CN116364563B - Display screen substrate covering method - Google Patents

Display screen substrate covering method Download PDF

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Publication number
CN116364563B
CN116364563B CN202310265300.1A CN202310265300A CN116364563B CN 116364563 B CN116364563 B CN 116364563B CN 202310265300 A CN202310265300 A CN 202310265300A CN 116364563 B CN116364563 B CN 116364563B
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CN
China
Prior art keywords
carrier
pcb substrate
mounting
sleeve plate
positioning
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Active
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CN202310265300.1A
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Chinese (zh)
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CN116364563A (en
Inventor
王凤德
倪寿杰
王鑫鑫
严华宁
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Wuxi Meike Microelectronics Technology Co ltd
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Wuxi Meike Microelectronics Technology Co ltd
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Priority to CN202310265300.1A priority Critical patent/CN116364563B/en
Publication of CN116364563A publication Critical patent/CN116364563A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application discloses a display screen substrate covering method, and relates to the technical field of substrate covering. The method comprises the following steps: mounting the PCB substrate coated with the adhesive material on a carrier of a capping device; mounting a sleeve plate in the cover attaching device on the carrier, and exposing wafers on the PCB substrate in the placing holes of the sleeve plate respectively; the number of the placing holes is multiple, and the placing holes are in one-to-one correspondence with the wafers on the PCB substrate; mounting plastic covers on the PCB substrate one by one based on the placement holes on the sleeve plate, and enabling the plastic covers to cover the wafer; mounting a pressing plate of the cover attaching device on the carrier; the pressing plate is used for enabling the plastic cover and the bonding material on the PCB substrate to be bonded together. The application improves the positioning efficiency of the plastic cover and the wafer on the PCB substrate and the efficiency of compacting the plastic cover, thereby greatly improving the cover attaching efficiency of the PCB substrate.

Description

Display screen substrate covering method
Technical Field
The application relates to the technical field of substrate covering, in particular to a display screen substrate covering method.
Background
In the process of manufacturing a PCB substrate, it is necessary to attach a plastic cover to several wafers on the PCB substrate. In the prior art, the wafer is covered by an operator manually. After dispensing on the PCB substrate, an operator takes the plastic cover by using tweezers, so that the plastic cover is aligned to the wafer and is attached to the wafer, then the iron block is placed on the plastic cover to press the plastic cover on the PCB substrate, and then a plurality of wafers on the PCB substrate are attached to the plastic cover one by one in the mode.
The prior art can cover the PCB substrate, but the efficiency of the cover the PCB substrate is very low.
Disclosure of Invention
The application mainly aims to provide a display screen substrate covering method, which aims to solve the technical problem that the efficiency of covering a PCB substrate is very low in the prior art.
In order to achieve the above object, the present application provides a method for attaching a display screen substrate, the method comprising:
mounting the PCB substrate coated with the adhesive material on a carrier of a capping device;
mounting a sleeve plate in the cover attaching device on the carrier, and exposing wafers on the PCB substrate in the placing holes of the sleeve plate respectively; the number of the placing holes is multiple, and the placing holes are in one-to-one correspondence with the wafers on the PCB substrate;
mounting plastic covers on the PCB substrate one by one based on the placement holes on the sleeve plate, and enabling the plastic covers to cover the wafer;
mounting a pressing plate of the cover attaching device on the carrier; the pressing plate is used for applying pressure to the plastic cover so as to enable the plastic cover to be bonded with the bonding material on the PCB substrate.
Optionally, a limiting boss is arranged on the bottom surface of the sleeve plate, and a bearing surface corresponding to the limiting boss is arranged on the top surface of the carrier;
the mounting the sleeve plate in the cover attaching device on the carrier, and exposing the wafers on the PCB substrate in the placing holes of the sleeve plate respectively, includes:
mounting a sleeve plate in the cover attaching device on the carrier, enabling a compression gap to be formed between the limiting boss and the bearing surface, and enabling wafers on the PCB substrate to be exposed in the placing holes of the sleeve plate respectively;
the mounting the pressing plate of the capping device on the carrier comprises:
and installing a pressing plate of the cover attaching device on the carrier so that the limiting boss is contacted with the bearing surface.
Optionally, a limiting groove is formed in the bottom surface of the sleeve plate, a limiting convex edge is formed in the top surface of the carrier, and the limiting convex edge and the limiting groove can be clamped with each other;
the mounting the sleeve plate in the cover attaching device on the carrier, and exposing the wafers on the PCB substrate in the placing holes of the sleeve plate respectively, includes:
and the limiting convex edges are clamped in the limiting grooves, so that the sleeve plate is mounted on the carrier, and wafers on the PCB substrate are exposed in the placing holes of the sleeve plate respectively.
