と径大部２０５とを連絡する。このような凹孔２０４は、コンタクト１０３における基板接続部１０５側の端部領域で二つの長辺のそれぞれにおいて対称となる二箇所と、コンタクト１０３における基板接続部１０５とは反対側の端部領域とに設けられる（図１も参照）。   The contact 103 forms a keyhole-shaped concave hole 204. The concave hole 204 has a large diameter portion 205 and a small diameter portion 206. The large-diameter portion 205 opens in a substantially circular shape in the contact 103 and penetrates from the first rolling surface 201 to the second rolling surface 202. The small diameter portion 206 connects the end surface 203 and the large diameter portion 205. Such a concave hole 204 is formed in two positions in the end region on the substrate connecting portion 105 side in the contact 103 that are symmetrical on each of the two long sides, and in the end region on the opposite side of the contact 103 from the substrate connecting portion 105. (See also FIG. 1).

コンタクト１０３において径小部２０６を形成する縁の部分には、先細部２０７が形成される。先細部２０７は、第１の圧延面２０１から端面２０３にかける箇所と、第２の圧延面２０２から端面２０３にかける箇所とのそれぞれに設けられる傾斜面である。これらの先細部２０７は、第１の圧延面２０１及び第２の圧延面２０２のそれぞれで、コンタクト１０３を挟んで対向する箇所に設けられる。先細部２０７は、コンタクト１０３の内側方向に傾斜して、コンタクト１０３の最端部分の厚さを、厚さ距離ｄよりも薄くする。このような先細部２０７は、一例として、面打ちで形成される。コンタクト１０３の最端部分の厚さの一例は、コンタクト１０３の厚さ距離（第１の圧延面２０１と第２の圧延面２０２との離間距離）の３分の１である。   A tapered portion 207 is formed at an edge portion of the contact 103 forming the small diameter portion 206. The tapered portion 207 is an inclined surface provided at each of a portion extending from the first rolling surface 201 to the end surface 203 and a portion extending from the second rolling surface 202 to the end surface 203. These tapered portions 207 are provided at locations facing each other across the contact 103 on each of the first rolling surface 201 and the second rolling surface 202. The tapered portion 207 is inclined toward the inner side of the contact 103 so that the thickness of the endmost portion of the contact 103 is smaller than the thickness distance d. Such a taper 207 is formed by face-to-face as an example. An example of the thickness of the outermost portion of the contact 103 is one third of the thickness distance of the contact 103 (the separation distance between the first rolling surface 201 and the second rolling surface 202).

凹孔２０４は、図４に示すように、ソケットハウジング１０２にも設けられる。この場合、ソケットハウジング１０２に設けられる凹孔２０４は、ソケットハウジング１０２によって仕切られた内側空間と外側空間とを連通し、ソケットハウジング１０２の下端に径小部２０６が連通するよう、ソケットハウジング１０２に設けられる。そして、このソケットハウジング１０２において径小部２０６を形成する縁の部分にも、先細部２０７が形成される。   The concave hole 204 is also provided in the socket housing 102 as shown in FIG. In this case, the concave hole 204 provided in the socket housing 102 communicates the inner space and the outer space partitioned by the socket housing 102, and the small diameter portion 206 communicates with the lower end of the socket housing 102. Provided. A tapered portion 207 is also formed at the edge portion of the socket housing 102 that forms the small diameter portion 206.

図６を参照する。樹脂１５１は、加熱溶融されて液化した状態で、金型（図示せず）内に収納された状態のソケットハウジング１０２及びコンタクト１０３に対して射出される。ここで重要なのは、コンタクト１０３の端面２０３に隣接する空間領域と先細部２０７に隣接する空間領域とのそれぞれに液化された樹脂１５１を配置し、端面２０３と先細部２０７とを取り囲む形状に連ねた状態で硬化させる、という点である。その結果、硬化した樹脂１５１は、断面コ字形状に成形され、コンタクト１０３をその厚さ方向に挟み込んで固定する。   Please refer to FIG. The resin 151 is injected into the socket housing 102 and the contact 103 in a state of being housed in a mold (not shown) in a state of being melted by heating and liquefying. What is important here is that the liquefied resin 151 is arranged in each of the space region adjacent to the end surface 203 of the contact 103 and the space region adjacent to the tip detail 207, and is connected to the shape surrounding the end surface 203 and the tip detail 207. It is a point of hardening in a state. As a result, the cured resin 151 is formed into a U-shaped cross section, and the contact 103 is sandwiched and fixed in the thickness direction.

