TWI435074B - Optical inspection device and optical inspection method - Google Patents

Description

Optical detecting device and optical detecting method

The present invention relates to an optical detecting device and an optical detecting method, and more particularly to an optical detecting device and an optical detecting method for detecting an LED wafer.

In recent years, the luminous efficiency of a light emitting diode (LED) has progressed remarkably. Therefore, the application fields of LEDs are becoming more and more extensive, from early traffic signs to the recent backlight modules for LCD TVs. Moreover, there are more and more lighting devices that use LEDs as light sources instead of bulbs or fluorescent tubes.

At present, the process of LED has gradually matured, and the yield it produces is getting higher and higher. However, in order to ensure the quality of the end product, it is still necessary to detect the LED dies in the LED wafer and remove the unqualified LED dies from the process before the subsequent process can be performed. For LED dies, optical inspection is a process that must be followed, mainly to detect the peak length, luminous intensity, luminous flux, and color temperature of the LED die. In addition, it also includes problems such as detecting whether the LED die has a poor appearance and whether the gap of the LED die is different.

In the process of detection, the LED wafers to be detected are sequentially detected one by one. After inspection, the defective LED dies in the LED wafer are marked and removed by the die sorter in the subsequent process. However, the detection in a piece by piece manner is less efficient. Therefore, how to further improve the optical detection efficiency of LED wafers is worthy of consideration by those who have common knowledge in the field.

A main object of the present invention is to provide an optical detecting device and an optical detecting method, whereby the optical detecting device and the optical detecting method can improve the optical detecting efficiency of the detected object.

Based on the above and other objects, the present invention provides an optical detecting apparatus. The optical detecting device comprises a loader, a buffering station, a plurality of detecting stations, and a robot arm. The loader comprises a storage cabinet and a pick-and-place station, and the storage cabinet stores a plurality of detected objects to be detected. . The loader can load the detected object in the storage cabinet to the pick-up table or load the detected object on the pick-up table into the storage cabinet. The robot arm is used to move the detected object between the pick-up table, the buffer table, and each of the test stands. Further, the above-mentioned detected object is, for example, an LED wafer.

In the above optical detecting device, the robot arm is pivotally connected to the optical detecting device by a pivot. Further, the pick-up table, the buffer table, and the inspection table are, for example, surrounded by a pivot.

In the above optical detecting device, at least one of the pick-up table, the buffer table, and the plurality of detecting stages is vertically movable up and down. Moreover, the position of the inspection station on the level is adjustable.

In the optical detecting device described above, the robot arm can be raised and lowered in the vertical direction.

Based on the above and other objects, the present invention provides an optical detecting method for detecting a plurality of detected objects using an optical detecting device. The optical detecting device includes a loader, a buffering station, a plurality of detecting stations, and a robot arm. The detected object is stored in a storage cabinet of the loader before the detecting, and the optical detecting method comprises the following steps:

(a) transferring the detected object from the storage cabinet to the pick-up station, and then transmitting from the pick-up station to the inspection station for testing until each test station is placed with the detected object;

(b) When all the test stations are performing the test, another object to be detected is transferred from the storage cabinet to the pick-up table, and then transferred to the buffer table for placement;

(c) after detecting one of the detected objects, transferring the detected detected object to the pick-up table, and transmitting the detected object on the buffer table to the test stand having the vacancy for detection;

(d) Transfer the detected object on the pick-up table to the storage cabinet.

In the above steps, when the detection stations are all performing the detection, the other detected objects to be tested are first moved to the buffer table, and after one of the detected detection objects is moved back to the access platform, The detected object on the buffer table is moved to the inspection station with the vacancy. However, it is also possible to move the detected object to be detected to the buffer table, then move the object to be tested to the inspection station with the vacancy, and finally move the detected object on the buffer table back to the access table. on.

In the above optical detecting method, the detected object is, for example, an LED wafer.

In the optical detecting device of the present invention, since the buffer table is provided, when all the detecting objects are detected on the detecting table, the other detected object to be tested can be placed on the buffer table first. After the detected object on one of the test stands is tested and moved to the pick-up table, the detected object on the buffer table can be immediately moved to the test stand with the vacancy for detection. In this way, the efficiency of optical detection can be increased.

