TWI434381B - Measurement device and thermal conductivity estimation method - Google Patents

Description

Measuring device and thermal conductivity estimating method

The present invention relates to a heating device and an assay device for evaluating the performance of a heat transfer machine.

The heat pipe is a device that absorbs heat at one end of a container in which a working fluid is sealed to evaporate the working fluid, and condenses the working fluid at the other end of the container to release heat, and is applied to cooling of an electronic device. A cooler (referred to as a heat pipe cooler in this specification) that combines a heat pipe and a heat sink, which is an electronic component such as an IC chip and a heat pipe, is proposed in Japanese Laid-Open Patent Publication No. 2007-208262, No. 2005-136117. Conductive connection is made to dissipate heat generated by the electronic components through the heat pipe to the heat sink.

The performance of the attached heat pipe cooler is evaluated by the total thermal resistance R _T represented by the following equation: R _T = (T _{1 -} T ₂ ) / W (Formula 1)

Wherein, W is the heat transfer amount per unit time of the heat pipe, T ₁ is the temperature of the heat absorbing portion of the heat pipe cooler (= surface temperature of the cooling target), and T ₂ is the temperature of the surrounding environment of the heat pipe cooler.

Alternatively, there is also a case where the total thermal resistance R _T is used instead of the working thermal resistance R _W . The working thermal resistance R _W is expressed by the following formula: R _W =(T ₁ -T' ₂ )/W (Equation 2)

Among them, T' ₂ is the temperature of the heat release portion of the heat pipe cooler.

In addition, the manufacturer of the heat pipe cooler measures the total thermal resistance R _{T of the} attached heat pipe cooler one by one to confirm that it meets the predetermined standard: (1) in measuring the temperature of the heat absorbing portion of the heat pipe cooler (= Cooling the surface temperature of the object) T ₁ while heating with an electric heater; (2) T ₁ rises slowly with time, but soon the heat release and heat generation reach equilibrium, making T ₁ constant (steady state); (3 Measuring the ambient temperature T ₂ when T ₁ becomes constant and the power consumption of the electric heater, and calculating the total thermal resistance R _{T of the} heat pipe cooler (the heat transfer amount W of the heat pipe cooler is equal to the electric heater when the steady state is reached) The amount of heat generated by the electric heater can be calculated from the power consumption.

However, the measurement of the total thermal resistance R _T according to the above method has the following problems.

In order for the electric heater to generate heat equal to the heat transfer amount of the heat pipe cooler (= heat release), heat insulation must be performed so that the heat of the electric heater is not dissipated outside the heat pipe cooler. Therefore, there is a problem that the size and weight of the electric heater become large.

Further, since the electric heater is difficult to be completely insulated, and there is no means for measuring and correcting the amount of heat radiated to the outside, there is a problem that the measurement cannot be performed correctly.

In addition, there is a case where the heat generating portion is uneven in the IC chip or the like. That is, there is a case where a high temperature occurs in a specific portion of the IC chip. The industry is seeking to reproduce this phenomenon to evaluate the effectiveness of the heat pipe cooler, but it requires a dedicated electric heater.

The present invention has been made to solve these problems, and aims to provide a heating device suitable for measuring the thermal resistance of a heat pipe cooler. The invention also provides an assay device suitable for determining the thermal resistance of a heat pipe cooler. In addition, the present invention also provides a method for easily estimating the effective thermal conductivity of an attached heat pipe cooler.

In order to achieve the above object, the heating device of the present invention is formed on the surface of the substrate by pairing A heating device that heats a film to conduct heat, and is characterized in that a plurality of heating films and power supply terminals for independently supplying power to the plurality of heating films are provided.

In addition, the power supply terminals may be formed on the bottom surface of the substrate, and through holes for electrically connecting the power supply terminals to the heating films may be disposed.

In addition, a plurality of sensing films may be formed on the bottom surface of the substrate.

In addition, while the substrate is disposed and held, a mounting substrate is also formed thereon, and a wiring pattern for electrically connecting the heating film and the sensing film to an external device is formed thereon.

In addition, the wiring pattern is provided with a plurality of power supply lines at each of the power supply terminals, and a start end that is in contact with the power supply terminals and a terminal that is located at an edge portion of the mounting substrate and is connected to the external device, and the plurality of terminals The lengths of the power supply lines are all equal.

