CN219577422U - Micro display screen substrate cover attaching device - Google Patents

Abstract

The utility model discloses a micro display screen substrate cover attaching device, and relates to the technical field of substrate cover attaching. The device comprises a carrier, wherein the carrier is provided with a mounting groove; the sleeve plate is positioned on the top surface of the carrier, a plurality of placing holes are formed in the sleeve plate, the placing holes correspond to the wafers on the PCB substrate one by one, and the placing holes are used for exposing the wafers on the PCB substrate and for mounting the plastic cover on the PCB substrate; and the pressing plate is positioned on the top surface of the sleeve plate and is used for applying pressure to the plastic cover in the direction of the PCB substrate so as to bond the plastic cover and the bonding material on the PCB substrate together. The plastic cover can be more accurately arranged at the wafer on the PCB substrate, and the pressure of the pressing plate on the plastic cover on the PCB substrate is more uniform, so that the quality of the plastic cover attached to the PCB substrate can be greatly improved.

Description

Micro display screen substrate cover attaching device

Technical Field

The utility model relates to the technical field of substrate covering, in particular to a micro display screen substrate covering device.

Background

PCB (Printed Circuit Board) is called a printed circuit board, also called a printed circuit board, which is an important electronic component, is a support for electronic components, is a carrier for electrically connecting electronic components, and requires a plastic cover to be attached to a plurality of wafers on a PCB substrate during the manufacturing process of the PCB substrate.

In the prior art, the wafer is covered by an operator manually. After dispensing on the PCB substrate, an operator takes the plastic cover by using tweezers, so that the plastic cover is aligned to the wafer and is attached to the wafer, then the iron block is placed on the plastic cover to press the plastic cover on the PCB substrate, and then a plurality of wafers on the PCB substrate are attached to the plastic cover one by one in the mode.

In the prior art, although the cover can be attached to the PCB substrate, the position of each wafer cannot be accurately found on the PCB substrate, so that the plastic cover cannot be accurately installed on the wafer of the PCB substrate; and the plastic cover is pressed by the iron block, so that the plastic cover on the PCB substrate is easy to be stressed unevenly, and finally, the quality of the cover attached to the PCB substrate is affected. Therefore, the quality of the cover of the PCB substrate in the prior art is not high.

Disclosure of Invention

The utility model mainly aims to provide a micro display screen substrate cover attaching device, which aims to solve the technical problem of low cover attaching quality of a PCB substrate in the prior art.

In order to solve the technical problems, the utility model provides a micro display substrate cover attaching device, which comprises:

the carrier is provided with a mounting groove which is used for placing the PCB substrate;

the sleeve plate is positioned on the top surface of the carrier, a plurality of placing holes are formed in the sleeve plate, the placing holes correspond to the wafers on the PCB substrate one by one, and the placing holes are used for exposing the wafers on the PCB substrate and for mounting the plastic cover on the PCB substrate;

and the pressing plate is positioned on the top surface of the sleeve plate and is used for applying pressure to the plastic cover in the direction of the PCB substrate so as to bond the plastic cover and the bonding material on the PCB substrate together.

Optionally, the top surface of carrier is equipped with a plurality of reference columns, it has a plurality of first locating holes to open on the cover board, a plurality of reference column with a plurality of first locating hole one-to-one, just the reference column can pass the first locating hole.

Optionally, a plurality of second positioning holes are formed in the pressing plate, a plurality of positioning columns are in one-to-one correspondence with a plurality of second positioning holes, and the positioning columns can penetrate through the second positioning holes.

Optionally, a plurality of locating pins are arranged in the mounting groove, a plurality of substrate locating holes are formed in the PCB substrate, the substrate locating holes correspond to the locating pins one by one, and the locating pins can penetrate through the substrate locating holes.

Optionally, the pressing plate and the sleeve plate are provided with observation holes, and the observation holes correspond to the positioning pins.

Optionally, the bottom surface of the sleeve plate is provided with a limiting groove, the top surface of the carrier is provided with a limiting convex edge, and the limiting convex edge and the limiting groove can be mutually clamped.

