JP2006318833A - Connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To allow contacts to be arranged at narrow pitches and prevent solder lifting. <P>SOLUTION: Each of the contacts 21 has a contacting part 23, a terminal part 25, and a middle part 27 coupling the contacting part 23 and the terminal part 25 to each other. The middle part 27 has a main body 27a and a pair of protruding portions 27b protruding from the main body 27a in a direction of width of the contact 21. Four surfaces of each of the protruding portions 27b are formed into tapered surfaces 28a, 28b, 28c and 28d, respectively, that are tapered toward the protruding direction. A low-wettability region 29 is formed between the protruding portions 28b, 28c and 28b, 28c on both surfaces of the main body 27a by laser irradiation. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a connector including a conductive contact soldered to a connection target board.

  A conventional connector includes a conductive contact and an insulator that holds the contact. The contact has a contact portion that contacts the mating contact of the mating connector and a terminal portion that extends from one side of the contact portion to the outside of the insulator. When the insulator is mounted on a connection target board such as a printed circuit board, the terminal part is connected to the conductive part disposed on the surface of the connection target board by solder.

  In such a connector, a nickel (Ni) plating layer is formed on the front and back surfaces of a contact, and then a gold plating layer is provided on the nickel plating layer. The nickel (Ni) plating layer has lower wettability with respect to solder than the gold plating layer. In the previous stage of connecting the terminal part to the conductive part of the connection target board by soldering, laser irradiation is applied to a part of the front and back surfaces of the terminal part to evaporate the gold plating layer on the surface and expose the nickel plating layer Things have been done.

  A low wettability region (laser Ni barrier) is formed in the terminal portion to prevent solder from rising to the contact portion side when the nickel plating layer is exposed by laser irradiation (for example, Patent Document 1). , See Patent Document 2).

JP 2003-45530 A Japanese Patent Laid-Open No. 9-245860

  The problem to be solved is that when the pitch between the terminal portions is narrowed, the terminal portions are also small, so the low wettability region is also narrowed, and the amount of solder rise during soldering is increased.

  That is, in the conventional connector, the laser irradiation range may be limited to two surfaces in order to form the low wettability region. That is, in the contact, if laser irradiation is to be performed on two surfaces perpendicular to the laser irradiation surface of a plurality of terminal portions having a prismatic cross section, the position of the laser irradiation direction must be changed.

  Therefore, in a state where the terminal portions are connected to the carrier at a narrow pitch, the pitch between the terminal portions is narrowed and the terminal portions are also small. It becomes very difficult to form a wettability region.

  In addition, when the contact cross-sectional shape is close to a square due to the miniaturization of the contact, when the space between the surfaces where the low wettability region is not formed becomes close, the solder flows into the space. Therefore, there is a problem that the effect of suppressing the solder rise cannot be expected.

  Furthermore, in order to reduce the surface on which the low wettability region is not formed, there is a method of performing a beveling process on the contact, but in the case of a contact having a cross section close to a square, the alignment of the terminal portion is achieved by the beveling process. As a result, the soldering failure is caused.

  Therefore, an object of the present invention is to provide a connector in which contacts can be arranged at a narrow pitch and solder rise during soldering can be prevented.

  The present invention provides a connector including a conductive contact soldered to a connection target board by solder and an insulator holding the contact, wherein the contact extends outside the contact portion and the insulator. A terminal part, and a contact part and an intermediate part for connecting the terminal part. The intermediate part has a main body part and a pair of protrusions protruding from the main body part in the width direction of the contact. Each of the projecting portions is formed with four tapered surfaces that taper in the projecting direction, and continues from each of the pair of projecting portions on both surfaces of the main body portion and both surfaces of the main body portion. A low wettability region is formed on the tapered surfaces of the extended pair of protruding portions to prevent solder from rising from the terminal portion soldered to the connection target substrate. The most important being a connector to symptoms.

  According to the connector of the present invention, the taper surface is formed in the protrusion of the contact, and the low wettability region is formed by irradiating the laser between the protrusion on both sides of the contact main body and the protrusion. The application surface of the wettability area can be widened, and the low wettability area by the base plating layer of the contact can be made large, so that it is possible to reliably prevent the solder from rising to the contact part side when the terminal part is soldered There is.

  In addition, in a state where one end of the contact is connected to the carrier, positioning the contact protrusions alternately with the protrusions of the adjacent contacts in the longitudinal direction makes the distance between the contacts narrower than the pitch between the contacts. Since it is possible to arrange them on the pitch, the efficiency of the contact material collection is improved.

  The connector according to the present invention is a connector including a conductive contact that is soldered to a connection target board by solder, and an insulator that holds the contact, wherein the contact is outside the contact portion and the insulator. A terminal part extending; and a contact part and an intermediate part connecting the terminal part, wherein the intermediate part protrudes in the width direction of the contact from the main body part. Each of the protrusions is formed with four tapered surfaces that taper in the protrusion direction, between the pair of protrusions on both surfaces of the main body portion and on both surfaces of the main body portion. A low wettability region is formed on the tapered surfaces of the pair of projecting portions continuously extending from the respective portions to prevent solder from rising from the terminal portions soldered to the connection target substrate. It was realized by that.

  FIG. 1 shows a first embodiment of a connector according to the present invention. FIG. 2 shows a state where the connector shown in FIG. 1 is viewed from the fitting portion side.

  1 and 2, the connector 11 includes an insulator 13 and a plurality of conductive contacts 21 arranged in parallel on the insulator 13 with a predetermined pitch interval in parallel.