Further, the measuring device of the present invention is characterized in that the measuring device is constituted by the heating device and the control device, and the control device has: a power control means for supplying predetermined heating power to the heating films; and a sensing control means, For measuring the temperature of the sensing film and the heating film; calculating means for calculating the temperature of the sensing film and the heating film measured by the sensing control means from the bottom surface of the substrate One of the outflows emits heat.

In addition, the calculation means calculates a temperature distribution of one of the bottom surfaces of the substrate based on the temperatures of the sensing films measured by the sensing control means.

Further, the calculation means calculates the amount of heat generated from the heating film based on the electric power supplied to the heating film by the power control means.

In addition, the calculation means can subtract the heat generated by the heating film. The heat flowing out from the bottom surface of the substrate is calculated, and one of the heat released from the heating film is calculated.

Further, an ambient temperature measuring means for measuring the ambient temperature of the measuring device is provided, and the calculating means is based on the temperature detected by the ambient temperature measuring means and the heated film measured by the sensing control means. The temperature and the amount of heat released from the upper surface of the heating film were used to calculate the thermal resistance of the test body provided on the heating film.

Further, a heat releasing portion temperature measuring means for measuring a surface temperature of the heat radiating portion of the test body provided on the heating film, and the calculating means is based on a temperature detected by the heat releasing portion temperature measuring means, The thermal resistance of the test body is calculated by sensing the temperature of the heated film measured by the control means and the amount of heat released from the heated film.

In addition, a temperature monitoring means is provided for monitoring the time change of the temperature of the heating film measured by the sensing control means, and the calculating means calculates the test body when the temperature of the heating film does not change with time. Thermal resistance.

The thermal conductivity estimation method of the present invention is characterized in that it comprises the following steps: a preliminary measurement step of disposing a heat radiator having a known thermal conductivity on a heat source, and the heat generation and the heat release amount of the heat source are equalized, thereby making the heat source When the temperature reaches a certain steady state, the temperature distribution of the heat radiator is measured; a calculation step is performed to solve the heat conduction equation about the heat radiator and the heat source, and the heat generation and the heat release amount of the heat source are calculated to be equalized and the heat source is The temperature distribution of the exothermic body when the temperature reaches a certain steady state; a boundary condition determining step, comparing the temperature distribution obtained by the preliminary measuring step and the temperature distribution obtained by the calculating step, determining the heat that is consistent with the two a boundary condition of the conduction equation; a stable temperature estimation step, substituting the thermal conductivity of the exothermic body, solving the heat conduction equation determined by the boundary condition determined by the boundary condition determining step, and estimating the heat generation and the heat release amount of the heat source to reach equilibrium And the temperature of the heat source reaches a certain steady state temperature of the heat source; an approximate determination step, according to the relationship between the thermal conductivity of the heat release body obtained by the stable temperature estimation step and the heat source temperature, determining the relationship between the two An approximate body; a test body measuring step, the test body is disposed on the heat source, measuring the heat source and the heat release amount of the heat source to be equalized and the temperature of the heat source reaches a certain temperature; and a thermal conductivity estimating step, The thermal conductivity of the test body is determined according to the temperature of the heat source obtained by the test body measuring step and the approximate expression obtained by the approximation determining step.

The heat source can be a heating device associated with any of the above structures.

Since the heating device of the present invention can independently control a plurality of heating films, it is possible to simulate a heat source in which heat is applied to a specific portion. Further, since the heating device of the present invention can detect the temperature of the surface of the substrate and the bottom surface, it is possible to calculate the amount of heat flowing out to the bottom surface of the substrate.

The measuring apparatus of the present invention can calculate the amount of heat transferred from the test body by subtracting the amount of heat flowing out from the heat generated by the heating film to the bottom surface of the substrate. In addition, the thermal resistance of the test body can be automatically measured.

According to the thermal conductivity estimation method of the present invention, the test body is placed on a heat source, and the thermal conductivity of the test body can be known only by measuring the temperature at which the temperature of the heat source reaches a steady state.

Hereinafter, the best mode for carrying out the invention will be described.

