CN103913483B - A kind of high-precision heat resistance test apparatus and method of testing thereof - Google Patents
A kind of high-precision heat resistance test apparatus and method of testing thereof Download PDFInfo
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- CN103913483B CN103913483B CN201410166724.3A CN201410166724A CN103913483B CN 103913483 B CN103913483 B CN 103913483B CN 201410166724 A CN201410166724 A CN 201410166724A CN 103913483 B CN103913483 B CN 103913483B
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Abstract
The invention discloses a kind of high-precision heat resistance test apparatus and method of testing thereof, described heat resistance test apparatus comprises casing, in described casing, be provided with control system, on described casing, be fixedly installed vertical direction detection platform and horizontal direction detection platform, be also provided with guidance panel in a side of described casing; Described vertical direction detection platform is all electrically connected with described control system with horizontal direction detection platform and guidance panel. Heat resistance test apparatus provided by the invention and method of testing, have simple to operate, measuring accuracy advantages of higher; And by introducing the thermal resistance of horizontal direction and the test of thermal conductivity factor, the heat conductivility assessment coordinate system that the thermal resistance that foundation records with horizontal direction and vertical direction and thermal conductivity factor data are set up, can make more adding system analysis and assessment comprehensively and accurately to the heat conductivility of PCB more effectively.
Description
Technical field
The present invention relates to thermal resistance value and the heat conduction system of PCB (printed circuit board) substrate horizontalThe test of number, particularly a kind of test of the heat conductivility assessment that is applicable to high-brightness LED PCBDevice and method of testing.
Background technology
In the last few years, along with the call of the United Nations's energy-saving and emission-reduction, China's advocating aspect green energy resource,LED growth momentum is swift and violent. PCB as LED circuit carrying is bearing important passage of heat effect, leadsThe hot important assessment key element that has become PCB reliability. Particularly to there being the PCB of high-power requirement,The assessment of PCB thermal conductivity is essential especially. PCB is actually multiple material after a series of processing proceduresComplex, its thermal resistance value and thermal conductivity factor are not the physochlaina infudibularis amount of some materials, but one etc.Effect value, different materials combination and aid in treatment are different on the thermal conductivity impact of PCB.
At present, existing thermal resistance tester can only carry out to PCB thermal resistance and the thermal conductivity factor of vertical directionTest, and the function that not thermal resistance to its horizontal direction and thermal conductivity factor are not tested, only to verticallyThe data that direction records cannot be carried out more adding system, effectively analysis, and its assessment mode lacks accuracyWith convincingness. How to introduce the thermal resistance of horizontal direction and the test of thermal conductivity factor, more effectively to PCBHeat conductivility more adding system comprehensively, assess exactly, be current urgent problem.
Summary of the invention
In order to overcome deficiency of the prior art, the invention provides a kind of high accuracy, high efficiency and behaviourMake heat resistance test apparatus easily, this heat resistance test apparatus is by increasing thermal resistance and the heat conduction of horizontal directionThe function of coefficient, accurate and effective and assessment mode be also more more in the assessment that makes the heat conductivility to PCBAdding system is comprehensive.
The present invention is achieved by the following technical solutions:
A kind of high-precision heat resistance test apparatus, comprises casing, is provided with control system, institute in casingA side of stating casing is provided with guidance panel, is provided with for testing substrate Vertical Square to be measured on casingTo thermal resistance and the vertical direction detection platform of thermal conductivity factor, described vertical direction detection platform and operationPanel is all electrically connected with described control system, is also provided with for testing substrate to be measured on described casingThe horizontal direction detection platform of the thermal resistance of horizontal direction and thermal conductivity factor, this horizontal direction detection platform withDescribed control system is electrically connected, and described heat resistance test apparatus also comprises and in the time testing, is positioned over Vertical SquareTo in detection platform or horizontal direction detection platform, for substrate to be measured is entered in closed environmentThe seal closure of row test.