Optionally, the top surface of the carrier is further provided with a plurality of reserved grooves located in the mounting groove, and the reserved grooves are in one-to-one correspondence with the wafers.

Optionally, a limiting boss is arranged on the bottom surface of the sleeve plate, and a bearing surface corresponding to the limiting boss is arranged on the top surface of the carrier;

when the pressure plate does not apply pressure to the plastic cover, a compression gap is formed between the limiting boss and the bearing surface; when the plastic cover is adhered to the adhesive material on the PCB substrate, the limit boss is in contact with the bearing surface.

Optionally, the bottom surface of the pressing plate comprises a first limiting surface, and the top surface of the sleeve plate comprises a second limiting surface;

when the pressure plate does not apply pressure to the plastic cover, a feeding gap is formed between the first limiting surface and the second limiting surface; when the plastic cover is adhered to the adhesive material on the PCB substrate, the first limiting surface is contacted with the second limiting surface.

Optionally, the bottom surface of the pressing plate is provided with a plurality of pressing blocks, and the plurality of pressing blocks are in one-to-one correspondence with the plurality of placing holes; the pressing block protrudes in a direction away from the bottom surface of the pressing plate, and is used for applying pressure to the plastic cover.

Compared with the prior art, the utility model has the following beneficial effects:

the utility model provides a micro display screen substrate cover attaching device, which comprises a carrier, wherein a mounting groove is formed in the carrier and is used for placing a PCB substrate; the sleeve plate is positioned on the top surface of the carrier, a plurality of placing holes are formed in the sleeve plate, the placing holes correspond to the wafers on the PCB substrate one by one, and the placing holes are used for exposing the wafers on the PCB substrate and for mounting the plastic cover on the PCB substrate; and the pressing plate is positioned on the top surface of the sleeve plate and is used for applying pressure to the plastic cover in the direction of the PCB substrate so as to bond the plastic cover and the bonding material on the PCB substrate together.

When the PCB substrate is required to be covered, the PCB substrate coated with the bonding material is firstly mounted on the carrier, then the sleeve plate is mounted on the carrier, the wafers on the PCB substrate are respectively exposed in the placing holes of the sleeve plate, then the plastic cover is mounted on the PCB substrate through the placing holes, the plastic cover covers the wafers, finally the pressing plate is mounted on the carrier, pressure is applied to the plastic cover by utilizing the gravity of the pressing plate, and finally the plastic cover and the bonding material on the PCB substrate are firmly bonded together.

That is, since the cover attaching device comprises the sleeve plate and the pressing plate, the sleeve plate is provided with a plurality of placing holes corresponding to the wafers on the PCB substrate one by one, and the wafers on the PCB substrate are exposed in the placing holes of the sleeve plate one by one, the placing holes can position the wafers on the PCB substrate, and therefore the plastic cover can be accurately arranged on the wafers on the PCB substrate. In addition, because the pressure is applied to all plastic covers in the placing holes by the gravity of the pressing plate, and the pressure generated by different positions of the pressing plate is relatively uniform, the stress of the plastic covers on the PCB substrate can be more uniform. Therefore, the plastic cover can be accurately arranged at the wafer position on the PCB substrate, and the pressure of the pressing plate on the plastic cover on the PCB substrate is more uniform, so that the quality of the plastic cover attached to the PCB substrate can be greatly improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is an exploded schematic view of a device for attaching a substrate to a micro display panel according to an embodiment of the present utility model;

fig. 2 is a schematic perspective view of a carrier according to an embodiment of the present utility model;

fig. 3 is a schematic bottom perspective view of a sleeve plate according to an embodiment of the present utility model;

fig. 4 is a schematic top perspective view of a sleeve plate according to an embodiment of the present utility model;

FIG. 5 is a schematic perspective view of a platen according to an embodiment of the present utility model;

fig. 6 is a schematic perspective view of a PCB substrate according to an embodiment of the present utility model;

fig. 7 is a schematic perspective view of a plastic cover according to an embodiment of the present utility model;

fig. 8 is a schematic diagram of a partial perspective structure of a PCB substrate with pinholes according to an embodiment of the present utility model.