[Overall structure of heating device]

Fig. 1 is a side view showing the conceptual structure of the heating device of the present invention. As shown in Fig. 1, the heating device 1 is a device for heating the heat pipe cooler 2, which is composed of a heating substrate 3 and a mounting substrate 4.

Further, the heat pipe cooler 2 has a heat pipe 5 and a heat sink 6, which is a cooler which is heated by the IC wafer (not shown) to transfer heat generated by the IC chip to the heat sink 6 through the heat pipe 5.

The heating substrate 3 is made of a heat resistant ceramic, and a plurality of heating films 7 are formed on the surface thereof. Further, a through hole (not shown) is provided in the heating substrate 3, and the power supply terminal 8 passes through the through hole and protrudes from the bottom surface of the heating substrate 3. The power supply terminal 8 is a terminal for supplying electric power to the heating film 7, and the heating film 7 is supplied with power via the power supply terminal 8 to generate heat. Further, by measuring the electric resistance between the power supply terminals 8, the temperature of the heating film 7 can be known.

Further, a plurality of sensing films 9 are provided on the bottom surface of the heating substrate 3. The temperature of the bottom surface of the heating substrate 3 can be known by measuring the electric resistance of the sensing film 9.

The mounting substrate 4 is for fixing and fixing the quartz substrate of the heating substrate 3, and the heating substrate 3 is fixed to a predetermined position on the mounting substrate 4 by a fastener (not shown). Moreover, the power supply wiring film 10 and the sensing wiring film 11 are formed on the surface of the mounting substrate 4. The power supply wiring film 10 is a power supply wiring pattern from an external device (not shown) to the heating film 7, and the sensing wiring film 11 is a wiring pattern that electrically connects the external device and the sensing film 9.

[heating the surface of the substrate]

Fig. 2 is an external view of the heating substrate 3, wherein (a) is a plan view of the surface thereof, (b) is an enlarged view of a portion where the heating film 7 is provided, and (c) is a partial cross-sectional view.

As shown in Fig. 2(a), the heating substrate 3 is formed into a square having a side length of 50 mm. A square heating surface 12 having a side length of 10 mm is formed in the center. The heating surface 12 is a part of a cooling object (i.e., an IC wafer) that simulates the heat pipe cooler 2, and has five heating films 7.

Further, as shown in Fig. 2(b), four L-shaped heating films 7 are disposed around the square heating film 7 provided at the center of the heating surface 12. Further, a power supply terminal 8 is provided at an end portion of the heating film 7, and each of the heating films is provided. The power supply terminal 8 protrudes from the surface of the heating substrate 3 to the through hole 13 of the bottom surface, and protrudes from the bottom surface of the heating substrate 3 ( Refer to Figure 2 (c)). Further, the thickness of the heating substrate 3 is about 1 mm.

In this manner, since the power supply terminals 8 are respectively provided on the five heating films 7, the five heating films 7 can be independently controlled. That is, it is possible to conduct electricity to one of the five heating films 7, and to adjust the amount of heat generated by the specific heating film 7, so that it is possible to simulate an IC wafer in which the heat generation portion is uneven.

Further, the material of the heating film 7 is selected from a material which is capable of generating heat after energization and whose electric resistance changes with temperature. In the present embodiment, platinum is used.

[heating the bottom surface of the substrate]

3 is a plan view showing the bottom surface of the heating substrate 3, wherein (a) is a general view, and (b) is an enlarged view of the sensing film 9.

As shown in Fig. 3(a), nine sensing films 9 are arranged on the bottom surface of the heating substrate 3 in the lateral direction and the oblique direction (diagonal direction). As described below, this arrangement is selected to estimate the overall temperature distribution of the bottom surface of the heating substrate 3 based on the temperature data obtained from the nine sensing films 9. Further, the sensing film 9 is selected so as not to interfere (overlap) with the power supply terminal 8 of the heating film 7.

Further, the sensing film 9 has a square shape having a side length of about 2.4 mm and has a pattern as shown in Fig. 3(b). In addition, a sensing end is provided at the two ends of the pattern of the sensing film 9. Sub-14, the temperature of the sensing film 9 can be known by measuring the resistance between the sensing terminals 14.