Preferably, described horizontal direction detection platform comprises a bracing frame, support frame as described above comprise base plate,Be arranged on base plate and the riser vertical with base plate and be arranged at the horizontal checkout plate on described riser,On described horizontal checkout plate, be provided with wire for being electrically connected with described test macro and for solidThe deck of fixed substrate to be measured, with the bracing frame of described horizontal checkout plate the same side on be provided with for obtainingGet environment temperature and environment temperature is fed back to the temperature sensor of control system.
Preferably, described vertical direction detection platform comprises water circulation temperature control system, to be measured for placingThe metal derby of substrate to be measured, described water circulation temperature control system comprises water tank, what be all connected with water tank addsHot charging is put and heat abstractor, and described water tank inner top is provided with testing flume, the sidewall setting of water tankBe useful on the temperature sensor of water temperature in the described testing flume of test and be used to testing flume to add waterFiller, described metal derby is arranged at described tank top, and described metal derby part puts in testing flumeIn, and the part that described metal derby is placed in outside testing flume is provided with temperature sensor, this TEMPDevice is by extremely described control system of the temperature feedback obtaining; Establish the below that is positioned at testing flume in described water tankBe equipped with stock trough, the sidewall of testing flume is provided with the water level limit for height hole being communicated with stock trough, andOutside water tank, described testing flume is connected with stock trough by the pipeline that is provided with water pump.
Preferably, described substrate to be measured comprises substrate, is arranged at the TEG chip on substrate, described TEGChip is connected with wire and described TEG built-in chip type has resistance calculations circuit.
Heat resistance test apparatus provided by the invention, its method of testing step is as follows:
The heat conduction that horizontal or vertical direction is carried out in step 1, selection detects;
Step 2, the substrate to be measured that is welded with TEG chip is positioned in corresponding detection platform, andConnect wire;
Step 3, control system initialize, and obtain the initial temperature T of test environment0With TEG chipInitial resistance R0, and calculate the target resistance Rt=R of TEG chip0+R0* (1+TCR*M), wherein, TCRFor temperature-coefficient of electrical resistance, M is the object variations temperature of TEG chip, M be can be predetermined constant temperatureValue;
Step 4, control system provide power P to TEG chip, obtain the real-time resistance of TEG chipRx, and calculate the real-time temperature difference T=(Rx-2R of TEG chip0)/(R0*TCR)；
Step 5, taking the target resistance Rt of TEG chip as reference value, power P is adjusted, makeThe real-time resistance R x of TEG chip equals target resistance Rt;
Step 6, stably equal, after target resistance Rt, to obtain as the real-time resistance R x of TEG chipTest environment temperature T now1, the power P x that system provides, and calculate TEG chip temperature Tx=T1+ΔT；
Step 7, calculating thermal resistance and thermal conductivity factor, thermal resistance R=(Tx-T0)/Px; If horizontal directionHeat conduction detect, thermal conductivity factor He=1/ (R*S selects a time1), if the heat conduction of vertical direction detects,Its thermal conductivity factor Ke=t/ (R*S2); Wherein, S1For substrate area to be measured, S2For TEG chip area,T is substrate thickness to be measured;
Step 8, is cooled to the temperature of the substrate to be measured that is welded with TEG chip after room temperature, and it is carried outThe heat conduction of another direction detects, and repeating step two is to step 7.
Preferably, in described step 4, when control system provides power P to TEG chip, meritRate P progressively increases, and in the time of the real-time temperature difference T=M of TEG chip, power P no longer increases; DescribedThe object variations temperature M of TEG chip is preferably M=50 DEG C.
In the control system of heat resistance test apparatus, its foundation has with horizontal direction and vertical direction and recordsThermal resistance and the heat conductivility assessment coordinate system set up of thermal conductivity factor data. The invention of this heat providesNot only carry out vertical direction test but also carried out the assessment mode of " face " of the heat conductivility of horizontal direction test,Only carry out the assessment side of " point " of the heat conductivility of vertical direction test with respect to existing thermal resistance testerFormula, can be more effectively to heat conductivility more adding system, assess exactly, make thermal conductivityCan assess more accurately with reliable.
