JP2005050670A - Manufacturing method of terminal device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a terminal device restraining generation of flash and deformation on a tip part of a male terminal due to cutting, enabling to connect a female connector without requiring post-work like coining. <P>SOLUTION: A conduction part 20, having a plurality of conductive plates 12 of which both end parts are jointed to the conduction part through tie-bars 22, 24, in order to position the base pedestal made of synthetic resin when inserting and forming the base pedestal, is arranged so as to be easily cut off with high precision, by arranging notches 26, 28, 30 at cutting positions C1, C2 where the tie-bars 22, 24 are cut off after insert-forming a base pedestal made of synthetic resin. The notches 26, 28 are formed in directions of width and thickness of the plate respectively at one end part side 12a used as the male terminal, and the tip part of the one end part 12a is formed into a truncated quadrangular pyramid shape. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a terminal device that is electrically connected, and more particularly to a method of manufacturing a terminal device that uses a conductive plate obtained by pressing as a male terminal.

(a) a conductive component processing step in which a conductive component in which one end portions of a plurality of longitudinal conductive plates are connected by a tie bar is prepared mainly by pressing; and (b) one end portion of the conductive plate including the tie bar is provided. An insert molding step of integrally molding the synthetic resin base with the conductive component so as to protrude from the synthetic resin base; and (c) one end of the conductive plate protruding from the synthetic resin base. And (d) a method for manufacturing a terminal device in which one end portion side of the conductive plate is used as a male terminal. It is described in.
JP-A-4-354362

  However, since the male terminal of the terminal device thus obtained has burrs or deformation at the cut tip, connection with the female connector may be hindered. Although it is conceivable to correct deformation or crush burrs by coining after cutting, the processing is cumbersome and the manufacturing cost increases.

  The present invention has been made against the background of the above circumstances. The object of the present invention is to suppress burrs and deformation generated at the tip of the male terminal by cutting, and without requiring post-processing such as coining. It is to be able to connect the mold connector well.

  In order to achieve such an object, the first invention comprises (a) a conductive component processing step in which a conductive component in which one end portions of a plurality of longitudinal conductive plates are connected by a tie bar is prepared mainly by pressing; b) an insert molding step of integrally molding the synthetic resin base with the conductive component such that one end of the conductive plate including the tie bar protrudes from the synthetic resin base; and (c) the synthetic resin. Cutting off one end portion of the conductive plate protruding from the manufacturing base together with the tie bar to separate the conductive plates from each other, and (d) one end portion side of the conductive plate is a male terminal. In the manufacturing method of the terminal device used, (e) in the conductive component processing step, the sheet width and the plate thickness are both reduced at the cutting position in the cutting step. Notch is formed from both sides respectively by engineering, by being cut at the cutting position tapered distal portion corresponding to the notch shape, characterized in that as provided in the male terminal.

  According to a second aspect of the present invention, in the method for manufacturing the terminal device according to the first aspect, (a) the conductive plate is connected to the other end portion with a tie bar and protrudes from the synthetic resin base. (B) At the cutting position, a notch is provided at the cutting position so that the plate thickness is reduced by pressing in the conductive component processing step, and bending and folding is performed in the cutting step. And being cut.

  According to a third aspect of the present invention, there is provided the method of manufacturing the terminal device according to the second aspect, wherein: (a) one side of the other end of the conductive plate is exposed on the surface of the synthetic resin base; (B) In the conductive part machining step, both sides of the bonding part are crushed into a bowl shape (L-shape) by pressing to provide a thin-walled part (c) ) In the insert molding step, the thin portion is embedded in the synthetic resin base.

  According to such a method of manufacturing a terminal device, a notch is provided by pressing so that the plate width and the plate thickness are both reduced at the cutting position in the cutting process in the conductive component processing step. This makes it easy to prevent deformation and burrs and achieves high dimensional accuracy. On the other hand, since the tapered tip corresponding to the notch shape is provided on the male terminal by cutting, deformation and burrs are suppressed. In combination with this, the female connector can be satisfactorily connected without requiring post-processing such as coining. In addition, since it is only necessary to provide the notch in the state of the conductive component alone before the insert molding, it is possible to provide the notch relatively easily by press working, and the manufacturing cost is reduced.