Further, the material of the sensing film 9 can be appropriately selected among substances whose electric resistance changes with temperature, and in the present embodiment, platinum is used.

[mounting substrate]

4 is a plan view showing the surface of the mounting substrate 4, wherein (a) is a single body of the mounting substrate 4, and (b) shows a state in which the heating substrate 3 is mounted on the mounting substrate 4.

As shown in Fig. 4, the mounting substrate 4 is a square quartz substrate having a side length of 150 mm, and ten power supply wiring films 10 and 18 sensing wiring films 11 are formed on the surface.

The power supply wiring film 10 is a conductor film for connecting the electrode pads 15 provided at the edge portions of the mounting substrate 4 and the connection pads 16 provided at the central portion of the mounting substrate 4. The electrode pad 15 is a connection portion for electrically connecting an external device (not shown), and the connection pad 16 is a connection portion that comes into contact with the power supply terminal 8 that protrudes from the bottom surface of the heating substrate 3. In other words, the power supply wiring film 10 is used as a wiring for electrically connecting the external device and the heating film 7.

In addition, the relative positional relationship between the electrode pads 15 of the ten power supply wiring films 10 and the connection pads 16 is different, and the path is bent by the relative positional relationship between the electrode pads 15 and the connection pads 16, so that the electrode pads are The path length of 15 to the connection pad 16 is equal for all of the power supply wiring films 10. This is to eliminate the measurement error of the heat generation amount and the temperature due to the difference in the wiring resistance of the power supply wiring film 10.

The sensing wiring film 11 is a conductor film for connecting the electrode pads 17 provided on the edge portions of the mounting substrate 4 and the connection pads 18 provided on the central portion of the mounting substrate 4. The electrode pad 17 is for electrically connecting a connection portion of an external device (not shown), and the connection pad 18 is provided The connecting portion of the sensing film 14 of the sensing film 9 on the bottom surface of the substrate 3 is in contact with each other. In other words, the sensing wiring film 11 is used as a wiring for electrically connecting the external device and the sensing film 7.

Further, for the same reason as the power supply wiring film 10, the sensing wiring film 11 is also bent by the path so that the path length from the electrode pad 17 to the connection pad 18 is the same for all the sensing wiring films 11 equal.

[Method for measuring thermal resistance]

Fig. 5 is a schematic view showing the principle of measuring the total thermal resistance R _T of the heat pipe cooler 2 using the heating device 1.

In Fig. 5, W _P is the heat generated by heating the film 7 per unit time, and the W _F is the heat absorbed by the heat pipe cooler 2 from the heating film 7 per unit time and discharged to the external environment, that is, the heat pipe is cooled. The amount of heat transfer per unit time. Further, W _B is heat that is discharged from the back surface of the heating film 7 to the external environment via the heating substrate 3 per unit time.

Further, T ₁ is the temperature of the heating film 7 , T ₂ is the temperature of the external environment, and T ₃ is the temperature of the bottom surface of the heating substrate 3 .

The total thermal resistance R _T of the attached heat pipe cooler 2 is calculated by the following formula: R _T = (T _{1 -} T ₂ ) / W _F (Formula 3)

Since T ₁ is the temperature of the heating film 7, it can be calculated from the resistance value of the heating film 7. In addition, since the T ₂ system is the temperature of the external environment, it can be measured by various known temperature measuring means. Therefore, the total thermal resistance R _T can be obtained by knowing W _F .

Here, the state in which the time change of T ₁ disappears, that is, the steady state is considered. In the steady state, all the heat generated by the heating film 7 is discharged to the outside, and therefore, the following formula holds: W _P = W _F + W _B (Expression 4) ∴ W _F = W _{P -} W _B (Expression 5)

Since W _P is a heat generated by heating the film 7 per unit time, it can be obtained by multiplying the power consumption of the heating film 7 by the thermoelectric conversion efficiency. On the other hand, W _B is calculated by the following procedure.

The area of the heating film 7 is A, and the thickness of the heating substrate 3 is t. Since t is small compared with A, the heat flowing from the back surface of the heating film 7 into the bottom surface of the heating substrate 3 can be regarded as flowing vertically into the heating substrate 3. Therefore, the following formula is established. In the formula, k is the thermal conductivity of the heating substrate 3.