Brief description of the drawings
Accompanying drawing 1 is the perspective view of heat resistance test apparatus in the embodiment of the present invention;
Accompanying drawing 2 removes cloche and base to be measured is installed for heat resistance test apparatus in the embodiment of the present inventionThe structural representation of plate;
Accompanying drawing 3 is the main TV structure schematic diagram of heat resistance test apparatus in the embodiment of the present invention;
Accompanying drawing 4 is the plan structure schematic diagram of heat resistance test apparatus in the embodiment of the present invention;
Accompanying drawing 5 is the cutaway view of A-A in accompanying drawing 4;
Accompanying drawing 6 is the cutaway view of B-B in accompanying drawing 4;
Accompanying drawing 7 is the cutaway view of C-C in accompanying drawing 4;
Accompanying drawing 8 is the logic relation picture of heat resistance test apparatus work in the embodiment of the present invention;
Accompanying drawing 9,10 is in the embodiment of the present invention, the size of horizontal direction detection platform associated components to be wantedThe schematic diagram of asking;
Accompanying drawing 11 is the perspective view of vertical direction detection platform in the embodiment of the present invention;
Accompanying drawing 12 is the sectional structure signal of the water tank of vertical direction detection platform in the embodiment of the present inventionFigure;
Accompanying drawing 13 is the structural representation of substrate to be measured in the embodiment of the present invention;
Wherein: 1-casing, 21-vertical direction detection platform, 22-aluminium block, 23-water tank, 231-testTank, 2311-water level limit for height hole, 232 stock trough, 24-filler, 25-fan, 26-heat radiationSheet, 27-water inlet pipe, 28 drinking-water pipes, 31-horizontal direction detection platform, 32-base plate, 33-riser,34-horizontal checkout plate, 35-deck, 4-guidance panel, 41-action button, 42-display floater, 5-Substrate to be measured, 51-substrate, 52-TEG chip, 53-wire, 6-control system, 7-temperature sensor,81-outlet pipe connector, 82-heating rod connector, 83-discharge outlet, 9-cloche.
Detailed description of the invention
For the ease of those skilled in the art's understanding, below in conjunction with accompanying drawing, the present invention is done furtherDescribe.
As shown in accompanying drawing 1-7, a kind of high-precision heat resistance test apparatus, comprises casing 1, on casing, establishesBe equipped with thermal resistance for testing substrate vertical direction to be measured and the vertical direction detection platform of thermal conductivity factor21, in casing, be provided with control system 6, a side of described casing is provided with guidance panel 4 and (comprisesAction button 41 and display floater 42), described vertical direction detection platform and guidance panel all with described inControl system is electrically connected, and is also provided with the heat for testing substrate horizontal direction to be measured on described casingThe horizontal direction detection platform 31 of resistance and thermal conductivity factor, this horizontal direction detection platform and described control systemSystem is electrically connected, and described heat resistance test apparatus also comprises in the time testing and is positioned over vertical direction detection platformOr in horizontal direction detection platform, close for what substrate to be measured was tested in closed environmentSealing cover. In the embodiment of the present invention, described seal closure is transparent cloche 9.
The test job of this heat resistance test apparatus, triggers by the action button 41 on guidance panel 4Realize, the test job of vertical direction detection platform 21 and horizontal direction detection platform 31, all passes throughControl system 6 is controlled realization, dynamically showing by display floater 42 in test process, itsLogic relation picture as shown in Figure 8.
