JPH0713987B2 - Mounting method of magnetic focusing chip in manufacturing method of high sensitivity Hall element - Google Patents

Description

The present invention relates to a method for mounting a magnetic focusing chip in a method for manufacturing a high-sensitivity Hall element.

[Prior Art] Although mounting a chip on a wafer has been conventionally performed, the magnetic focusing chip mounting of a Hall element will be described as to the significance of mounting the chip. The Hall element detects magnetism and outputs it as an electric signal. It is a magnetoelectric conversion element that utilizes the effect. A magnetic focusing chip is attached for the purpose of increasing this output (sensitivity). That is, by attaching a cube, rectangular parallelepiped, or cylindrical magnetic substance chip on the sensitive portion of the Hall element formed by attaching a semiconductor thin film of, for example, InSb on the magnetic substance substrate, a sensitive magnetic field can be received even with weak leakage magnetic field. As a result, it is possible to make a highly sensitive element that can exert its effect sufficiently even in a weak magnetic field as a result of efficient focusing, and as a result of experiments, compared to an element without a chip, a chip was attached. 2 to 2
5 times higher sensitivity has been obtained. As an example of the method for manufacturing this high sensitivity Hall element, the method disclosed in Japanese Patent Publication No. 53-46675 is explained. This method is shown in FIG. As described above, a magnetic sensitive semiconductor vapor deposition film 32 of InSb or Si, Ge or the like having a thickness of about 1 μ is formed on one surface of the vapor deposition substrate 31 having a smooth surface by a vacuum vapor deposition machine.
A magnetic substrate 34 coated with an adhesive layer 33 is laminated on the upper surface of the semiconductor vapor deposition film 32, and the semiconductor vapor deposition film is provided with the adhesive layer 33 interposed therebetween.
A magnetic substrate 34 is laminated on 32 (FIG. 5A), the vapor deposition substrate 31 is peeled off after curing of the adhesive, and the semiconductor vapor deposition film 32 is formed on the magnetic substrate.
Transfer to 34.

A photo-curable resin is transferred onto the magnetic substrate 34, and one surface of the semiconductor vapor-deposited film 32 is exposed again. The photo-curable resin is applied on the semiconductor vapor-deposited film 32 with a required pattern and washed with water. The resin is removed, and unnecessary portions of the semiconductor vapor deposition film 32 are removed by etching using this photocurable resin as a mask to form the sensitive portions 35a of the Hall elements and the portions 35b to be the electrodes in the portions to be the Hall elements. (Fig. 5C).

Next, on the portion 35b to be the electrode of the semiconductor vapor deposition film 32,
Electrode layer 36 is formed by depositing gold, silver, indium, etc. by vapor deposition.
Are formed (FIG. 5D). Then, the electrode layer 36 is subjected to solder plating, an adhesive layer 37 is applied over the entire sensing portion 35a and a part of the electrode layer 36, and the upper surface of the adhesive layer 37 is, for example, ferrite. A disc-shaped or column-shaped magnetic focusing tip 38 made of, for example, is placed, and the magnetic focusing tip 38 is attached so as to cover the entire sensing portion 35a and a part of the electrode layer 36 (FIG. 5E). However, all the mounting of the magnetic focusing chip on the wafer of this Hall element was done manually.

The manual method of the above-mentioned conventional method is one in which the adhesive is applied to all the elements of the wafer by hand while observing the center of the sensitive area with a microscope, and then the magnetic focusing chip is also manually operated with tweezers under the microscope. It was attached while grasping and grasping the center of each element.

Further, as limited to the aligned supply of so-called pellets (corresponding to chips to be described later) in the form of a thin plate having a side of about 1 mm, there are JP-A-58-188136 and JP-A-60-29030. However, in these methods, pellets are put on a transfer body, and the transfer body is vibrated and oscillated to align the pellets in a storage hole provided in the transfer body.