W _B =A‧k‧(T ₁ -T ₃ )/t (Equation 6)

As described above, T ₁ can be calculated from the resistance value of the heating film 7. However, T ₃ cannot directly use the measured value of the sensing film 9 because the sensing film 9 is not located directly under the heating film 7 (this configuration is to prevent the power supply terminal 8 of the heating film 7 from interfering with the sensing film 9) .

Further, the temperature distribution of the bottom surface of the heating substrate 3 is estimated based on the measured values of the nine sensing films 9 provided on the bottom surface of the heating substrate 3, and the temperature of the bottom surface of the heating substrate 3 directly under the heating film 7 is obtained, that is, T ₃ .

When the heating film 7 is appropriately disposed with respect to the preset temperature distribution, the temperature of the point between the adjacent sensing films 9 can be determined as a linear change corresponding to the distance from the one sensing film 9. Further, in the present embodiment, since the sensing film 9 is not uniformly distributed with respect to the heating substrate 3, the temperature estimation accuracy at the portion away from the sensing film 9 may be problematic, however, the heating film 7 is disposed on the heating substrate. 3 In the vicinity of the center, it is considered that the temperature of the bottom surface of the heating substrate 3 is symmetrically distributed with respect to the center of the heating substrate 3. Therefore, as shown in Fig. 6, it can be considered that the temperature of the portions A to D is equal to the measured value of the sensing film 9 provided at the portions A' to D', and an isotherm diagram can be made.

According to the temperature distribution of the bottom surface of the substrate 3 thus obtained, if the temperature of the bottom surface of the heating substrate 3 directly under the heating film 7 is T ₃ , W _B can be obtained by Equation 6.

[Measuring device]

A measuring device 21 for automatically measuring the total thermal resistance R _T or the working thermal resistance R _W of the heat pipe cooler 2 using the heating device 1 will be described below.

Fig. 7 is a structural view showing the conceptual structure of the measuring device 21. As shown in Fig. 7, the measuring device 21 is composed of a heating device 1, a control device 22, a power control device 23, a sensing control device 24, and temperature sensors 25, 26.

The control device 22 is a computer equipped with the entire measuring device 21, and the power control device 23 and the sensing control device 24 are operated by the command of the control device 22.

The power control device 23 is a device for supplying predetermined power to the heating film 7 of the heating device 1 in accordance with an instruction from the control device 22.

The sensing control device 24 measures the resistance between the sensing terminals 14 of the sensing film 9 in accordance with an instruction from the control device 22, and calculates the temperature of the sensing film 9. Further, the sensing control device 24 measures the electric resistance between the power supply terminals 8 of the heating film 7 in accordance with an instruction from the control device 22, and calculates the temperature of the heating film 7.

The temperature sensor 25 is a sensor for detecting the temperature of the external environment (the space in which the heat pipe cooler 2 is radiated). Further, the temperature sensor 26 is a sensor for detecting the surface temperature of the heat radiating portion (heat sink 6) of the heat pipe cooler 2.

[control program]

The control device 22 is provided with a control program, and the control device 22 operates the power control device 23 and the like according to the control program, and performs automatic measurement. Figure 8 shows the flow of executing one of the control program instances on the control device 22. Hereinafter, the control program will be described in order according to the step numbers attached to the drawings.

(Step 1) The power control device 23 supplies the heating film 7 with predetermined electric power to start heating. As described above, for example, one of the five heating films 7 is supplied with power to simulate an IC chip having uneven heat generation portions; (Step 2) After the heating is started, the sensing control device 24 determines the resistance between the power supply terminals 8 of the heating film 7. The change in the temperature T ₁ of the heating film 7 is monitored until the non-changing state (stable state) is reached. When the state of no change is reached, the process proceeds to step 3; (step 3) the sensing control device 24 calculates the temperature of the sensing film 9, and based on the result, estimates the temperature distribution of the bottom surface of the heating substrate 3, and finds the heating film 7 directly below. 3 the bottom surface temperature T ₃ of the heated substrate; (step 4) the T ₁ and T _3, calculated from the amount of heat per unit time of heating the substrate W _B 3 effluent bottom surface; a supply (step 5) the power control device 23 heating the film 7 The electric power is used to obtain the heat W _P generated on the heating film 7 per unit time; (Step 6), according to W _B and W _P , the heat W _F delivered (heat release) by the heat pipe cooler 2 per unit time is obtained; (Step 7) The total thermal resistance R _{T of the} heat pipe cooler 2 is obtained from the external environmental temperatures T ₂ and T ₁ and W _F detected by the temperature sensor 25.