The above described objects, features, and advantages of the present invention will become more apparent from the following description. It is to be noted that the various elements in the drawings are merely illustrative and not necessarily in the actual proportion of each element.

Hereinafter, an LED wafer is used as an embodiment of the object to be detected, and an embodiment of the inspection station is the first detection stage 130 and the second detection stage 140 shown in FIG.

1 and FIG. 2, FIG. 1 is a perspective view showing an embodiment of an optical detecting device of the present invention, and FIG. 2 is a plan view showing an embodiment of the optical detecting device of the present invention. The optical detecting device 100 includes a loader 110, a buffer table 120, a first detecting station 130, a second detecting station 140, and a robot arm 150. The loader 110 includes a storage cabinet 112 and a pick-and-place station 114. The storage cabinet 112 stores a plurality of LED wafers 20 (shown in FIG. 3). Each of the LED wafers 20 includes a plurality of LED crystals. Granules, and each LED die has a unique code. The buffer table 120 is located adjacent to the access table 114, the second detection station 140 is adjacent to the access table 114, and the first detection station 130 is adjacent to the second detection station 140 and the buffer table 120. In addition, the robot arm 150 is pivotally connected to the optical detecting device 100 by a pivot 152. Wherein, the access table 114, the buffer table 120, the first detecting station 130, and the second detecting station 140 are surrounded by the pivot 152, that is, the pivot 152 is located at the pick-and-place table 114, the buffer table 120, and the first detection. The center of the area surrounded by the stage 130 and the second detection stage 140. The robot arm 150 can be rotated by the pivot 152, whereby the gripping end 154 of the robot arm 150 can be moved between the access table 114, the buffer table 120, the first detecting station 130, and the second detecting station 140. .

Please refer to FIG. 3 at the same time. FIG. 3 is a structural diagram of the storage cabinet 112. The storage cabinet 112 is composed of a plurality of sheets 211, and each of the cassettes 211 has a plurality of slots 213 for accommodating the LED wafer 20. In addition, the optical detecting device 100 further includes a pick-up mechanism (not shown) and a lifting mechanism 160. The pick-up mechanism is used to load the LED wafer 20 in the storage cabinet 112 onto the pick-and-place table 114. The sheet mechanism transports the LED wafer 20 by, for example, picking or picking. The lifting mechanism 160 is for lifting and lowering the entire take-up mechanism in a vertical direction to allow the pick-up mechanism to be at an appropriate height for loading or unloading the LED wafer 20.

Please refer to FIG. 4 , which illustrates a flow of a method for detecting an LED wafer by an optical detecting device. Hereinafter, the steps shown in FIG. 4 will be described in more detail in conjunction with FIGS. 5A to 5H.

Step S305: First, referring to FIG. 5A, a first LED wafer 21 in the storage cabinet 112 is loaded onto the access table 114 by using a pick-up mechanism.

Step S310: Next, referring to FIG. 5B, the robot arm 150 is activated and grasped by the first LED wafer 21 located on the pick-and-place table 114, and the first LED wafer 21 is moved to the top of the first detecting station 130. Placed on the first inspection station 130. In the present embodiment, the robot arm 150 grasps the first LED wafer 21 by means of clamping or vacuum adsorption. In addition, in this embodiment, the robot arm 150 and the first detecting station 130 both have a vertical lifting function, so when the robot arm 150 comes above the first detecting station 130, the robot arm 150 will descend, and the first The inspection station 130 will be raised to allow the first LED wafer 21 to be stably placed on the first inspection station 130. After the first LED wafer 21 is stably placed on the first inspection station 130, the first detection station 130 will fall again.

Step S315: The first sensor 132 is located above the first detecting station 130. The first sensor 132 is internally provided with a photosensitive coupled device (CCD), which can be sensed via The light transmitted or emitted by the first LED wafer 21. Thereby, the LED dies in the first LED wafer 21 can be detected. Without passing through the detected LED dies, the computer in optical inspection device 100 will record its code for culling in subsequent programs.

