KR101524561B1 - Die bonder zeroing devices in the drum disk assembly - Google Patents
Die bonder zeroing devices in the drum disk assembly Download PDFInfo
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- KR101524561B1 KR101524561B1 KR1020140184318A KR20140184318A KR101524561B1 KR 101524561 B1 KR101524561 B1 KR 101524561B1 KR 1020140184318 A KR1020140184318 A KR 1020140184318A KR 20140184318 A KR20140184318 A KR 20140184318A KR 101524561 B1 KR101524561 B1 KR 101524561B1
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- bracket
- groove
- drum
- gauge
- adhesive
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Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a zero point adjusting apparatus for a die bonder drum disc assembly and more particularly to a drum disc assembly for holding an adhesive (liquid epoxy) used in a die bonder which is a packaging apparatus for a semiconductor element or an LED element To a zero point adjusting device of a die bonder drum disc assembly capable of adjusting the initial zero point and the digital cage so that the adhesive can be continuously applied at a constant depth.
The zero point adjusting device of the die bonder drum disc assembly of the present invention comprises: a bracket fixedly mounted on a die bonder; A drum disc rotatably connected to an upper portion of the bracket by a rotating means and having a circular coating groove formed on an upper surface thereof; The drum is rotatably supported by the bracket so that the adhesive applied to the application groove is applied to the application groove at a predetermined depth as the drum disc rotates and has a width corresponding to the application groove and is spaced apart from the bottom surface of the application groove. ; A distance adjusting bracket coupled to the lower portion of the applicator and coupled with the upper portion of the fixing bracket so as to move upward and downward to adjust a distance between a bottom surface of the applicator and a bottom surface of the application groove; A gauge bracket coupled to one side bolt hole of the distance adjustment bracket and equipped with a digital gauge in a front gauge groove; A meta bracket fixed to one side of the fixing bracket; And a digital meter in which one side is fixedly coupled to the meta bracket and the digital gauge is positioned in a back vertical groove and a display unit is formed on the front side.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a zero point adjusting apparatus for a die bonder drum disc assembly and more particularly to a drum disc assembly for holding an adhesive (liquid epoxy) used in a die bonder which is a packaging apparatus for a semiconductor element or an LED element To a zero point adjusting device of a die bonder drum disc assembly capable of adjusting the initial zero point and the digital cage so that the adhesive can be continuously applied at a constant depth.
Generally, a manufacturing process of a semiconductor device or an LED device includes a raw material inspecting process for inspecting defects of a wafer or an LED device, a sawing process for separating the wafer or the LED device into individual pieces, A die bonding process for attaching the separated semiconductor chip or LED device to the mount plate of the lead frame, a wire bonding process for connecting the lead pad on the semiconductor chip with the lead of the lead frame by wire bonding a molding process for encapsulating the exterior with an encapsulant to protect the internal circuitry and other components of the semiconductor chip or the LED device and a singulation process ) And the like.
In the above process, the die bonding process is performed by a dedicated device called a 'die bonder'. The die bonder is used to stamp a predetermined amount of epoxy from a drum disk containing a liquid epoxy, which is an adhesive, pin is used to apply a small amount to the lead frame, and then the semiconductor chip or the LED element is transferred to a vacuum adsorption collet to be adhered to the lead frame. In this process, the drum disk is made of a structure that rotates at a constant speed from the lower portion of the epoxy drum disk assembly. The epoxy drum disk assembly includes a drum disk rotating at a constant speed by a motor, an epoxy guide positioned at an upper portion of the epoxy contained in the drum disk to uniformly control an epoxy surface, and an adjuster for adjusting the height of the guide do.
The epoxy used in the die bonding process is contained in a drum disk, and has a life time of several minutes at room temperature depending on characteristics after being put into a process. The time for which the epoxy for bonding is generally used is about 8 to 10 hours. Therefore, it is necessary to separate the epoxy drum disk from the die bonder for a certain period of time (about 7 to 8 hours) and to mount the drum disk containing the new epoxy. The separated drum disk is washed to remove the epoxy exposed in the air for a long time, You have to be prepared to do it again.
In the past, an adhesive dispensing apparatus for an LED bonding apparatus, which is registered in Korean Patent Application No. 10-0962663, is disclosed.