In addition, if the surface temperature T' ₂ of the heat radiating portion (heat sink 6) of the heat pipe cooler 2 detected by the temperature sensor 26 is replaced by T ₂ in step 7, the working heat of the heat pipe cooler 2 can be calculated. Resistance R _W .

[Evaluation of the efficiency of heat transfer machine units]

The above description illustrates the step of measuring the thermal resistance of the heat pipe cooler 2 using the measuring device 21 provided with the heating device 1. The thermal resistance is an effective indicator for evaluating the heat transfer performance of a heat transfer machine when it is installed in a specific heat source.

However, according to the experiments of the inventors, the working thermal resistance R _W of the 2x7 mm planar heater (heat source 1) combined with the heat pipe cooler 2 is 0.35 (K/W), and the 3x5 mm planar heater (heat source) 2) The working thermal resistance R _W when combined with the heat pipe cooler 2 is 0.80 (K/W). Therefore, since the thermal resistance varies depending on the size and shape of the heat source, there is a problem that it is difficult to be used as an evaluation index of the heat transfer efficiency of the heat transfer machine.

Therefore, the inventors considered the measuring device 21 to estimate the effective thermal conductivity of the heat transfer machine while using the effective thermal conductivity to evaluate the heat transfer efficiency of the heat transfer machine unit. The following is a method for setting a heat transfer machine on a heat source, estimating the effective heat conductivity of the heat transfer machine according to the heat source of the heat source and the heat transfer amount of the heat transfer machine to balance the heat source temperature, and estimating the effective heat transfer rate of the heat transfer machine; The thermal conductivity is superior to the evaluation index of the heat transfer efficiency of the heat pipe cooler 2 alone.

[Determining the boundary conditions of the heat transfer equation]

An object having a known thermal conductivity is placed on a heat source, and a heat transfer machine is disposed thereon. To calculate the temperature (steady temperature) at which the heat generation of the heat source is balanced with the heat transfer amount of the heat transfer machine, the following steps are used to determine the boundary conditions of the heat transfer equation: (1) placing an exothermic body (for example, a copper plate) having a known thermal conductivity on a heat source, and measuring the temperature distribution of the exothermic body when the temperature of the heat source is stabilized (for example, using infrared rays) (2) establish a ternary heat conduction equation for the exothermic body and the heat source, and solve it by a finite volume method; (3) compare the measured value of (1) with the calculated value of (2), and decide to make the two The boundary condition of the uniform ternary heat conduction equation (the thickness of the high temperature grease between the exotherm and the heat source, and the heat transfer coefficient above the exotherm).

[Determining the relationship between thermal conductivity and heat source stable temperature]

While determining the boundary condition by using the above method, the thermal conductivity of the exothermic body is variously changed, the ternary heat conduction equation is solved, and the stable temperature of the heat source corresponding to the thermal conductivity of each of the exotherms is calculated.

The inventor determines the boundary conditions of the heat conduction equation of the heat source 1 and the heat source 2 by the above method, and calculates the relationship between the thermal conductivity and the stable temperature, and takes the thermal conductivity of the heat radiating body as the horizontal axis, and takes the heat source 1 and The stable temperature of the heat source 2 is plotted on the vertical axis, and the result shown in Fig. 9 is obtained.

Here, it is assumed that the stable temperature of the heat source 1 or the heat source 2 is Y, and the thermal conductivity of the heat radiator is X, and the relationship between the two is approximated by the following formula:

In order to maximize the correlation coefficient between the thermal conductivity X and the stable temperature Y, the constant of Equation 7 is selected, and as a result, the following values are obtained.

That is, for this heat source 1:

For this heat source 2:

Further, the curve shown in Fig. 9 is a curve obtained by substituting the value shown in Formula 8 or Formula 9 in Formula 7.

