KR101524561B1 - Die bonder zeroing devices in the drum disk assembly - Google Patents

Die bonder zeroing devices in the drum disk assembly Download PDF

Info

Publication number
KR101524561B1
KR101524561B1 KR1020140184318A KR20140184318A KR101524561B1 KR 101524561 B1 KR101524561 B1 KR 101524561B1 KR 1020140184318 A KR1020140184318 A KR 1020140184318A KR 20140184318 A KR20140184318 A KR 20140184318A KR 101524561 B1 KR101524561 B1 KR 101524561B1
Authority
KR
South Korea
Prior art keywords
bracket
groove
drum
gauge
adhesive
Prior art date
Application number
KR1020140184318A
Other languages
Korean (ko)
Inventor
한철희
김정현
Original Assignee
주식회사 케이앤에스
전영욱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이앤에스, 전영욱 filed Critical 주식회사 케이앤에스
Priority to KR1020140184318A priority Critical patent/KR101524561B1/en
Application granted granted Critical
Publication of KR101524561B1 publication Critical patent/KR101524561B1/en

Links

Images

Landscapes

  • Manufacturing Optical Record Carriers (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a zero point adjusting apparatus for a die bonder drum disc assembly and more particularly to a drum disc assembly for holding an adhesive (liquid epoxy) used in a die bonder which is a packaging apparatus for a semiconductor element or an LED element To a zero point adjusting device of a die bonder drum disc assembly capable of adjusting the initial zero point and the digital cage so that the adhesive can be continuously applied at a constant depth.
The zero point adjusting device of the die bonder drum disc assembly of the present invention comprises: a bracket fixedly mounted on a die bonder; A drum disc rotatably connected to an upper portion of the bracket by a rotating means and having a circular coating groove formed on an upper surface thereof; The drum is rotatably supported by the bracket so that the adhesive applied to the application groove is applied to the application groove at a predetermined depth as the drum disc rotates and has a width corresponding to the application groove and is spaced apart from the bottom surface of the application groove. ; A distance adjusting bracket coupled to the lower portion of the applicator and coupled with the upper portion of the fixing bracket so as to move upward and downward to adjust a distance between a bottom surface of the applicator and a bottom surface of the application groove; A gauge bracket coupled to one side bolt hole of the distance adjustment bracket and equipped with a digital gauge in a front gauge groove; A meta bracket fixed to one side of the fixing bracket; And a digital meter in which one side is fixedly coupled to the meta bracket and the digital gauge is positioned in a back vertical groove and a display unit is formed on the front side.

Figure R1020140184318

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a die bonder drum disc assembly,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a zero point adjusting apparatus for a die bonder drum disc assembly and more particularly to a drum disc assembly for holding an adhesive (liquid epoxy) used in a die bonder which is a packaging apparatus for a semiconductor element or an LED element To a zero point adjusting device of a die bonder drum disc assembly capable of adjusting the initial zero point and the digital cage so that the adhesive can be continuously applied at a constant depth.

Generally, a manufacturing process of a semiconductor device or an LED device includes a raw material inspecting process for inspecting defects of a wafer or an LED device, a sawing process for separating the wafer or the LED device into individual pieces, A die bonding process for attaching the separated semiconductor chip or LED device to the mount plate of the lead frame, a wire bonding process for connecting the lead pad on the semiconductor chip with the lead of the lead frame by wire bonding a molding process for encapsulating the exterior with an encapsulant to protect the internal circuitry and other components of the semiconductor chip or the LED device and a singulation process ) And the like.

In the above process, the die bonding process is performed by a dedicated device called a 'die bonder'. The die bonder is used to stamp a predetermined amount of epoxy from a drum disk containing a liquid epoxy, which is an adhesive, pin is used to apply a small amount to the lead frame, and then the semiconductor chip or the LED element is transferred to a vacuum adsorption collet to be adhered to the lead frame. In this process, the drum disk is made of a structure that rotates at a constant speed from the lower portion of the epoxy drum disk assembly. The epoxy drum disk assembly includes a drum disk rotating at a constant speed by a motor, an epoxy guide positioned at an upper portion of the epoxy contained in the drum disk to uniformly control an epoxy surface, and an adjuster for adjusting the height of the guide do.

The epoxy used in the die bonding process is contained in a drum disk, and has a life time of several minutes at room temperature depending on characteristics after being put into a process. The time for which the epoxy for bonding is generally used is about 8 to 10 hours. Therefore, it is necessary to separate the epoxy drum disk from the die bonder for a certain period of time (about 7 to 8 hours) and to mount the drum disk containing the new epoxy. The separated drum disk is washed to remove the epoxy exposed in the air for a long time, You have to be prepared to do it again.