The adhesive dispensing apparatus for the LED bonding apparatus includes: a bracket fixedly mounted on the LED bonding apparatus; A rotating body rotatably connected to the bracket and having a circular coating groove formed on an upper surface thereof; A plurality of grooves formed in the grooves and having a width corresponding to the grooves and spaced from the bottom surface of the grooves by a predetermined distance so that the grooves injected into the grooves are applied to the grooves at a predetermined depth And a coating material.
The apparatus for applying an adhesive for an LED bonding apparatus includes an applicator coupled to the bracket so as to move up and down so as to adjust a distance between a bottom surface of the applicator and a bottom surface of the applicator, There is a problem in that it is difficult to adjust the distance by adjusting the micro gauge scale because the distance adjusting means can not hold the zero point when the handle is operated so that the adhesive injected into the groove is applied to the application groove at a constant depth.
An object of the present invention is to provide an epoxy drum disc which can adjust the initial zero point by pressing the zero button of the digital meter and adjust the digital gauge through the display unit of the digital meter so as to apply the adhesive to a predetermined depth on the bottom surface of the application groove of the drum disc, And a zero-point adjusting device for the assembly.
Another object of the present invention is to provide a method of manufacturing an adhesive tape for a drum disc, comprising: applying a pressure to a bottom surface of a drum disc to apply adhesive to a predetermined depth; And a zero point adjusting device for the drum disc assembly.
It is another object of the present invention to provide a zero point adjusting device for an epoxy drum disc assembly in a die bonder in which a depth of an adhesive can be easily adjusted by anyone so that an adhesive is applied to a bottom surface of a coating groove of a drum disc.
According to an aspect of the present invention, there is provided a zero point adjusting apparatus for a die bonder drum disc assembly, including: a bracket fixedly mounted on a die bonder; A drum disc rotatably connected to an upper portion of the bracket by a rotating means and having a circular coating groove formed on an upper surface thereof; The drum is rotatably supported by the bracket so that the adhesive applied to the application groove is applied to the application groove at a predetermined depth as the drum disc rotates and has a width corresponding to the application groove and is spaced apart from the bottom surface of the application groove. ; A distance adjusting bracket coupled to the lower portion of the applicator and coupled with the upper portion of the fixing bracket so as to move upward and downward to adjust a distance between a bottom surface of the applicator and a bottom surface of the application groove; A gauge bracket coupled to one side bolt hole of the distance control bracket and having a digital gauge installed in a front gauge groove; A meta bracket fixed to one side of the fixing bracket; And a digital meter in which one side is fixedly coupled to the meta bracket and the digital gauge is positioned in a back vertical groove and a display unit is formed on the front side.
Wherein a bottom of the applicator is formed with a storage groove for temporarily storing and storing excess adhesive remaining on the bottom surface of the application groove of the adhesive injected into the application groove at a predetermined depth.
The digital meter has a display unit for displaying a digital gauge value rising and lowering at the center of the front, an on / off button on one side, and an on / off button and a zero button on the other side.
The gauge bracket is formed with a bolt hole for fixing with a fixing bolt bent to one side of the center for fixing to one side of the distance adjusting bracket and a front gauge groove with both sides protruding to be fixed with a digital gauge inserted thereinto .
According to the present invention as described above, the zero point of the digital meter can be adjusted by pressing the zero button of the digital meter so that the adhesive is applied to the bottom surface of the application groove of the drum disk, and the digital meter can be viewed and adjusted through the display of the digital meter.
Also, there is an effect that the number displayed on the display portion can be checked by adjusting the depth of the adhesive in the application groove by holding the zero point with the zero button of the digital meter so that the adhesive is applied to the bottom surface of the application groove of the drum disk at a predetermined depth.
Also, the depth of the adhesive can be easily adjusted by anyone so that the adhesive is applied to the bottom surface of the application groove of the drum disk at a predetermined depth.
BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of a zero point adjustment device of a die bonder drum disk assembly of the present invention.
Fig. 2 is a view of assembled brackets of the die bonder drum disc assembly of the present invention. Fig.
3 is a perspective view of the zero point adjustment assembly of the die bonder drum disk assembly of the present invention.
4 is a side elevation view of the zero point adjustment device of the die bonder drum disk assembly of the present invention.