In the control system of heat resistance test apparatus, its foundation has with horizontal direction and vertical direction and recordsThermal resistance and the heat conductivility assessment coordinate system set up of thermal conductivity factor data, meanwhile, in control systemAlso be provided with data analysis functional module and stable state monitoring function module. Heat conduction in control systemPerformance Evaluation coordinate system is to be based upon not only with the thermal resistance of vertical direction and thermal conductivity factor but also with level sideTo the coordinate system of thermal resistance and thermal conductivity factor, be the assessment mode of a kind of " face ", with respect to existing heatResistance tester only carries out the assessment mode of " point " of the heat conductivility of vertical direction test, can more be added withEffect ground to heat conductivility more adding system, assess exactly, make heat conductivility assessment more accurateReally with reliable. In addition, by data analysis functional module, simplified operation, by loaded down with trivial details dividingThe work of analysing is integrated in control system, makes data analysis efficiently and accurately more; By stable state monitoring functionModule can make the data in whole testing process carry out dynamic graph display on display floater, makes inspectionSurvey process data, pictorialization, visual, be convenient to fault real-time judge.
Below the horizontal direction detection platform of this heat resistance test apparatus is further described, asAccompanying drawing 2 is with shown in accompanying drawing 6, and horizontal direction detection platform 31 comprises a bracing frame, and this bracing frame is placedIn the groove arranging on casing. Support frame as described above comprises base plate 32, is arranged on base plate and and base plateVertical riser 33 and be arranged at the horizontal checkout plate 34 on described riser, described horizontal checkout plateOn be provided with wire (figure does not indicate) for being electrically connected with described test macro and for consolidatingThe deck 35 of fixed substrate to be measured, with the bracing frame of described horizontal checkout plate the same side on be provided with forObtain environment temperature and environment temperature is fed back to the temperature sensor 7 of control system.
Wherein, in the time that being tested, horizontal direction requires substrate to be measured to be placed in an airtight environment and to carry out(useable glass cover is covered in horizontal direction detection platform and realizes), and glass to test requestSize and the relative position of cover, bracing frame, temperature sensor also explicitly call for, and specific requirement can be joinedRead and consult accompanying drawing 9,10, wherein the unit of the size of the outer mark of the bracket in accompanying drawing 9,10 is inch,Unit in bracket is centimetre. For the size of cloche, bracing frame, temperature sensor and relativelyThe requirement of position, for according to the regulation of normative document in the industry, no longer describes in detail here.
For the vertical direction detection platform of this heat resistance test apparatus, it can adopt of the prior artVertical direction detection platform, but based on the existing vertical direction detection platform large shortcoming that takes up room,It is little that the present embodiment provides one to take up room, the vertical direction detection platform that integrated level is high. The present embodimentThe vertical direction detection platform providing comprises water circulation temperature control system, for placing substrate to be measured 5 to be measuredMetal derby (being preferably aluminium block 22), described water circulation temperature control system comprises water tank 23, all and water tankThe heater and the heat abstractor that connect; Top in described water tank is provided with testing flume 231, waterThe sidewall of case is provided with the temperature sensor 7 for testing water temperature in described testing flume and is used toThe filler 24 that testing flume adds water, described metal derby is arranged at described tank top, described metal derbyPart puts in testing flume, and the part that described metal derby is placed in outside testing flume is provided with temperature biographySensor 7; The below that is positioned at testing flume in described water tank is provided with stock trough 232, testing flumeSidewall is provided with the water level limit for height hole 2311 being communicated with stock trough, and outside water tank described testing flumeBe connected with stock trough by the pipeline that is provided with water pump. TEMP in vertical direction detection platformDevice is all fed back to control system obtaining after temperature.