Optionally, the top surface of the carrier is provided with a plurality of positioning columns, the sleeve plate is provided with a plurality of first positioning holes, the positioning columns are in one-to-one correspondence with the first positioning holes, and the positioning columns can pass through the first positioning holes;
the mounting the sleeve plate in the cover attaching device on the carrier, and exposing the wafers on the PCB substrate in the placing holes of the sleeve plate respectively, includes:
and enabling the positioning columns on the top surface of the carrier to penetrate through the first positioning holes on the sleeve plate one by one so as to mount the sleeve plate on the carrier, and enabling the wafers on the PCB substrate to be exposed in the placing holes of the sleeve plate respectively.
Optionally, a plurality of second positioning holes are formed in the pressing plate, the plurality of positioning columns are in one-to-one correspondence with the plurality of second positioning holes, and the positioning columns can penetrate through the second positioning holes;
the mounting the pressing plate of the cover attaching device on the carrier comprises the following steps of;
and enabling a plurality of positioning columns on the top surface of the carrier to pass through a plurality of second positioning holes on the pressing plate one by one so as to mount the pressing plate on the carrier.
Optionally, the bottom surface of the pressing plate comprises a first limiting surface, the top surface of the sleeve plate comprises a second limiting surface, the bottom surface of the pressing plate is provided with a plurality of pressing blocks, and the pressing blocks are in one-to-one correspondence with the placing holes; wherein the pressure location block protrudes in a direction away from the bottom surface of the pressure plate;
the mounting the pressing plate of the capping device on the carrier comprises:
mounting a pressing plate of the cover attaching device on the carrier, and enabling the pressing block to be in contact with the plastic cover; when the pressure block does not apply pressure to the plastic cover, a feeding gap is formed between the first limiting surface and the second limiting surface; when the plastic cover is adhered to the adhesive material on the PCB substrate, the first limiting surface is contacted with the second limiting surface.
Optionally, the top surface of the carrier is provided with a mounting groove;
the mounting of the PCB substrate coated with the adhesive material on the carrier of the capping device comprises the following steps:
and mounting the PCB substrate coated with the adhesive material in a mounting groove of a carrier in the cover attaching device.
Optionally, a plurality of positioning pins are arranged in the mounting groove, a plurality of substrate positioning holes are formed in the PCB substrate, the plurality of substrate positioning holes correspond to the plurality of positioning pins one by one, and the positioning pins can penetrate through the substrate positioning holes;
the said PCB base plate coated with adhesive material is installed in the installation groove of the carrier in the cover attaching device, including:
and enabling the positioning pins to pass through the corresponding substrate positioning holes so as to mount the PCB substrate coated with the adhesive material in a mounting groove of a carrier in the covering device.
Optionally, the top surface of the carrier is further provided with a plurality of reserved grooves located in the mounting groove, and the reserved grooves are in one-to-one correspondence with the wafers;
the said PCB base plate coated with adhesive material is installed in the installation groove of the carrier in the cover attaching device, including:
and mounting the PCB substrate coated with the bonding material in a mounting groove of a carrier in the cover attaching device, and positioning the wafer in the reserved groove.
Optionally, after the step of mounting the platen of the capping device on the carrier, the method further includes:
and after the plastic cover is adhered with the adhesive material on the PCB substrate, placing the cover attaching device into heating equipment to cure the plastic cover and the adhesive material.
Compared with the prior art, the application has at least the following beneficial effects:
the embodiment of the application provides a display screen substrate covering method, which comprises the following steps: mounting the PCB substrate coated with the adhesive material on a carrier of a capping device; mounting a sleeve plate in the cover attaching device on the carrier, and exposing wafers on the PCB substrate in the placing holes of the sleeve plate respectively; the number of the placing holes is multiple, and the placing holes are in one-to-one correspondence with the wafers on the PCB substrate; mounting plastic covers on the PCB substrate one by one based on the placement holes on the sleeve plate, and enabling the plastic covers to cover the wafer; mounting a pressing plate of the cover attaching device on the carrier; the pressing plate is used for applying pressure to the plastic cover so as to enable the plastic cover to be bonded with the bonding material on the PCB substrate.
That is, since the plurality of placing holes corresponding to the wafers on the PCB substrate one by one are formed in the sleeve plate, the placing holes can position the wafers on the PCB substrate, and therefore the efficiency of installing the plastic cover on the wafers on the PCB substrate can be improved through the placing holes. In addition, the pressure towards the wafer direction can be uniformly applied to all the plastic covers through the weight of the pressing plate, so that a plurality of plastic covers can be pressed on the PCB substrate at one time through the pressing plate. Therefore, the positioning efficiency of the plastic cover and the wafer on the PCB substrate is improved, and the efficiency of compressing the plastic cover is improved, so that the cover attaching efficiency of the PCB substrate is greatly improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a method for attaching a display screen substrate according to an embodiment of the present application;
fig. 2 is a schematic perspective view of a display screen capping device according to an embodiment of the present application;
fig. 3 is a schematic perspective view of a carrier according to an embodiment of the present application;
fig. 4 is a schematic perspective view of a sleeve plate according to an embodiment of the present application;
FIG. 5 is a schematic perspective view of a platen according to an embodiment of the present application;
fig. 6 is a schematic perspective view of a PCB substrate according to an embodiment of the present application;
fig. 7 is a schematic flow chart of adding a curing step in the method for attaching a display substrate according to an embodiment of the application.