5 is a top view of the zero point adjustment device of the die bonder drum disk assembly of the present invention.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
FIG. 1 is a perspective view of the zero-point adjusting device of the die bonder drum disk assembly of the present invention, FIG. 2 is an assembled view of the bracket of the die bonder drum disk assembly of the present invention, 4 is a side elevation view of a die bonder drum disk assembly of the present invention, and FIG. 5 is a plan view of a zero point adjustment device of the die bonder drum disk assembly of the present invention.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a zero point adjusting apparatus for a die bonder drum disc assembly and more particularly to a drum disc assembly for holding an adhesive (liquid epoxy) used in a die bonder which is a packaging apparatus for a semiconductor element or an LED element To a zero point adjusting device of a die bonder drum disc assembly capable of adjusting the initial zero point and the cage so that the adhesive can be continuously applied at a constant depth.
1 to 5, a zero point adjusting device of a die bonder drum disc assembly according to the present invention will be described below.
The zero point adjusting device of the die bonder drum disc assembly of the present invention comprises: a bracket (10) fixedly mounted on a die bonder; A
The
A
A
The bottom of the
The
The
The
Surplus grooves are formed at both side edges of the
The die bonder may be formed by applying a small amount of epoxy from a
To push the adhesive injected into the
At this time, the
The
The upper surface of the
The adhesive injected into the
The
The rotating means 60 is rotatably coupled to the
The injection nozzle 5 is disposed in the
An adhesive is continuously supplied to the rear
The zero point adjustment device of the die bonder drum disk assembly as described above is configured to hold the zero point by the zero
Also, anyone can easily adjust the depth of the adhesive so that the adhesive is applied to the bottom surface of the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, The present invention may employ various changes, modifications, and equivalents. It is clear that the present invention can be suitably modified and applied in the same manner. Therefore, the above description does not limit the scope of the present invention, which is defined by the limitations of the following claims.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention.
10: Bracket 20: Drum disk
21: application groove 30:
40: Fixing bracket 50: Distance adjusting bracket
51: bolt hole 52: pin hole
60: handle 70: rotating means
80:
90: Gauge bracket 91: Bolt hole
92: front gauge groove 93: digital gauge
100: digital meter 101: display unit
102: ON / OFF button 103: Zero button
104: pre-inches / inch Barton 105:
Claims (4)
The bottom of the applicator 30 is formed with a storage groove for temporarily storing and storing excess adhesive remaining on the bottom surface of the application groove 21 of the adhesive injected into the application groove 21 at a predetermined depth Wherein the die-bonder drum disc assembly has a plurality of holes.
The digital meter 100 includes a display unit 101 displaying a value of a digital gauge 93 ascending and descending at the center of the front face of the digital still camera 100 and an on / off button 104 and a on / off button 102 and a zero button 103) are provided on the outer circumferential surface of the die-bonder drum disc assembly.
The gauge bracket 90 includes a bolt hole 91 for fixing a fixing bolt bent to one side of the center for fixing to one side of the distance adjusting bracket 50 and a digital gauge 93 inserted into the front side, And the protruding front gage grooves (92) are formed on the surface of the die-bonding drum disc assembly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020140184318A KR101524561B1 (en) | 2014-12-19 | 2014-12-19 | Die bonder zeroing devices in the drum disk assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020140184318A KR101524561B1 (en) | 2014-12-19 | 2014-12-19 | Die bonder zeroing devices in the drum disk assembly |
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KR101524561B1 true KR101524561B1 (en) | 2015-06-09 |
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KR1020140184318A KR101524561B1 (en) | 2014-12-19 | 2014-12-19 | Die bonder zeroing devices in the drum disk assembly |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10233042A (en) * | 1997-02-19 | 1998-09-02 | Matsushita Electric Ind Co Ltd | Disk sticking method |
JPH1145486A (en) * | 1997-05-26 | 1999-02-16 | Sony Corp | Disk position adjusting device and method therefor |
JP2003161309A (en) * | 2001-11-27 | 2003-06-06 | Matsushita Electric Ind Co Ltd | Height adjusting device |
-
2014
- 2014-12-19 KR KR1020140184318A patent/KR101524561B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10233042A (en) * | 1997-02-19 | 1998-09-02 | Matsushita Electric Ind Co Ltd | Disk sticking method |
JPH1145486A (en) * | 1997-05-26 | 1999-02-16 | Sony Corp | Disk position adjusting device and method therefor |
JP2003161309A (en) * | 2001-11-27 | 2003-06-06 | Matsushita Electric Ind Co Ltd | Height adjusting device |
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