CN102476089A - Dispensing apparatus for chip welding machine - Google Patents
Dispensing apparatus for chip welding machine Download PDFInfo
- Publication number
- CN102476089A CN102476089A CN2011100350707A CN201110035070A CN102476089A CN 102476089 A CN102476089 A CN 102476089A CN 2011100350707 A CN2011100350707 A CN 2011100350707A CN 201110035070 A CN201110035070 A CN 201110035070A CN 102476089 A CN102476089 A CN 102476089A
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- vesse
- die bonder
- outer member
- glue equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7555—Mechanical means, e.g. for planarising, pressing, stamping
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Die Bonding (AREA)
Abstract
Provided is a dispensing apparatus for a chip welding machine, used for dispensing liquid glue upon the position where a semiconductor chip is to be attached, thus to make the semiconductor chip to be attached to a mainboard or a lead frame. The dispensing apparatus comprises a pedestal, a container member, a rotating module, an extruding member, a support member, and a dispensing module, wherein the container member comprises an outside member and an inside member. The outside member, with a cylindrical shape, is provided with a female thread part at the internal side surface while the inside member is provided with a male thread part at the external side surface to combine with the female thread part of the outside member in a screw manner. Moreover, a dipping surface is provided for the glue to be coated thereon. The extruding member is provided with an extruding part arranged opposite to the dipping surface. Therefore, when the container member rotates, the glue upon the dipping surface is coated. The dispensing apparatus for a chip welding machine of the utility model is easy to keep and adjust the set dispensing amount.
Description
Technical field
The present invention relates to die bonder and use point glue equipment, in more detail, relate to and a kind ofly be coated with liquid viscose glue, so that the bonding machine that semiconductor chip is attached on mainboard or the lead frame is used point glue equipment at the location point that will adhere to semiconductor chip.
Background technology
With semiconductor chip be attached to die bonder on lead frame or the mainboard generally be with liquid viscose glue dip-coating on a plastic pin, will put the plastic pin point then and be applied on the lead frame.Utilize a some plastic pin that micro-viscose glue point is applied on the lead frame, place the method for semiconductor chip then in the above, with semiconductor chip attached on the lead frame.
Along with the development of technology, the semiconductor chip size of adhering to through die bonder like this presents more and more littler trend.So, the technology that the viscose glue of minute quantity is applied on the lead frame all the time definitely is very important.If the amount of viscose glue is too much or very few, then can cause occurring the operation that semiconductor chip is attached on the lead frame bad.
Therefore, it is very important in the container that stores viscose glue, to make viscose glue remain certain height.After reaching the bottom, point is applied on the lead frame with a container that the plastic pin immersion stores viscose glue.In this case, if the height of viscose glue changes, then putting the glue amount also can be different.The point glue amount of accomplishing through the some plastic pin like this is very few, so the height of viscose glue must be controlled in the error range of several μ m to tens of μ m.Yet, the error of number μ m to tens of μ m very easily possibly take place in the device use, such as after cleaning the viscose glue reservoir vessel, reapposing use, the management of this error range is difficulty very.
In addition, must regulate the amount of viscose glue according to the semiconductor chip size of adhering to, the characteristic aspect of liquid viscose glue but problem is is very difficult to the adjusting of its amount.
Summary of the invention
The technical problem that solves
The present invention proposes for addressing the above problem just, and its purpose is to provide the die bonder that is easy to keep both to fix a point the glue amount on a kind of structure, is easy to point of adjustment glue amount to use point glue equipment.