Description of the drawings: 1. a carrier; 11. positioning columns; 12. a bearing surface; 13. a mounting groove; 14. limiting convex edges; 15. a positioning pin; 16. a reserved groove; 17. a handle; 2. a sleeve plate; 21. placing the hole; 22. a limit boss; 23. a limit groove; 24. a first positioning hole; 25. a hand support surface; 3. a pressing plate; 31. a pressing block; 32. a second positioning hole; 33. a pick-up groove; 34. a first limiting surface; 4. a PCB substrate; 41. a crystal; 42. a substrate positioning hole; 5. a plastic cover.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present application, it should be noted that the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.
In the description of the present application, "plurality" means a positive integer greater than one, such as two, three, four, etc.
The application provides a display screen substrate covering method, referring to fig. 1, comprising the following steps:
s10: the PCB substrate 4 coated with the adhesive material is mounted on the carrier 1 of the capping device.
In the implementation process, referring to fig. 2 and 6, the capping device includes a carrier 1, where the carrier 1 plays a role in placing and positioning a PCB substrate 4. The PCB substrate 4 is a display substrate to be covered, and the display is generally referred to as a micro display. The adhesive material refers to a material, such as glue, that can firmly adhere the plastic cover 5 to the PCB substrate 4 without affecting the performance of the PCB substrate 4. The PCB substrate 4 may be glued by a conventional glue coater, and after the glue is applied to the PCB substrate 4, the glued PCB substrate 4 is mounted on the carrier 1 of the capping device.
S11: mounting a sleeve plate 2 in the cover attaching device on the carrier 1, and exposing wafers on the PCB substrate 4 in the placing holes 21 of the sleeve plate 2 respectively; the number of the placement holes 21 is plural, and the placement holes 21 are in one-to-one correspondence with the wafers on the PCB substrate 4.
In the specific implementation process, please refer to fig. 2, 4 and 6, the covering device further includes a sleeve plate 2, a limiting steel mesh can be arranged on the sleeve plate 2, meshes on the limiting steel mesh are the placing holes 21, and a plurality of placing holes 21 can also be directly formed on the sleeve plate 2, and the arrangement of the placing holes 21 is consistent with that of the wafers on the PCB substrate 4. Therefore, when the cover plate 2 of the capping device is mounted on the carrier 1, the wafers to be capped on the PCB substrate 4 are required to be exposed in the placement holes 21 of the cover plate 2. In this way, it is easier to position the plastic cover 5 and to glue the plastic cover 5 to the PCB substrate 4 at a later stage.
S12: based on the placement holes on the sheathing board 2, plastic covers 5 are mounted one by one on the PCB substrate, and the plastic covers 5 cover the wafer.
In a specific implementation process, the plastic cover 5 is provided with a plurality of pins, the diameter of each pin can be 0.3mm, the PCB substrate 4 is provided with a plurality of pinholes, and the diameter of each pinhole can be 0.38mm. The orthographic projection of the plastic cover 5 on the carrier 1 is located in the orthographic projection of the placement hole 21 on the carrier 1, and a single-side error corresponding to the placement hole 21 between the plastic cover 5 and the placement hole 21 is smaller than or equal to 0.05mm, for example, the length and the width of the placement hole 21 may be respectively greater than 0.05mm-0.1mm of the length and the width of the plastic cover 5. More specifically, the plastic cover 5 may have a length of 21.8mm, a width of 18.8mm, a length of 21.9mm, and a width of 18.9mm. So, place hole 21 and the unilateral error that plastic cover 5 corresponds and be 0.05mm, combine the stitch of three area 0.1mm chamfer of plastic cover 5 again, make the stitch of plastic cover 5 can accurately install on the pinhole on PCB base plate 4 to can carry out better location to plastic cover 5, and then make the corresponding position of plastic cover 5 more accurate installation at PCB base plate 4.
When the plastic cover 5 is placed in the placement hole 21, a plurality of pins on the plastic cover 5 are inserted into corresponding pinholes on the PCB substrate 4 one by one, and the placement hole 21 can reduce the range of the plastic cover 5 installed at the wafer because the wafer is exposed in the placement hole 21. According to the application, the plastic covers 5 are placed into the placing holes 21 of the sleeve plate 2 one by one, so that the plastic covers 5 can be positioned more conveniently; and the plurality of plastic covers 5 are separated, so that the adjacent plastic covers 5 are not easy to influence during operation, and pins of the plastic covers 5 can be inserted into pinholes of the PCB substrate 4 more efficiently and accurately.