As shown in accompanying drawing 11,12, Figure 11 is the solid knot of vertical direction detection platform in the present embodimentStructure simplified schematic diagram, the sectional structure schematic diagram that Figure 12 is water tank. This vertical direction detection platform comprises oneWater tank 23, this water tank is connected with heater (be heating rod in the present embodiment, do not indicate in figure), looseHot charging is put (the present embodiment comprises fin 26 and fan 25), and water pump (not indicating in figure) etc. are logicalCross heater, the effect of heat abstractor and water pump can make the water temperature in water tank raise or lower or makeWater temperature stability, forms a water circulation temperature control system. Top in water tank is provided with testing flume 231, surveysThe below of examination tank is stock trough 232, and the sidewall of testing flume is provided with and is communicated with stock troughWater level limit for height hole 2311, when the water level of testing flume is during higher than water level limit for height hole, water will flow to water for subsequent useIn groove. The sidewall of water tank be provided with temperature sensor 7 for testing water temperature in described testing flume withAnd the filler 24 that is used to testing flume to add water. One sidewall of water tank is provided with one and connects with testing flumeLogical water inlet pipe 27, and be provided with the drinking-water pipe 28 being connected with stock trough, this water inlet pipe and drinking-water pipeBetween be connected with water pump (in figure do not indicate), can make to carry out between testing flume and stock trough water and heatExchange. Stock trough one sidewall lower end be also provided with outlet pipe connector 81 discharge outlet 83 andFor the heating rod connector 82 being connected with heating rod. For placing substrate (this enforcement to be measured to be measuredIn example, the substrate in substrate to be measured is PCB) aluminium block 22 be arranged at water tank 23 tops, and described aluminiumPiece part puts in testing flume, and for carrying out heat transmission with the water of testing flume, and aluminium block is placed inPart outside testing flume is provided with the temperature sensor 7 for detection of environment temperature.
The vertical direction detection platform that the present embodiment provides, designs based on steady state method, with existingHave technology to compare, have integrated level high, the advantage such as take up room little.
Before utilizing this heat resistance test apparatus to test, be first ready to substrate to be measured 5 to be tested, shouldSubstrate to be measured comprises substrate 51, is arranged at the TEG chip 52 (being testing element core assembly sheet) on substrate,On TEG chip, be connected with wire 53 and TEG built-in chip type has resistance calculations circuit. The present embodiment providesSubstrate to be measured structure as shown in Figure 13.
Utilize this heat resistance test apparatus to carry out the side of thermal resistance and Determination of conductive coefficients by further illustrating belowMethod step:
The heat conduction that horizontal or vertical direction is carried out in step 1, selection detects;
Step 2, the substrate to be measured that is welded with TEG chip is positioned in corresponding detection platform, andConnect wire, itself and control system are electrically connected;
Step 3, control system initialize, and obtain the initial temperature T of test environment0With TEG chipInitial resistance R0, and calculate the target resistance Rt=R of TEG chip0+R0* (1+TCR*M), wherein, TCRFor temperature-coefficient of electrical resistance, M is the object variations temperature of TEG chip, in the present embodiment, and described M=50 DEG C;
Step 4, control system provide power P to TEG chip, obtain the real-time resistance of TEG chipRx, and calculate the real-time temperature difference T=(Rx-2R of TEG chip0)/(R0*TCR)；
Step 5, taking the target resistance Rt of TEG chip as reference value, power P is adjusted, makeThe real-time resistance R x of TEG chip equals target resistance Rt;
Step 6, stably equal, after target resistance Rt, to obtain as the real-time resistance R x of TEG chipTest environment temperature T now1, the power P x that control system provides, and calculate TEG chip temperatureTx＝T1+ΔT；
Step 7, calculating thermal resistance and thermal conductivity factor, thermal resistance R=(Tx-T0)/Px; If horizontal directionHeat conduction detect, thermal conductivity factor He=1/ (R*S selects a time1), if the heat conduction of vertical direction detects,Its thermal conductivity factor Ke=t/ (R*S2); Wherein, S1For substrate area to be measured, S2For TEG chip area,T is substrate thickness to be measured;
Step 8, is cooled to the temperature of the substrate to be measured that is welded with TEG chip after room temperature, and it is carried outThe heat conduction of another direction detects, and repeating step two is to step 7; When carrying out the heat conduction inspection of horizontal directionWhen survey, cloche cover need to be closed in horizontal direction detection platform, make substrate to be measured in airtightIn environment, test. Certainly,, in the time that the heat conduction of carrying out vertical direction detects, also can select to make to be measuredSubstrate carries out in closed environment.
Wherein, the initial temperature T of test environment0, test environment temperature T1All obtain by temperature sensorGet, because TEG built-in chip type has resistance calculations circuit, therefore control system can directly obtain TEG chipInitial resistance R0, TEG chip real-time resistance R x, and temperature-coefficient of electrical resistance TCR, real estate to be measuredLong-pending S1, TEG chip area S2, substrate thickness t to be measured is the constant that can predict or test in advance gainedValue.