Technical scheme
For realizing above-mentioned purpose; To being coated with liquid viscose glue at the location point that will adhere to semiconductor chip; So that semiconductor chip can be used point glue equipment attached to the die bonder on mainboard or the lead frame, die bonder of the present invention is characterised in that with point glue equipment and comprises like the lower part: base; Container member; Have outer member and inner member; The profile of outer member is cylindrical, is formed with box thread portion at medial surface, and inner member has the male screw portion that can combine with screw fashion with above-mentioned outer member box thread portion on lateral surface; And have the dipping face, supply above-mentioned viscose glue to coat above it; Rotary module, it is installed on the above-mentioned base, has to supply above-mentioned container member rotating disk of placing and the rotary means that makes the rotating disk rotation; Extruded member has the press section of placing relatively with above-mentioned dipping face, thereby when the said vesse member rotates, the viscose glue on the above-mentioned dipping face that nuzzles up; Supporting member is fixed above-mentioned extruded member and is supported with respect to above-mentioned base; Point rubber moulding piece, on a plastic pin, point is applied to the position that above-mentioned semiconductor chip will adhere to the viscose glue dip-coating of holding in the said vesse member.
Beneficial effect
Die bonder of the present invention is to provide a kind of with the effect of point glue equipment and is easy to keep a die bonder of plastic pin point glue amount to use point glue equipment.
In addition, die bonder of the present invention also is to provide the die bonder that is easy to point of adjustment plastic pin point glue amount on a kind of structure to use point glue equipment with the effect of point glue equipment.
Description of drawings
Fig. 1 is the sectional view of the die bonder of one embodiment of the invention with point glue equipment.
Fig. 2 is the II-II line sectional view of die bonder shown in Figure 1 with point glue equipment.
Fig. 3 is a die bonder shown in Figure 1 exploded perspective view with the point glue equipment major part.
The specific embodiment
With reference to the accompanying drawings, the embodiment of die bonder of the present invention with point glue equipment described.
Fig. 1 is the sectional view of the die bonder of one embodiment of the invention with point glue equipment, and Fig. 2 is the II-II line sectional view of die bonder shown in Figure 1 with point glue equipment, and Fig. 3 is the exploded perspective view of die bonder shown in Figure 1 with the point glue equipment major part.
Referring to figs. 1 through Fig. 3, the die bonder of present embodiment comprises base 101, container member 200, rotary module 300 and extruded member 400 with point glue equipment.
Be installed with on the base 101 die bonder comprise die bonder with point glue equipment at interior primary structure, the effect of base 101 is with respect to its primary structure of ground supports.
As shown in Figure 3, the outer member 210 of container member 200 is made up of the 1st annular component 211 and the 2nd annular component 212.The 1st annular component 211 and the 2nd annular component 212 are cylindrical, and the 1st annular component 211 is pressed in the 2nd annular component 212 and combines, thereby the 2nd annular component 212 is wrapped in the periphery of the 1st annular component 211.
On the 1st annular component 211, be formed with the rail portion 2121 that box thread portion 2112, the 2 annular components 212 that combine with the male screw portion 222 of inner member 220 have the peripheral of inner member of surrounding 220 and prolong to upside.The effect of rail portion 2121 is to prevent that the viscose glue L that holds in the container member 200 from splashing the outside of container member 200.
If inner member 220 is rotated with respect to outer member 210, then under the interaction of box thread portion 2112 and male screw portion 222, inner member 220 is advanced with respect to outer member 210 or is retreated.That is, rotate with respect to outer member 210 through making inner member 220, scalable dipping face 221 is with respect to the height of outer member 210.As shown in Figure 3, for the user can being learnt easily, on the 1st annular component 211 of outer member 210, be formed with scale portion 2113 because the rotation of inner member 220 causes the height change of dipping face 221.Identify the numeral of 224 indicated scale portions 2113 through the benchmark that forms on the dipping face 221, can learn the height that dipping face 221 rises or descends easily.
On the dipping face 221 of inner member 220, extruded member 400 is installed.If container member 200 rotates, the extruded member 400 that then the is in stationary state viscose glue L on the dipping face 221 that nuzzles up.Extruded member 400 has the press section 401 relative with dipping face 221.Press section 401 and the 221 parallel formation of dipping face are with the set interval of part maintenance of this dipping face 221.As shown in Figure 2, on forming, preferably the nuzzle up part of dipping face 221 of press section 401.