S13: mounting a pressing plate 3 of the capping device on the carrier 1; wherein the pressing plate 3 is used for applying pressure to the plastic cover 5 so as to bond the plastic cover 5 and the bonding material on the PCB substrate 4 together.
In a specific implementation, referring to fig. 2, the capping device further includes a pressing plate 3, where the pressing plate 3 plays a role of pressing the plastic cap 5 onto the PCB substrate 4. After the plastic covers 5 are placed in the placing holes 21 of the sleeve plate 2 one by one, the pressing plate 3 is installed on the carrier 1, and when the pressing plate 3 is installed on the carrier 1, the bottom surface of the pressing plate 3 is contacted with the plastic covers 5.
The pressure plate 3 itself has a weight, for example, the weight of the pressure plate 3 may be 0.75 Kg.+ -. 0.2Kg, which is just enough to ensure the fusion of the plastic cover and the glue. Under the action of gravity of the pressing plate 3, the pressing plate 3 can apply pressure to the plastic cover 5 in the direction of the wafer, and when the pressing plate 3 presses the plastic cover 5 for about thirty minutes, the plastic cover 5 can be fused with the adhesive material on the PCB substrate 4, so that the plastic cover 5 can be attached to the PCB substrate 4.
In this embodiment, since the sleeve plate 2 is provided with the plurality of placement holes 21 corresponding to the wafers on the PCB substrate 4 one by one, the placement holes 21 can position the wafers on the PCB substrate 4, so that the efficiency of mounting the plastic cover 5 on the wafers on the PCB substrate 4 can be improved through the placement holes 21. In addition, the pressure in the wafer direction can be uniformly applied to all the plastic covers 5 by the weight of the pressing plate 3, so that a plurality of plastic covers 5 can be pressed on the PCB substrate 4 at one time by the pressing plate 3. Thus, the positioning efficiency of the plastic cover 5 and the wafer on the PCB substrate 4 is improved, and the efficiency of compressing the plastic cover 5 is improved, so that the cover attaching efficiency of the PCB substrate 4 is greatly improved.
In addition, compared with the prior art that the hand-aligned attaching cover is not provided with a fixed limiting device, the hand is easy to touch the adjacent plastic cover 5, so that the plastic cover 5 is misplaced. Since the pressing plate 3 is simultaneously pressed on the plurality of plastic covers 5 and the plastic covers 5 are pressed by the self gravity of the pressing plate 3, the self gravity of the pressing plate 3 at different positions is basically uniform, so that each plastic cover can be fused with the bonding material. Compared with the prior art, after the plastic cover 5 is manually attached, because the glue is not cured yet, the PCB substrate 4 is thinner, and the PCB substrate 4 is easy to bend during taking, so that the plastic cover 5 has the problem of falling risk.
In some embodiments, referring to fig. 3 to 4, a limiting boss 22 is disposed on a bottom surface of the sleeve plate 2, and a bearing surface 12 corresponding to the limiting boss 22 is disposed on a top surface of the carrier 1; the mounting the sleeve plate 2 on the carrier 1 and exposing the wafers on the PCB substrate 4 in the placement holes 21 of the sleeve plate 2 respectively includes: the sleeve plate 2 in the capping device is mounted on the carrier 1, a compression gap is formed between the limit boss 22 and the bearing surface 12, and the wafers on the PCB substrate 4 are exposed in the placement holes 21 of the sleeve plate 2.
The mounting of the pressing plate 3 of the capping device on the carrier 1 includes: the pressing plate 3 of the capping device is mounted on the carrier 1 so that the limit boss 22 contacts the bearing surface.
In this embodiment, the compression gap is a gap between the limiting boss 22 and the bearing surface 12 when the fingerboard 2 is mounted on the carrier 1 and the pressing plate 3 does not apply pressure to the plastic cover 5, and the compression gap may be 0.1mm-0.2mm, preferably 0.2mm. When the sleeve plate 2 is pressed by the pressing plate 3, the compression gap gradually becomes smaller in the process of gradually moving to the carrier 1 until the limit boss 22 on the sleeve plate 2 is in contact with the bearing surface 12 on the carrier 1. At this time, the bearing surface 12 limits the sleeve plate 2 from moving towards the carrier 1, so that the sleeve plate 2 can be prevented from generating an overpressure phenomenon on the carrier 1.
In some embodiments, referring to fig. 3-4 again, a limiting groove 23 is provided on the bottom surface of the sleeve plate 2, a limiting ridge 14 is provided on the top surface of the carrier 1, and the limiting ridge 14 and the limiting groove 23 can be clamped with each other. The mounting the sleeve plate 2 on the carrier 1 and exposing the wafers on the PCB substrate 4 in the placement holes 21 of the sleeve plate 2 respectively includes: the limiting ribs 14 are clamped in the limiting grooves 23, so that the sleeve plate 2 is mounted on the carrier 1, and the wafers on the PCB substrate 4 are exposed in the placing holes 21 of the sleeve plate 2 respectively.
