TWI422290B - Structure for preventing static electricity - Google Patents

Description

Anti-static structure

This invention relates to an antistatic structure, and more particularly to an antistatic structure for protecting electronic components on a circuit board.

In general, static electricity enters the circuit board from the outside, for example, through the touch of the human body into the circuit board. As a result, static electricity accumulated on the board may cause damage to the electronic components on it. Taking a light-emitting diode as an example, the internal PN junction (PN junction) is inevitably induced by electrostatic induction during the manufacture, assembly, screening, testing, packaging, storage, installation, and use of electronic products. . If these charges are not released in time, a higher potential difference will be formed on the two electrodes of the light-emitting diode, and when the amount of charge reaches the limit of the light-emitting diode, the charge will be released instantaneously. At this very short moment, the two electrodes of the light-emitting diode are discharged (the place where the resistance value is the smallest, often around the electrode), and the internal material of the conductive layer, the light-emitting layer, etc. between the two electrodes is instantaneously generated. Local high temperature, this temperature can be as high as 1400 °C. At such extreme temperatures, the material layer between the two electrodes will melt, causing anomalies such as leakage, darkening, or damage.

Therefore, antistatic components must be provided on the circuit board to prevent static electricity accumulated on the circuit board from causing high voltage and damaging electronic components on the circuit board. In general, most of the antistatic components currently used in the market are Zener diodes, but the Zener diodes have higher costs and have a certain limit on the static electricity they can withstand. Relatively limited in application.

Therefore, how to design an anti-static structure to effectively protect the electronic components on the circuit board has become a problem worthy of consideration in the field of ordinary knowledge.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide an antistatic structure for effectively protecting electronic components on a circuit board.

According to the above and other objects, the present invention provides an antistatic structure, comprising: a conductive plate, a circuit board, and at least one conductive bar. Wherein, at least one electronic component is mounted on one surface of the circuit board, and the other surface of the circuit board is attached to the conductive plate. The circuit board has at least one through hole, and one end of the conductive bar is disposed on the conductive plate, and the conductive bar is penetrated through the through hole and protrudes from the surface of the circuit board.

In the above antistatic structure, the electronic component is a light emitting diode device, and the light emitting diode device comprises a positive conductive region, a negative conductive region, and a heat conducting region, the heat conducting region and the positive conductive region and the negative conductive region. Zone isolation. In addition, the circuit board is coated with a solder and includes a circuit layer which is connected to the heat conducting region, and the conductive layer and the circuit layer of the circuit board are connected by solder.

In the antistatic structure described above, the perforations are located at the center of the circuit board.

In the above antistatic structure, the circuit board is adhered to the heat sink.

In the antistatic structure described above, the circuit board is a printed circuit board, a metal-based printed circuit board, a ceramic substrate, or a germanium substrate.

In the antistatic structure described above, the conductive plate further includes a plurality of heat dissipation fins, which are distributed on the other side of the conductive plate compared to the circuit board.

In the antistatic structure described above, the conductive plate is made of copper or aluminum.

In the above antistatic structure, the electronic component is a laser diode, a photovoltaic diode, a logic IC, a memory IC, an analog IC, or a CMOS image sensing component.

Since the conductive rod is inserted through the perforation on the circuit board and inserted on the conductive plate, static electricity generated by the external environment is transmitted to the conductive plate via the conductive bar without accumulating on the circuit board, so the circuit board The upper electronic components are less subject to static electricity, thereby extending the life of the electronic components.

The above described objects, features, and advantages of the present invention will become more apparent from the following description.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of an antistatic structure according to a first embodiment of the present invention. The antistatic structure 100 includes a conductive plate 110, a circuit board 120, and at least one conductive bar 140. A plurality of light emitting diode devices 130 are mounted on one surface of the circuit board 120. In addition, another surface of the circuit board 120 is adhered to the conductive plate 110 by using an adhesive, for example, and a through hole 122 is defined in the circuit board 120. One end of the conductive bar 140 is disposed on the conductive plate 110, and the other end of the conductive bar 140 is pierced through the through hole 122 and protrudes from the surface of the circuit board 120, that is, the height of the top end of the conductive bar 140 must be higher than The height of the surface of the circuit board 120. The material of the conductive plate 110 and the conductive bar 140 is, for example, aluminum, copper, or other conductive material. In the present embodiment, the perforations 122 are located at the center of the circuit board 120. In addition, the circuit board 120 is a metal core printed circuit board (MCPCB), and may also be a printed circuit board (PCB), a ceramic substrate (Ceramic Substrate), or a silicon substrate (Silicon Substrate). ).

Due to the arrangement of the conductive bars 140, external static electricity can be transmitted to the conductive plates 110 via the conductive bars 140 without being accumulated on the circuit board 120. In this way, the LED device 130 on the circuit board 120 can be protected from static electricity, thereby extending the service life of the LED device 130.

In this embodiment, the conductive plate 110 may be a separate plate-shaped body, or may be a part of the housing of the lamp, or the conductive plate 110 may also be a part of the heat sink.

Please refer to FIG. 2. FIG. 2 is a schematic diagram of an antistatic structure according to a second embodiment of the present invention. The anti-static structure 200 includes a conductive plate 210, a circuit board 120, and at least one conductive bar 140. The same components in the embodiment as those in the first embodiment will be denoted by the same reference numerals and will not be described again. The conductive plate 210 includes a substrate 212 and a plurality of heat dissipation fins 214 disposed above the substrate 212. The heat dissipation fins 214 can improve the heat dissipation efficiency of the entire conductive plate 210. Therefore, the conductive plate 210 can also be used as a heat sink.