Description of the drawings: 1. a carrier; 11. positioning columns; 12. a bearing surface; 13. a mounting groove; 14. limiting convex edges; 15. a positioning pin; 16. a reserved groove; 17. a handle; 2. a PCB substrate; 21. a crystal; 22. a substrate positioning hole; 23. a pinhole; 3. a sleeve plate; 31. placing the hole; 32. a limit boss; 33. a limit groove; 34. a first positioning hole; 35. a hand support surface; 36. the second limiting surface; 37. an observation window; 4. a pressing plate; 41. a pressing block; 42. a second positioning hole; 43. a pick-up groove; 44. a first limiting surface; 5. a plastic cover; 51. and (5) stitching.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present utility model, it should be noted that the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, "plurality" means a positive integer greater than one, such as two, three, four, etc.

Referring to fig. 1, the utility model provides a cover attaching device for a micro display substrate, which comprises a carrier 1, a sleeve plate 3 and a pressing plate 4, wherein a mounting groove 13 is formed in the carrier 1, and the mounting groove 13 is used for placing a PCB substrate 2; the sleeve plate 3 is mounted on the top surface of the carrier 1, a plurality of placing holes 31 are formed in the sleeve plate 3, the placing holes 31 are in one-to-one correspondence with the wafers on the PCB substrate 2, the placing holes 31 are used for exposing the wafers on the PCB substrate 2, and the plastic cover 5 is mounted on the PCB substrate 2; the pressing plate 4 is mounted on the top surface of the sleeve plate 3, and the pressing plate 4 is used for applying pressure to the plastic cover 5 in the direction of the PCB substrate 2 so as to bond the plastic cover 5 and the bonding material on the PCB substrate together.

In this embodiment, the PCB substrate 2 is a substrate of a micro display to be covered. The adhesive material refers to a material, such as glue, that can firmly adhere the plastic cover 5 to the PCB substrate 2 without affecting the performance of the PCB substrate 2. When the PCB substrate 2 needs to be covered, the PCB substrate 2 coated with the bonding material is firstly mounted on the carrier 1, then the sleeve plate 3 is mounted on the carrier 1, the wafers on the PCB substrate 2 are respectively exposed in the placing holes 31 of the sleeve plate 3, then the plastic cover 5 is mounted on the PCB substrate 2 through the placing holes 31, the plastic cover 5 covers the wafers, finally the pressing plate 4 is mounted on the carrier 1, and the pressure is applied to the plastic cover 5 by utilizing the gravity of the pressing plate 4, so that the plastic cover 5 and the bonding material on the PCB substrate 2 are firmly bonded together.

In summary, since the cover attaching device includes the sleeve plate 3 and the pressing plate 4, the sleeve plate 3 is provided with a plurality of placement holes 31 corresponding to the wafers on the PCB substrate 2 one by one, and the wafers on the PCB substrate 2 are exposed in the placement holes 31 of the sleeve plate 3 one by one, the placement holes 31 can position the wafers on the PCB substrate 2, so that the plastic cover 5 can be more accurately installed on the wafers on the PCB substrate 2. In addition, since the pressure is applied to all the plastic covers 5 positioned in the placement holes 31 by the gravity of the pressing plate 4, and the pressure generated by different positions of the pressing plate 4 is uniform, the plastic covers 5 on the PCB substrate 2 can be stressed more uniformly. Therefore, the plastic cover 5 can be more accurately arranged at the wafer position on the PCB substrate 2, and the plastic cover 5 on the PCB substrate 2 is more uniformly pressed by the pressing plate 4, so that the quality of the plastic cover 5 attached to the PCB substrate 2 can be greatly improved. In addition, since the plastic covers 5 can be positioned more quickly and the pressure can be applied to the plurality of plastic covers 5 by the pressing plate 4, the attaching efficiency to the PCB substrate 2 can be greatly improved.