  The insulator 13 includes a long plate-shaped bottom wall portion 15a and a plurality of side wall portions 15b, 15c, and 15d extending from the peripheral end of the bottom wall portion 15a to one side. A portion surrounded by the bottom wall portion 15a and the side wall portions 15b, 15c, and 15d is a large groove-shaped fitting portion 17 into which a mating fitting portion of a mating connector (not shown) is fitted. The insulator 13 is mounted on a connection target board such as a printed circuit board described later.

  As shown in FIGS. 3 and 4, the contact 21 penetrates the contact portion 23 located in the fitting portion 17 of the insulator 13 and the bottom wall portion 15 a of the fitting portion 15, and It has the terminal part 25 extended outside, and the intermediate part 27 which connected the contact part 23 and the terminal part 25 on the outside of the insulator 13.

  The contact 21 has a substantially quadrangular prism shape. The intermediate portion 27 of the contact 21 includes a main body portion 27 a and a pair of protruding portions 27 b that protrude from the main body portion 27 a in the width direction of the contact 21. Each of the pair of projecting portions 27b is formed with tapered surfaces 28a, 28b, 28c, and 28d in which four surfaces taper in the projecting direction. A nickel (Ni) plating layer, which is a base plating layer, is provided on the front and back surfaces of the contact 21, and then a gold plating layer as a coating plating layer is provided on the nickel plating layer.

  As shown in FIG. 5, low wettability regions 29 are formed on a pair of protrusions 27b of the contact 21 and both surfaces of the main body 27a located between the pair of protrusions 27b. The low wettability region 29 is formed in a belt shape by irradiating a laser so as to prevent soldering up from the terminal portion 25 soldered to the connection target substrate 31 shown in FIG. In addition, the low wettability area | region 29 formed by irradiating a laser is a barrier by the nickel layer formed by the laser.

  In the step before incorporating the contact 21 into the insulator 13, as shown in FIG. 6, the contact 21 is stamped and formed by a press with one end of the plurality of contacts 21 connected to the carrier 51. The protrusions 27 b of the contacts 21 are positioned so as to face each other in a direction orthogonal to the longitudinal direction of the contacts 21 while being connected to the carrier 51.

  In this state, the contact 21 is plated. The two surfaces of the contact 21, the front surface and the back surface, evaporate the gold plating on the surface by irradiating the laser, and when the nickel (Ni) plating layer as the underlayer is exposed by irradiating the laser, the surface becomes low wet. The sex region 29 is formed.

  In addition, since the low wettability area | region 31 is formed not only in a main-body part but in the taper surfaces 28b and 28c in the contact 21, the range of the width direction of the low wettability area | region 29 can be taken widely. After forming the low wettability region 29, the contact 21 is press-fitted into the insulator 13 and separated from the carrier 51 at a cut portion A indicated by a dotted line in FIG.

  When the terminal portion 25 is connected to the connection target substrate 31, the terminal portion 25 is connected to the conductive portion 32 of the connection target substrate 31 by soldering. At this time, since the low wettability region 29 is formed in the contact 21, the taper surfaces 28 a and 28 d not forming the low wettability region 29 can be reduced, and therefore the solder rising path toward the contact portion 23 side. Therefore, it is possible to prevent the solder from rising to the contact portion 23 side.

    In FIG. 7, in the state where one end of the contact 21 is connected to the carrier 51, the positions of the protrusions 27 b of the contacts 21 are shifted in the longitudinal direction of the protrusions 27 b and the contacts 21 between the adjacent contacts 21. It is arranged. After forming the low wettability region 29, the contact 21 is press-fitted into the insulator 13 and separated from the carrier 51 at a portion A indicated by a dotted line in FIG.

  When the protrusions 27b are alternately arranged on the contacts 21, the distance between the contacts 21 can be arranged at a narrower pitch P2 than the pitch P1 between the contacts shown in FIG.

It is a top view which shows Example 1 of the connector concerning this invention. It is a front view of the connector shown in FIG. It is a right view of the connector shown in FIG. It is a top view which shows a part of contact shown in FIG. It is a perspective view which shows the terminal part and intermediate part of the contact which were shown in FIG. It is a top view which shows an example of the state which connected the contact shown in FIG. 1 to the carrier. It is a top view which shows the other example of the state which connected the contact shown in FIG. 1 to the carrier.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Connector 13 Insulator 21 Contact 17 Fitting part 23 Contact part 25 Terminal part 27 Intermediate part 27a Main body part 27b Protrusion part 28a, 28b, 28c, 28d Tapered surface 29 Low wettability area | region 31 Connection object board | substrate 51 Carrier P1, P2 pitch

Claims (2)

In a connector including a conductive contact that is soldered to a connection target board by solder, and an insulator that holds the contact,
The contact has a contact portion, a terminal portion extending outside the insulator, and an intermediate portion connecting the contact portion and the terminal portion,
The intermediate portion has a main body portion and a pair of protruding portions protruding from the main body portion in the width direction of the contact,
Each of the protrusions is formed with four tapered surfaces that taper in the protrusion direction.
From the terminal portion soldered to the connection target board, the taper surfaces of the pair of protrusions that continue to extend between the pair of protrusions on both surfaces of the body portion and from both surfaces of the body portion, respectively. A connector characterized in that a low wettability region is formed to prevent solder from rising. The connector according to claim 1, wherein at least both surfaces of the contact include
A base plating layer having low wettability with respect to the solder and a conductive coating layer covering the base plating layer are provided, and the low wettability region is formed by applying a laser to the coating plating layer. A connector characterized in that it is a portion where the base plating layer is exposed by irradiation.

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