In this embodiment, the spacing rib 14 and the carrier 1 may be integrally formed, and the spacing rib 14 and the spacing groove 23 may be annular, so that the sleeve plate 2 may be better spacing. When the sleeve plate 2 is mounted on the carrier 1, the limiting ribs 14 on the carrier 1 are clamped into the limiting grooves 23 of the sleeve plate 2, and when the limiting ribs 14 are clamped into the limiting grooves 23, the sleeve plate 2 is mounted on the carrier 1 at a proper position. Because the sleeve plate 2 can be more accurately installed at the proper position of the carrier 1 through the limiting ribs 14 and the limiting grooves 23, the placing holes 21 on the sleeve plate 2 can be more accurately in one-to-one correspondence with the crystals 41 on the PCB substrate 4, so that the plastic cover 5 can be more accurately attached to the corresponding position of the PCB substrate 4, and the attaching quality of the PCB substrate 4 can be further improved.
In some embodiments, referring to fig. 3-4 again, the top surface of the carrier 1 is provided with a plurality of positioning posts 11, the sleeve plate 2 is provided with a plurality of first positioning holes 24, the positioning posts 11 and the first positioning holes 24 are in one-to-one correspondence, and the positioning posts 11 can pass through the first positioning holes 24. The mounting the sleeve plate 2 on the carrier 1 and exposing the wafers on the PCB substrate 4 in the placement holes 21 of the sleeve plate 2 respectively includes: the positioning posts 11 on the top surface of the carrier 1 are led to pass through the positioning holes 24 on the sleeve plate 2 one by one, so that the sleeve plate 2 is mounted on the carrier 1, and the wafers on the PCB substrate 4 are respectively exposed in the placing holes 21 of the sleeve plate 2.
In this embodiment, when the sleeve plate 2 is mounted on the carrier 1, the positioning posts 11 on the carrier 1 respectively pass through the corresponding first positioning holes 24 on the sleeve plate 2, and move the sleeve plate 2 toward the carrier 1. Due to the positioning of the positioning column 11 and the first positioning hole 24, the position accuracy of the mounting of the sleeve plate 2 on the carrier 1 can be further improved, and finally, the wafers on the PCB substrate 4 can be accurately exposed in the placement holes 21 of the sleeve plate 2, so that the quality of the later-stage covering of the PCB substrate 4 can be improved.
In some embodiments, referring to fig. 3 and 5, the pressing plate 3 is provided with a plurality of second positioning holes 32, the plurality of positioning columns 11 are in one-to-one correspondence with the plurality of second positioning holes 32, and the positioning columns 11 can pass through the second positioning holes 32. The mounting of the pressing plate 3 of the capping device on the carrier 1 comprises; the positioning posts 11 on the top surface of the carrier 1 are led to pass through the second positioning holes 32 on the pressing plate 3 one by one, so that the pressing plate 3 is mounted on the carrier 1.
In this embodiment, when the platen 3 is mounted on the carrier 1, the plurality of positioning posts 11 on the carrier 1 respectively pass through the corresponding second positioning holes 32 on the platen 3, and move the platen 3 in the direction of the carrier 1. Due to the positioning of the positioning column 11 and the second positioning hole 32, the position accuracy of the pressing plate 3 mounted on the carrier 1 can be improved, and finally the pressing plate 3 can compress the plastic cover 5 more accurately, so that the plastic cover 5 can be more accurately attached to the PCB substrate 4.
In some embodiments, referring to fig. 4 to fig. 5, the bottom surface of the pressing plate 3 includes a first limiting surface 34, the top surface of the sleeve plate 2 includes a second limiting surface, the bottom surface of the pressing plate 3 is provided with a plurality of pressing blocks 31, and the plurality of pressing blocks 31 are in one-to-one correspondence with the plurality of placing holes 21; wherein the pressing block 31 protrudes in a direction away from the bottom surface of the pressing plate 3.
The mounting of the pressing plate 3 of the capping device on the carrier 1 includes: mounting the pressing plate 3 of the covering device on the carrier 1, and enabling the pressing block 31 to be in contact with the plastic cover 5; when the pressing block 31 does not apply pressure to the plastic cover 5, a feeding gap is formed between the first limiting surface 34 and the second limiting surface; when the plastic cover 5 is adhered to the adhesive material on the PCB substrate 4, the first limiting surface 34 contacts with the second limiting surface.
In this embodiment, the feeding gap is a gap between the first limiting surface 34 and the second limiting surface when the pressing plate 3 is mounted on the carrier 1 and the pressing block 31 contacts the plastic cover 5, but no pressure is applied to the plastic cover 5, and the feeding gap may be 0.05mm-0.1mm, preferably 0.1mm. When the pressing block 31 is in contact with the plastic cover 5, a feeding gap is formed between a first limiting surface 34 on the pressing plate 3 and a second limiting surface of the sleeve plate 2; along with the effect of clamp plate 3 self gravity, clamp plate 3 moves to carrier 1 gradually, and when the first spacing face 34 of clamp plate 3 and the second spacing face of cover board 2 are in full contact, the deflection of plastics cover is the deflection of feeding clearance, and the plastics cover is the deflection of feeding clearance in the acceptable within range of plastics lid 5, so plastics lid 5 can not appear the uneven or phenomenon of crushing the product of yield because of atress too big or atress is uneven to the quality of laminating plastics lid 5 on PCB base plate 4 has been protected.