In the above two embodiments, only one conductive bar 140 is inserted on the conductive plate 110 and the conductive plate 210. However, those skilled in the art can also provide a plurality of conductive bars 140 as needed. Please refer to FIG. 3. FIG. 3 is a schematic diagram of an antistatic structure according to a third embodiment of the present invention. Compared with the second embodiment, the circuit board 320 of the present embodiment has a large area, and a plurality of light emitting diode devices 130 are also disposed thereon. Since there are many light-emitting diode devices 130 to be protected, there are many conductive bars 140 provided thereon. These conductive bars 140 are passed through the through holes 322 on the circuit board 320 and are inserted on the conductive plates 310.

Hereinafter, the structure of the light-emitting diode device 130 will be described in detail. Please refer to FIG. 4. FIG. 4 illustrates a light emitting diode device according to a first embodiment of the present invention. The LED device 130 includes a positive conductive region 132, a substrate 133, a negative conductive region 134, a plurality of insulating film patterns 135, and a heat conducting region 136, wherein the positive conductive region 132, the negative conductive region 134, and the heat conducting portion Zone 136 is primarily comprised of copper. The insulating film pattern 135 is distributed between the positive conductive region 132 and the substrate 133 and between the negative conductive region 134 and the substrate 133. The heat conducting region 136 is directly disposed on the substrate 133, and a die 131 is disposed on the heat conducting region 136. A first wire 131a and a second wire 131b are further connected to the die 131 of the LED device 130. The first wire 131a is connected between the die 131 and the positive conductive region 132, and the second wire 131b is connected between the die 131 and the negative conductive region 134. When the LED device 130 is turned on, the die 131 emits colored light. In addition, the heat conduction region 136 is isolated from the positive conductive region 132 and the negative conductive region 134, and functions to conduct heat generated by the die 131 to the external environment.

Please refer to FIG. 5. FIG. 5 is a partial enlarged view of the circuit board, showing the relationship between the conductive bar 140, the circuit board 120 and the conductive plate 110. The circuit board 120 is a metal-based printed circuit board comprising a circuit layer 123, an insulating layer 124 and an aluminum substrate 126. A solder mask layer 128 may be disposed on the circuit board 120. The function of the solder resist layer 128 is to prevent short circuit caused by wave soldering and save the amount of solder. A wiring layer 123 is disposed on the insulating layer 124, and the wiring layer 123 is connected to the heat conduction region 136 on the LED device 130. In addition, a solder 150 is also coated on the circuit board 120. With the solder 150, the wiring layer 123 can be connected to the conductive bar 140. Therefore, the heat generated by the die 131 is transmitted to the heat transfer region 136, transferred to the conductive bar 140 via the circuit layer 123 and the solder 150, and then transferred to the conductive plate 110. In this way, the conductive rod 140 has the effect of heat conduction in addition to the antistatic effect.

In the above embodiments, the electronic components disposed on the circuit board are light emitting diode devices, but those skilled in the art may also set other types of electronic components or set various types of electronic components according to needs. On the board. These electronic components are, for example, a light-emitting diode, a laser diode, a photovoltaic diode (PVD), a logic IC, a memory IC, an analog IC, or a CMOS image sensing element.

The present invention has been described above by way of examples, and is not intended to limit the scope of the claims. The scope of patent protection is subject to the scope of the patent application and its equivalent fields. Modifications or modifications made by those skilled in the art, without departing from the spirit or scope of the invention, are equivalent to the equivalents or modifications made in the spirit of the invention and should be included in the following claims. Inside.

100. . . Anti-static structure

110. . . Conductive plate

120. . . Circuit board

122. . . perforation

130. . . Light-emitting diode device

131. . . Grain

131a. . . First wire

131b. . . Second wire

132. . . Positive conduction zone

133. . . Substrate

134. . . Negative conductive zone

136. . . Thermal conduction zone

140. . . Conductive rod

200. . . Anti-static structure

210. . . Conductive plate

212. . . Base

214. . . Heat sink fin

310. . . Conductive plate

320. . . Circuit board

FIG. 1 is a schematic view showing an antistatic structure according to a first embodiment of the present invention.

FIG. 2 is a schematic view showing an antistatic structure according to a second embodiment of the present invention.

FIG. 3 is a schematic view showing an antistatic structure according to a third embodiment of the present invention.

FIG. 4 illustrates a light emitting diode device according to a first embodiment of the present invention.

FIG. 5 is a partial enlarged view of the circuit board.

100. . . Anti-static structure

110. . . Conductive plate

120. . . Circuit board

122. . . perforation

130. . . Light-emitting diode device

140. . . Conductive rod

Claims (6)

An anti-static structure includes: a conductive plate; a circuit board having at least one light emitting diode device mounted on one surface of the circuit board, and another surface of the circuit board is attached to the conductive plate And the circuit board has at least one through hole; at least one conductive bar, one end of the conductive bar is disposed on the conductive plate; wherein the conductive bar is pierced through the through hole and protrudes from the surface of the circuit board, the circuit Applying a solder to the board, the LED device includes a positive conductive region, a negative conductive region, and a heat conducting region, the heat conducting region is isolated from the positive conductive region and the negative conductive region, and the circuit board includes a a circuit layer, the circuit layer is connected to the heat conduction region, and the conductive layer and the circuit layer of the circuit board are connected by the solder. The antistatic structure of claim 1, wherein the perforation is located at a center of the circuit board. The antistatic structure of claim 1, wherein the circuit board is adhered to the conductive plate. The antistatic structure of claim 1, wherein the circuit board is a printed circuit board, a metal-based printed circuit board, a ceramic substrate, or a germanium substrate. The antistatic structure of claim 1, wherein the conductive plate further comprises a plurality of heat dissipation fins, the heat dissipation fins being distributed on the other side of the conductive plate compared to the circuit board. The antistatic structure of claim 1, wherein the conductive plate is made of copper or aluminum.