In the past, an adhesive dispensing apparatus for an LED bonding apparatus, which is registered in Korean Patent Application No. 10-0962663, is disclosed.

The adhesive dispensing apparatus for the LED bonding apparatus includes: a bracket fixedly mounted on the LED bonding apparatus; A rotating body rotatably connected to the bracket and having a circular coating groove formed on an upper surface thereof; A plurality of grooves formed in the grooves and having a width corresponding to the grooves and spaced from the bottom surface of the grooves by a predetermined distance so that the grooves injected into the grooves are applied to the grooves at a predetermined depth And a coating material.

The apparatus for applying an adhesive for an LED bonding apparatus includes an applicator coupled to the bracket so as to move up and down so as to adjust a distance between a bottom surface of the applicator and a bottom surface of the applicator, There is a problem in that it is difficult to adjust the distance by adjusting the micro gauge scale because the distance adjusting means can not hold the zero point when the handle is operated so that the adhesive injected into the groove is applied to the application groove at a constant depth.

Korean Patent No. 10-0962663 discloses an adhesive dispensing apparatus for an LED bonding apparatus.

An object of the present invention is to provide an epoxy drum disc which can adjust the initial zero point by pressing the zero button of the digital meter and adjust the digital gauge through the display unit of the digital meter so as to apply the adhesive to a predetermined depth on the bottom surface of the application groove of the drum disc, And a zero-point adjusting device for the assembly.

Another object of the present invention is to provide a method of manufacturing an adhesive tape for a drum disc, comprising: applying a pressure to a bottom surface of a drum disc to apply adhesive to a predetermined depth; And a zero point adjusting device for the drum disc assembly.

It is another object of the present invention to provide a zero point adjusting device for an epoxy drum disc assembly in a die bonder in which a depth of an adhesive can be easily adjusted by anyone so that an adhesive is applied to a bottom surface of a coating groove of a drum disc.

According to an aspect of the present invention, there is provided a zero point adjusting apparatus for a die bonder drum disc assembly, including: a bracket fixedly mounted on a die bonder; A drum disc rotatably connected to an upper portion of the bracket by a rotating means and having a circular coating groove formed on an upper surface thereof; The drum is rotatably supported by the bracket so that the adhesive applied to the application groove is applied to the application groove at a predetermined depth as the drum disc rotates and has a width corresponding to the application groove and is spaced apart from the bottom surface of the application groove. ; A distance adjusting bracket coupled to the lower portion of the applicator and coupled with the upper portion of the fixing bracket so as to move upward and downward to adjust a distance between a bottom surface of the applicator and a bottom surface of the application groove; A gauge bracket coupled to one side bolt hole of the distance control bracket and having a digital gauge installed in a front gauge groove; A meta bracket fixed to one side of the fixing bracket; And a digital meter in which one side is fixedly coupled to the meta bracket and the digital gauge is positioned in a back vertical groove and a display unit is formed on the front side.

Wherein a bottom of the applicator is formed with a storage groove for temporarily storing and storing excess adhesive remaining on the bottom surface of the application groove of the adhesive injected into the application groove at a predetermined depth.

The digital meter has a display unit for displaying a digital gauge value rising and lowering at the center of the front, an on / off button on one side, and an on / off button and a zero button on the other side.

The gauge bracket is formed with a bolt hole for fixing with a fixing bolt bent to one side of the center for fixing to one side of the distance adjusting bracket and a front gauge groove with both sides protruding to be fixed with a digital gauge inserted thereinto .

According to the present invention as described above, the zero point of the digital meter can be adjusted by pressing the zero button of the digital meter so that the adhesive is applied to the bottom surface of the application groove of the drum disk, and the digital meter can be viewed and adjusted through the display of the digital meter.

Also, there is an effect that the number displayed on the display portion can be checked by adjusting the depth of the adhesive in the application groove by holding the zero point with the zero button of the digital meter so that the adhesive is applied to the bottom surface of the application groove of the drum disk at a predetermined depth.