Like Fig. 1 and shown in Figure 2, extruded member 400 is utilized supporting member 500 to be fixed on the base 101 and is supported.On extruded member 400, be formed with slotted hole 402; Utilize to connect slotted hole 402 and the set bolt 501 that combines with supporting member 500 and can move up and down, extruded member 400 with the combinations of states that can rotate with respect to this set bolt 501 on supporting member 500.Supporting member 500 has the elastic mean that pressurizes with respect to 200 pairs of extruded member 400 of container member.As shown in Figure 2, in the present embodiment, spring 502 and the slide block 503 installed between supporting member 500 and the extruded member 400 are used as elastic mean.
On the outer member 210 of container member 200, along the circumferential direction be formed with holding section 2111.In the present embodiment, the scale portion 2113 of edge the 2nd annular component 212 forms parts and is formed with holding section 2111.The holding section 2111 of sliding part 403 contacts the 2nd annular component 212 that the downside two ends of extruded member 400 have.If press section utilizes elastic mean to container member 200 pressurizations, then sliding part 403 keeps and holding section 2111 state of contact.If container member 200 rotates, then the sliding part 403 of extruded member 400 with holding section 2111 state of contact under, slide to its 2111 tops, holding section.So, if keep holding section 2111 and sliding part 403 state of contact, then the dipping face 221 of the press section 401 of extruded member 400 and inner member 220 remains set interval.Therefore, press section 401 nuzzle up the viscose glue L of position in given time, keep with press section 401 and dipping face 221 between the identical height in interval.
Thus, reference mark portion 2113 utilizes the method that inner member 220 is rotated with respect to outer member 210, and scalable is extruded the coating thickness of the viscose glue L of member 400 extruding.If the method that utilization makes inner member 220 rotate with respect to outer member 210 decides the height of dipping face 221, then in container member 200, has the fixing means of the relative position that is used for fixing outer member 210 and inner member 220.Use locking pin 230 as fixing means in the present embodiment, it is incorporated on the outer member 210 with screw fashion, connects outer member 210 and contacts with inner member 220.Connect the 2nd annular component 212 and be incorporated into locking pin 230 on the 1st annular component 211 in, combine inner member 220 with respect to outer member 210 to the pressurization of the side of inner member 220 with screw fashion.
On the other hand, O shape ring 240 (O-ring) are installed between outer member 210 and inner member 220, are used to prevent that viscose glue L from draining between outer member 210 and the inner member 220.
Be extruded viscose glue L that member 400 remains in the coating of set thickness under an effect of rubber moulding piece 600 on the dipping face 221, point is applied to the position that semiconductor chip will adhere to.Point rubber moulding piece 600 has the some plastic pin 601 of end portion dipping viscose glue L, and this plastic pin 601 can be up and down and the horizontal direction handover.Fall the dipping face 221 of a plastic pin 601, behind the dipping viscose glue L, fall the viscose glue L that spot printing was both quantitative in the position that the semiconductor chip of mainboard or lead frame will adhere to once more with contacting container member 200.So, put down semiconductor chip in the position of coating viscosity glue L, this semiconductor chip just is attached on mainboard or the lead frame.
Below, the effect with the present embodiment that as above constitutes is described.
At first, the 1st annular component 211 is pressed into the 2nd annular component 212 assembles, process outer member 210.In this state, through the male screw portion 222 of inner member 220 being inserted the method for the box thread portion 2112 of outer member 210, assembling inner member 220 and outer member 210.At this moment, with reference to the benchmark sign 224 that forms on the dipping face 221 and the scale portion 2113 of outer member 210, can regulate the height of dipping face 221 easily.Particularly, dwindle the method for male screw portion 222 pitch through enlarging inner member 220 external diameters, but the height of fine adjustment dipping face 221.
After regulating the height of dipping face 221 like this, tighten locking pin 230, the fixing relative position of outer member 210 and inner member 220, thereby the fixing height of dipping face 221.
Then, under the state in the holddown groove 322 that steady pin 323 is inserted rotating disk 320, container member 200 is placed on the rotating disk 320, so that steady pin 323 inserts in the holddown groove 223 of container member 200.At this moment, the magnet 321 of rotating disk 320 holds container member 200, and container member 200 and rotating disk 320 are adjacent to.