ところで、図３及び図６に示すように、樹脂１５１は、コンタクト１０３の第１の圧延面２０１及び第２の圧延面２０２からコンタクト１０３の厚さ方向に突出した状態で成形される。これにより、コンタクト１０３とソケットハウジング１０２に挿入されたカメラモジュール３０１とのショートが防止される。また、カメラモジュールソケット１０１の外側に配置されコンタクト１０３に近接した金属体３０２とのショートも防止される。   Incidentally, as shown in FIGS. 3 and 6, the resin 151 is molded in a state of protruding from the first rolling surface 201 and the second rolling surface 202 of the contact 103 in the thickness direction of the contact 103. Thereby, a short circuit between the contact 103 and the camera module 301 inserted into the socket housing 102 is prevented. Further, a short circuit with the metal body 302 disposed outside the camera module socket 101 and in the vicinity of the contact 103 is also prevented.

図７は、樹脂１５１を射出注入して硬化させた状態の、ソケットハウジング１０２に形成された凹孔２０４の断面図である。ソケットハウジング１０２に形成された凹孔２０４内で硬化した樹脂１５１は、ソケットハウジング１０２と面一をなしている。このように樹脂１５１をソケットハウジング１０２の表面（圧延面）から突出せずに成形されても、断面コ字形状をなしていれば、ソケットハウジング１０２をその厚さ方向に挟み込んで固定する。   FIG. 7 is a cross-sectional view of the concave hole 204 formed in the socket housing 102 in a state where the resin 151 is injected and injected and cured. The resin 151 cured in the concave hole 204 formed in the socket housing 102 is flush with the socket housing 102. Even if the resin 151 is molded without protruding from the surface (rolling surface) of the socket housing 102 as described above, the socket housing 102 is sandwiched and fixed in the thickness direction as long as it has a U-shaped cross section.

このように、本実施の形態のカメラモジュールソケット１０１では、先細部２０７に迫り出して断面コ字形状に成形された樹脂１５１が板状のコンタクト１０３やソケットハウジング１０２をその厚さ方向に挟んで保持する。このため、板状のコンタクト１０３やソケットハウジング１０２の厚みを増すことなく、このカメラモジュールソケット１０１に用いる板状のコンタクト１０３やソケットハウジング１０２等の金属部品を確実に固定することができる。   As described above, in the camera module socket 101 according to the present embodiment, the resin 151 formed in a U-shaped cross-section protruding from the tip 207 sandwiches the plate-like contact 103 and the socket housing 102 in the thickness direction. Hold. Therefore, metal parts such as the plate-like contact 103 and the socket housing 102 used for the camera module socket 101 can be securely fixed without increasing the thickness of the plate-like contact 103 and the socket housing 102.

さらに、本実施の形態のカメラモジュールソケット１０１では、ソケットハウジング１０２やコンタクト１０３に鍵穴状の凹孔２０４が形成され、この中に樹脂１５１が入り込んだ後に硬化するため、金属板の厚み方向のみならず、その平面方向にも樹脂１５１が外れることはない。   Furthermore, in the camera module socket 101 of the present embodiment, a keyhole-shaped concave hole 204 is formed in the socket housing 102 and the contact 103, and the resin 151 is cured after entering into the socket housing 102 or the contact 103. In addition, the resin 151 does not come off in the planar direction.

さらに、本実施の形態のカメラモジュールソケット１０１では、先細部２０７を、鍵穴状の凹孔２０４の径小部２０６を形成するソケットハウジング１０２やコンタクト１０３の縁部に形成するために、ソケットハウジング１０２やコンタクト１０３にわずかに先細部２０７を形成するだけで樹脂１５１の連結を強固にすることが可能になり、カメラモジュールソケット１０１の製造の効率化が図られる。   Furthermore, in the camera module socket 101 of the present embodiment, the socket housing 102 is formed in order to form the tapered portion 207 at the edge of the socket housing 102 or the contact 103 that forms the small diameter portion 206 of the keyhole-shaped concave hole 204. In addition, the connection of the resin 151 can be strengthened only by forming a slight detail 207 on the contact 103, and the manufacturing efficiency of the camera module socket 101 can be improved.

図８は、コンタクト１０３に設けられた先細部２０７の変形例を示す断面図である。先細部２０７は、図６及び図７に示したような、第１の圧延面２０１や第２の圧延面２０２から傾斜する傾斜面であることに限られず、コンタクト１０３をその厚さ方向に挟み込む形状のものであればよい。一例として、図８に示すように、先細部２０７を、コンタクト１０３の第１の圧延面２０１及び第２の圧延面２０２のそれぞれに設け、端面２０３からコンタクト１０３の平面方向に延びた切欠としてもよい。なお、このような先細部２０７をソケットハウジング１０２に形成してもよいことは、言うまでもない。   FIG. 8 is a cross-sectional view showing a modification of the tip 207 provided on the contact 103. The tapered portion 207 is not limited to the inclined surface inclined from the first rolled surface 201 or the second rolled surface 202 as shown in FIGS. 6 and 7, and the contact 103 is sandwiched in the thickness direction. Any shape can be used. As an example, as shown in FIG. 8, the taper 207 is provided on each of the first rolling surface 201 and the second rolling surface 202 of the contact 103, and as a notch extending from the end surface 203 in the planar direction of the contact 103. Good. Needless to say, such a taper 207 may be formed in the socket housing 102.