Step S320: loading a second LED wafer 22 from the storage cabinet 112 onto the pick-and-place table 114 by using a pick-up mechanism. It should be noted that the execution order of step S320 is not necessarily after step S315, and step S320 may also be started after execution of step S310. That is, after the first LED wafer 21 is removed from the pick-and-place stage 114, the loader 110 can begin loading the second LED wafer 22 from the storage cabinet 112 onto the pick-and-place stage 114.

Step S325: Then, referring to FIG. 5C, the robot arm 150 is activated and grasped by the second LED wafer 22 located on the pick-and-place table 114, and the second LED wafer 22 is moved to the top of the second detecting station 140. Placed on the second inspection station 140.

Step S330: After the second LED wafer 22 is disposed on the second detecting station 140, the second sensor 142 located above the second detecting station 140 is activated to detect the LED dies in the second LED wafer 22. The second sensor 142 is also internally provided with a photosensitive coupling element for sensing light transmitted or emitted via the second LED wafer 22. Thereby, the LED dies in the second LED wafer 22 can be detected. Without passing through the detected LED dies, the computer in optical inspection device 100 will record its code for culling in subsequent programs.

Step S335: loading a third LED wafer 23 from the storage cabinet 112 onto the pick-and-place table 114 by using a pick-up mechanism.

Step S340: Referring to FIG. 5D simultaneously, the robot arm 150 is activated and grasped by the third LED wafer 23 located on the pick-and-place table 114, and the third LED wafer 23 is moved above the buffer table 120 and placed in the buffer. On the platform 120.

Step S345: After the first LED wafer 21 is detected, the robot arm 150 grabs the first LED wafer 21 from the first inspection station 130 and moves the first LED wafer 21 back to the pick-up table 114. on.

In the above steps, since the first LED wafer 21 on the first detecting station 130 is detected first, the first LED wafer 21 is moved first. However, if the second LED wafer 22 on the second inspection station 140 is detected first, the second LED wafer 22 can be moved first.

Step S350: Referring to FIG. 5E, after the first LED wafer 21 is moved to the pick-and-place stage 114, the robot arm 150 moves the third LED wafer 23 from the buffer table 120 to the top of the first detecting station 130 and places it. On the first inspection station 130, the LED dies in the third LED wafer 23 are detected.

Step S355: The first LED wafer 21 located on the pick-and-place stage 114 is received into the storage cabinet 112.

It can be seen from the above steps that, due to the arrangement of the buffer table 120, when both the first detection station 130 and the second detection station 140 have LED wafers for detection, another LED wafer to be tested (ie: The three LED wafers 23) can be placed on the buffer table 120 first. After the first LED wafer 21 is tested and moved to the pick-and-place stage 114, the third LED wafer 23 can be moved to the first inspection station 130 for detection. However, if there is no buffer table 120, and both the first detection station 130 and the second detection station 130 have LED wafers for detection, they must wait for the first detection station 130 or the second detection station 130. After an LED wafer is detected and stored in the storage cabinet 112, the loader 110 can continue to load other LED wafers to be tested from the storage cabinet 112 onto the pick-and-place station 114. Therefore, the detection speed of the LED wafer can be greatly accelerated by the arrangement of the buffer table 120.

Further, in the above steps, the step numbers do not represent the order of the steps. For example, the order of execution of step S335 is not necessarily after step S330, they may be performed simultaneously. Similarly, step S355 can also be performed simultaneously with step S350. This will increase the efficiency of the entire optical inspection process.

In addition, in step S340 to step S350, the third LED wafer 23 is first moved onto the buffer table 120, and after the first LED wafer 21 is moved back to the pick-and-place stage 114, the third LED wafer 23 is moved. Up to the first inspection station 130. However, it is also possible to first move the first LED wafer 21 to the buffer table 120, then move the third LED wafer 23 to the first detection station 130, and finally move the first LED wafer 21 back to the access table. 114 on.

