TWI434358B - Adhesive stamping apparatus for die bonder - Google Patents

Description

Dispensing device for wafer welding machine

The present invention relates to a dispensing device for a wafer bonding machine, and more particularly to a welding machine for applying a liquid adhesive to a position where a semiconductor wafer is to be attached to attach a semiconductor wafer to a main board or a lead frame. Dispensing device.

A wafer bonding machine for attaching a semiconductor wafer to a lead frame or a main board is generally obtained by dip-coating a liquid adhesive onto a dispensing needle, and then applying a dispensing needle to the lead frame. The semiconductor wafer is attached to the lead frame by applying a small amount of the adhesive to the lead frame by means of a dispensing needle and then placing the semiconductor wafer thereon.

As technology advances, the size of semiconductor wafers attached by wafer soldering machines such as this appears to be getting smaller and smaller. Therefore, the technique of applying a very small amount of adhesive to a lead frame at a certain point is extremely important. If the amount of the adhesive is too large or too small, the process of attaching the semiconductor wafer to the lead frame may be poor.

Therefore, it is important to keep the adhesive at a certain height in the container in which the glue is stored. Dip the dispensing needle into the container that stores the adhesive until it reaches the bottom and apply it to the lead frame. In this case, if the height of the adhesive changes, the amount of dispensing will be different. Thus, the amount of dispensing by the dispensing needle is very small, so the height of the adhesive must be controlled within an error range of several μm to several tens of μm. However, it is highly probable that errors of several μm to several tens of μm may occur during the use of the device, such as repositioning after cleaning the adhesive storage container, and the management of such an error range is very difficult.

In addition, it is necessary to be able to adjust the amount of the adhesive depending on the size of the attached semiconductor wafer, but the problem is that it is extremely difficult to adjust the amount of the liquid adhesive due to the characteristics of the liquid adhesive.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a dispensing device for a wafer bonding machine which is structurally easy to maintain a predetermined amount of dispensing and easy to adjust the amount of dispensing.

In order to achieve the above object, a dispensing device for a wafer bonding machine of the present invention is directed to a dispensing device for a wafer bonding machine for applying a liquid adhesive at a position where a semiconductor wafer is to be attached so that the semiconductor wafer can be attached to a main board or a lead frame. The utility model is characterized in comprising: a base; a container member having an outer member and an inner member, wherein the outer member has a cylindrical shape, a female thread portion is formed on the inner side surface, and the inner member has a female thread on the outer side surface and the outer member a male threaded portion coupled by a screw and having a dip surface for applying the above-mentioned adhesive thereon; a rotary module mounted on the base, having a turntable for placing the container member and rotating the turntable a pressing member having a pressing portion disposed opposite to the impregnating surface to wipe the adhesive on the dip surface when the container member rotates; and the supporting member fixing the pressing member relative to the base a dispensing module that dips the adhesive contained in the container member onto the dispensing needle and applies the above-mentioned semi-conductive Wafer position to be attached.

The effect of the dispensing device for a wafer bonding machine of the present invention is to provide a dispensing device for a wafer bonding machine which is easy to maintain the dispensing amount of the dispensing needle.

Further, the effect of the dispensing device for a wafer bonding machine of the present invention is to provide a dispensing device for a wafer bonding machine which is structurally easy to adjust the amount of dispensing of a dispensing needle.

The above described features and advantages of the present invention will be more apparent from the following description. The present specification provides various embodiments to illustrate the technical features of various embodiments of the present invention. The arrangement of the various elements in the embodiments is for illustrative purposes and is not intended to limit the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a dispensing device for a wafer bonding machine of the present invention will be described with reference to the accompanying drawings.

1 is a cross-sectional view of a dispensing device for a wafer bonding machine according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line II-II of the dispensing device for the wafer bonding machine of FIG. 1, and FIG. 3 is a wafer of FIG. An exploded perspective view of the main part of the dispensing device for the welding machine.

Referring to FIGS. 1 to 3, the dispensing device for a wafer bonding machine of the present embodiment includes a base (101), a container member (200), a rotary module (300), and a pressing member (400).