[Problems to be Solved by the Invention] In the conventional manual work described above, the time required to mount the magnetic focusing chips on one wafer depends on the number of elements in the wafer or the proficiency of the operator. Per wafer
When the number of elements is 342, it is approximately 50 to 60 minutes. In recent years, the number of elements in one wafer tends to increase more and more due to the increase in size of wafers and the reduction in size of elements, and it is a reality that manual work requires a further long time. Also, because of the need for manual labor, for example, in the case of a Hall element, the accuracy of the mounting position of the magnetic focusing chip becomes uneven, and if the mounting position exceeds ± 50 μm from the original mounting position, the sensitivity decreases, and other practical characteristics. As a result, the number of defective products that are out of specification as a product such as inferiority is frequently generated.

As described above, there is a problem that the work efficiency is extremely poor in the case of manual work, the manufacturing cost of the element is increased, and the mounting accuracy is frequently inferior.

Further, the above-mentioned Japanese Patent Laid-Open No. 58-188136 and Japanese Utility Model Laid-Open No. 60-29.
The 030 publication is merely a technique relating to transfer alignment of pellets, and there is no functional means such as positioning means for the aligned pellets and the mounted body (wafer or substrate), and bonding means for the pellets and the mounted body. It was insufficient in terms of chip mounting.

In view of the present situation, an object of the present invention is to provide a method of mounting a magnetic focusing chip of a Hall element on a wafer in a short time with high accuracy and at low equipment cost.

[Means for Solving the Problem] In order to achieve the above-mentioned object, a method for mounting a magnetic focusing chip in a method for manufacturing a high-sensitivity Hall element according to the present invention is formed on a thin film in the process of manufacturing the high-sensitivity Hall element. In the method of mounting the magnetic focusing chip on the sensing unit, the stamp base and the tray, which are aligned with the wafer when mounted, are attached to the wafer which is positioned and attracted and fixed on the positioning base. A lift holder that can be selectively attached to and detached from the suction box is available.
Attach the suction box to a separately prepared vibration holder, and connect each tip receiving hole of the tray with a required number of tip receiving holes similar to the magnetic focusing tips to be aligned to the suction box. After supplying more magnetic transfer chips to the tray than the required transfer amount, the tray is slightly vibrated in the horizontal direction while suctioning each chip receiving hole, and one magnetic focusing chip is attached to each chip receiving hole. The suction box is removed from the vibrating holder while aligned and sucked, and excess chips are collected.On the other hand, the individual Hall elements on the wafer that are positioned and fixed by the stamp attached to the stamp table mounted on the elevating holder are After applying adhesive to one part at once, remove the stamp base from the lift holder,
The magnetic focusing chip described above is attached to the elevating holder by reversing the suction box to which the tray in which the magnetic focusing chips are aligned is attached,
The feature is that the suction of the magnetic focusing chips arranged on the descending tray is released and the magnetic focusing chips are adhered onto the wafer.

[Operation] According to the present invention, a stamp base and a suction box to which a tray is attached can be selectively attached to and detached from a wafer positioned and fixed on a base so as to be aligned with the wafer. The above-mentioned elevating holder is prepared, and the adhesive is collectively applied to the individual Hall elements on the wafer by the stamp of the stamp table in advance, and the above-mentioned chip receiving hole having a shape similar to that of the chip is provided. Supply more chips than required to the tray, and vibrate the tray horizontally while sucking each chip receiving hole, and align the supplied chips individually into the chip receiving holes. , After collecting the extra chips in the container, position the suction box with the tray attached while holding the chips by suction above the fixed wafer. It is inverted and mounted on an elevating holder, lowered to bring the tray close to the wafer and stopping suction, thereby simultaneously adhering a predetermined number of chips to a predetermined position on the wafer all at once. Application of adhesive,
Align a predetermined number of chips with the mounting center of the wafer,
It is possible to mount the aligned chips on the wafer all at once without much labor.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, the wafer A on which the magnetic focusing chip B is to be mounted is positioned and placed in accordance with a mark indicating a predetermined position on the positioning base 2 fixed on the machine base 1, and the wafer A described above is mounted. The positioning base 2 on which is mounted is provided with a suction groove 3 opening on its surface, and the wafer A is vacuumed by a vacuum pump or the like communicating with the suction groove 3 formed in the positioning base 2. By the suction from the source 4, it is sucked and fixed at a predetermined position on the positioning base 2.

