201249264 六、發明說明： 【發明所屬之技術領域】 本發明是關於一種防靜電結構’且特別是關於一種用於保護 電路板上之電子元件的防靜電結構。 【先前技術】 一般而言’靜電是由外界進入至電路板中，例如是經由人體 的觸摸而進入電路板。如此一來，累積在電路板上的靜電便可能 會對其上的電子元件造成損壞。就以發光二極體為例，其内部的 PN接合(PN junction)在電子產品的製造、組裝、筛選、測試、包 裝、儲運、安裝、及使用時，難免會受靜電感應影響而產生感= 電荷。若這些電荷得不到及時釋放，將在發光二極體的兩個電極 上形成較高的電位差，當電荷量達到發光二極體的承受極限值， 電荷將會在瞬間釋放。在這極短的瞬間對發光二極體的 間進行放電（電阻值最小的地方’往歧電極觸），瞬間將在兩 個電極之關導電層、發紐等晶片⑽物f產生局部的高溫， 此溫度可高達剛。C。這種極端高溫下，兩電極之_材料:將 會產生熔融，從而造成漏電、亮度變暗、或損壞等的異常現象。 也因此，於f雜域必設置抗靜電的元件， 電造成高電壓而損害電路板上的電子元件… (rde) ’脑齊納二極體的成本較高，且其所能承受的= 有-定的限度’故在細上相對受限。 X的電 電子：= 十出一種防靜電結構’以有效保護電路板上的 電子兀件，e成絲躺具有财知識讀得去思量關題板上的 4 201249264 【發明内容】 本發明的主要目的在於提供一種防靜電結 路板上的電子元件。 句双怵墁€ 構，其他目的’本發明提供一種防靜電結 盆中，於雷路二3主一電路板、與至少一導電棒。 ”中於電路板的其中-表面上安裝有至少—電子201249264 VI. Description of the Invention: [Technical Field] The present invention relates to an antistatic structure and particularly relates to an antistatic structure for protecting electronic components on a circuit board. [Prior Art] In general, static electricity enters a circuit board from the outside, for example, through a touch of a human body into a circuit board. As a result, static electricity accumulated on the board may damage the electronic components on it. Taking a light-emitting diode as an example, the internal PN junction (PN junction) is inevitably affected by electrostatic induction during the manufacture, assembly, screening, testing, packaging, storage, transportation, installation, and use of electronic products. = charge. If these charges are not released in time, a higher potential difference will be formed on the two electrodes of the light-emitting diode. When the amount of charge reaches the limit of the light-emitting diode, the charge will be released instantaneously. At this very short moment, the light-emitting diodes are discharged (the place where the resistance value is the smallest 'toward the electrode), and the local high temperature is instantaneously generated in the conductive layer of the two electrodes, the wafer (10) , this temperature can be as high as just. C. At such extreme temperatures, the material of the two electrodes will melt, causing anomalies such as leakage, darkening, or damage. Therefore, anti-static components must be placed in the f-domain, causing high voltages and damaging electronic components on the board... (rde) 'The brain Zener diode is more expensive and can withstand = - The fixed limit 'is therefore relatively limited in terms of fineness. X's electro-electronics: = Ten anti-static structures are used to effectively protect the electronic components on the circuit board, e is placed in the silk and has a wealth of knowledge to read on the board 4 4 201249264 [Summary] The main aspects of the present invention The object is to provide an electronic component on an antistatic circuit board. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; "In the circuit board - at least on the surface - electronic
Sit表面則是與導電板相貼合。電路板具有至少-穿孔， 而導電棒的-端技置在導她上， 出於電路板的表面。 电悴疋才叹過穿孔並凸 之防靜電結構中’電子元件為一發光二極體裝置，且 =-極體裝置包括—正導電區、—負導電區、與 ==電區及負導電區相隔離。此外，電路板上ί佈-Ϊ 層’該線路層是連接到導熱區，且導電棒^電路 板的線路収義觸而鱗接。 Μ榉與電路 於上述之防靜電結射，穿孔是位於板財央處。 於上述之防靜電結射，電職是_在散熱片上。 於上述之防靜電結射，電路板騎 電路板、陶究基板、或石夕基板。 扳金屬基印刷 =上述之防靜電結構中，導電板還包 於電路板，該散熱鰭片是分布在導電板的另外一側:、則相較 於上述之防靜電結射，導電板的材質為銅或紹。 於上述之防靜電結構中，電 電二極體、-邏輯ic、一二二一極體、一先發 像感測元件。 " 類比1C、或-CMOS影 201249264 擾’從而縣電子树的使用壽命 【實施方式】 ==因，板上的電子元件 ，讓本發明之上述目的、特徵和優點更㈣ 下文將以實施例並配合所_式，作詳細說明如下。 $照圖！’圖i所繪示為本發明的第—實施例之防靜電 t U靜電結構⑽包括—導電板⑽、一電路板120了與 二-導電棒14()，其中於電路板12()的其中—表面上安裝有多個 發光一極體裝置13G。此外，電路板m的 用黏膠而與導電板1K)相貼合，且電路板12〇上開=== 122。導電棒140的一端是設置在導電板11〇上，而導電棒14〇的 另-端則是穿設過穿孔122並凸出於·板12G絲面，也就是 說導電棒140頂端的高度必須要高於電路板12〇表面的高度。導 電板110與導電棒140的材質例如為紹、銅、或其他導電材質。 在本實施例中’穿孔122是位於電路板12〇的中央處。另外，電 路板120為金屬基印刷電路板(Metal Core Print Circuit Board，簡稱 MCPCB) ’也可為印刷電路板(Print Circuit Board，簡稱PCB)、陶 瓷基板(Ceramic Substrate)、或矽基板(suicon Substrate)。 