図９は、コンタクト１０３に形成された凹孔２０４の変形例を示す断面図である。凹孔２０４は、径大部２０５と径小部２０６と連結して有した鍵穴状であることに限られず、コンタクト１０３の端面２０３の近傍部分の孔部の間隔が狭まっていればよい。一例として、図９に示すように、径大部２０５を、径小部２０６に一つの角を位置付けた三角形形状にしてもよい。なお、このような凹孔２０４をソケットハウジング１０２に形成してもよいことは、言うまでもない。   FIG. 9 is a cross-sectional view showing a modified example of the recessed hole 204 formed in the contact 103. The concave hole 204 is not limited to the keyhole shape connected to the large-diameter portion 205 and the small-diameter portion 206, and the interval between the hole portions in the vicinity of the end surface 203 of the contact 103 may be narrowed. As an example, as shown in FIG. 9, the large diameter portion 205 may have a triangular shape in which one corner is positioned on the small diameter portion 206. Needless to say, such a recess 204 may be formed in the socket housing 102.

１０１ カメラモジュールソケット（電子部品）
１０２ ソケットハウジング（金属部品）
１０３ コンタクト（金属部品）
１５１ 樹脂
２０１ 第１の圧延面
２０２ 第２の圧延面
２０３ 端面
２０４ 凹孔
２０５ 径大部
２０６ 径小部
２０７ 先細部
ｄ 厚さ距離 101 Camera module socket (electronic parts)
102 Socket housing (metal parts)
103 Contacts (metal parts)
151 Resin 201 1st rolling surface 202 2nd rolling surface 203 End surface 204 Recessed hole 205 Large diameter part 206 Small diameter part 207 Tip d Thickness distance

Claims (5)

所定厚さだけ互いに離れた表裏の圧延面を形成する板状の金属部品と、
一方の前記圧延面から前記金属部品の端面にかける箇所と他方の前記圧延面から前記端面にかける箇所とのそれぞれに設けられ、前記金属部品の最端の厚さを前記所定厚さよりも薄くする先細部と、
前記金属部品の前記端面側と前記先細部と取り囲む形状に連なって硬化し前記金属部品を挟む樹脂と、
を備える電子部品。 A plate-like metal part that forms the rolling surfaces of the front and back surfaces separated from each other by a predetermined thickness;
It is provided in each of a part that extends from one rolled surface to the end surface of the metal part and a part that extends from the other rolled surface to the end surface, and makes the thickness of the end of the metal part thinner than the predetermined thickness. Taper,
Resin that is cured continuously in a shape surrounding the end face side of the metal part and the taper and sandwiches the metal part;
With electronic components. 前記先細部は、前記圧延面から前記金属板の内側方向に傾斜する傾斜面である、
請求項１記載の電子部品。 The tapered portion is an inclined surface that is inclined from the rolled surface toward the inner side of the metal plate.
The electronic component according to claim 1. 前記金属部品は、各前記圧延面を貫通する径大部と、前記端面と前記径大部とを連絡する径小部と、を有する鍵穴状の凹孔を形成し、
前記先細部は、前記径小部を形成する前記金属部品の縁部に形成される、
請求項１又は２記載の電子部品。 The metal part forms a keyhole-shaped concave hole having a large diameter portion penetrating each rolling surface, and a small diameter portion connecting the end surface and the large diameter portion,
The tapered portion is formed at an edge of the metal part that forms the small diameter portion.
The electronic component according to claim 1 or 2. 前記樹脂は、少なくとも一方の前記圧延面から前記金属部品の厚さ方向に突出している、
請求項１から３のいずれか一に記載の電子部品。 The resin protrudes in the thickness direction of the metal part from at least one of the rolling surfaces,
The electronic component as described in any one of Claim 1 to 3. 所定厚さだけ互いに離れた表裏の圧延面を形成する板状の金属部品に対して、一方の前記圧延面から前記金属部品の端面にかける箇所と他方の前記圧延面から前記端面にかける箇所とのそれぞれに、前記金属部品の最端の厚さを前記所定厚さよりも薄くする先細部を形成する工程と、
前記金属部品の前記端面側と前記先細部とを取り囲む箇所に液状の樹脂を配置しこれらを連ねて硬化させ、前記樹脂に前記金属部品を挟みこませる工程と、
を備える電子部品の製造方法。 For plate-like metal parts forming the front and back rolling surfaces separated from each other by a predetermined thickness, a location that extends from one rolling surface to the end surface of the metal component, and a location that extends from the other rolling surface to the end surface Forming a taper in which the thickness of the end of the metal part is thinner than the predetermined thickness, respectively,
Placing a liquid resin at a location surrounding the end face side of the metal part and the taper, curing them together, and sandwiching the metal part in the resin; and
An electronic component manufacturing method comprising:
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