The main structure of the wafer bonding machine including the dispensing device for the wafer bonding machine is mounted on the base (101), and the base (101) functions to support its main structure with respect to the ground.

The rotating module (300) is mounted on the base (101) and has a turntable (320) and a rotating means (310). The rotating means (310) is coupled to the turntable (320), and a plurality of configurations capable of rotating the turntable (320) can be used. In the present embodiment, a motor (310) is used. The turntable (320) is rotated by the motor (310), and a fixing groove (322) is formed on the upper surface thereof, and a fixing pin (323) is inserted into the fixing groove (322). Further, a magnet (321) is attached to the turntable (320), and the container member (200) is sucked on the turntable (320) by the magnet (321).

The container member (200) has an outer member (210) and an inner member (220) forming a container shape for storing the liquid glue (L). As shown in Fig. 3, the outer member (210) has a cylindrical shape, and a female thread portion (2112) is formed on the inner side of the lower end. The inner member (220) is formed with a male screw portion (222) on the outer side surface, and is screw-coupled from the lower end with respect to the outer member (210). The upper surface of the inner member (220) is an impregnation surface (221), and the impregnation surface (221) forms a horizontal surface. When the outer member (210) and the inner member (220) are combined, the dip surface (221) is exposed to the outer member (210). Inner end. Adhesive (L) is applied to the impregnation surface (221) of the inner member (220). The inner member (220) is formed of a material that can be sucked on the magnet (321), and can be easily attached and detached from the magnet (321) of the turntable (320). A fixing groove (223) is formed under the inner member (220), and the inner member (220) is opposed to the turntable (320) by a method of inserting the fixing pin (323) into the fixing groove (223) of the inner member (220). ) to install. The relative rotation of the turntable (320) and the inner member (220) is prevented by the fixing pin (323), so that if the turntable (320) is rotated, the container member (200) mounted thereon is also rotated together.

As shown in Fig. 3, the outer member (210) of the container member (200) is composed of a first annular member (211) and a second annular member (212). The first annular member (211) and the second annular member (212) have a cylindrical shape, and the first annular member (211) is press-fitted into the second annular member (212) and joined to form the second annular member. (212) wrapping the outer circumference of the first annular member (211).

A female screw portion (2112) coupled to the male screw portion (222) of the inner member (220) is formed in the first annular member (211), and the second annular member (212) has an inner member (220) a fence portion (2121) that is extended around the periphery. The function of the fence portion (2121) is to prevent the glue (L) contained in the container member (200) from splashing outside the container member (200).

If the inner member (220) is rotated relative to the outer member (210), the inner member (220) advances relative to the outer member (210) under the interaction of the female thread portion (2112) and the male thread portion (222). Or back. That is, by rotating the inner member (220) relative to the outer member (210), the height of the impregnation surface (221) relative to the outer member (210) can be adjusted. As shown in FIG. 3, in order to allow the user to easily know that the height of the dip surface (221) changes due to the rotation of the inner member (220), a scale is formed on the first annular member (211) of the outer member (210). Ministry (2113). The height of the rising or falling surface of the impregnation surface (221) can be easily known by the number of the scale portion (2113) indicated by the reference mark (224) formed on the impregnation surface (221).

A pressing member (400) is attached to the impregnation surface (221) of the inner member (220). If the container member (200) is rotated, the pressing member (400) in a fixed state wipes the glue (L) on the impregnation surface (221). The pressing member (400) has a pressing portion (401) opposed to the impregnation surface (221). The pressing portion (401) is formed in parallel with the impregnation surface (221), and is maintained at a predetermined interval from a portion of the dip surface (221). As shown in Fig. 2, the pressing portion (401) is preferably formed to pass over a portion of the impregnation surface (221).

As shown in FIGS. 1 and 2, the pressing member (400) is fixed to the base (101) by a support member (500) and supported. An elongated hole (402) is formed in the pressing member (400), and is movable up and down by a fixing bolt (501) penetrating the elongated hole (402) and combined with the supporting member (500), and the pressing member (400) is pressed It can be coupled to the support member (500) in a state in which the fixing bolt (501) is rotated. The support member (500) has an elastic means for pressurizing the pressing member (400) with respect to the container member (200). As shown in Fig. 2, in the present embodiment, a spring (502) and a slider (503) mounted between the support member (500) and the pressing member (400) are used as an elastic means.