Then, utilizing elastic mean under the state of extruded member 400 pressurizations, combining extruded member 400 with respect to supporting member 500.Set bolt 501 is inserted in the slotted hole 402 of extruded member 400, be assembled in supporting member 500, combine extruded member 400 with respect to supporting member 500 with the method.
As shown in Figure 2; Can set bolt 501 under the state for the center rotation in extruded member 400; Owing to receive the pressurization of the spring of this set bolt 501 both sides installing 502, the sliding part 403 of extruded member 400 is adjacent to the holding section 2111 of the 1st annular component 211 all the time.Therefore, the interval between press section 401 and the dipping face 221 remains necessarily.Particularly, even former thereby make the container member 200 can't horizontal positioned because of getting into foreign matter etc. between container member 200 and the rotating disk 320, under the effect of elastic mean, slotted hole 402 and set bolt 501, sliding part 403 keeps the state that is adjacent to holding section 2111.Thereby the interval between press section 401 and the dipping face 221 also remains necessarily.In this state, supply viscose glue L in container member 200, starter 310.
If starter 310 makes rotating disk 320 rotations, then also together rotation of container member 200.At this moment, the press section 401 of the fixing extruded member 400 dipping face 221 that nuzzles up.Because liquid viscose glue L has higher viscosity, even after press section 401 nuzzles up, within a certain period of time, its coating state on dipping face 221 also can keep with by press section 401 height highly identical with respect to dipping face 221.
At this moment, some rubber moulding piece 600 starts, a plastic pin 601 is immersed viscose glue L with the degree that can contact dipping face 221 after, this plastic pin 601 is risen, adhere to the location point coating viscosity glue L of semiconductor chip.Like fruit dot rubber moulding piece 600 high speed motion, then immerse in the process among the viscose glue L will putting plastic pin 601, viscose glue L possibly splash the outside of container member 200, but the advantage of the rail portion 2121 that has on the 2nd annular component 212 just is to prevent that viscose glue L from dripping to the outside splashes down.
Irrelevant with the size or the controlled state of other part; If only the flatness of the precision size degree between press section 401 and the dipping face 221 and press section 401 and dipping face 221 is managed; The coating thickness that can keep set viscose glue L; Therefore, very easily carry out the amount that management point plastic pin 601 soaks viscose glue L.
On the other hand; When the amount of the viscose glue L that stores in the container member 200 was very sufficient, viscose glue L was filled to the position of holding section 2111, at this moment; Liquid viscose glue L also brings into play the effect of lubricant, makes sliding part 403 can slide on the holding section 2111 easily and moves.
More than one embodiment of the present of invention are described, but scope of the present invention be not limited to above-mentioned explanation and the diagram form.
For example, in above-mentioned explanation, outer member 210 is made up of the 1st annular component 211 and 212 assemblings of the 2nd annular component, but the structure that also can adopt the 1st annular component and the 2nd annular component to be combined into one.
In addition, in above-mentioned explanation, utilize on the rotating disk 320 magnet of installing 321 make container member 200 with rotating disk 320 sorptions be in the same place, but magnet can not be installed on the rotating disk yet, and is mounted on the container member.Simultaneously, also can not utilize magnet, but constitute mutually combining of realization rotating disk and container member through other.
In addition, above-mentioned explanation be that steady pin 323 inserts in the holddown groove 322 of rotating disks 320, but also can make steady pin protrude in rotating disk, insert in the holddown groove of container member.On the contrary, also can form steady pin through bottom surface and combine, make steady pin insert the method in the holddown groove that forms on the rotating disk, fix container member and rotating disk at container member.
Elastic mean with respect to 400 pressurizations of 200 pairs of extruded member of container member also can adopt other various mechanism structure except that spring 502.
In addition, sliding part 403 also can adopt the cylinder form on constituting, with respect to the holding section roll-sliding.