In addition, compared with the prior art that the hand-aligned attaching cover is not provided with a fixed limiting device, the hand is easy to touch the adjacent plastic cover 5, so that the plastic cover 5 is misplaced. Since the pressing plate 4 is simultaneously pressed on the plurality of plastic covers 5 and the plastic covers 5 are pressed by the self gravity of the pressing plate 4, the self gravity of the pressing plate 4 at different positions is basically uniform, so that each plastic cover can be fused with the bonding material. Compared with the prior art, after the plastic cover 5 is manually attached, because the glue is not cured yet, the PCB substrate 2 is thinner, and the PCB substrate 2 is easy to bend during taking, so that the plastic cover 5 has the problem of falling risk.

In some embodiments, referring to fig. 1-3, the top surface of the carrier 1 is provided with a plurality of positioning posts 11, the sleeve plate 3 is provided with a plurality of first positioning holes 34, the plurality of positioning posts 11 are in one-to-one correspondence with the plurality of first positioning holes 34, and the positioning posts 11 can pass through the first positioning holes 34.

In this embodiment, when the sleeve plate 3 is mounted on the carrier 1, the positioning posts 11 on the carrier 1 respectively pass through the corresponding first positioning holes 34 on the sleeve plate 3, and move the sleeve plate 3 toward the carrier 1. Due to the positioning of the positioning column 11 and the first positioning hole 34, the position accuracy of the mounting of the sleeve plate 3 on the carrier 1 can be further improved, and finally, the wafers on the PCB substrate 2 can be accurately exposed in the placing holes 31 of the sleeve plate 3 respectively, so that the quality of attaching the cover to the PCB substrate 2 in the later stage can be improved.

In some embodiments, referring to fig. 2 and 5, the pressing plate 4 is provided with a plurality of second positioning holes 42, the plurality of positioning columns 11 are in one-to-one correspondence with the plurality of second positioning holes 42, and the positioning columns 11 can pass through the second positioning holes 42.

In this embodiment, when the platen 4 is mounted on the carrier 1, the plurality of positioning posts 11 on the carrier 1 respectively pass through the corresponding second positioning holes 42 on the platen 4, and move the platen 4 toward the carrier 1. Due to the positioning of the positioning column 11 and the second positioning hole 42, the position accuracy of the pressing plate 4 mounted on the carrier 1 can be improved, and finally the pressing plate 4 can compress the plastic cover 5 more accurately, so that the plastic cover 5 can be more accurately attached to the PCB substrate 2.

Referring to fig. 2 and 6, a plurality of positioning pins 15 are disposed in the mounting groove 13, a plurality of substrate positioning holes 22 are formed in the PCB substrate 2, the plurality of substrate positioning holes 22 and the plurality of positioning pins 15 are in one-to-one correspondence, and the positioning pins 15 can pass through the substrate positioning holes 22.

In this embodiment, when the PCB substrate 2 is mounted in the mounting groove 13, the positioning pins 15 in the mounting groove 13 sequentially pass through the corresponding substrate positioning holes 22 on the PCB substrate 2, and the positioning of the substrate positioning holes 22 and the positioning pins 15 can enable the PCB substrate 2 to be mounted at the predetermined position of the carrier 1 more accurately, so that the wafer on the PCB substrate 2 can be more accurately corresponding to the placement holes 31 on the cover plate 3.

Referring to fig. 3-5, the pressing plate 4 and the sleeve plate 3 are provided with observation holes 37, and the observation holes 37 correspond to the positioning pins 15.

In this embodiment, in order to prevent the situation that the PCB substrate 2 is placed on the carrier 1 and misplaced, in addition to the positioning pins 15, the sleeve plate 3 and the pressing plate 4 are both designed with the observation holes 37, the positions of the observation holes 37 correspond to the positions of the positioning pins 15 on the carrier 1, after the PCB substrate 2 is placed on the carrier 1, the sleeve plate 3 is installed to observe whether the PCB substrate 2 is placed in place, and after the sleeve plate 3 and the pressing plate 4 are both installed, the observation holes 37 are also used to observe whether the PCB substrate 2 is placed in place, so that the position of the PCB substrate 2 mounted on the carrier 1 can be further improved.

In some embodiments, referring to fig. 2-3 again, a limiting groove 33 is formed on the bottom surface of the sleeve plate 3, a limiting ridge 14 is formed on the top surface of the carrier 1, and the limiting ridge 14 and the limiting groove 33 can be clamped with each other.

In this embodiment, the spacing rib 14 and the carrier 1 may be integrally formed, and the spacing rib 14 and the spacing groove 33 may be annular, so that the sleeve plate 3 may be better spacing. When the sleeve plate 3 is mounted on the carrier 1, the limit ridge on the carrier 1 will be clamped into the limit groove 33 of the sleeve plate 3, and when the limit ridge is clamped into the limit groove 33, the sleeve plate 3 is mounted on the proper position of the carrier 1. Because the sleeve plate 3 can be more accurately installed at the proper position of the carrier 1 through the limiting ribs 14 and the limiting grooves 33, the placing holes 31 on the sleeve plate 3 can be more accurately in one-to-one correspondence with the crystals 21 on the PCB substrate 2, so that the plastic cover 5 can be more accurately attached to the corresponding position of the PCB substrate 2, and the attaching quality of the PCB substrate 2 can be further improved.

In some embodiments, referring to fig. 2 again, the top surface of the carrier 1 is further provided with a plurality of reserved slots 16 located in the mounting slots 13, and the reserved slots 16 are in one-to-one correspondence with the wafers.

In this embodiment, when the PCB substrate 2 is mounted on the carrier 1, the wafers on the PCB substrate 2 are located in the reserved slots 16 of the carrier 1 one by one, so that the position of the PCB substrate 2 can be more conveniently located. In addition, the pressure of the pressing plate 4 applied to the wafer on the PCB substrate 2 can be reduced, thereby protecting the wafer on the PCB substrate 2.

In some embodiments, referring to fig. 2-3, a limiting boss 32 is disposed on a bottom surface of the sleeve plate 3, and a bearing surface 12 corresponding to the limiting boss 32 is disposed on a top surface of the carrier 1; when the pressure plate 4 does not apply pressure to the plastic cover 5, a compression gap is formed between the limiting boss 32 and the bearing surface 12; when the plastic cover 5 is adhered to the adhesive material on the PCB substrate 2, the limit boss 32 contacts the carrying surface 12.

In this embodiment, the compression gap refers to a gap between the limiting boss 32 and the bearing surface 12 when the pressing plate 4 does not apply pressure to the plastic cover 5, and the compression gap may be 0.1mm-0.2mm, preferably 0.2mm. When the sleeve plate 3 is pressed by the pressing plate 4, the compression gap is gradually reduced in the process of gradually moving to the carrier 1 until the limit boss 32 on the sleeve plate 3 is contacted with the bearing surface 12 on the carrier 1. At this time, the bearing surface 12 limits the sleeve plate 3 from moving toward the carrier 1, so that the sleeve plate 3 can be prevented from generating an overpressure phenomenon on the carrier 1.

In some embodiments, referring to fig. 3-5, the bottom surface of the pressing plate 4 includes a first limiting surface 44, and the top surface of the sleeve plate 3 includes a second limiting surface 36; when the pressing plate 4 does not apply pressure to the plastic cover 5, a feeding gap is formed between the first limiting surface 44 and the second limiting surface 36; when the plastic cover 5 is adhered to the adhesive material on the PCB substrate 2, the first limiting surface 44 contacts the second limiting surface 36.