In some embodiments, referring again to fig. 3, the top surface of the carrier 1 is provided with a mounting groove 13; the mounting of the PCB substrate 4 coated with the adhesive material on the carrier 1 of the capping device includes: the PCB substrate 4 coated with the adhesive material is mounted in the mounting groove 13 of the carrier 1 in the capping device.
In this embodiment, the front projection of the PCB substrate 4 on the carrier 1 is located in the front projection of the mounting groove 13 on the carrier 1, for example, the length of the mounting groove 13 is greater than 0.15mm-0.23mm of the length of the PCB substrate 4, and the width of the mounting groove 13 is greater than 0.15mm-0.23mm of the width of the PCB substrate 4. In this way, the PCB substrate 4 is more conveniently mounted on the carrier 1.
In some embodiments, referring to fig. 3 and 6, a plurality of positioning pins 15 are disposed in the mounting groove 13, a plurality of substrate positioning holes 42 are formed in the PCB substrate 4, the plurality of substrate positioning holes 42 are in one-to-one correspondence with the plurality of positioning pins 15, and the positioning pins 15 can pass through the substrate positioning holes 42.
The mounting of the PCB substrate 4 coated with the adhesive material in the mounting groove 13 of the carrier 1 in the capping device includes: the positioning pins 15 are passed through the corresponding substrate positioning holes 42 to mount the PCB substrate 4 coated with the adhesive material in the mounting groove 13 of the carrier 1 in the capping device.
In this embodiment, when the PCB substrate 4 is mounted in the mounting groove 13, the positioning pins 15 in the mounting groove 13 sequentially pass through the corresponding substrate positioning holes 42 on the PCB substrate 4, and the PCB substrate 4 can be more accurately mounted at the predetermined position of the carrier 1 due to the positioning of the substrate positioning holes 42 and the positioning pins 15, so that the wafer on the PCB substrate 4 can be more accurately corresponding to the placement holes 21 on the cover plate 2.
In order to prevent the situation that the PCB substrate 4 is placed on the carrier 1 and misplaced, besides the positioning pins 15, observation holes are designed on the sleeve plate 2 and the pressing plate 3, the positions of the observation holes correspond to the positions of the positioning pins 15 on the carrier 1, after the PCB substrate 4 is placed on the carrier 1, the sleeve plate 2 is arranged to observe whether the PCB substrate 4 is placed in place, after the sleeve plate 2 and the pressing plate 3 are arranged, whether the PCB substrate 4 is placed in place can be observed through the observation holes, so that the position of the PCB substrate 4 mounted on the carrier 1 can be further improved.
In some embodiments, referring to fig. 3 again, the top surface of the carrier 1 is further provided with a plurality of reserved slots 16 located in the mounting slots 13, and the reserved slots 16 are in one-to-one correspondence with the wafers. The mounting of the PCB substrate 4 coated with the adhesive material in the mounting groove 13 of the carrier 1 in the capping device includes: the PCB substrate 4 coated with the adhesive material is mounted in the mounting groove 13 of the carrier 1 in the capping device, and the wafer is positioned in the reserve groove 16.
In this embodiment, when the PCB substrate 4 is mounted on the carrier 1, the wafers on the PCB substrate 4 are located in the reserved slots 16 of the carrier 1 one by one, so that the position of the PCB substrate 4 can be more conveniently located. In addition, the pressure of the pressing plate 3 applied to the wafer on the PCB substrate 4 can be reduced, thereby protecting the wafer on the PCB substrate 4.
In some embodiments, referring to fig. 7, after the step of mounting the platen 3 of the capping device on the carrier 1, step S14 (curing step) is further included: after the plastic cover 5 is bonded with the bonding material on the PCB substrate 4, the cover attaching device is placed in a heating device to cure the plastic cover 5 and the bonding material.
In this embodiment, the heating device may be a conventional device, and the heating time is about thirty minutes, and after the plastic cover 5 and the adhesive material which are attached together are heated, the plastic cover 5 and the adhesive material can be cured, so that the plastic cover 5 and the adhesive material are attached more stably, and the quality of attaching the plastic cover 5 to the PCB substrate 4 can be improved. Finally, the whole PCB substrate 4 is taken out from the capping device, and the PCB substrate 4 after capping and curing can be formed.