由於導電棒140的設置，外界的靜電便可經由導電棒14〇而 傳輸到導電板110中，而不會累積在電路板120上。如此一來， 便可保護電路板120上的發光二極體裝置13〇,使其不會受到靜電 的侵擾，從而延長發光二極體裝置130的使用壽命。 在本實施例中，導電板U0可以為獨立的板狀體，或者也可 6 201249264 ^體的—部份’或者導電板⑽也可為散熱片的-部份。 的干3照^带圖2崎示為本發明的第二實施例之防靜電結構 包括一導電板210、-電路板120、與 以相本實關中與第一實施例中相同的元件將標 並不再贅述。其中，導電板210包括-基底212 214，散熱鰭片214是設置在基底212的上方。藉 14 ’可使導電板210整體的散熱效率提高。因 此，導電板210還可作為散熱片之用。 在上述的二個實施例中，於導電板110與導電板210上皆只 加ί電棒140 ’然而本領域具有通常知識者也可依據需要而 权置多個導電棒140。請參照圖3，圖3所繪示為本發明的第三實 施例之防靜電結構的示_。她於第二實_，本實施例之電 路板32G具有較大的面積，且其上也設置較多的發光二極體裝置 130。由於需要保護的發光二極體裝置130較多，故其上所設置的 導電棒140也較多。這些導電棒14〇皆穿設過電路板32〇上的穿 孔322，而插置在導電板310上。 以下，將對發光二極體裝置13〇的結構作一詳細介紹。請參 照圖4，圖4所繚示為本發明的帛一實施例之發光二極體裝置。此 發光二極體裝置13G包括-正導電區132、—基板133、一負導電 區134、多個絕緣薄膜_ 135、與一導熱區136，其中正導電區 132、負導電區134、與導熱區136主要是由銅所構成。絕緣薄膜 圖案135是分佈在：正導電區132與基板133間及負導電區 ，基板133間。導熱區136則是直接設置於基板133上，於導熱 區136上设有一晶粒131’於發光二極體装置13〇的晶粒ΐ3ι上還 連接有-第-導線131a與-第二導線131b，其中第—導線131a 連接於晶粒131與正導電區132間，而第二導線㈣則連接於晶 201249264 粒131與負導電區134間。當發光二極體裝置13〇導通後，晶粒 131便會發出色光。另外，導熱區136則是與正導電區丨32及負導 電區134相隔離，其功用在於將晶粒131所產生的熱量傳導到外 界環境。 清參照圖5 ’圖5所繪示為電路板的局部放大圖，其顯示出導 電棒140電路板120與導電板no間的關係。此電路板12〇為金 屬基印刷電路板’其包括一線路層⑵、一絕緣層m與一紹基板 以。電路板120上可設置一防焊層128，防焊層128的功用在於： 防止波焊時所造成的短路並節省谭錫之用量。於絕緣層124上設 置有線路層123’此線路層123是與發光二極體裝置⑽上的導熱 區136相連接。另外，於電路板12〇上還塗佈有一焊錫15〇。藉由 此焊錫150，可使線路層123與導電棒14〇產生連接。也因此晶 粒131所產生的熱量傳導到導熱區136後，會經由線路層123及 焊錫150而傳送到導電棒140，之候再傳送到導電板n〇。這樣一 來’導電棒14G除了有防靜電的功效外，還具有賴的功效。 在上述的實_巾，電路板上所設置㈣子元件為發光二極 體裝置’但本領域具有通常知識者也可依據需要而改設置其他種 類的電子雜或將多麵_電子元件設置在料板h這些電 子7L件例如為：發光二極體、雷射二極體、光發電二極體 (Photovoltaic Diode; PVD)、邏輯 IC、記憶體 IC、類比忙、或 cm〇s 影像感測元件。 本發明以實關朗如上，然其並_嫌定本發明所主張 之專利權利顧。其專梅護細當視後附之申請專利範圍及^ 等同領域歧。凡本領域具有通常知識者，在不脫離本專利辦申 或範圍内，所作之更動_飾，均屬於本發明所揭示精神 成之等效改變或設計’且應包含在下述之申請專利範圍内。几 8 201249264 【圖式簡單說明】 圖1所繪示為本發明的第一實施例之防靜電結構的示意圖。 圖2所繪示為本發明的第二實施例之防靜電結構的示意圖。 圖3所繪示為本發明的第三實施例之防靜電結構的示意圖。 圖4所繪示為本發明的第一實施例之發光二極體裝置。 圖5所繪示為電路板的局部放大圖。 【主要元件符號說明】 100 :防靜電結構 110 :導電板 120 :電路板 122 :穿孔 130 :發光二極體裝置 131 ·晶粒 131a :第一導線 131b :第二導線 132 :正導電區 133 :基板 134 :負導電區 136 :導熱區 140 :導電棒 201249264 200 :防靜電結構 210 :導電板 212 :基底 214 :散熱鰭片 310 :導電板 320 :電路板The surface of the Sit is attached to the conductive plate. The board has at least a perforation, and the end of the conductive bar is placed over her, due to the surface of the board. The electric cymbal sighs through the perforated and convex antistatic structure. The electronic component is a light-emitting diode device, and the =-polar device includes a positive conductive region, a negative conductive region, a == electrical region, and a negative conductive region. Zone isolation. In addition, the circuit layer on the circuit board is connected to the heat conduction area, and the line of the conductive bar circuit board is tapped. Μ榉 和 Circuit In the above anti-static junction, the perforation is located at the board of the financial center. In the above anti-static junction, the electric job is _ on the heat sink. In the above anti-static junction, the circuit board rides a circuit board, a ceramic substrate, or a stone substrate. Metal-based printing = the above-mentioned anti-static structure, the conductive plate is also wrapped in the circuit board, the heat-dissipating fins are distributed on the other side of the conductive plate: the material of the conductive plate is compared with the above-mentioned anti-static junction For copper or Shao. In the above antistatic structure, the electric diode, the logic ic, the 221 polar body, and the first image sensing element. " analog 1C, or - CMOS shadow 201249264 disturbs the life of the county electronic tree [embodiment] == due to the electronic components on the board, the above objects, features and advantages of the present invention are more (4) And with the _ formula, a detailed description is as follows. $Photograph! The anti-static t U electrostatic structure (10) of the first embodiment of the present invention includes a