The elevating holder 5 is loosely inserted into the machine frames 6 and 6 above the positioning base 2 with a space therebetween so that the elevating holder 5
Is configured so that the center of the wafer A is aligned with that of the wafer A that is positioned and sucked and fixed on the positioning base 2 described above (see FIG. 1).
5a is formed, and the suction box 10 to which a stamp base 7 and a tray, which will be described later, are attached by the protrusion 5a, is attached to the lifting holder 5
It is configured so that it can be selectively attached to and detached from. Since the wafer A and the elevating holder 5 are concentric as described above, the stamp base 7 and the suction box 10 are simply attached to the elevating holder 5 to be integrated with the stamp base 7 and the suction box 10. Tray 18
Will be aligned with the wafer A.

Reference numeral 13 denotes a lift holder lowering prevention stopper provided for stopping the lift holder 5 at the highest position, and the stamp base 7 or the suction box 10 is attached or detached at the position where the stopper 13 prevents the lowering. Also, the lifting holder 5 is lowered by removing the stopper 13.

FIG. 2 shows an embodiment of the stamp base 7 used in the method of the present invention. The outer periphery of the stamp base 7 is a concave portion 7a into which the protrusion 5a provided on the inner peripheral edge of the lifting holder 5 can be fitted. And a bottom portion is made of synthetic rubber, natural rubber, resin, or the like having a predetermined number of small protrusions 9, 9, 9, ... A stamp 8 is attached.

FIG. 3 shows an example of the transfer part of the magnetic focusing chip B used in the method of the present invention, in which the inner peripheral edge of the vibration holder 14 has the same shape and size as the inner peripheral edge of the elevating holder 5 described above. The vibration holder 14 is horizontally supported by leaf springs 15 and 15,
The vibrating portion 16 attached to the side portion of the vibration holder 14 gives a fine horizontal vibration.

Since the inner peripheral edge of the vibration holder 14 has the same shape and size as the inner peripheral edge of the elevating holder 5 as described above, the suction box 10 is detachably mounted. When mounted on the vibration holder 14, the suction box 10 is horizontally vibrated together with the vibration holder 14 by the operation of the vibration unit 16.

A vacuum chamber 11 connected to the suction box 10 via the suction pipe 12 provided with a valve 17 from the vacuum source 4 is formed in the upper part of the suction box 10, and the magnetic focusing is provided on the upper surface of the vacuum chamber 11. The chip B is transferred and the tray 18 aligned is attached. A predetermined number of chip receiving holes 19, 19, which are similar to or have the same shape as the magnetic focusing chip B for aligning the magnetic focusing chip B provided on the upper surface of the tray 18 corresponding to the center of the sensing portion of the wafer A by transfer. ‥‥‥‥ is provided, and the tip receiving hole 1
A small hole 20 communicating with the vacuum chamber 11 of the suction box 10 is formed on the bottom surface of each of 9, 19 ,.

Reference numeral 21 in the figure denotes a valve arranged in the pipe between the vacuum source 4 and the suction groove 3 formed in the positioning base 2.
Further, the tray 18 is preferably a non-magnetic material because the chip is a magnetic material, and further, as an adhesive,
It is preferable to use a silicone resin adhesive.

The method of mounting the magnetic focusing chip in the method of manufacturing the high-sensitivity Hall element according to the present invention will be further described with reference to the above description with reference to the drawings. The wafer A on which the magnetic focusing chip B is to be mounted is positioned. Position it according to the mark that shows the predetermined position on the base 2,
The vacuum source 4 is activated to adsorb and fix the wafer A on the positioning base.

On the other hand, the adhesive is thinly and evenly spread on a smooth surface such as a glass plate, and the same number as the magnetic focusing chips to be mounted formed on the bottom surface of the stamp 8 of the stamp base 7 and a small size which is aligned with the mounting center. Apply the thin and even adhesive on the smooth surface to the tips of the protrusions 9, 9 ,.
The small protrusions 9,9, .................. The stamp base 7 having an adhesive applied to the tip thereof is mounted on the lift holder 5, and the small protrusions 9,9 of the stamp base 7 are previously mounted on the wafer A which is positioned and fixed in advance. ‥‥‥‥
The elevating holder 5 is lowered until the tip of the wafer touches, and the adhesive adhered to the tip of the small protrusions 9, 9 ,. After the application, the elevating holder 5 is lifted after the application and the stamp base 7 is removed from the elevating holder 5.