Further, the holding groove 33 is provided on the pressing plate 3, the hand support surface 25 is provided on the sleeve plate 2, the handle 17 is provided on the carrier 1, and the assembly of the holding groove 33 of the pressing plate 3, the hand support surface 25 of the sleeve plate 2 and the handle 17 of the carrier 1 is dislocated, so that the differential design is made structurally. When the PCB substrate 4 is taken out, the pressing plate 3 is taken out firstly, the pressing plate 3 can be taken out by screwing the pressing plate 3 according to the position of the taking groove 33 when the pressing plate 3 is taken out, and the pressing plate 3 cannot interfere with the sleeve plate 2 of the second layer when the pressing plate 3 is taken out. When the second layer sleeve plate 2 is taken out, the four protruding hand support surfaces 25 are screwed up, and the hand support surfaces do not interfere with and touch the bottom carrier 1. Finally, when the whole device is lifted, the carrier 1 and the PCB substrate 4 can be taken together by only holding the handles 17 on the side of the carrier 1 by hands. In this way, the pressing plate 3, the sleeve plate 2 and the carrier 1 are more convenient to carry, and the three parts are not mutually influenced in the carrying process, so that the influence degree on the PCB substrate 4 positioned on the carrier 1 can be reduced.
In summary, since the sleeve plate 2 is provided with the plurality of placement holes 21 corresponding to the wafers on the PCB substrate 4 one by one, the placement holes 21 can position the wafers on the PCB substrate 4, so that the efficiency of mounting the plastic cover 5 on the wafers on the PCB substrate 4 can be improved through the placement holes 21. In addition, can unify through the weight of clamp plate 3 self and apply the pressure to the wafer direction to all plastics lid 5, consequently, once only can compress tightly a plurality of plastics lids 5 on PCB base plate 4 through clamp plate 3, compare the mode that compresses tightly plastics lid 5 through the iron plate respectively one by one in the prior art, can improve the efficiency of compressing tightly plastics lid 5 through clamp plate 3. In this way, the positioning efficiency of the plastic cover 5 and the wafer on the PCB substrate 4 is improved, namely, the efficiency of installing the plastic cover 5 at the corresponding position on the PCB substrate 4 is improved, and the efficiency of compacting the plastic cover 5 is improved, so that the cover attaching efficiency of the PCB substrate 4 is greatly improved.
In addition, the mechanical arm can be controlled to take the plastic cover 5 to attach the PCB substrate 4 by running a program through the calculator, and the PCB substrate 4 is also placed in a clamp in the automatic equipment; after the plastic cover 5 is attached, the mechanical arm grabs the corresponding pressing plate 3 to press the plastic cover 5 under the control of a program. In this way, the attaching efficiency to the PCB substrate 4 can be further improved.
Because of the positioning of the mounting groove 13 on the carrier 1 to the PCB substrate 4 and the positioning of the positioning pin 15 in the mounting groove 13 and the substrate positioning hole 42 on the PCB substrate 4, the PCB substrate 4 can be more accurately mounted on the carrier 1. Because of the positioning between the positioning posts 11 on the carrier 1 and the first positioning holes 24 on the sleeve plate 2, and the positioning between the limiting ribs 14 on the carrier 1 and the limiting grooves 23 on the sleeve plate 2, the sleeve plate 2 can be more accurately mounted on the carrier 1, and the placement holes 21 on the carrier 1 can be more accurately in one-to-one correspondence with the wafers on the PCB substrate 4. Because of the positioning between the positioning column 11 on the carrier 1 and the second positioning hole 32 on the pressing plate 3, the pressing plate 3 can be more accurately installed above the sleeve plate 2, and the pressing blocks 31 on the pressing plate 3 can be more accurately in one-to-one correspondence with the plastic cover 5. The plastic covers 5 can be positioned more accurately at each wafer of the PCB substrate 4, and the pressing blocks 31 can be positioned more accurately on each plastic cover 5.
And because a feeding gap is reserved between the first limiting surface 34 of the pressing plate 3 and the second limiting surface of the sleeve plate 2, the feeding gap can ensure that the deformation of the plastic cover 5 attached to the PCB substrate 4 is just suitable. In conclusion, the quality of the plastic cover 5 attached to the PCB substrate 4 can be greatly improved, and therefore the performance of the PCB substrate 4 can be greatly improved.