conductive plate (10), a circuit board 120 and a two-conductive bar 14 (), wherein the circuit board 12 () Wherein, a plurality of light-emitting diode devices 13G are mounted on the surface. Further, the board m is adhered to the conductive board 1K) with the adhesive, and the board 12 is opened === 122. One end of the conductive bar 140 is disposed on the conductive plate 11〇, and the other end of the conductive bar 14〇 is pierced through the through hole 122 and protrudes from the surface of the plate 12G, that is, the height of the top end of the conductive bar 140 must be It is higher than the height of the surface of the circuit board 12. The material of the conductive plate 110 and the conductive bar 140 is, for example, a copper, or other conductive material. In the present embodiment, the 'perforation 122' is located at the center of the circuit board 12''. In addition, the circuit board 120 is a metal-based printed circuit board (MCPCB), which may also be a printed circuit board (PCB), a ceramic substrate (Ceramic Substrate), or a germanium substrate (suicon Substrate). ). Due to the arrangement of the conductive bars 140, external static electricity can be transmitted to the conductive plates 110 via the conductive bars 14 without being accumulated on the circuit board 120. In this way, the light-emitting diode device 13A on the circuit board 120 can be protected from static electricity, thereby extending the service life of the light-emitting diode device 130. In this embodiment, the conductive plate U0 may be a separate plate-shaped body, or may be a portion of the body or the conductive plate (10) may also be a portion of the heat sink. The antistatic structure of the second embodiment of the present invention includes a conductive plate 210, a circuit board 120, and the same components as those in the first embodiment. No longer. The conductive plate 210 includes a substrate 212 214 , and the heat dissipation fins 214 are disposed above the substrate 212 . By 14', the heat dissipation efficiency of the entire conductive plate 210 can be improved. Therefore, the conductive plate 210 can also be used as a heat sink. In the above two embodiments, only the electric bar 140' is attached to the conductive plate 110 and the conductive plate 210. However, those skilled in the art can also dispense a plurality of conductive bars 140 as needed. Please refer to FIG. 3. FIG. 3 is a diagram showing an antistatic structure according to a third embodiment of the present invention. In the second embodiment, the circuit board 32G of the present embodiment has a large area, and a plurality of light emitting diode devices 130 are also disposed thereon. Since there are many light-emitting diode devices 130 to be protected, there are many conductive bars 140 provided thereon. These conductive bars 14 are passed through the through holes 322 of the circuit board 32 and are inserted on the conductive plates 310. Hereinafter, the structure of the light-emitting diode device 13A will be described in detail. Referring to Fig. 4, Fig. 4 shows a light emitting diode device according to an embodiment of the present invention. The light emitting diode device 13G includes a positive conductive region 132, a substrate 133, a negative conductive region 134, a plurality of insulating films 135, and a heat conducting region 136, wherein the positive conductive region 132, the negative conductive region 134, and the heat conducting portion Zone 136 is primarily comprised of copper. The insulating film pattern 135 is distributed between the positive conductive region 132 and the substrate 133 and between the negative conductive region and the substrate 133. The heat conducting region 136 is directly disposed on the substrate 133, and a die 131' is disposed