Further, the suction box 10 is attached and fixed to a vibration holder 14 which is prepared separately from the lifting holder 5 and has the same shape and size as the lifting holder 5, and the magnetic focusing chip B is approximately twice as much as the required transfer amount. The vacuum chamber on top of the suction box 10
It is supplied onto a tray 18 which is attached to the upper surface of 11 and is integrated with the suction box 10, and the vibration box 16 horizontally and slightly vibrates the suction box 10 so that the magnetic focusing chip B supplied onto the tray 18 is also supplied. While vibrating, at the same time, the magnetic focusing chip mounted on the upper surface of the tray 18 has a shape similar to or the same as that of the mounted magnetic focusing chip, and is drilled on the bottom surface of a predetermined number of chip receiving holes 19, 19 ,. Small holes 20, 20,
Vacuum suction more and insert the above tip into the tip receiving hole 1
Transfer each one to each of 9,19 ... and transfer the suction box 10 to the vibration holder when the transfer is completed.
After removing from 14, the suction box 10 is turned over while vacuum suction is continuously applied to the magnetic focusing chips B aligned by transfer, and the extra magnetic focusing chips not contained in the chip receiving holes 19, 19, ... are collected in the container. While the vacuum suction is continuously applied to the suction box 10, the suction box 10 is mounted so that the magnetic focusing chips B aligned with the elevating holder 5 are on the lower side (wafer side). This suction box
At the time of reversing and mounting of 10, the magnetic focusing chip B is attracted more strongly at the time of reversing than the attraction at the time of arranging the magnetic focusing chips B on the tray. It is good to prevent the chips from falling.

After mounting the suction box 10 on the elevating holder 5, the elevating holder 5 is lowered to a position where the lower surface of the magnetic focusing chip B is a slight gap, for example, about 0.1 mm above the chip mounting surface of the wafer A. The vacuum suction of the suction box 10 is stopped, the suction to the magnetic focusing chips aligned on the tray is released, and the magnetic focusing chips B are held in the aligned state and are collectively set as individual Hall elements of the wafer A. The magnetic focusing chip is mounted at the position of the applied adhesive.

In the embodiment described above, the magnetic focusing chip B is placed on the tray 18
When transferring and aligning the magnetic focusing chips, the magnetic focusing chips need to be transferred about twice the required amount, that is, more magnetic focusing chips than required.
18 and the suction box 10 to which the tray 18 is attached is attached to the vibration holder 14 with the suction box 10 attached.
Is attached to the vibrating section 16, and the suction box 10 is vibrated horizontally through the vibration holder 14 by the operation of the vibrating section 16, and the microvibration causes the magnetic focusing chip B on the tray 18 to be vibrated.
Is sucked from a small hole 20, 20 ... which communicates with each of a predetermined number of chip receiving holes 19, 19, ... having a shape similar to or the same as that of the magnetic focusing chip B provided on the tray 18 and shaken. A certain number of chip receiving holes 19,19,
Magnetic focusing chip B addressed to each one without omission
The suction box 10 to which the trays 18 aligned by transfer are attached is inverted and attached to the elevating holder 5 while maintaining the above suction, and the elevating holder 5 is lowered to suck. By releasing the wafer A, the magnetic focusing chips B aligned in the transfer are collectively applied with an adhesive at a predetermined position in advance.
Since it is mounted on top, the mounting time can be greatly shortened to 1/10 to 1/12 compared to the conventional manual method, and there is no variation in mounting position mounting, and accuracy is improved. I was able to do it.

Further, in the present embodiment, the stamp base 7 for applying the adhesive and the suction box 10 to which the tray 18 for mounting the magnetic focusing chip B are attached can be selectively attached to and detached from the same lifting holder 5. Since the lift holder and the wafer are concentrically provided, when the stamp base 7 or the suction box 10 is mounted on the lift holder 5, the mounted stamp base 7 or suction box 10 is aligned with the wafer A. Since it is in a state, it is possible to contribute to work efficiency without requiring any work such as centering.