By the computing formula Δ T=(Rx-2R of the real-time temperature difference T of TEG chip0)/(R0* TCR), knotClose the computing formula Rt=R of the target resistance Rt of TEG chip0+R0* (1+TCR*M), the known Rx=Rt that works asTime, the real-time temperature difference T of TEG chip equals the object variations temperature M of TEG chip. Therefore, surveyingIn examination process, in described step 4, when control system provides power P to TEG chip, power PProgressively increase, in the time of real-time temperature difference T=M=50 DEG C of TEG chip, power P no longer increases, thisTime Rx can approach and equal Rt, in step 5, only need finely tune power P, can make Rx=Rt.
Utilize heat resistance test apparatus provided by the invention and method of testing, have simple to operate, test essenceDegree advantages of higher; And by introducing the thermal resistance of horizontal direction and the test of thermal conductivity factor, set up with waterSquare heat conductivility assessment coordinate system of setting up to the thermal resistance recording with vertical direction and thermal conductivity factor dataSystem, can make more adding system analysis and assessment comprehensively and accurately to the heat conductivility of PCB more effectively.The present invention is specially adapted to the heat conductivility assessment of high-brightness LED PCB, certainly also can be used for otherThe PCB of type carries out heat conductivility assessment.
The content of mentioning in above-described embodiment is preferably embodiment of the present invention, is not to the present inventionRestriction, without departing from the inventive concept of the premise, any apparent replacement is all in the present inventionProtection domain within.
Claims (8)
1. a high-precision heat resistance test apparatus, comprise casing, in casing, be provided with control system, one side of described casing is provided with guidance panel, on casing, be provided with thermal resistance for testing substrate vertical direction to be measured and the vertical direction detection platform of thermal conductivity factor, described vertical direction detection platform and guidance panel are all electrically connected with described control system, it is characterized in that: on described casing, be also provided with thermal resistance for testing substrate horizontal direction to be measured and the horizontal direction detection platform of thermal conductivity factor, this horizontal direction detection platform and described control system are electrically connected, described heat resistance test apparatus also comprises and time being positioned in vertical direction detection platform or horizontal direction detection platform when test, for the seal closure that substrate to be measured is tested in closed environment.
2. heat resistance test apparatus according to claim 1, it is characterized in that: described horizontal direction detection platform comprises a bracing frame, support frame as described above comprises base plate, be arranged on base plate and the riser vertical with base plate and be arranged at the horizontal checkout plate on described riser, on described horizontal checkout plate, be provided with wire for being electrically connected with described test macro and the deck for fixing substrate to be measured, with the bracing frame of described horizontal checkout plate the same side on be provided with for obtaining environment temperature and environment temperature being fed back to the temperature sensor of control system.
3. heat resistance test apparatus according to claim 1 and 2, it is characterized in that: described vertical direction detection platform comprises water circulation temperature control system, for placing the metal derby of substrate to be measured to be measured, described water circulation temperature control system comprises water tank, the heater being all connected with water tank and heat abstractor, described water tank inner top is provided with testing flume, the filler that the sidewall of water tank is provided with the temperature sensor for testing water temperature in described testing flume and is used to testing flume to add water, described metal derby is arranged at described tank top, described metal derby part puts in testing flume, and the part that described metal derby is placed in outside testing flume is provided with temperature sensor.
4. heat resistance test apparatus according to claim 3, it is characterized in that: the below that is positioned at testing flume in described water tank is provided with stock trough, the sidewall of testing flume is provided with the water level limit for height hole being communicated with stock trough, and described testing flume is connected with stock trough by the pipeline that is provided with water pump outside water tank.
5. heat resistance test apparatus according to claim 3, is characterized in that: described substrate to be measured comprises substrate, is arranged at the TEG chip on substrate, and described TEG chip is connected with wire and described TEG built-in chip type has resistance calculations circuit.