on the heat conducting region 136. The first wire 131a and the second wire 131b are connected to the die ΐ3 of the light emitting diode device 13〇. The first wire (131a) is connected between the die 131 and the positive conductive region 132, and the second wire (4) is connected between the crystal 201249264 particle 131 and the negative conductive region 134. When the light-emitting diode device 13 is turned on, the crystal grains 131 emit colored light. In addition, the thermally conductive region 136 is isolated from the positive conductive region 丨32 and the negative conductive region 134, and functions to conduct heat generated by the die 131 to the external environment. Referring to Figure 5, a partial enlarged view of the circuit board is shown in Figure 5, which shows the relationship between the circuit board 120 of the conductive bar 140 and the conductive plate no. The circuit board 12 is a metal-based printed circuit board which includes a wiring layer (2), an insulating layer m and a substrate. A solder mask layer 128 may be disposed on the circuit board 120. The function of the solder resist layer 128 is to prevent short circuit caused by wave soldering and save the amount of tan tin. A wiring layer 123' is disposed on the insulating layer 124. The wiring layer 123 is connected to the heat conducting region 136 on the light emitting diode device (10). In addition, a solder 15 is also coated on the circuit board 12A. With this solder 150, the wiring layer 123 can be connected to the conductive bar 14A. Therefore, the heat generated by the crystal particles 131 is transmitted to the heat transfer portion 136, transferred to the conductive rod 140 via the wiring layer 123 and the solder 150, and then transferred to the conductive plate n. In this way, the conductive rod 14G has the effect of antistatic effect. In the above-mentioned real towel, the (four) sub-element is provided on the circuit board as a light-emitting diode device. However, those skilled in the art can also set other kinds of electronic impurities or set multi-faceted electronic components according to needs. The material plate 7h are, for example, a light-emitting diode, a laser diode, a photovoltaic diode (PVD), a logic IC, a memory IC, an analog busy, or a cm〇s image sensing. element. The present invention is based on the above, and it is also a patent right claimed by the present invention. Its special beauty care is attached to the scope of the patent application and the equivalent field. Those skilled in the art who do not depart from the scope of this patent application, the modifications and modifications are intended to be equivalent to the spirit of the present invention, and should be included in the following claims. . Several 8 201249264 [Simple Description of the Drawings] FIG. 1 is a schematic view showing an antistatic structure according to a first embodiment of the present invention. FIG. 2 is a schematic view showing an antistatic structure according to a second embodiment of the present invention. FIG. 3 is a schematic view showing an antistatic structure according to a third embodiment of the present invention. FIG. 4 illustrates a light emitting diode device according to a first embodiment of the present invention. FIG. 5 is a partial enlarged view of the circuit board. [Main component symbol description] 100: Antistatic structure 110: Conductive plate 120: Circuit board 122: Perforation 130: Light emitting diode device 131 • Die 131a: First wire 131b: Second wire 132: Positive conductive region 133: Substrate 134: Negative conductive region 136: Thermal conductive region 140: Conductive bar 201249264 200: Antistatic structure 210: Conductive plate 212: Substrate 214: Heat sink fin 310: Conductive plate 320: Circuit board