[Estimating the effective thermal conductivity of heat transfer machines]

The following formula is obtained from the formula 7.

The heat pipe cooler 2 is placed on the heat source 1 and the heat source 2 described above, and 349.4 (K) and 350.6 (K) are obtained when the heat source 1 and the heat source 2 are at a stable temperature. This equivalent value is substituted into Equation 10 together with Equations 8 and 9, to determine the effective thermal conductivity X of the heat pipe cooler 2, and as a result, the following values are obtained.

That is, for this heat source 1:

For this heat source 2:

Thus, regardless of whether the heat source 1 is used or the effective heat conductivity of the attached heat pipe cooler 2 is measured by the heat source 2, the results are almost indistinguishable. It can be seen that the effective heat conductivity X is an inherent heat transfer performance index of the heat pipe cooler 2, and is not affected by the size or size of the heat source.

Therefore, a heat radiating body having a known thermal conductivity is placed on the heating device 1, and the temperature distribution of the heat radiating body when the heating device 1 reaches a stable temperature is measured, thereby determining the stable temperature of the heating device 1 and the object placed on the heating device 1. The relationship between thermal conductivity. Further, if the relationship can be determined for the heating device 1, the effective thermal conductivity of the object can be estimated only by measuring the stable temperature of the heating device 1.

The foregoing is an example of the invention for determining the heat transfer characteristics of an attached heat pipe cooler, but The scope of application of the present invention is not limited thereto. The invention is broadly applicable to the determination of heat transfer characteristics of various heat transfer machines.

[Industrial use possibilities]

The apparatus and method of the present invention can be used to determine the heat transfer characteristics of various heat transfer machines.

1‧‧‧heating device

2‧‧‧With heat pipe cooler

3‧‧‧heating the substrate

4‧‧‧Installation substrate

5‧‧‧heat pipe

6‧‧‧ Heat sink

7‧‧‧heated film

8‧‧‧Power supply terminal

9‧‧‧Sensing film

10‧‧‧Power supply wiring film

11‧‧‧Sensing wiring film

12‧‧‧ heating surface

13‧‧‧through hole

14‧‧‧Sensor terminal

15‧‧‧electrode pads

16‧‧‧Connecting mat

17‧‧‧electrode pads

18‧‧‧Connecting mat

21‧‧‧Measurement device

22‧‧‧Control device

23‧‧‧Power control unit

24‧‧‧Sensing control device

25‧‧‧ Temperature Sensor

26‧‧‧Temperature Sensor

1 is a side view showing a conceptual structure of a heating device of the present invention; and FIG. 2 is a view showing a heating substrate of the heating device, wherein (a) is a plan view of the surface thereof, and (b) is provided with An enlarged view of a portion where the film is heated, (c) is a partial cross-sectional view; and a third view is a plan view showing a bottom surface of the heating substrate of the heating device, wherein (a) is a general view and (b) is a sensing film Fig. 4 is a plan view showing the surface of the mounting substrate of the heating device, wherein (a) is a single figure, (b) is a state in which a heating substrate is mounted, and Fig. 5 is a heating device exemplified. A schematic diagram for determining the principle of the total thermal resistance of the heat pipe cooler; FIG. 6 is an example of an isotherm diagram for heating the bottom surface of the substrate; and FIG. 7 is a structural diagram showing the conceptual structure of the measuring device of the present invention; The figure is a flow chart showing an example of a program executed on the inspection apparatus; and the figure 9 is a diagram showing the relationship between the thermal conductivity of the heat radiator and the stable temperature of the heat source.