Step S360: Referring to FIG. 5F, after the execution of step S355, the loader 110 can continue to load other LED wafers (ie, the fourth LED wafer 24) in the storage cabinet 112 onto the access table 114. .

Step S365: Thereafter, the fourth LED wafer 24 is moved to the buffer table 120 by the robot arm 150.

Step S370: Referring to FIG. 5G, after the second LED wafer 22 is detected, the robot arm 150 can be activated to move it back to the access table 114. Thereafter, the second LED wafer 22 can be stored in the storage cabinet 112.

Step S375: Thereafter, referring to FIG. 5H, the fourth LED wafer 24 is moved to the second inspection station 140 by the robot arm 150 for detection.

In step S360 to step S375, the fourth LED wafer 24 is first moved to the buffer table 120. After the second LED wafer 22 is detected and moved to the pick-and-place stage 114, the fourth LED wafer 24 is further processed. Moving to the second inspection station 140 for detection. However, the detected second LED wafer 22 may be first moved to the buffer table 120, and then the fourth LED wafer 24 may be moved from the pick-and-place stage 114 to the second detecting station 140. Thereafter, the second LED wafer 22 on the buffer table 120 is moved onto the pick-and-place stage 114, and the second LED wafer 22 is housed in the storage cabinet 112.

In this embodiment, the pick-up table 114, the buffer table 120, the first detecting station 130, the second detecting station 140, and the robot arm 150 can be vertically moved up and down. The reason for this design is that the LED wafer can be made. In addition to being placed more stably, it is also possible to prevent the robot arm 150 from interfering with other components while moving. In addition, in addition to the position in the vertical direction, the first detecting station 130 and the second detecting station 140 can also be adjusted in a horizontal position for more precise alignment. Further, in the above embodiment, the robot arm 150 is rotated by the pivot 152. However, the robotic arm can also be in other forms, such as by hanging.

In addition, the relative positions of the pick-up table 114, the buffer table 120, the first detecting station 130, and the second detecting station 140 are not limited to the relative positions shown in FIG. 2, and those skilled in the art may Appropriately varied, for example, the position of the access stage 114 is exchanged with the position of the second inspection station 140. In addition, the number of detection stations is not limited to two, and more detection stations can be disposed in the optical detecting device, for example, three, so that the detection speed can be accelerated.

In the above embodiments, the detected object is an LED wafer. However, those skilled in the art should understand that the optical detecting device and the optical detecting method of the present invention can also be used for detecting other kinds of detected objects, for example, for example. Can be used to detect ICs or diodes.

The present invention has been described above by way of examples, and is not intended to limit the scope of the claims. The scope of patent protection is subject to the scope of the patent application and its equivalent fields. Modifications or modifications made by those skilled in the art, without departing from the spirit or scope of the invention, are equivalent to the equivalents or modifications made in the spirit of the invention and should be included in the following claims. Inside.

20. . . LED wafer

twenty one. . . First LED wafer

twenty two. . . Second LED wafer

twenty three. . . Third LED wafer

twenty four. . . Fourth LED wafer

100. . . Optical detection device

110. . . Loader

112. . . Storage cabinet

211. . . Film

213. . . Slot

114. . . Pick-up table

120. . . Buffer table

130. . . First test station

132. . . First sensor

140. . . Second test station

142. . . Second sensor

150. . . Mechanical arm

152. . . Pivot

154. . . Grab end

160. . . Lifting mechanism

S305~S375. . . Flow chart step

1 is a perspective view of an embodiment of an optical detecting device of the present invention.

2 is a top plan view of an embodiment of an optical detecting device of the present invention.

FIG. 3 is a structural diagram of a storage cabinet.

FIG. 4 is a flow chart showing a method for detecting an LED wafer by an optical detecting device.

5A to 5H are diagrams showing an optical detecting device when each step is performed.