  The second invention is a case where a tie bar is also provided and connected to the other end side of the conductive plate, and the tie bar is insert-molded so as to protrude from the synthetic resin base and cut off in the cutting step. Since a notch is provided at the cutting position so that the plate thickness is reduced and it is bent and folded in the cutting process, the projecting dimension from the synthetic resin base can be made smaller than when cutting with a press.

  The third invention is the above-mentioned second invention, in which the other end of the conductive plate is exposed on the surface of the synthetic resin base and used as a bonding part, and both sides of the bonding part are pressed by a conductive component processing step. By crushing into a bowl shape, a thin part is provided, and the thin part is embedded in a synthetic resin base during the insert molding process. Therefore, when the tie bar is bent and folded during the cutting process, the bonding part rises from the synthetic resin base. There is no risk of deformation or inability to bend and fold. In particular, since it is crushed into a bowl shape, compared to the case of embedding with an inclined surface, sufficient fixing strength can be obtained while maintaining the thickness of the conductive plate thin, and the surface of the bonding portion, that is, the connection The possibility of the base synthetic resin material entering the surface is small.

  The terminal device of the present invention is used for input / output of electric power, input / output of electric signals, etc. by electrically connecting a female connector to a male terminal, and is arranged in cases of various electric devices. Installed and used. The terminal device may be manufactured and assembled separately from the case, or the terminal device may be integrally inserted into the synthetic resin case, but the conductive parts may be directly insert molded into the synthetic resin case. The terminal device can be configured integrally with the case.

  In the conductive part processing step, conductive parts are mainly manufactured by stamping or bending by pressing, but if necessary, processing other than press processing such as cutting can be used in combination. The number of conductive plates is generally provided in a large number of about 5 or more, but may be about 2 to 4.

  The notch in the plate width direction is formed simultaneously with the punching process by providing irregularities corresponding to the notch in the punch or die when punching a conductive part having a plurality of conductive plates connected by a tie bar. The notch in the plate thickness direction can be formed in a separate process such as coining, but there are various modes such as providing the notch in the plate width direction in a separate process from the punching process. Is possible.

  Each of the notches in the plate width direction and the plate thickness direction preferably has a V-shaped cross section, but may have an arc shape or the like. These notches are preferably provided from both sides substantially symmetrically with respect to the center line of the conductive plate, but the notch shapes on both sides can be asymmetrical.

  The shape of the tapered tip of the male terminal provided by the notch is appropriately determined according to the notch shape. For example, a simple V-shaped notch has a truncated quadrangular pyramid shape. If rounded, various forms are possible, such as a shape close to a frustoconical shape.

  One end of the plurality of conductive plates may all be used as male terminals, but a part of the plurality of conductive plates is used as male terminals and the other is used as another terminal such as a bonding part. Various embodiments are possible, such as As for the notches, it is not necessary to provide notches of the same shape on all the conductive plates, but it is sufficient that the notches of the first invention are provided at least for use as male terminals.

  In the second invention, a tie bar is also provided and connected to the other end portion side of the conductive plate. However, when the first invention is implemented, only one end portion functioning as a male terminal is connected with the tie bar, and the other end is connected. The part side may be separated from the beginning.

  In the second invention, the notch provided in front of the tie bar on the other end portion side of the conductive plate may be at least as long as the plate thickness is reduced, but a notch for reducing the plate width is provided in the same manner as the one end portion side. Is also possible. These notches are desirably provided at the same time as the notches on one end side, for example, by pressing, but may be provided in a separate process. Further, similarly to the one end side, notches can be provided symmetrically from both sides of the plate thickness and width, for example, but it is also possible to provide notches only from one side.

  In the third invention, the other end side is used as a bonding part, and the connection terminal is connected by a fixing means such as vibration welding or brazing. Various modes are possible, such as providing a terminal to connect a female connector.

  In the third invention, both sides of the bonding part are crushed into a bowl shape by pressing, but it is not always necessary to crush into a bowl shape when implementing other inventions. For example, an inclined surface is provided to provide a synthetic resin base You may make it embed in.