Further, in this embodiment, the lifting holder 5 and the vibration holder
The inner peripheral edge of 14 is the same shape and the same size, so that it is easy to attach one suction box 10.

The following table shows the results of mounting the magnetic focusing chip of the high-sensitivity Hall element as described above.

[Advantages of the Invention] According to the present invention, an adhesive is applied in advance to each Hall element on a wafer, and more chips than necessary are placed on a tray having a predetermined number of chip receiving holes similar to the shape of the chip. As the chips are supplied, each tray is sucked and the tray is slightly vibrated to insert chips into each tip receiving hole separately.
Transfer the chips individually to each other and, while sucking the chips, reverse the suction box with the tray attached and attach it to the lift holder to align it on the positionally fixed wafer. By removing the suction of, a predetermined number of chips are simultaneously mounted at a predetermined position on the wafer at the same time.
Not only is it possible to greatly reduce it to 10 to 1/12, but there is no variation in the mounting position compared to manual mounting, and it is possible to install it accurately and evenly.

Further, in the present invention, the stamp base to which the adhesive is applied and the suction box to which the tray for mounting the magnetic focusing chip are attached can be selectively attached to and detached from the same elevating holder, and the elevating holder and the wafer are different from each other. Since they are provided concentrically, when the stamp base or suction box is mounted on the lift holder, the mounted stamp base or suction box will be in a state of being aligned with the wafer, so that especially the work such as centering is performed. There is something that is not necessary and contributes to work efficiency.

[Brief description of drawings]

The drawings show an embodiment of the present invention. FIG. 1 is a front view of a magnetic focusing chip mounting portion used in a method for manufacturing a high-sensitivity Hall element, and FIG. 2 is a front view of a stamp used in the present invention.
FIG. 3 is a front view of the chip transfer aligning section of the method of the present invention, and FIG.
FIG. 5 is a partially enlarged sectional view of a tray used in the present invention.
The drawings are cross-sectional views showing steps for explaining a conventional method for manufacturing a Hall element. A: Wafer, B: Magnetic focusing chip 2: Positioning base, 3: Suction groove 4: Vacuum source, 5: Lift holder 7: Stamp stand, 8: Stamp 9,9,9, ...: Small protrusion, 11: Vacuum Chamber 10: Suction box 14: Vibration holder, 15, 15: Leaf spring 18: Tray 19, 19, 19, ……: Tip receiving hole 20, 20, 20, ……: Small hole

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-55-151392 (JP, A) JP-A-58-188136 (JP, A) JP-A-57-15437 (JP, A) Actual development Sho-60- 29030 (JP, U) JP-B-53-46675 (JP, B2)

Claims (1)

[Claims] 1. A method of mounting a magnetic focusing chip on a sensitive portion formed on a thin film in the process of manufacturing a high-sensitivity Hall element, wherein the magnetic focusing chip is mounted on a wafer which is positioned and adsorbed and fixed on a positioning base. At this time, an elevating holder was prepared in which the stamp base adapted to be aligned with the wafer and the suction box to which the tray was attached were selectively attachable / detachable, and the suction box was mounted on a separately prepared vibration holder and aligned Each of the trays with a required number of chip receiving holes similar in shape to the magnetic focusing chips to be brought into communication is connected to the suction box, and the magnetic focusing chips in excess of the required transfer amount are supplied to the tray. After that, the tray is slightly vibrated in the horizontal direction while sucking each chip receiving hole, The magnetic focusing chips are aligned and addressed to each piece, and the suction box is removed from the vibration holder while sucking, and the excess chips are collected, while the wafer is positioned and fixed by the stamp attached to the stamp table mounted on the lifting holder. After applying the adhesive to each Hall element in a batch, remove the stamp base from the lift holder, reverse the suction box with the tray on which the magnetic focusing chips are aligned and attach it to the lift holder, and lower it. A method of mounting a magnetic focusing chip in a method of manufacturing a high-sensitivity Hall element, comprising: releasing suction of magnetic focusing chips arranged on a tray to bond the magnetic focusing chips onto a wafer.