The above description is merely illustrative of various embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the scope of the present application, and the application is intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (8)

1. A method for attaching a display screen substrate, the method comprising:
mounting the PCB substrate coated with the adhesive material on a carrier of a capping device;
mounting a sleeve plate in the cover attaching device on the carrier, and exposing wafers on the PCB substrate in the placing holes of the sleeve plate respectively; the number of the placing holes is multiple, and the placing holes are in one-to-one correspondence with the wafers on the PCB substrate;
mounting plastic covers on the PCB substrate one by one based on the placement holes on the sleeve plate, and enabling the plastic covers to cover the wafer;
mounting a pressing plate of the cover attaching device on the carrier; the pressing plate is used for applying pressure to the plastic cover so as to enable the plastic cover to be bonded with the bonding material on the PCB substrate;
a limiting boss is arranged on the bottom surface of the sleeve plate, and a bearing surface corresponding to the limiting boss is arranged on the top surface of the carrier;
the mounting the sleeve plate in the cover attaching device on the carrier, and exposing the wafers on the PCB substrate in the placing holes of the sleeve plate respectively, includes:
mounting a sleeve plate in the cover attaching device on the carrier, enabling a compression gap to be formed between the limiting boss and the bearing surface, and enabling wafers on the PCB substrate to be exposed in the placing holes of the sleeve plate respectively;
the mounting the pressing plate of the capping device on the carrier comprises:
mounting a pressing plate of the cover attaching device on the carrier so as to enable the limit boss to be in contact with the bearing surface;
the bottom surface of the pressing plate comprises a first limiting surface, the top surface of the sleeve plate comprises a second limiting surface, the bottom surface of the pressing plate is provided with a plurality of pressing blocks, and the pressing blocks correspond to the placing holes one by one; wherein the pressure location block protrudes in a direction away from the bottom surface of the pressure plate;
the mounting the pressing plate of the capping device on the carrier comprises:
mounting a pressing plate of the cover attaching device on the carrier, and enabling the pressing block to be in contact with the plastic cover; when the pressure block does not apply pressure to the plastic cover, a feeding gap is formed between the first limiting surface and the second limiting surface; when the plastic cover is adhered to the adhesive material on the PCB substrate, the first limiting surface is contacted with the second limiting surface.
2. The method of claim 1, wherein a limiting groove is formed in the bottom surface of the sleeve plate, a limiting convex edge is formed in the top surface of the carrier, and the limiting convex edge and the limiting groove can be clamped with each other;
the mounting the sleeve plate in the cover attaching device on the carrier, and exposing the wafers on the PCB substrate in the placing holes of the sleeve plate respectively, includes:
and the limiting convex edges are clamped in the limiting grooves, so that the sleeve plate is mounted on the carrier, and wafers on the PCB substrate are exposed in the placing holes of the sleeve plate respectively.
3. The method of claim 1, wherein a plurality of positioning posts are provided on a top surface of the carrier, a plurality of first positioning holes are provided on the sleeve plate, the plurality of positioning posts are in one-to-one correspondence with the plurality of first positioning holes, and the positioning posts can pass through the first positioning holes;
the mounting the sleeve plate in the cover attaching device on the carrier, and exposing the wafers on the PCB substrate in the placing holes of the sleeve plate respectively, includes:
and enabling the positioning columns on the top surface of the carrier to penetrate through the first positioning holes on the sleeve plate one by one so as to mount the sleeve plate on the carrier, and enabling the wafers on the PCB substrate to be exposed in the placing holes of the sleeve plate respectively.
4. The method of claim 3, wherein a plurality of second positioning holes are formed in the pressing plate, a plurality of positioning columns are in one-to-one correspondence with a plurality of second positioning holes, and the positioning columns can pass through the second positioning holes;
the mounting the pressing plate of the cover attaching device on the carrier comprises the following steps of;
and enabling a plurality of positioning columns on the top surface of the carrier to pass through a plurality of second positioning holes on the pressing plate one by one so as to mount the pressing plate on the carrier.
5. The method of claim 1, wherein the top surface of the carrier is provided with a mounting groove;
the mounting of the PCB substrate coated with the adhesive material on the carrier of the capping device comprises the following steps:
and mounting the PCB substrate coated with the adhesive material in a mounting groove of a carrier in the cover attaching device.
6. The method of claim 5, wherein a plurality of positioning pins are arranged in the mounting groove, a plurality of substrate positioning holes are formed in the PCB substrate, the plurality of substrate positioning holes correspond to the plurality of positioning pins one by one, and the positioning pins can pass through the substrate positioning holes;
the said PCB base plate coated with adhesive material is installed in the installation groove of the carrier in the cover attaching device, including:
and enabling the positioning pins to pass through the corresponding substrate positioning holes so as to mount the PCB substrate coated with the adhesive material in a mounting groove of a carrier in the covering device.
7. The method of claim 5, wherein the top surface of the carrier is further provided with a plurality of reserved slots in the mounting slot, and the reserved slots are in one-to-one correspondence with the wafers;
the said PCB base plate coated with adhesive material is installed in the installation groove of the carrier in the cover attaching device, including:
and mounting the PCB substrate coated with the bonding material in a mounting groove of a carrier in the cover attaching device, and positioning the wafer in the reserved groove.
8. The method of any one of claims 1-7, wherein after the step of mounting the platen of the capping device on the carrier, further comprising:
and after the plastic cover is adhered with the adhesive material on the PCB substrate, placing the cover attaching device into heating equipment to cure the plastic cover and the adhesive material.
CN202310265300.1A 2023-03-17 2023-03-17 Display screen substrate covering method Active CN116364563B (en)

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CN117650089B (en) * 2023-12-20 2024-07-12 技感半导体设备(南通)有限公司 Substrate Carrier

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