Also, the depth of the adhesive can be easily adjusted by anyone so that the adhesive is applied to the bottom surface of the application groove of the drum disk at a predetermined depth.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of a zero point adjustment device of a die bonder drum disk assembly of the present invention.
Fig. 2 is a view of assembled brackets of the die bonder drum disc assembly of the present invention. Fig.
3 is a perspective view of the zero point adjustment assembly of the die bonder drum disk assembly of the present invention.
4 is a side elevation view of the zero point adjustment device of the die bonder drum disk assembly of the present invention.
5 is a top view of the zero point adjustment device of the die bonder drum disk assembly of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

FIG. 1 is a perspective view of the zero-point adjusting device of the die bonder drum disk assembly of the present invention, FIG. 2 is an assembled view of the bracket of the die bonder drum disk assembly of the present invention, 4 is a side elevation view of a die bonder drum disk assembly of the present invention, and FIG. 5 is a plan view of a zero point adjustment device of the die bonder drum disk assembly of the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a zero point adjusting apparatus for a die bonder drum disc assembly and more particularly to a drum disc assembly for holding an adhesive (liquid epoxy) used in a die bonder which is a packaging apparatus for a semiconductor element or an LED element To a zero point adjusting device of a die bonder drum disc assembly capable of adjusting the initial zero point and the cage so that the adhesive can be continuously applied at a constant depth.

1 to 5, a zero point adjusting device of a die bonder drum disc assembly according to the present invention will be described below.

The zero point adjusting device of the die bonder drum disc assembly of the present invention comprises: a bracket (10) fixedly mounted on a die bonder; A drum disc 20 rotatably connected to an upper portion of the bracket 10 by a rotating means 70 and having a circular coating groove 21 formed on an upper surface of the bracket 10, do.

The drum 20 is connected to the bracket 10 and has a width corresponding to the application groove 21 and is spaced from the bottom surface of the application groove 21 by a predetermined distance. As the drum 20 rotates, 21 for applying an adhesive to the application groove 21 at a predetermined depth; The applicator 30 is coupled to the lower portion of the applicator 30 so that the applicator 30 can be raised and lowered by the fixing bracket 40 by adjusting the upper handle 60, A distance adjustment bracket 50 for adjusting the distance of the lens barrel 50 is provided.

A gauge bracket 90 provided with a digital gauge 93 is fixed to the front gauge groove 92 on one side of the bolt hole 51 and the pinhole 52 of the distance adjustment bracket 50.

A meta bracket 80 having a bolt hole 81 formed at one side of the fixing bracket 40 is fixed and a fixing part 105 is fixed to one side of the meta bracket 80 through a bolt hole 82 And a digital meter 100 having the display unit 101 formed on the front surface thereof is provided with the digital gauge 93 positioned on the back vertical groove.

The bottom of the applicator 30 is formed with a storage groove for temporarily storing and storing excess adhesive remaining on the bottom surface of the application groove 21 of the adhesive injected into the application groove 21 at a predetermined depth will be.

The digital meter 100 includes a display unit 101 displaying a value of a digital gauge 93 ascending and descending at the center of the front face of the digital still camera 100 and an on / off button 104 and a on / off button 102 and a zero button 103) is installed.

The gauge bracket 90 includes a bolt hole 91 for fixing a fixing bolt bent to one side of the center for fixing to one side of the distance adjusting bracket 50 and a digital gauge 93 inserted into the front side, And the protruded front gage grooves 92 are formed.

The drum disk 20 is rotatably connected to the bracket 10 through the rotating means 70. A cylindrical coupling portion is protruded from the center of the upper surface of the drum disk 20, The application groove 21 is formed in a circular shape.

Surplus grooves are formed at both side edges of the application groove 21 to accommodate the over-injected adhesive when the adhesive is excessively injected into the application groove 21.

The die bonder may be formed by applying a small amount of epoxy from a drum disk 20 containing liquid epoxy as an adhesive to a lead frame by using a stamping pin and then attaching a semiconductor chip or LED device to the vacuum adsorption cortex collet) and placed on the lead frame for adhesion.

To push the adhesive injected into the application groove 21 to a predetermined thickness on the bottom surface of the application groove 21, the ON / OFF button provided on the front surface of the digital meter 100 is turned on, The distance adjusting bracket 50 moves downward so that the lower end of the lower applicator 30 contacts the bottom surface of the application groove 21 of the drum disk 20. [

At this time, the display unit 101 formed on the front surface of the digital meter 100 needs to be in a zero state, but according to the state of installation, it does not become a zero state, so that the current state is set to a zero state by pressing the zero button 103 at this time. The distance adjusting bracket 50 is moved upward and the lower end of the applicator 30 is moved to the upper side of the drum disk 20 from the bottom surface of the application groove 21. At this time, the user views the number displayed on the display unit 101 formed on the front surface of the digital meter 100 and can easily set the height of the adhesive.

The applicator 30 has a width corresponding to the width of the application groove 21 and is spaced apart from the bottom groove of the application groove 21 by a predetermined distance. When the drum 20 is rotated, 21 is spread on the bottom surface of the application groove 21 to a constant thickness. In other words, it is applied to the bottom surface of the application groove 21 with a constant thickness.

The upper surface of the applicator 30 is formed with a fixing groove into which a distance adjusting pin of the distance adjusting bracket 50 is inserted and fixed to the upper surface of the applicator 30. The bottom surface is flattened in a forward direction And a storage groove is formed to deepen the depth.

The adhesive injected into the application groove 21 located at the rear end side of the applicator 30 is transferred to the front end of the flat applicator 30 and the bottom surface of the application groove 21 as the drum disc 20 rotates, The adhesive agent is applied to the application groove 21 located on the front end side of the applicator 30 by the thickness corresponding to the spacing space. As a result of the rotation of the drum disk 20, the excess adhesive is temporarily stored in the storage groove and then passes through the spacing space to be discharged into the application groove 21 .

The distance adjustment bracket 50 moves the applicator 30 up and down to finely adjust the distance between the bottom surface of the applicator 30 and the bottom surface of the application groove 21. The distance adjusting bracket 40 has a lower distance adjusting pin of the handle 60 to which the applicator 30 is coupled and inserted into the fastening hole of the fastening bracket 40, And a handle 60 connected to the distance adjusting pin so as to be protruded from the upper portion and having a scale on the surface thereof and rotating the distance adjusting pin finely.

The rotating means 60 is rotatably coupled to the bracket 10 and is rotated by an external power source to rotate the drum disk 20 connected to the lower portion.

The injection nozzle 5 is disposed in the application groove 21 located on the rear side of the applicator 30 so that the adhesive is continuously injected into the application groove 21 and the application groove (Not shown) is mounted on the mounting unit 21 so that the adhesive is applied to the bottom surface of the LED, and then the LED is picked up again and adhered to the surface of the sheet or substrate.

An adhesive is continuously supplied to the rear side application groove 21 of the applicator 30 and the adhesive agent 30 is applied to the bottom surface of the front side application groove 21 of the applicator 30, The adhesive applied to the front side application groove 21 is contacted and the bottom surface of the LED can be coated with an adhesive having a constant thickness as a whole.

The zero point adjustment device of the die bonder drum disk assembly as described above is configured to hold the zero point by the zero button 103 of the digital meter 100 so that the adhesive is applied to the bottom surface of the application groove 21 of the drum disk 20 at a predetermined depth It is possible to easily adjust the depth of the adhesive in the application groove 21 by confirming the number displayed on the display unit 101.

Also, anyone can easily adjust the depth of the adhesive so that the adhesive is applied to the bottom surface of the application groove 21 of the drum disk 20 at a predetermined depth.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, The present invention may employ various changes, modifications, and equivalents. It is clear that the present invention can be suitably modified and applied in the same manner. Therefore, the above description does not limit the scope of the present invention, which is defined by the limitations of the following claims.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention.

10: Bracket 20: Drum disk
21: application groove 30:
40: Fixing bracket 50: Distance adjusting bracket
51: bolt hole 52: pin hole
60: handle 70: rotating means
80: Meta bracket 81, 82: Bolt hole
90: Gauge bracket 91: Bolt hole
92: front gauge groove 93: digital gauge
100: digital meter 101: display unit
102: ON / OFF button 103: Zero button
104: pre-inches / inch Barton 105:

Claims (4)

A bracket 10 fixedly mounted on the die bonder; A drum disc 20 rotatably connected to an upper portion of the bracket 10 by a rotating means 70 and having a circular coating groove 21 formed on an upper surface thereof; The drum 20 is connected to the bracket 10 and has a width corresponding to the application groove 21 and is spaced from the bottom surface of the application groove 21 by a predetermined distance. As the drum 20 rotates, 21 for applying an adhesive to the application groove 21 at a predetermined depth; The distance between the bottom surface of the applicator 30 and the bottom surface of the application groove 21 is adjusted by the upper bracket 40 and the upper bracket 40, An adjustment bracket (50); A gauge bracket 90 coupled to one side bolt hole 51 of the distance adjustment bracket 50 and having a digital gauge 93 mounted on the front gauge groove 92; A meta bracket 80 fixed to one side of the fixing bracket 40; And a digital meter 100 having one side fixedly connected to the meta bracket 80 and the digital gauge 93 positioned on a back vertical groove and a display unit 101 formed on a front surface thereof. Zero point adjustment device for assembly.
The method according to claim 1,
The bottom of the applicator 30 is formed with a storage groove for temporarily storing and storing excess adhesive remaining on the bottom surface of the application groove 21 of the adhesive injected into the application groove 21 at a predetermined depth Wherein the die-bonder drum disc assembly has a plurality of holes.
The method according to claim 1,
The digital meter 100 includes a display unit 101 displaying a value of a digital gauge 93 ascending and descending at the center of the front face of the digital still camera 100 and an on / off button 104 and a on / off button 102 and a zero button 103) are provided on the outer circumferential surface of the die-bonder drum disc assembly.
The method according to claim 1,
The gauge bracket 90 includes a bolt hole 91 for fixing a fixing bolt bent to one side of the center for fixing to one side of the distance adjusting bracket 50 and a digital gauge 93 inserted into the front side, And the protruding front gage grooves (92) are formed on the surface of the die-bonding drum disc assembly.
KR1020140184318A 2014-12-19 2014-12-19 Die bonder zeroing devices in the drum disk assembly KR101524561B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140184318A KR101524561B1 (en) 2014-12-19 2014-12-19 Die bonder zeroing devices in the drum disk assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140184318A KR101524561B1 (en) 2014-12-19 2014-12-19 Die bonder zeroing devices in the drum disk assembly

Publications (1)

Publication Number Publication Date
KR101524561B1 true KR101524561B1 (en) 2015-06-09

Family

ID=53503902

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140184318A KR101524561B1 (en) 2014-12-19 2014-12-19 Die bonder zeroing devices in the drum disk assembly

Country Status (1)

Country Link
KR (1) KR101524561B1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233042A (en) * 1997-02-19 1998-09-02 Matsushita Electric Ind Co Ltd Disk sticking method
JPH1145486A (en) * 1997-05-26 1999-02-16 Sony Corp Disk position adjusting device and method therefor
JP2003161309A (en) * 2001-11-27 2003-06-06 Matsushita Electric Ind Co Ltd Height adjusting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233042A (en) * 1997-02-19 1998-09-02 Matsushita Electric Ind Co Ltd Disk sticking method
JPH1145486A (en) * 1997-05-26 1999-02-16 Sony Corp Disk position adjusting device and method therefor
JP2003161309A (en) * 2001-11-27 2003-06-06 Matsushita Electric Ind Co Ltd Height adjusting device

Similar Documents

Publication Publication Date Title
TW201801512A (en) Camera module, and photosensitive component thereof and manufacturing method therefor
KR102326457B1 (en) Method of producing protective member
US11313996B2 (en) Light emitting device with self-aligning preformed lens
US6554598B1 (en) Mold assembly for encapsulating semiconductor device
US20120202300A1 (en) Die bonder including automatic bond line thickness measurement
JP6498118B2 (en) Devices and methods
KR101524561B1 (en) Die bonder zeroing devices in the drum disk assembly
TW200610583A (en) Turntable device for spin-coating
WO2017215651A1 (en) Photosensor, camera module and manufacturing method thereof
JP2008041846A (en) Flip-chip resin injection molding method, and metal mold
CN107768395A (en) Oversize optical image sensor chip load process and suction nozzle
CN204981127U (en) Controllable paster device of thickness
JP5836757B2 (en) Grinding method for plate
KR20120057151A (en) Adhesive stamping apparatus for die bonder
KR101167658B1 (en) Having glue supply controller semiconductor die bonding apparatus
US9199396B2 (en) Substrate carrier for molding electronic devices
JP2970525B2 (en) Hollow package manufacturing method and hollow package manufacturing apparatus
CN216528798U (en) Full-automatic wafer pad pasting material feeding unit
JP7060809B2 (en) Manufacturing method of semiconductor device
JPS6258655B2 (en)
US9171786B1 (en) Integrated circuit with recess for die attachment
JP5189925B2 (en) Lens member manufacturing method
CN219577422U (en) Micro display screen substrate cover attaching device
JP2753141B2 (en) Die bonding method for semiconductor device
JPH0713987B2 (en) Mounting method of magnetic focusing chip in manufacturing method of high sensitivity Hall element

Legal Events

Date Code Title Description
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20180328

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20190515

Year of fee payment: 5