Claims (11)
1. a die bonder is used point glue equipment, is coated with liquid viscose glue to the location point that will adhere at semiconductor chip, so that above-mentioned semiconductor chip can is characterized in that comprising like the lower part attached on mainboard or the lead frame:
Base;
Container member; Have outer member and inner member; The profile of above-mentioned outer member is cylindrical, and is formed with box thread portion at medial surface, and above-mentioned inner member has the male screw portion that can combine with screw fashion with above-mentioned outer member box thread portion on lateral surface; And have the dipping face, supply above-mentioned viscose glue to coat above it;
Rotary module is installed on the above-mentioned base, has the rotating disk of placing the said vesse member and the rotary means that makes above-mentioned rotating disk rotation;
Extruded member has the press section of placing relatively with above-mentioned dipping face, thereby when the said vesse member rotates, the viscose glue on the above-mentioned dipping face that nuzzles up;
Supporting member is fixed above-mentioned extruded member and is supported with respect to above-mentioned base;
Point rubber moulding piece has a plastic pin, and on above-mentioned some plastic pin, point is applied to the position that above-mentioned semiconductor chip will adhere to the viscose glue dip-coating of holding in the said vesse member.
2. die bonder according to claim 1 is used point glue equipment, it is characterized in that:
The said vesse member also comprises a fixing means that the relative position of above-mentioned outer member and above-mentioned inner member is fixed.
3. die bonder according to claim 2 is used point glue equipment, it is characterized in that:
The said fixing means are to be incorporated on the above-mentioned outer member with screw fashion, connect above-mentioned outer member and contact the locking pin of above-mentioned inner member.
4. die bonder according to claim 1 is used point glue equipment, it is characterized in that:
The said vesse member can be from dismounting said vesse member on the above-mentioned rotating disk through the magnet above-mentioned rotating disk of sorption in addition.
5. die bonder according to claim 1 is used point glue equipment, it is characterized in that:
Form holddown groove in above-mentioned rotating disk and container member at least one, another in both then has steady pin and inserts the said fixing groove, to prevent the relative rotation of said vesse member with respect to above-mentioned rotating disk.
6. use point glue equipment according to any described die bonder in claim 1 to the claim 5, it is characterized in that:
Above-mentioned supporting member also comprises one with respect to the elastic mean of said vesse member to above-mentioned extruded member pressurization.
7. die bonder according to claim 6 is used point glue equipment, it is characterized in that:
On the outer member of said vesse member, along the circumferential direction be formed with the holding section;
Above-mentioned extruded member comprises that also one contacts with above-mentioned holding section, keeps the sliding part at the interval between above-mentioned press section and the above-mentioned dipping face.
8. die bonder according to claim 6 is used point glue equipment, it is characterized in that:
Any one in the above-mentioned outer member of said vesse member and the above-mentioned inner member has the scale portion that can show the height of above-mentioned dipping face along with the relative rotation of above-mentioned outer member and inner member.
9. die bonder according to claim 1 is used point glue equipment, it is characterized in that:
Above-mentioned outer member also comprises rail portion, and above-mentioned rail portion surrounds the periphery of above-mentioned inner member, and prolongs to upside, splashes the outside of this container member to prevent the viscose glue that holds in the said vesse member.
10. die bonder according to claim 9 is used point glue equipment, it is characterized in that:
Above-mentioned outer member has the 1st annular component and the 2nd annular component, and above-mentioned the 1st annular component has above-mentioned box thread portion, and cylindrical, above-mentioned the 2nd member wraps the periphery of above-mentioned the 1st annular component, and is cylindrical, has above-mentioned rail portion;
The said vesse member also comprises locking pin; Above-mentioned fixing needle connects above-mentioned the 1st annular component and above-mentioned the 2nd annular component; And combine, thereby to above-mentioned inner member pressurization, so that can fix the relative position of above-mentioned outer member and above-mentioned inner member with above-mentioned the 1st annular component.