In this embodiment, the feeding gap is a gap between the first limiting surface 44 and the second limiting surface 36 when the pressing plate 4 is mounted on the carrier 1 and no pressure is applied to the plastic cover 5 by the pressing plate 4, and the feeding gap may be 0.05mm-0.1mm, preferably 0.1mm. When the pressing plate 4 is in contact with the plastic cover 5, a feeding gap is formed between the first limiting surface 44 on the pressing plate 4 and the second limiting surface 36 of the sleeve plate 3; along with the effect of the gravity of the pressing plate 4, the pressing plate 4 gradually moves towards the carrier 1, when the first limiting surface 44 of the pressing plate 4 is completely contacted with the second limiting surface 36 of the sleeve plate 3, the deformation of the plastic cover is the deformation of the feeding gap, and the deformation of the plastic cover which is the feeding gap is within the acceptable range of the plastic cover 5, so that the plastic cover 5 cannot generate the phenomenon of uneven yield or crushing products due to overlarge stress or uneven stress, thereby protecting the quality of the plastic cover 5 attached on the PCB substrate 2.

In some embodiments, referring to fig. 3 to 5, a plurality of pressing blocks 41 are disposed on the bottom surface of the pressing plate 4, and the plurality of pressing blocks 41 are in one-to-one correspondence with the plurality of placement holes 31; wherein, the pressure position block 41 is protruded in a direction away from the bottom surface of the pressure plate 4, and the pressure position block 41 is used for applying pressure to the plastic cover 5.

In this embodiment, when the pressing plate 4 is mounted on the carrier 1, the pressing blocks 41 are in one-to-one contact with the plastic covers 5, and the pressing blocks 41 apply pressure to the plastic covers 5 and gradually move toward the carrier 1 with the action of the gravity of the pressing plate 4. Because the pressure position blocks 41 are in one-to-one correspondence with the placement holes 31, and the pressure position blocks 41 are protruded in the direction away from the bottom surface of the pressure plate 4, the extrusion effect of the pressure position blocks 41 on the plastic cover 5 is better, so that the quality of the plastic cover 5 attached to the PCB substrate 2 can be further improved.

In some embodiments, referring to fig. 7-8, the plastic cover 5 is provided with a plurality of pins 51, the diameter of the pins 51 may be 0.3mm, the PCB substrate 2 is provided with a plurality of pinholes 23, and the diameter of the pinholes 23 may be 0.38mm. The orthographic projection of the plastic cover 5 on the carrier 1 is located in the orthographic projection of the placement hole 31 on the carrier 1, and a single-side error corresponding to the placement hole 31 between the plastic cover 5 and the placement hole 31 is less than or equal to 0.05mm, for example, the length and the width of the placement hole 31 may be respectively greater than 0.05mm-0.1mm of the length and the width of the plastic cover 5. More specifically, the plastic cover 5 may have a length of 21.8mm, a width of 18.8mm, a length of 21.9mm, and a width of 18.9mm. In this way, the single-side error of the placement hole 31 and the plastic cover 5 is 0.05mm, and the three pins 51 with 0.1mm chamfers of the plastic cover 5 are combined, so that the pins 51 of the plastic cover 5 can be accurately installed on the pin holes 23 on the PCB substrate 2, and the plastic cover 5 can be better positioned.

In some embodiments, referring to fig. 2-5, a picking groove 43 is provided on the pressing plate 4, a hand support surface 35 is provided on the sleeve plate 3, a handle 17 is provided on the carrier 1, and the assembly of the picking groove 43 of the pressing plate 4, the hand support surface 35 of the sleeve plate 3, and the handle 17 of the carrier 1 is dislocated and structurally designed differently. When the PCB substrate 2 is taken out, the pressing plate 4 is taken out firstly, the pressing plate 4 can be taken out by screwing the pressing plate 4 according to the position of the taking groove 43 when the pressing plate 4 is taken out, and the pressing plate 4 cannot interfere with the sleeve plate 3 of the second layer when the pressing plate 4 is taken out. When the second layer sleeve plate 3 is taken out, the four protruding hand support surfaces 35 are screwed up, and the hand support surfaces do not interfere with and touch the bottom carrier 1. Finally, when the whole device is lifted, the carrier 1 and the PCB substrate 2 can be taken together by only holding the handles 17 on the side of the carrier 1 by hands. In this way, the pressing plate 4, the sleeve plate 3 and the carrier 1 are more convenient to carry, and the three parts are not mutually influenced in the carrying process, so that the influence degree on the PCB substrate 2 positioned on the carrier 1 can be reduced.

