TWI428701B - 微蝕印投影曝光設備的光學系統 - Google Patents
微蝕印投影曝光設備的光學系統 Download PDFInfo
- Publication number
- TWI428701B TWI428701B TW095117201A TW95117201A TWI428701B TW I428701 B TWI428701 B TW I428701B TW 095117201 A TW095117201 A TW 095117201A TW 95117201 A TW95117201 A TW 95117201A TW I428701 B TWI428701 B TW I428701B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical system
- cavity
- exposure apparatus
- lens
- projection exposure
- Prior art date
Links
- 239000007788 liquid Substances 0.000 claims description 171
- 230000003287 optical effect Effects 0.000 claims description 134
- 238000007654 immersion Methods 0.000 claims description 85
- 238000006073 displacement reaction Methods 0.000 claims description 50
- 238000003384 imaging method Methods 0.000 claims description 26
- 230000000903 blocking effect Effects 0.000 claims description 25
- 239000012528 membrane Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 23
- 238000013022 venting Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 8
- 238000005286 illumination Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000005499 meniscus Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/12—Fluid-filled or evacuated lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Microscoopes, Condenser (AREA)
- Lenses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005024163A DE102005024163A1 (de) | 2005-05-23 | 2005-05-23 | Optisches System einer mikrolithographischen Projektionsbelichtungsanlage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200700929A TW200700929A (en) | 2007-01-01 |
| TWI428701B true TWI428701B (zh) | 2014-03-01 |
Family
ID=37387660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095117201A TWI428701B (zh) | 2005-05-23 | 2006-05-16 | 微蝕印投影曝光設備的光學系統 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US20080170217A1 (enExample) |
| EP (1) | EP1883860A1 (enExample) |
| JP (1) | JP5225075B2 (enExample) |
| CN (1) | CN101180581A (enExample) |
| DE (1) | DE102005024163A1 (enExample) |
| TW (1) | TWI428701B (enExample) |
| WO (1) | WO2006125538A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10324477A1 (de) * | 2003-05-30 | 2004-12-30 | Carl Zeiss Smt Ag | Mikrolithographische Projektionsbelichtungsanlage |
| CN101727021A (zh) * | 2004-02-13 | 2010-06-09 | 卡尔蔡司Smt股份公司 | 微平版印刷投影曝光装置的投影物镜 |
| US7969549B2 (en) * | 2006-06-30 | 2011-06-28 | Asml Netherlands B.V. | Liquid filled lens element, lithographic apparatus comprising such an element and device manufacturing method |
| JP5058305B2 (ja) * | 2009-06-19 | 2012-10-24 | エーエスエムエル ネザーランズ ビー．ブイ． | 液浸リソグラフィ装置、液体閉じ込め構造体、液浸リソグラフィ装置用の投影システムの最終エレメント、および基板テーブル |
| US8941814B2 (en) * | 2011-06-20 | 2015-01-27 | Nikon Corporation | Multiple-blade holding devices |
| JP5972010B2 (ja) * | 2012-03-30 | 2016-08-17 | キヤノン株式会社 | 撮像装置 |
| CN104570613B (zh) * | 2013-10-25 | 2018-01-19 | 上海微电子装备（集团）股份有限公司 | 浸没头、浸没流场初始化和维持方法及光刻设备 |
| WO2018031590A1 (en) | 2016-08-09 | 2018-02-15 | Skattward Research Llc | Lens system with optical actuator |
| DE102017217380A1 (de) * | 2017-09-29 | 2019-04-04 | Carl Zeiss Microscopy Gmbh | Immersionsvorrichtung zur dynamischen Anpassung eines Mediums an eine Probe |
| DE102017217389A1 (de) | 2017-09-29 | 2019-04-04 | Carl Zeiss Microscopy Gmbh | Optische Linse zur Verwendung in einer Medienzuführungsvorrichtung sowie Objektiv, Medienzuführungsvorrichtung und Mikroskop |
| CN111240003B (zh) * | 2020-03-26 | 2024-09-20 | 苏州睿仟科技有限公司 | 一种高数值孔径水浸/油浸物镜系统及显微镜扫描系统 |
| CN114646291B (zh) * | 2020-12-17 | 2024-09-13 | 均豪精密工业股份有限公司 | 检测设备及物镜贴合度的检测方法 |
| TWI798986B (zh) * | 2021-02-04 | 2023-04-11 | 大陸商廣州立景創新科技有限公司 | 變焦透鏡模組 |
| DE102024204464A1 (de) * | 2024-05-14 | 2025-05-08 | Carl Zeiss Smt Gmbh | Kühlvorrichtung zum kühlen einer positionssensitiven komponente einer lithographieanlage und lithographieanlage |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5919912A (ja) * | 1982-07-26 | 1984-02-01 | Hitachi Ltd | 液浸距離保持装置 |