11. die bonder according to claim 1 is used point glue equipment, it is characterized in that:
Between above-mentioned outer member and above-mentioned inner member, be equipped with and be used to prevent that the O shape that above-mentioned viscose glue spills from encircling.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2010-0118762 | 2010-11-26 | ||
| KR1020100118762A KR101165360B1 (en) | 2010-11-26 | 2010-11-26 | Adhesive stamping apparatus for die bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102476089A true CN102476089A (en) | 2012-05-30 |
| CN102476089B CN102476089B (en) | 2014-09-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110035070.7A Active CN102476089B (en) | 2010-11-26 | 2011-01-28 | Dispensing apparatus for chip welding machine |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101165360B1 (en) |
| CN (1) | CN102476089B (en) |
| TW (1) | TWI434358B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101503018B1 (en) * | 2013-08-20 | 2015-03-17 | 주식회사 프로텍 | Phosphor Film Pick-up Apparatus for LED Chip |
| KR101718719B1 (en) * | 2015-08-11 | 2017-03-22 | (주)다원넥스뷰 | Probe Bonding Device and Probe Bonding Method Using the Same |
| KR101748395B1 (en) * | 2016-05-12 | 2017-06-19 | 주식회사 영진플렉스 | Improved flexible joint for sprinkler and manufacturing method thereof |
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|---|---|---|---|---|
| US20030205197A1 (en) * | 2001-02-27 | 2003-11-06 | Chippac, Inc. | Apparatus and process for precise encapsulation of flip chip interconnects |
| CN2662447Y (en) * | 2003-06-16 | 2004-12-08 | 上海晨兴电子科技有限公司 | Rotary disc type conducting resin hotpress |
| JP2007111862A (en) * | 2005-10-18 | 2007-05-10 | Apic Yamada Corp | Vacuum dispenser |
| CN201030353Y (en) * | 2007-04-30 | 2008-03-05 | 沈阳芯源微电子设备有限公司 | Square sheet rotating gumming mechanism |
| CN101176866A (en) * | 2006-09-22 | 2008-05-14 | 索尼株式会社 | Coating device, installation device, coating method, electric component as well as manufacturing method thereof |
| CN101211811A (en) * | 2006-12-27 | 2008-07-02 | 细美事有限公司 | Substrate material support unit and substrate material processing apparatus and method using same |
| CN201632380U (en) * | 2010-03-19 | 2010-11-17 | 深圳市珈伟实业有限公司 | Glue dropping machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0528763Y2 (en) | 1986-08-06 | 1993-07-23 |
-
2010
- 2010-11-26 KR KR1020100118762A patent/KR101165360B1/en active IP Right Grant
-
2011
- 2011-01-28 CN CN201110035070.7A patent/CN102476089B/en active Active
- 2011-01-28 TW TW100103450A patent/TWI434358B/en active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030205197A1 (en) * | 2001-02-27 | 2003-11-06 | Chippac, Inc. | Apparatus and process for precise encapsulation of flip chip interconnects |
| CN2662447Y (en) * | 2003-06-16 | 2004-12-08 | 上海晨兴电子科技有限公司 | Rotary disc type conducting resin hotpress |
| JP2007111862A (en) * | 2005-10-18 | 2007-05-10 | Apic Yamada Corp | Vacuum dispenser |
| CN101176866A (en) * | 2006-09-22 | 2008-05-14 | 索尼株式会社 | Coating device, installation device, coating method, electric component as well as manufacturing method thereof |
| CN101211811A (en) * | 2006-12-27 | 2008-07-02 | 细美事有限公司 | Substrate material support unit and substrate material processing apparatus and method using same |
| CN201030353Y (en) * | 2007-04-30 | 2008-03-05 | 沈阳芯源微电子设备有限公司 | Square sheet rotating gumming mechanism |
| CN201632380U (en) * | 2010-03-19 | 2010-11-17 | 深圳市珈伟实业有限公司 | Glue dropping machine |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101165360B1 (en) | 2012-07-12 |
| KR20120057151A (en) | 2012-06-05 |
| CN102476089B (en) | 2014-09-03 |
| TW201222686A (en) | 2012-06-01 |
| TWI434358B (en) | 2014-04-11 |
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