On the outer member (210) of the container member (200), an engaging portion (2111) is formed in the circumferential direction. In the present embodiment, an engaging portion (2111) is formed along the portion where the scale portion (2113) of the second annular member (212) is formed. A sliding portion (403) provided at both ends of the lower side of the pressing member (400) contacts the engaging portion (2111) of the second annular member (212). When the pressing portion pressurizes the container member (200) by the elastic means, the sliding portion (403) is kept in contact with the engaging portion (2111). When the container member (200) is rotated, the sliding portion (403) of the pressing member (400) slides over the engaging portion (2111) in a state of being in contact with the engaging portion (2111). In this way, if the engaging portion (2111) and the sliding portion (403) are kept in contact, the pressing portion (221) of the pressing member (400) and the impregnation surface (221) of the inner member (220) are always maintained. The established interval. Therefore, the adhesive (L) in which the pressing portion (401) is wiped over maintains the same height as the interval between the pressing portion (401) and the impregnation surface (221) for a predetermined period of time.

In this way, with reference to the scale portion (2113), the coating of the adhesive (L) pressed by the extruded member (400) can be adjusted by rotating the inner member (220) relative to the outer member (210). thickness. If the height of the impregnation surface (221) is determined by a method of rotating the inner member (220) relative to the outer member (210), the outer member (210) and the inner member are fixed in the container member (200) ( 220) A fixed means of relative position. In the present embodiment, a fixing pin (230) is used as a fixing means which is screwed to the outer member (210) and is in contact with the inner member (220) through the outer member (210). The fixing needle (230) that penetrates the second annular member (212) and is screwed to the first annular member (211) presses the side surface of the inner member (220) while opposing the outer member (210). ) in combination with the inner member (220).

On the other hand, an O-ring (240; O-ring) is installed between the outer member (210) and the inner member (220) for preventing the adhesive (L) from leaking to the outer member (210) and the inner member ( 220) between.

The pressed member (400) on the impregnated surface (221) is held at a predetermined thickness and the applied adhesive (L) is applied to the position where the semiconductor wafer is to be attached by the dispensing module (600). The dispensing module (600) has a dispensing needle (601) having an end portion impregnated with a glue (L), and the dispensing needle (601) can be transferred up and down and in a horizontal direction. Lower the dispensing needle (601) to contact the dip surface (221) of the container member (200), dip the adhesive (L), and then lower the position where the semiconductor wafer of the main board or lead frame is to be attached, and apply a certain amount of viscosity. Glue (L). In this way, the semiconductor wafer is lowered at the position where the adhesive (L) is applied, and the semiconductor wafer is attached to the main board or the lead frame.

Next, the action of the present embodiment having the above configuration will be described.

First, the first annular member (211) is press-fitted into the second annular member (212) and assembled to form the outer member (210). In this state, the inner member (220) and the outer member (210) are assembled by inserting the male screw portion (222) of the inner member (220) into the female screw portion (2112) of the outer member (210). At this time, the height of the dip surface (221) can be easily adjusted by referring to the reference mark (224) formed on the impregnation surface (221) and the scale portion (2113) of the outer member (210). In particular, by increasing the outer diameter of the inner member (220) and reducing the pitch of the male thread portion (222), the height of the impregnation surface (221) can be precisely adjusted.

After adjusting the height of the dip surface (221) as such, the fixing pin (230) is tightened to fix the relative positions of the outer member (210) and the inner member (220), thereby fixing the height of the dip surface (221).

Then, in a state where the fixing pin (323) is inserted into the fixing groove (322) of the turntable (320), the container member (200) is placed on the turntable (320) to insert the fixing pin (323) into the container member ( 200) in the fixing groove (223). At this time, the magnet (321) of the turntable (320) sucks the container member (200) to bring the container member (200) into close contact with the turntable (320).

Next, the pressing member (400) is bonded to the supporting member (500) in a state where the pressing member (400) is pressurized by the elastic means. The fixing bolt (501) is inserted into the elongated hole (402) of the pressing member (400), assembled to the supporting member (500), by which the pressing member (400) is coupled with respect to the supporting member (500).