  The crushing process of the third invention can be performed at the same time as pressing the notch by providing a projection or the like on the mold for processing the notch in the thickness direction of the first invention, but it is performed in a separate process. Also good.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 (a) is a perspective view showing a terminal device 10 manufactured according to the method of the present invention, in which a large number (in the embodiment, five) of electrically conductive plates 12 bent in an L-shape are arranged at substantially constant intervals. And are integrally fixed to the synthetic resin base 14 in a state where they are lined up close to each other. The synthetic resin base 14 is L-shaped and is integrally insert-molded with the corner portions 12k of the conductive plates 12 embedded therein, and protrudes upward from the synthetic resin base 14. One end 12a of the conductive plate 12 is used as a male terminal, while one surface (upper surface) of the other end is exposed on the surface of the synthetic resin base 14 and used as a bonding portion 12b. ing.

  One end 12a functioning as a male terminal has a truncated quadrangular pyramid-shaped tapered tip 12c as shown in FIG. 1 (b), and the female connector 16 is positioned upward (tip side) as shown in FIG. ) To be connected. The female connector 16 is brazed to, for example, a conductive pattern of the substrate 18 integrally fixed in the vicinity of the terminal device 10 and configured to energize the conductive pattern and the one end portion 12a.

  The bonding portion 12b is a portion where predetermined connection terminals are integrally connected by vibration welding or the like. As shown in FIG. 1 (d), thin portions 12d are integrally provided on both sides, and the thin portion 12d is firmly fixed by being embedded in the base 14 made of synthetic resin. The thin portion 12d is a portion obtained by crushing both sides of the bonding portion 12b with a press. The thickness ta is about 50 to 70% of the plate thickness t, and the plate thickness t is about 0.4 to 0.6 mm, for example. The width dimension w of the thin portion 12d is about 0.2 to 0.6 mm, and the plate width before the bonding portion 12b is crushed is about 1.5 to 3 mm. The length La of the thin portion 12d is about L × 0.8 to 0.3 with respect to the entire length L of the bonding portion 12b, and the length Lb on the tip side of the thin portion 12d is L × 0. It is about 1 to 0.3. As a result, the natural frequency of the bonding portion 12b is 100 kHz or more, which is sufficiently higher than the frequency of 60 kHz during general vibration welding, and excellent vibration welding strength is obtained.

  Further, as shown in FIG. 1 (c), the protrusion dimension d that the bonding portion 12b protrudes forward from the synthetic resin base 14 is extremely small within a range of 0 to 0.5 mm.

  Such a terminal device 10 is used by being assembled integrally with a case 40 of an electric device such as a DC-DC converter or a DC-AC converter shown in FIG. FIG. 5 shows a case where a plurality of terminal devices 10 are embedded in the case 40 and integrally assembled by insert molding.

  On the other hand, such a terminal device 10 is manufactured using the conductive component 20 shown in FIG. FIG. 2 (a) is a perspective view of the conductive component 20, which has a large number of the conductive plates 12, and both ends in the longitudinal direction of the conductive plates 12 are connected by tie bars 22 and 24, respectively. Manufactured mainly by punching and bending using a press using a plate material. This step is a conductive component processing step. The tie bars 22 and 24 are for positioning a large number of conductive plates 12, and the conductive component 20 is inserted into the synthetic resin base 14 and partially embedded in the synthetic resin base 14. After being fixed integrally, they are cut off at predetermined cutting positions C1 and C2.

  2B is a view showing one end portion 12a side of the conductive plate 12, that is, an end portion on the tie bar 22 side, and FIG. 2C is a side view of FIG. 2B, and the tapered tip end portion 12c. V-shaped notches 26 and 28 for reducing the plate width and the plate thickness are provided by pressing at a cutting position C1 corresponding to the tip of the plate. These notches 26 and 28 are provided from both sides symmetrically with respect to the center line of the conductive plate 12, and the notches 26 in the plate width direction are formed on punches or dies for punching the conductive component 20 by pressing. By providing the unevenness corresponding to the notch 26, it is formed at the same time as the punching process, and the notch 28 in the thickness direction is formed in a separate process by coining or the like. The notch 28 in the thickness direction is provided so that the remaining dimension tb is in the range of about 40 to 60% of the thickness t.