The above description is merely illustrative of various embodiments of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the scope of the present utility model, and the utility model is intended to be covered by the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims (10)

1. A micro-display substrate capping device, characterized in that the capping device comprises:

the PCB comprises a carrier (1), wherein a mounting groove (13) is formed in the carrier (1), and the mounting groove (13) is used for placing a PCB substrate (2);

the sleeve plate (3) is positioned on the top surface of the carrier (1), a plurality of placing holes (31) are formed in the sleeve plate (3), the placing holes (31) are in one-to-one correspondence with the wafers on the PCB substrate (2), the placing holes (31) are used for exposing the wafers on the PCB substrate (2), and the plastic cover (5) is arranged on the PCB substrate (2);

and the pressing plate (4) is positioned on the top surface of the sleeve plate (3), and the pressing plate (4) is used for applying pressure to the plastic cover (5) in the direction of the PCB substrate (2) so as to bond the plastic cover (5) and the bonding material on the PCB substrate together.

2. The device according to claim 1, wherein the top surface of the carrier (1) is provided with a plurality of positioning columns (11), the sleeve plate (3) is provided with a plurality of first positioning holes (34), the positioning columns (11) are in one-to-one correspondence with the first positioning holes (34), and the positioning columns (11) can pass through the first positioning holes (34).

3. The device according to claim 2, wherein the pressing plate (4) is provided with a plurality of second positioning holes (42), the positioning columns (11) are in one-to-one correspondence with the second positioning holes (42), and the positioning columns (11) can pass through the second positioning holes (42).

4. The device according to claim 1, wherein a plurality of positioning pins (15) are arranged in the mounting groove (13), a plurality of substrate positioning holes (22) are formed in the PCB substrate (2), the plurality of substrate positioning holes (22) are in one-to-one correspondence with the plurality of positioning pins (15), and the positioning pins (15) can pass through the substrate positioning holes (22).

5. The device according to claim 4, characterized in that the pressure plate (4) and the sleeve plate (3) are provided with observation holes (37), and the observation holes (37) correspond to the positioning pins (15).

6. The device according to claim 1, characterized in that the bottom surface of the sleeve plate (3) is provided with a limit groove (33), the top surface of the carrier (1) is provided with a limit ridge (14), and the limit ridge (14) and the limit groove (33) can be clamped with each other.

7. The device according to claim 1, wherein the top surface of the carrier (1) is further provided with a plurality of reserved slots (16) located in the mounting slots (13), and the reserved slots (16) are in one-to-one correspondence with the wafers.

8. The device according to claim 1, characterized in that the bottom surface of the sleeve plate (3) is provided with a limit boss (32), and the top surface of the carrier (1) is provided with a bearing surface (12) corresponding to the limit boss (32);

when the pressure plate (4) does not apply pressure to the plastic cover (5), a compression gap is formed between the limit boss (32) and the bearing surface (12); when the plastic cover (5) is adhered with the adhesive material on the PCB substrate (2), the limit boss (32) is contacted with the bearing surface (12).

9. The device according to claim 1, characterized in that the bottom surface of the pressure plate (4) comprises a first stop surface (44) and the top surface of the sleeve plate (3) comprises a second stop surface (36);

when the pressure plate (4) does not apply pressure to the plastic cover (5), a feeding gap is formed between the first limiting surface (44) and the second limiting surface (36); when the plastic cover (5) is adhered with the adhesive material on the PCB substrate (2), the first limiting surface (44) is contacted with the second limiting surface (36).

10. The device according to claim 1, wherein the bottom surface of the pressing plate (4) is provided with a plurality of pressing blocks (41), and the plurality of pressing blocks (41) are in one-to-one correspondence with the plurality of placing holes (31); wherein the pressure location block (41) protrudes in a direction away from the bottom surface of the pressure plate (4), and the pressure location block (41) is used for applying pressure to the plastic cover (5).