TWI428397B - A thermally conductive silicone oxygen composition and a thermally conductive silicone oxygen forming body - Google Patents

A thermally conductive silicone oxygen composition and a thermally conductive silicone oxygen forming body Download PDF

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Publication number
TWI428397B
TWI428397B TW96128007A TW96128007A TWI428397B TW I428397 B TWI428397 B TW I428397B TW 96128007 A TW96128007 A TW 96128007A TW 96128007 A TW96128007 A TW 96128007A TW I428397 B TWI428397 B TW I428397B
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TW
Taiwan
Prior art keywords
group
component
composition
bonded
mass
Prior art date
Application number
TW96128007A
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English (en)
Chinese (zh)
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TW200831613A (en
Inventor
Masaya Asaine
Yuuki Sakurai
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Shinetsu Chemical Co
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Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200831613A publication Critical patent/TW200831613A/zh
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Publication of TWI428397B publication Critical patent/TWI428397B/zh

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  • Compositions Of Macromolecular Compounds (AREA)
TW96128007A 2006-08-10 2007-07-31 A thermally conductive silicone oxygen composition and a thermally conductive silicone oxygen forming body TWI428397B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006217611A JP4299324B2 (ja) 2006-08-10 2006-08-10 熱伝導性シリコーン組成物及び熱伝導性シリコーン成形体

Publications (2)

Publication Number Publication Date
TW200831613A TW200831613A (en) 2008-08-01
TWI428397B true TWI428397B (zh) 2014-03-01

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ID=39173493

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96128007A TWI428397B (zh) 2006-08-10 2007-07-31 A thermally conductive silicone oxygen composition and a thermally conductive silicone oxygen forming body

Country Status (3)

Country Link
JP (1) JP4299324B2 (ja)
CN (1) CN101220207B (ja)
TW (1) TWI428397B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011081223A1 (en) * 2009-12-29 2011-07-07 Dow Corning Toray Co., Ltd. Curable liquid silicone rubber composition for forming a sealing member and sealing member
CN102134474B (zh) * 2010-12-29 2013-10-02 深圳市优宝惠新材料科技有限公司 导热硅脂组合物
CN112449546A (zh) * 2019-08-27 2021-03-05 华硕电脑股份有限公司 液态金属散热膏涂布方法及散热模块

Also Published As

Publication number Publication date
JP2008038102A (ja) 2008-02-21
TW200831613A (en) 2008-08-01
JP4299324B2 (ja) 2009-07-22
CN101220207B (zh) 2012-01-04
CN101220207A (zh) 2008-07-16

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