As shown in FIG. 2, in a state where the pressing member (400) is rotatable about the fixing bolt (501), the pressing member is pressed by the spring (502) mounted on both sides of the fixing bolt (501). The sliding portion (403) of 400) is always in close contact with the engaging portion (2111) of the first annular member (211). Therefore, the interval between the pressing portion (401) and the impregnation surface (221) is always kept constant. In particular, even if the container member (200) cannot be placed at a level due to foreign matter entering between the container member (200) and the turntable (320), the elastic means, the elongated hole (402), and the fixing bolt (501) act. The sliding portion (403) is kept in a state of being in close contact with the engaging portion (2111). Thereby, the interval between the pressing portion (401) and the impregnation surface (221) is also always kept constant. In this state, the glue (L) is supplied into the container member (200) to start the motor (310).

If the starter motor (310) rotates the turntable (320), the container member (200) also rotates together. At this time, the pressing portion (401) of the fixed pressing member (400) is wiped over the impregnation surface (221). Since the liquid viscose (L) has a high viscosity, even after the pressing portion (401) is rubbed, the coating state on the impregnation surface (221) is maintained and pressed for a certain period of time. The portion (401) has the same height as the impregnation surface (221).

At this time, the dispensing module (600) is activated, and the dispensing needle (601) is immersed in the adhesive (L) to the extent that it can contact the dip surface (221), and the dispensing needle (601) is re-raised. Adhesive (L) is applied to the location where the semiconductor wafer is attached. If the dispensing module (600) is operated at a high speed, the glue (L) may splash outside the container member (200) during the process of immersing the dispensing needle (601) in the adhesive (L), but the second The advantage of the fence portion (2121) provided on the annular member (212) is to prevent the glue (L) from splashing to the outside.

Regardless of the size or management state of other parts, if only the dimensional precision between the pressing portion (401) and the dip surface (221) and the flatness of the pressing portion (401) and the dip surface (221) are managed, The coating thickness of the predetermined adhesive (L) can be maintained, so that it is easy to manage the amount of the dispensing needle (601) immersion adhesive (L).

On the other hand, when the amount of the adhesive (L) stored in the container member (200) is sufficient, the adhesive (L) is filled to the position of the engaging portion (2111), and at this time, the liquid adhesive (L) is also The action of the lubricant acts to allow the sliding portion (403) to easily slide onto the engaging portion (2111) and move.

Although an embodiment of the present invention has been described above, the scope of the present invention is not limited to the above description and the illustrated embodiment.

For example, in the above description, the outer member (210) is assembled by the first annular member (211) and the second annular member (212), but the first annular member and the second annular member may be employed. Combine the structure into one.

Further, in the above description, the container member (200) and the turntable (320) are sucked together by the magnet (321) mounted on the turntable (320), but the magnet may be mounted not on the turntable but on the container member. on. At the same time, it is also possible to realize the mutual combination of the turntable and the container member by other means without using a magnet.

Further, the above description is that the fixing pin (323) is inserted into the fixing groove (322) of the turntable (320), but the fixing pin may be protruded from the turntable and inserted into the fixing groove of the container member. Conversely, the container member and the turntable can also be fixed by forming a fixing pin on the bottom surface of the container member to join the fixing pin into the fixing groove formed in the turntable.

The elastic means for pressurizing the pressing member (400) with respect to the container member (200) can also adopt various mechanism structures other than the spring (502).

Further, the sliding portion (403) may be in the form of a drum and may be slidably slid with respect to the engaging portion.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

101. . . Base

210. . . Outer member

211. . . First annular member

212. . . Second annular member

220. . . Inner member

221. . . Dip surface

222. . . Male thread

223. . . Fixed slot

230. . . Fixed needle

240. . . O-ring

300. . . Rotary module

310. . . motor

320. . . Turntable

321. . . magnet

322. . . Fixed slot

323. . . Fixed pin

400. . . Extrusion member

401. . . Extrusion

402. . . Long hole

500. . . Support member

501. . . Fixing bolts

600. . . Dispensing module

601. . . Dispensing needle

2111. . . Clamping department

2112. . . Female thread

2121. . . Fence section

L. . . Viscose

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a dispensing device for a wafer bonding machine according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view taken along line II-II of the dispensing device for the wafer bonding machine shown in Fig. 1.