6. a method of testing for the heat resistance test apparatus as described in any one in claim 1-5, described method of testing step comprises:
The heat conduction that horizontal or vertical direction is carried out in step 1, selection detects;
Step 2, the substrate to be measured that is welded with TEG chip is positioned in corresponding detection platform, and connects wire;
Step 3, control system initialize, and obtain the initial temperature T of test environment0Initial resistance R with TEG chip0, and calculate the target resistance Rt=R of TEG chip0+R0* (1+TCR*M), wherein, TCR is temperature-coefficient of electrical resistance, M is the object variations temperature of TEG chip;
Step 4, control system provide power P to TEG chip, obtain the real-time resistance R x of TEG chip, and calculate the real-time temperature difference T=(Rx-2R of TEG chip0）/（R0*TCR）；
Step 5, taking the target resistance Rt of TEG chip as reference value, power P is adjusted, make the real-time resistance R x of TEG chip equal target resistance Rt;
Step 6, when the real-time resistance R x of TEG chip stably equals after target resistance Rt, obtain test environment temperature T now1, the power P x that system provides, and calculate TEG chip temperature Tx=T1+ΔT；
Step 7, calculating thermal resistance and thermal conductivity factor, thermal resistance R=(Tx-T0)/Px; If the heat conduction of horizontal direction detects, its thermal conductivity factor He=1/(R*S1), if the heat conduction of vertical direction detects, its thermal conductivity factor Ke=t/(R*S2); Wherein, S1For substrate area to be measured, S2For TEG chip area, t is substrate thickness to be measured;
Step 8, is cooled to the temperature of the substrate to be measured that is welded with TEG chip after room temperature, and the heat conduction that it is carried out to another direction detects, and repeating step two is to step 7; In the time carrying out the heat conduction of horizontal direction and detect, described substrate to be measured is placed in an airtight environment and is tested.
7. method of testing according to claim 6, is characterized in that: in described step 4, and when control system provides power P to TEG chip, progressively increasing power P, in the time of the real-time temperature difference T=M of TEG chip, power P no longer increases.
8. according to the method for testing described in claim 6 or 7, it is characterized in that: the object variations temperature M of described TEG chip is preferably M=50 DEG C.
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| CN105466965A (en) * | 2014-09-10 | 2016-04-06 | 神讯电脑(昆山)有限公司 | Heat dissipating effect testing apparatus of heat dissipating module |
| DE102015209200B3 (en) * | 2015-05-20 | 2016-03-10 | Siemens Aktiengesellschaft | thermal conductivity detector |
| CN109060865A (en) * | 2018-07-26 | 2018-12-21 | 桂林电子科技大学 | A kind of experimental provision of equivalent heat source |
| CN111398344B (en) * | 2020-04-30 | 2024-09-27 | 亚士漆(上海)有限公司 | Detection device and method for equivalent thermal resistance of heat-preserving heat-insulating thin material |
| CN112327133A (en) * | 2020-10-20 | 2021-02-05 | 南京尚孚电子电路有限公司 | High-temperature heat dissipation test system for aluminum-based circuit board and test method thereof |
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| CN102217414B (en) * | 2008-02-27 | 2014-04-30 | 莫列斯日本有限公司 | Heater device, measuring device, and thermal conductivity estimating method |
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| CN103364431A (en) * | 2012-04-10 | 2013-10-23 | 中兴通讯股份有限公司 | Thermal resistance testing method and thermal resistance testing device |
| CN203811564U (en) * | 2014-04-23 | 2014-09-03 | 广东正业科技股份有限公司 | High-precision thermal resistance testing device |
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Denomination of invention: High-precision thermal resistance testing device and testing method thereof Effective date of registration: 20180119 Granted publication date: 20160525 Pledgee: Pudong Development Bank of Shanghai, Limited by Share Ltd, Dongguan branch Pledgor: Guangdong Zhengye Technology Co., Ltd. Registration number: 2018440000026 |
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