1‧‧‧heating device

2‧‧‧With heat pipe cooler

3‧‧‧heating the substrate

4‧‧‧Installation substrate

5‧‧‧heat pipe

6‧‧‧ Heat sink

7‧‧‧heated film

8‧‧‧Power supply terminal

9‧‧‧Sensing film

10‧‧‧Power supply wiring film

11‧‧‧Sensing wiring film

Claims (11)

An assay device comprising: a heating device for generating heat by energizing a plurality of heating films formed on a substrate, comprising: the substrate; the plurality of heating films; and a plurality of power supply terminals for heating the plurality of heating electrodes The film is separately powered; and a plurality of sensing films are formed on the bottom surface of the substrate; and a control device having: a power control means for supplying predetermined power to the heating films; and a sensing control means For measuring the temperatures of the sensing films and the heating films; and calculating means for calculating the temperatures of the sensing films and the heating films measured by the sensing control means One of the bottom surfaces of the substrate flows out of the heat; wherein the power supply terminals are formed on the bottom surface of the substrate, and the heating device has a through hole for electrically connecting the power supply terminals to the heating films. The measuring device according to claim 1, wherein the calculating means calculates a temperature distribution of a bottom surface of the substrate based on the temperature of the sensing film measured by the sensing control means. The measuring device according to claim 1, wherein the calculating means calculates the electric power of the heating film according to the electric power control means, and calculates the heating film Produces one of the calories. The measuring device according to claim 3, wherein the calculating means subtracts the heat of outflow from the bottom surface of the substrate from the heat generated by the heating film, and calculates the discharge from the upper surface of the heating film. One releases heat. The measuring device according to claim 4, further comprising an environmental temperature measuring means for measuring an ambient temperature of the measuring device, wherein the calculating means is based on a temperature detected by the ambient temperature measuring means, and the sensing control means The temperature of the heated film and the heat released from the upper surface of the heated film were measured to calculate the thermal resistance of one of the test bodies disposed on the heated film. The measuring device according to claim 4, further comprising a heat releasing portion temperature measuring means for measuring a surface temperature of one of the heat radiating portions of the test body disposed on the heating film, wherein the calculating means is based on the heat radiating portion The temperature detected by the temperature measuring means, the temperature of the heating film measured by the sensing control means, and the heat released from the heating film, calculate the thermal resistance of the test piece. The measuring device according to claim 5 or claim 6, further comprising a temperature monitoring means for monitoring a time change of a temperature of the heating film measured by the sensing control means, wherein the computing means is When the temperature of the heated film did not change with time, the thermal resistance of the test body was calculated. The measuring device according to claim 1, wherein the heating device further comprises a mounting substrate on which a wiring pattern for electrically connecting the heating film and the sensing film to an external device is formed. The measuring device according to claim 8, wherein the wiring pattern has a plurality of strips The electrical circuit has a starting end in contact with the power supply terminals and is connected to a terminal located at one edge of the mounting substrate and connected to the external device, and the lengths of the plurality of power supply lines are all equal. A method for estimating thermal conductivity includes the following steps: a preliminary measuring step of disposing a heat-dissipating body having a known thermal conductivity on a heat source, wherein one of the heat source and the heat-dissipating heat are equalized, and one of the heat sources When the temperature reaches a certain steady state, measuring a temperature distribution of the heat radiator; a calculation step of solving a heat conduction equation about the heat radiator and the heat source, calculating a heat generation and a heat release amount of the heat source to achieve equilibrium and the heat source The temperature reaches a certain temperature state of the exothermic body; a boundary condition determining step, comparing the temperature distribution obtained by the preliminary measuring step and the temperature distribution obtained by the calculating step, determining that the two are consistent a boundary condition of the heat conduction equation; a stable temperature estimation step, substituting the thermal conductivity of the heat release body, and solving the heat conduction equation determined by the boundary condition determined by the boundary condition determining step, and estimating the heat generation amount and the heat release amount of the heat source Equilibrium and the temperature of the heat source reaches a certain steady state of the temperature of the heat source; an approximation a step of determining an approximate expression indicating a relationship between the thermal conductivity of the exothermic body obtained by the stable temperature estimating step and the temperature of the heat source; and a test body measuring step of setting a test body to the heat source Measuring the heat generation and the heat release amount of the heat source to be equalized and the temperature of the heat source reaches a certain temperature The temperature of the heat source; and a thermal conductivity estimating step, determining the thermal conductivity of the test body according to the temperature of the heat source obtained by the test body measuring step and the approximate expression obtained by the approximated determining step. The method of estimating thermal conductivity according to claim 10, wherein the heat source is a heating device comprising: a substrate; a plurality of heating films; and a plurality of power supply terminals for independently supplying power to the plurality of heating films.