  FIG. 2D is a cross-sectional view showing the other end of the conductive plate 12, that is, the end of the bonding portion 12b and the end of the tie bar 24. At the cutting position C2 corresponding to the tip of the bonding portion 12b, A V-shaped notch 30 for reducing the plate thickness is provided by pressing. The notch 30 is provided from both sides symmetrically with respect to the center line of the conductive plate 12 in the same manner as the notch 28. For example, before the conductive plate 12 is bent at a substantially right angle, the notch 30 is simultaneously with the notch 28 by coining or the like. Pressed. The notch 30 is also provided so that the remaining dimension tc is in the range of about 40 to 60% of the plate thickness t.

  FIG. 2 (e) is a cross-sectional view of the bonding part 12b. The thin part 12d is provided on both sides of the bonding part 12b by crushing into a bowl shape by pressing. A dotted line is a cross-sectional shape of the conductive plate 12 before the crushing process is performed.

  When the synthetic resin base 14 is formed as shown in FIG. 3, a part of the conductive component 20 is embedded and integrally fixed. This step is an insert molding step, and the one end portion 12a and the tie bars 22, 24 protrude to the outside from the synthetic resin base 14, and the bonding portion 12b has a thin-walled portion 12d as shown in FIG. It is embedded in the synthetic resin base 14 and its upper surface is exposed on the surface of the synthetic resin base 14. Further, the cutting position C2 on the tie bar 24 side, that is, the portion where the notch 30 is provided is substantially coincided with the front end edge of the synthetic resin base 14 as shown in FIG. Portions outside the cutting positions C1 and C2 including the tie bars 22 and 24 are clamped between molds for molding the synthetic resin base 14 and the conductive plate 12 with respect to the molding cavity of the synthetic resin base 14. Is positioned with high accuracy.

  After that, by cutting at the cutting positions C1 and C2 and cutting off the tie bars 22 and 24, respectively, the plurality of conductive plates 12 are separated from each other, and the terminal device 10 is obtained. This process is a cutting process. One cutting position C1 is provided with notches 26 and 28 in the plate width direction and the plate thickness direction, so that it can be easily cut with high precision by a press cutting process, and deformation and burrs are generated. While being suppressed and high dimensional accuracy is obtained, a truncated quadrangular pyramid-shaped tapered tip 12c corresponding to the shape of the notches 26 and 28 is provided. Further, the other cutting position C2 is provided with a notch 30 in the thickness direction, and the notch 30 is substantially coincident with the front edge of the synthetic resin base 14, so that (b) of FIG. ), By bending and deforming a portion ahead of the notch 30 as indicated by an arrow A, cutting can be easily performed with high accuracy at the position of the notch 30. Since the bonding portion 12b is provided with a thin portion 12d and is firmly fixed to the synthetic resin base 14, the bonding portion 12b is lifted from the synthetic resin base 14 and deformed when bent, There is no danger of bending or folding.

  Thus, in this embodiment, at the stage of manufacturing the conductive component 20 before the synthetic resin base 14 is integrally molded, the notch 26 is formed by pressing so that both the plate width and the plate thickness are reduced at the cutting position C1. 28, the synthetic resin base 14 is insert-molded integrally with the conductive component 20, and can be easily cut with high accuracy when cutting at the cutting position C1. As a male terminal Deformation and burrs are suppressed from occurring at the tip (cutting position C1) of the functioning one end 12a, and high dimensional accuracy is obtained.

  Further, by cutting at the cutting position C1, the tip of the one end 12a is provided with the truncated quadrangular pyramid-shaped tapered tip 12c corresponding to the shape of the notches 26 and 28, thereby suppressing the occurrence of deformation and burrs. In combination with this, the female connector 16 can be satisfactorily connected without requiring post-processing such as coining.

  In addition, since it is only necessary to provide the notches 26 and 28 in a state where the conductive component 20 before the insert molding is a single product, the notches 26 and 28 can be provided relatively easily by press working, and the manufacturing cost is reduced.

  In addition, a tie bar 24 is provided and connected to the other end portion of the conductive plate 12, and the tie bar 24 is insert-molded so as to protrude from the synthetic resin base 14 and cut off in the cutting process. While the plate 12 can be embedded in the synthetic resin base 14 with higher dimensional accuracy, a notch 30 is also provided at the cutting position C2 so as to reduce the plate thickness, and the plate 12 is bent and folded in the cutting process. Compared with the case where it does, the protrusion dimension d from the synthetic resin base 24 can be made small.

