TWI433251B - 用於濕處理晶圓狀物件之周邊區域的裝置及方法 - Google Patents

用於濕處理晶圓狀物件之周邊區域的裝置及方法 Download PDF

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Publication number
TWI433251B
TWI433251B TW097143677A TW97143677A TWI433251B TW I433251 B TWI433251 B TW I433251B TW 097143677 A TW097143677 A TW 097143677A TW 97143677 A TW97143677 A TW 97143677A TW I433251 B TWI433251 B TW I433251B
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TW
Taiwan
Prior art keywords
liquid
wafer
gas
peripheral region
processing unit
Prior art date
Application number
TW097143677A
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English (en)
Chinese (zh)
Other versions
TW200933794A (en
Inventor
亞歷山大 史華弗特那
迪特 法蘭克
喬珍 帕利弗
Original Assignee
蘭研究公司
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Publication date
Application filed by 蘭研究公司 filed Critical 蘭研究公司
Publication of TW200933794A publication Critical patent/TW200933794A/zh
Application granted granted Critical
Publication of TWI433251B publication Critical patent/TWI433251B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
TW097143677A 2007-11-23 2008-11-12 用於濕處理晶圓狀物件之周邊區域的裝置及方法 TWI433251B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT19062007 2007-11-23

Publications (2)

Publication Number Publication Date
TW200933794A TW200933794A (en) 2009-08-01
TWI433251B true TWI433251B (zh) 2014-04-01

Family

ID=40300366

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097143677A TWI433251B (zh) 2007-11-23 2008-11-12 用於濕處理晶圓狀物件之周邊區域的裝置及方法

Country Status (7)

Country Link
US (1) US8801865B2 (cg-RX-API-DMAC10.html)
EP (1) EP2215651A1 (cg-RX-API-DMAC10.html)
JP (1) JP5336506B2 (cg-RX-API-DMAC10.html)
KR (1) KR101505700B1 (cg-RX-API-DMAC10.html)
CN (1) CN102084458B (cg-RX-API-DMAC10.html)
TW (1) TWI433251B (cg-RX-API-DMAC10.html)
WO (1) WO2009065757A1 (cg-RX-API-DMAC10.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5412230B2 (ja) * 2009-10-19 2014-02-12 株式会社半導体エネルギー研究所 コート材除去装置及びコート材除去方法
US8858755B2 (en) * 2011-08-26 2014-10-14 Tel Nexx, Inc. Edge bevel removal apparatus and method
CN102569150B (zh) * 2012-02-23 2014-12-10 北京七星华创电子股份有限公司 一种易清洗的薄壁盘状物夹持装置及方法
CN103418563B (zh) * 2012-05-22 2016-12-14 盛美半导体设备（上海）有限公司 晶片边缘清洗装置
JP6140439B2 (ja) * 2012-12-27 2017-05-31 株式会社荏原製作所 研磨装置、及び研磨方法
WO2014129167A1 (ja) * 2013-02-21 2014-08-28 凸版印刷株式会社 塗布膜除去装置
TWI597770B (zh) * 2013-09-27 2017-09-01 斯克林集團公司 基板處理裝置及基板處理方法
US10825705B2 (en) * 2015-05-15 2020-11-03 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
US10249521B2 (en) * 2016-03-17 2019-04-02 Lam Research Ag Wet-dry integrated wafer processing system
CN107690358B (zh) * 2016-09-30 2020-08-28 深圳市柔宇科技有限公司 柔性触控面板清洗设备
DE102017212887A1 (de) 2017-07-26 2019-01-31 Gebr. Schmid Gmbh Verfahren, Vorrichtung und Anlage zur Leiterplattenherstellung

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0611274B1 (de) 1993-02-08 1998-12-02 SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG Träger für scheibenförmige Gegenstände
AT640U1 (de) 1993-10-22 1996-02-26 Sez Semiconduct Equip Zubehoer Greifer für halbleiterwafer und andere scheibenförmige gegenstände
JP4127866B2 (ja) * 1996-05-21 2008-07-30 東京応化工業株式会社 基板端縁部被膜の除去方法
US6015467A (en) * 1996-03-08 2000-01-18 Tokyo Ohka Kogyo Co., Ltd. Method of removing coating from edge of substrate
ATE211855T1 (de) 1999-04-28 2002-01-15 Sez Semiconduct Equip Zubehoer Vorrichtung und verfahren zur flüssigkeitsbehandlung von scheibenförmigen gegenständen
US6186873B1 (en) * 2000-04-14 2001-02-13 International Business Machines Corporation Wafer edge cleaning
US7000622B2 (en) * 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
JP3944368B2 (ja) 2001-09-05 2007-07-11 株式会社荏原製作所 基板処理装置及び基板処理方法
JP3954881B2 (ja) * 2002-03-27 2007-08-08 大日本スクリーン製造株式会社 基板処理装置およびそれを備えたメッキ装置
US20070062647A1 (en) 2005-09-19 2007-03-22 Bailey Joel B Method and apparatus for isolative substrate edge area processing
KR100481277B1 (ko) 2002-05-10 2005-04-07 한국디엔에스 주식회사 반도체 제조 장치 및 방법
JP3985250B2 (ja) * 2002-09-13 2007-10-03 和夫 田▲邉▼ ウエーハエッジのエッチング処理装置
JP4095478B2 (ja) * 2003-03-27 2008-06-04 芝浦メカトロニクス株式会社 基板のエッチング装置及びエッチング方法
JP2004214695A (ja) * 2004-03-22 2004-07-29 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2006060161A (ja) * 2004-08-24 2006-03-02 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2006120666A (ja) 2004-10-19 2006-05-11 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4601452B2 (ja) 2005-02-22 2010-12-22 大日本スクリーン製造株式会社 基板処理装置
JP4594767B2 (ja) * 2005-03-09 2010-12-08 積水化学工業株式会社 基材外周処理装置
US20060243304A1 (en) * 2005-04-25 2006-11-02 Applied Materials, Inc. Methods and apparatus for cleaning an edge of a substrate
JP2008198667A (ja) * 2007-02-08 2008-08-28 Nec Electronics Corp 半導体製造装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
JP5336506B2 (ja) 2013-11-06
KR20100106339A (ko) 2010-10-01
CN102084458A (zh) 2011-06-01
CN102084458B (zh) 2014-07-09
US20100288312A1 (en) 2010-11-18
WO2009065757A1 (en) 2009-05-28
JP2011504653A (ja) 2011-02-10
TW200933794A (en) 2009-08-01
EP2215651A1 (en) 2010-08-11
US8801865B2 (en) 2014-08-12
KR101505700B1 (ko) 2015-03-24

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