Fig. 3 is an exploded perspective view showing the main part of the dispensing device for a wafer bonding machine shown in Fig. 1;

101. . . Base

210. . . Outer member

211. . . First annular member

212. . . Second annular member

220. . . Inner member

221. . . Dip surface

222. . . Male thread

223. . . Fixed slot

230. . . Fixed needle

240. . . O-ring

300. . . Rotary module

310. . . motor

320. . . Turntable

321. . . magnet

322. . . Fixed slot

323. . . Fixed pin

400. . . Extrusion member

401. . . Extrusion

402. . . Long hole

500. . . Support member

501. . . Fixing bolts

600. . . Dispensing module

601. . . Dispensing needle

2111. . . Clamping department

2112. . . Female thread

2121. . . Fence section

L. . . Viscose

Claims (11)

A dispensing device for a wafer bonding machine, which applies a liquid adhesive to a position where a semiconductor wafer is to be attached, so that the semiconductor wafer can be attached to a main board or a lead frame, and is characterized by comprising: a base; a container member having An outer member and an inner member, wherein the outer member has a cylindrical outer shape, and a female screw portion is formed on the inner side surface, and the inner member has a male screw portion that is screwably coupled to the outer member female screw portion on the outer side surface. And having a dip surface on which the above-mentioned adhesive is applied; a rotary module mounted on the base, having a turntable for placing the container member and a rotating means for rotating the turntable; and the pressing member having the same surface a pressing portion disposed oppositely to wipe the adhesive on the dip surface when the container member rotates; the supporting member fixes and supports the pressing member relative to the base; the dispensing module has a dispensing needle Applying the adhesive contained in the container member to the dispensing needle, and applying the coating to the semiconductor wafer s position. The dispensing device for a wafer bonding machine according to claim 1, wherein the container member further includes a fixing means for fixing a relative position of the outer member and the inner member. The dispensing device for a wafer bonding machine according to claim 2, wherein the fixing means is a screw that is coupled to the outer member and that penetrates the outer member and contacts the fixing member of the inner member. The dispensing device for a wafer bonding machine according to the first aspect of the invention, wherein the container member is detached from the turntable by a magnet, and the container member is detachably attached to the turntable. The dispensing device for a wafer bonding machine according to claim 1, wherein a fixing groove is formed on at least one of the turntable and the container member, and the other of the two has a fixing pin. The fixing groove is inserted to prevent relative rotation of the container member with respect to the turntable. The dispensing device for a wafer bonding machine according to any one of claims 1 to 5, wherein the supporting member further comprises an elastic force for pressing the pressing member with respect to the container member. means. The dispensing device for a wafer bonding machine according to claim 6, wherein the outer member of the container member is formed with an engaging portion in a circumferential direction; the pressing member further includes a coupling portion with the above The portion contacts the sliding portion that maintains the interval between the pressing portion and the impregnating surface. The dispensing device for a wafer bonding machine according to claim 6, wherein any one of the outer member and the inner member of the container member has a relative rotation with the outer member and the inner member. A scale portion showing the height of the above-mentioned impregnated surface. The dispensing device for a wafer bonding machine according to claim 1, wherein the outer member further includes a fence portion, the fence portion surrounding a periphery of the inner member and extending upward to prevent the container The glue contained in the member is splashed outside the container member. The dispensing device for a wafer bonding machine according to claim 9, wherein the outer member has a first annular member and a second annular member, and the first annular member has the female screw portion. a cylindrical shape, the second member enclosing the outer circumference of the first annular member, having a cylindrical shape and having the fence portion, the container member further including a fixing needle, the fixing needle penetrating the first annular member and the The second annular member is coupled to the first annular member to pressurize the inner member so that the relative position of the outer member and the inner member can be fixed. The dispensing device for a wafer bonding machine according to claim 1, wherein an O-ring for preventing leakage of the adhesive is attached between the outer member and the inner member.