  Further, the other end side of the conductive plate 12, that is, the bonding portion 12b is exposed on the surface of the synthetic resin base 14, but both side portions of the bonding portion 12b are crushed into a bowl shape by a press to form a thin portion 12d. And is embedded in the synthetic resin base 14 in the insert molding process, so that the bonding portion 12b is firmly fixed to the synthetic resin base 14 and an excellent vibration welding strength is obtained. .

  Further, since the bonding portion 12b is firmly fixed in this way, when the tie bar 24 is cut off by bending at the cutting position C2, the bonding portion 12b is lifted from the synthetic resin base 14 and deformed. There is no danger of bending or folding.

  Further, since the thin-walled portion 12d is provided by being crushed into a bowl shape, sufficient fixing strength can be obtained while maintaining the plate thickness t of the conductive plate 12 thinner than in the case where the inclined surface is provided and embedded. At the same time, the possibility that the synthetic resin material of the base 14 enters the surface of the bonding portion 12b, that is, the connection surface is small.

  As mentioned above, although the Example of this invention was described in detail based on drawing, these are one embodiment to the last, and this invention is implemented in the aspect which added the various change and improvement based on the knowledge of those skilled in the art. be able to.

FIG. 3 is a diagram showing an example of a terminal device manufactured according to the method of the present invention, in which (a) is a perspective view of the whole, (b) is a perspective view showing a tip of a male terminal, and (c) is a bonding part on the opposite side. Sectional view of the tip, (d) is a transverse sectional view of the bonding part. FIGS. 2A and 2B are diagrams showing a conductive component having a large number of conductive plates, which are components of the terminal device of FIG. 1, wherein FIG. 1A is a perspective view, and FIG. (c) is a right side view of (b), (d) is a side view showing a notch provided at the cutting position C2 of the other end portion, and (e) is a cross-sectional view of the bonding portion. FIGS. 3A and 3B are views showing a state in which a synthetic resin base is insert-molded together with the conductive part of FIG. 2, wherein FIG. 2A is a perspective view, FIG. 2B is a cross-sectional view near a cutting position C2, and FIG. FIG. It is sectional drawing which shows the state by which the female connector was connected to the male terminal of the terminal device of FIG. It is a perspective view which shows an example of the case of the electric apparatus with which the terminal device of FIG. 1 is assembled | attached.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10: Terminal apparatus 12: Conductive plate 12a: One end part (male type terminal) 12b: Bonding part 12c: Tapered tip part 12d: Thin part 14: Base made of synthetic resin 20: Conductive parts 22, 24: Tie bar 26, 28, 30: Notch C1, C2: Cutting position

Claims (3)

Conductive component processing step of preparing a conductive component in which one end portions of a plurality of longitudinal conductive plates are connected by a tie bar mainly as a press process;
An insert molding step of integrally molding the synthetic resin base with the conductive component such that one end of the conductive plate including the tie bar protrudes from the synthetic resin base;
A cutting step of separating the conductive plates from each other by cutting off one end of the conductive plate protruding from the synthetic resin base together with the tie bar;
In the method of manufacturing a terminal device in which one end side of the conductive plate is used as a male terminal,
In the conductive component processing step, notches are formed from both sides by pressing so that both the plate width and thickness are reduced at the cutting position in the cutting step, and the notch shape is handled by cutting at the cutting position. A terminal device manufacturing method, characterized in that a tapered tip portion is provided on the male terminal. The conductive plate is connected with a tie bar provided on the other end side, and is insert-molded so as to protrude from the synthetic resin base and cut off in the cutting step.
2. The terminal according to claim 1, wherein a notch is provided at the cutting position so that a plate thickness is reduced by pressing in the conductive component processing step, and the terminal is bent and folded in the cutting step. Device manufacturing method. The other end portion side of the conductive plate is used as a bonding portion where one side surface is exposed on the surface of the synthetic resin base and a predetermined connection terminal is connected.
In the conductive component processing step, both sides of the bonding portion are crushed into a bowl shape by pressing to provide a thin portion,
The method for manufacturing a terminal device according to claim 2, wherein in the insert molding step, the thin portion is embedded in the synthetic resin base.

Images