100. . . Optical detection device

110. . . Loader

112. . . Storage cabinet

114. . . Pick-up table

120. . . Buffer table

130. . . First test station

132. . . First sensor

140. . . Second test station

142. . . Second sensor

150. . . Mechanical arm

152. . . Pivot

160. . . Lifting mechanism

Claims (13)

An optical detecting device comprising: a loader, the loader comprising a storage cabinet and a pick-and-place station, the storage cabinet storing a plurality of detected objects; a buffering station; a plurality of detecting stations, the detecting The table is for detecting the detected object; and a robot arm; wherein the loader can load the detected object in the storage cabinet to the pick-up table or detect the pick-up table The object is loaded into the storage cabinet, and the robot arm is used to move the detected object between the pick-up table, the buffer table, and each of the detecting stations. The optical detecting device of claim 1, wherein the detected object is an LED wafer. The optical detecting device of claim 1 or 2, wherein the robot arm is pivotally connected to the optical detecting device by a pivot. The optical detecting device of claim 3, wherein the pick-up table, the buffer table, and the detecting station surround the pivot. The optical detecting device according to claim 1 or 2, wherein at least one of the detecting station, the pick-up table, and the buffer table is vertically movable. The optical detecting device of claim 5, wherein the position of the detecting station on the horizontal level is adjustable. The optical detecting device according to claim 1 or 2, wherein the robot arm is movable up and down in a vertical direction. An optical detecting device according to claim 1 or 2, wherein When the optical detecting device performs the detecting, the following steps are performed: transferring the detected object from the storage cabinet to the pick-and-place station, and then transmitting from the pick-up station to the detecting station. Detecting until the test object is placed on each test stand; when the test stand is detecting, another detected object is transferred from the storage cabinet to the pick-up table, and then transferred to the test object Placed on the buffer table; after one of the detected objects is detected, the detected detected object is transferred to the pick-up table, and the detected object on the buffer table is transferred to the test stand having the vacancy Detecting; and transferring the detected object located on the access platform to the storage cabinet. The optical detecting device according to claim 1 or 2, wherein when the optical detecting device performs the detecting, performing the following steps: transferring the detected object from the storage cabinet to the pick and place And detecting from the pick-up station to the inspection station until the detection object is placed in each inspection station; when the inspection station is performing the detection, the other detected object is The storage cabinet is transported to the pick-up table; after detecting one of the detected objects, the detected detected object is transferred to the buffer station, and the detected object located on the pick-up table is transferred to The test station having the vacancy is tested; and the detected object located on the buffer table is transferred to the pick-up station and transferred to the storage cabinet. An optical detecting method for detecting a plurality of detected objects by using an optical detecting device, the optical detecting device comprising a loader, a buffering station, a plurality of detecting stations, and a robot arm, the loader including a storage The cabinet and a pick-up table are stored in the storage cabinet before the detecting, and the optical detecting method comprises: Transferting the detected object from the storage cabinet to the access platform, and the mechanical arm is further transmitted from the pick-up station to the inspection station for detection until each test station is placed with the The detected object; when the detecting station is detecting, another detected object is transferred from the storage cabinet to the pick-up table, and then transferred to the buffer table by the mechanical arm; After the detected object is detected, the detected object is transferred to the pick-up table by the robot arm, and the detected object on the buffer table is transferred to the test stand with the vacancy for detection. And transferring the detected object located on the access platform to the storage cabinet. The optical detecting method of claim 10, wherein the detected object is an LED wafer. An optical detecting method for detecting a plurality of detected objects by using an optical detecting device, the optical detecting device comprising a loader, a buffering station, a plurality of detecting stations, and a robot arm, the loader including a storage a cabinet and a pick-up table, wherein the detected object is stored in the storage cabinet before the detecting, the optical detecting method comprises: transferring the detected object from the storage cabinet to the pick-up table, by The robot arm is further transmitted from the pick-up station to the inspection station for detection until each test station is placed with the detected object; when the test station is detecting, another detected object is Transferring from the storage cabinet to the access platform; after detecting one of the detected objects, the detected object is transferred to the buffer table by the robot arm, and is located on the access platform The detected object is transferred to the inspection station having a vacancy for detection; the mechanical object is used to transfer the detected object located on the buffer table to the access table; and The detected object located on the pick-up table is transferred to the storage cabinet. The optical detecting method of claim 12, wherein the detected object is an LED wafer.