| DD221563A1 (de) * | 1983-09-14 | 1985-04-24 | Mikroelektronik Zt Forsch Tech | Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur |
| JP2753930B2 (ja) * | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | 液浸式投影露光装置 |
| EP1571701A4 (en) * | 2002-12-10 | 2008-04-09 | Nikon Corp | EXPOSURE DEVICE AND METHOD FOR MANUFACTURING COMPONENTS |
| EP1571697A4 (en) * | 2002-12-10 | 2007-07-04 | Nikon Corp | EXPOSURE SYSTEM AND DEVICE PRODUCTION METHOD |
| DE60326384D1 (de) * | 2002-12-13 | 2009-04-09 | Koninkl Philips Electronics Nv | Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht |
| US6781670B2 (en) * | 2002-12-30 | 2004-08-24 | Intel Corporation | Immersion lithography |
| WO2004090956A1 (ja) | 2003-04-07 | 2004-10-21 | Nikon Corporation | 露光装置及びデバイス製造方法 |
| DE10324477A1 (de) * | 2003-05-30 | 2004-12-30 | Carl Zeiss Smt Ag | Mikrolithographische Projektionsbelichtungsanlage |
| US6954256B2 (en) * | 2003-08-29 | 2005-10-11 | Asml Netherlands B.V. | Gradient immersion lithography |
| US7385764B2 (en) * | 2003-12-15 | 2008-06-10 | Carl Zeiss Smt Ag | Objectives as a microlithography projection objective with at least one liquid lens |
| US7460206B2 (en) * | 2003-12-19 | 2008-12-02 | Carl Zeiss Smt Ag | Projection objective for immersion lithography |
| CN101727021A (zh) | 2004-02-13 | 2010-06-09 | 卡尔蔡司Smt股份公司 | 微平版印刷投影曝光装置的投影物镜 |
| US20070030467A1 (en) * | 2004-02-19 | 2007-02-08 | Nikon Corporation | Exposure apparatus, exposure method, and device fabricating method |
| US20060244938A1 (en) | 2004-05-04 | 2006-11-02 | Karl-Heinz Schuster | Microlitographic projection exposure apparatus and immersion liquid therefore |
| US7209213B2 (en) * | 2004-10-07 | 2007-04-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP4961709B2 (ja) * | 2004-10-13 | 2012-06-27 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
| US7128427B2 (en) * | 2004-11-05 | 2006-10-31 | Sematech, Inc. | Method and apparatus for fluid handling in immersion lithography |
| WO2006053751A2 (de) * | 2004-11-18 | 2006-05-26 | Carl Zeiss Smt Ag | Projektionsobjektiv einer mikrolithographischen projektionsbelichtungsanlage |
| US7405805B2 (en) * | 2004-12-28 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7324185B2 (en) * | 2005-03-04 | 2008-01-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20070070323A1 (en) * | 2005-09-21 | 2007-03-29 | Nikon Corporation | Exposure apparatus, exposure method, and device fabricating method |
-
2005
- 2005-05-23 DE DE102005024163A patent/DE102005024163A1/de not_active Ceased
-
2006
- 2006-05-13 CN CNA2006800177753A patent/CN101180581A/zh active Pending
- 2006-05-13 US US11/911,899 patent/US20080170217A1/en not_active Abandoned
- 2006-05-13 JP JP2008512728A patent/JP5225075B2/ja not_active Expired - Fee Related
- 2006-05-13 WO PCT/EP2006/004520 patent/WO2006125538A1/en not_active Ceased
- 2006-05-13 EP EP06753599A patent/EP1883860A1/en not_active Withdrawn
- 2006-05-16 TW TW095117201A patent/TWI428701B/zh not_active IP Right Cessation
-
2008
- 2008-08-08 US US12/188,652 patent/US20080309904A1/en not_active Abandoned
-
2009
- 2009-12-01 US US12/628,294 patent/US8212991B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008543034A (ja) | 2008-11-27 |
| US20100073655A1 (en) | 2010-03-25 |
| TW200700929A (en) | 2007-01-01 |
| CN101180581A (zh) | 2008-05-14 |
| WO2006125538A1 (en) | 2006-11-30 |
| US20080170217A1 (en) | 2008-07-17 |
| DE102005024163A1 (de) | 2006-11-30 |
| EP1883860A1 (en) | 2008-02-06 |
| JP5225075B2 (ja) | 2013-07-03 |
| US20080309904A1 (en) | 2008-12-18 |
| US8212991B2 (en) | 2012-07-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |