TWI419992B - 用於薄膜沈積之輸送裝置 - Google Patents
用於薄膜沈積之輸送裝置 Download PDFInfo
- Publication number
- TWI419992B TWI419992B TW097100593A TW97100593A TWI419992B TW I419992 B TWI419992 B TW I419992B TW 097100593 A TW097100593 A TW 097100593A TW 97100593 A TW97100593 A TW 97100593A TW I419992 B TWI419992 B TW I419992B
- Authority
- TW
- Taiwan
- Prior art keywords
- extended
- gas
- substrate
- channels
- gaseous material
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
- C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45517—Confinement of gases to vicinity of substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45519—Inert gas curtains
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45559—Diffusion of reactive gas to substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45568—Porous nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45574—Nozzles for more than one gas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/620,740 US7789961B2 (en) | 2007-01-08 | 2007-01-08 | Delivery device comprising gas diffuser for thin film deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200839028A TW200839028A (en) | 2008-10-01 |
| TWI419992B true TWI419992B (zh) | 2013-12-21 |
Family
ID=39321545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097100593A TWI419992B (zh) | 2007-01-08 | 2008-01-07 | 用於薄膜沈積之輸送裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7789961B2 (enExample) |
| EP (4) | EP2102383B1 (enExample) |
| JP (1) | JP5466019B2 (enExample) |
| TW (1) | TWI419992B (enExample) |
| WO (1) | WO2008085474A2 (enExample) |
Families Citing this family (158)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7573420B2 (en) * | 2007-05-14 | 2009-08-11 | Infineon Technologies Ag | RF front-end for a radar system |
| US20080166880A1 (en) * | 2007-01-08 | 2008-07-10 | Levy David H | Delivery device for deposition |
| US11136667B2 (en) * | 2007-01-08 | 2021-10-05 | Eastman Kodak Company | Deposition system and method using a delivery head separated from a substrate by gas pressure |
| US7789961B2 (en) * | 2007-01-08 | 2010-09-07 | Eastman Kodak Company | Delivery device comprising gas diffuser for thin film deposition |
| DE112008000169T5 (de) * | 2007-01-12 | 2010-01-14 | Veeco Instruments Inc. | Gasbehandlungssysteme |
| US8207063B2 (en) * | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| US20080299771A1 (en) * | 2007-06-04 | 2008-12-04 | Irving Lyn M | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US8528498B2 (en) * | 2007-06-29 | 2013-09-10 | Lam Research Corporation | Integrated steerability array arrangement for minimizing non-uniformity |
| US8092599B2 (en) * | 2007-07-10 | 2012-01-10 | Veeco Instruments Inc. | Movable injectors in rotating disc gas reactors |
| US8039052B2 (en) * | 2007-09-06 | 2011-10-18 | Intermolecular, Inc. | Multi-region processing system and heads |
| US7972898B2 (en) * | 2007-09-26 | 2011-07-05 | Eastman Kodak Company | Process for making doped zinc oxide |
| US8211231B2 (en) * | 2007-09-26 | 2012-07-03 | Eastman Kodak Company | Delivery device for deposition |
| US8398770B2 (en) * | 2007-09-26 | 2013-03-19 | Eastman Kodak Company | Deposition system for thin film formation |
| US7572686B2 (en) * | 2007-09-26 | 2009-08-11 | Eastman Kodak Company | System for thin film deposition utilizing compensating forces |
| US20090081360A1 (en) * | 2007-09-26 | 2009-03-26 | Fedorovskaya Elena A | Oled display encapsulation with the optical property |
| US8182608B2 (en) * | 2007-09-26 | 2012-05-22 | Eastman Kodak Company | Deposition system for thin film formation |
| US7976631B2 (en) | 2007-10-16 | 2011-07-12 | Applied Materials, Inc. | Multi-gas straight channel showerhead |
| JP5202050B2 (ja) * | 2008-03-14 | 2013-06-05 | 東京エレクトロン株式会社 | シャワーヘッド及び基板処理装置 |
| JP5179389B2 (ja) * | 2008-03-19 | 2013-04-10 | 東京エレクトロン株式会社 | シャワーヘッド及び基板処理装置 |
| JP2011517087A (ja) * | 2008-04-07 | 2011-05-26 | チャーム エンジニアリング シーオー エルティーディー | プラズマ処理装置及びプラズマ処理方法 |
| US9238867B2 (en) | 2008-05-20 | 2016-01-19 | Asm International N.V. | Apparatus and method for high-throughput atomic layer deposition |
| US20090291209A1 (en) * | 2008-05-20 | 2009-11-26 | Asm International N.V. | Apparatus and method for high-throughput atomic layer deposition |
| DE102008024486B4 (de) * | 2008-05-21 | 2011-12-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Plasmastempel, Plasmabehandlungsvorrichtung, Verfahren zur Plasmabehandlung und Herstellungsverfahren für einen Plasmastempel |
| GB0816186D0 (en) * | 2008-09-05 | 2008-10-15 | Aviza Technologies Ltd | Gas delivery device |
| US8071165B2 (en) * | 2008-08-08 | 2011-12-06 | International Solar Electric Technology, Inc. | Chemical vapor deposition method and system for semiconductor devices |
| EP2159304A1 (en) | 2008-08-27 | 2010-03-03 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Apparatus and method for atomic layer deposition |
| CN102308368B (zh) * | 2008-12-04 | 2014-02-12 | 威科仪器有限公司 | 用于化学气相沉积的进气口元件及其制造方法 |
| US8293013B2 (en) * | 2008-12-30 | 2012-10-23 | Intermolecular, Inc. | Dual path gas distribution device |
| KR101190750B1 (ko) * | 2009-02-19 | 2012-10-12 | 엘지전자 주식회사 | 실리콘 박막 제조방법 및 제조장치 |
| NL2002590C2 (en) * | 2009-03-04 | 2010-09-07 | Univ Delft Technology | Apparatus and process for atomic or molecular layer deposition onto particles during pneumatic transport. |
| US8931431B2 (en) | 2009-03-25 | 2015-01-13 | The Regents Of The University Of Michigan | Nozzle geometry for organic vapor jet printing |
| US8307854B1 (en) | 2009-05-14 | 2012-11-13 | Vistadeltek, Inc. | Fluid delivery substrates for building removable standard fluid delivery sticks |
| TWI534922B (zh) | 2009-06-10 | 2016-05-21 | 威士塔戴爾泰克有限責任公司 | 極端流量和/或高溫流體輸送基板 |
| EP2281921A1 (en) | 2009-07-30 | 2011-02-09 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Apparatus and method for atomic layer deposition. |
| US20110023775A1 (en) * | 2009-07-31 | 2011-02-03 | E.I. Du Pont De Nemours And Company | Apparatus for atomic layer deposition |
| US8657959B2 (en) * | 2009-07-31 | 2014-02-25 | E I Du Pont De Nemours And Company | Apparatus for atomic layer deposition on a moving substrate |
| US20110097491A1 (en) * | 2009-10-27 | 2011-04-28 | Levy David H | Conveyance system including opposed fluid distribution manifolds |
| US20110097489A1 (en) * | 2009-10-27 | 2011-04-28 | Kerr Roger S | Distribution manifold including multiple fluid communication ports |
| WO2011062779A1 (en) | 2009-11-20 | 2011-05-26 | Eastman Kodak Company | Method for selective deposition and devices |
| US20110120544A1 (en) | 2009-11-20 | 2011-05-26 | Levy David H | Deposition inhibitor composition and method of use |
| US7998878B2 (en) * | 2009-11-20 | 2011-08-16 | Eastman Kodak Company | Method for selective deposition and devices |
| EP2360293A1 (en) | 2010-02-11 | 2011-08-24 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for depositing atomic layers on a substrate |
| EP2362002A1 (en) | 2010-02-18 | 2011-08-31 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Continuous patterned layer deposition |
| US8803203B2 (en) | 2010-02-26 | 2014-08-12 | Eastman Kodak Company | Transistor including reentrant profile |
| EP2362411A1 (en) * | 2010-02-26 | 2011-08-31 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Apparatus and method for reactive ion etching |
| US7923313B1 (en) | 2010-02-26 | 2011-04-12 | Eastman Kodak Company | Method of making transistor including reentrant profile |
| FI124414B (fi) * | 2010-04-30 | 2014-08-29 | Beneq Oy | Lähde ja järjestely substraatin käsittelemiseksi |
| US9184028B2 (en) | 2010-08-04 | 2015-11-10 | Lam Research Corporation | Dual plasma volume processing apparatus for neutral/ion flux control |
| US8869742B2 (en) * | 2010-08-04 | 2014-10-28 | Lam Research Corporation | Plasma processing chamber with dual axial gas injection and exhaust |
| FI20105909A0 (fi) * | 2010-08-30 | 2010-08-30 | Beneq Oy | Suutinpää |
| US8133806B1 (en) | 2010-09-30 | 2012-03-13 | S.O.I.Tec Silicon On Insulator Technologies | Systems and methods for forming semiconductor materials by atomic layer deposition |
| US8486192B2 (en) | 2010-09-30 | 2013-07-16 | Soitec | Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods |
| TWI541378B (zh) | 2010-10-16 | 2016-07-11 | 奧特科技公司 | 原子層沉積鍍膜系統及方法 |
| US8847226B2 (en) | 2011-01-07 | 2014-09-30 | Eastman Kodak Company | Transistor including multiple reentrant profiles |
| US8847232B2 (en) | 2011-01-07 | 2014-09-30 | Eastman Kodak Company | Transistor including reduced channel length |
| WO2012094109A1 (en) | 2011-01-07 | 2012-07-12 | Eastman Kodak Company | Transistor including reduced channel length |
| US8304347B2 (en) | 2011-01-07 | 2012-11-06 | Eastman Kodak Company | Actuating transistor including multiple reentrant profiles |
| US8383469B2 (en) | 2011-01-07 | 2013-02-26 | Eastman Kodak Company | Producing transistor including reduced channel length |
| US8338291B2 (en) | 2011-01-07 | 2012-12-25 | Eastman Kodak Company | Producing transistor including multiple reentrant profiles |
| US7985684B1 (en) | 2011-01-07 | 2011-07-26 | Eastman Kodak Company | Actuating transistor including reduced channel length |
| US8409937B2 (en) | 2011-01-07 | 2013-04-02 | Eastman Kodak Company | Producing transistor including multi-layer reentrant profile |
| US8492769B2 (en) | 2011-01-07 | 2013-07-23 | Eastman Kodak Company | Transistor including multi-layer reentrant profile |
| EP2661776A2 (en) | 2011-01-07 | 2013-11-13 | Eastman Kodak Company | Transistor including multiple reentrant profiles |
| EP2481832A1 (en) | 2011-01-31 | 2012-08-01 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Apparatus for atomic layer deposition |
| EP2481830A1 (en) | 2011-01-31 | 2012-08-01 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Apparatus for atomic layer deposition. |
| EP2481833A1 (en) | 2011-01-31 | 2012-08-01 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Apparatus for atomic layer deposition |
| US20120222620A1 (en) | 2011-03-01 | 2012-09-06 | Applied Materials, Inc. | Atomic Layer Deposition Carousel with Continuous Rotation and Methods of Use |
| US8617942B2 (en) | 2011-08-26 | 2013-12-31 | Eastman Kodak Company | Producing transistor including single layer reentrant profile |
| US8592909B2 (en) | 2011-08-26 | 2013-11-26 | Eastman Kodak Company | Transistor including single layer reentrant profile |
| US8637355B2 (en) | 2011-08-26 | 2014-01-28 | Eastman Kodak Company | Actuating transistor including single layer reentrant profile |
| US9175393B1 (en) * | 2011-08-31 | 2015-11-03 | Alta Devices, Inc. | Tiled showerhead for a semiconductor chemical vapor deposition reactor |
| US10066297B2 (en) * | 2011-08-31 | 2018-09-04 | Alta Devices, Inc. | Tiled showerhead for a semiconductor chemical vapor deposition reactor |
| US9212422B2 (en) | 2011-08-31 | 2015-12-15 | Alta Devices, Inc. | CVD reactor with gas flow virtual walls |
| US8865576B2 (en) | 2011-09-29 | 2014-10-21 | Eastman Kodak Company | Producing vertical transistor having reduced parasitic capacitance |
| US8623757B2 (en) | 2011-09-29 | 2014-01-07 | Eastmak Kodak Company | Producing a vertical transistor including reentrant profile |
| US8273654B1 (en) | 2011-09-29 | 2012-09-25 | Eastman Kodak Company | Producing a vertical transistor including reentrant profile |
| US8803227B2 (en) | 2011-09-29 | 2014-08-12 | Eastman Kodak Company | Vertical transistor having reduced parasitic capacitance |
| US9109754B2 (en) * | 2011-10-19 | 2015-08-18 | Applied Materials, Inc. | Apparatus and method for providing uniform flow of gas |
| CN104081456B (zh) | 2011-11-23 | 2018-07-03 | 康宁股份有限公司 | 用于保护玻璃板的气相沉积方法 |
| US8618003B2 (en) | 2011-12-05 | 2013-12-31 | Eastman Kodak Company | Method of making electronic devices using selective deposition |
| WO2013108751A1 (ja) * | 2012-01-16 | 2013-07-25 | 株式会社アルバック | 成膜装置 |
| US9748125B2 (en) | 2012-01-31 | 2017-08-29 | Applied Materials, Inc. | Continuous substrate processing system |
| WO2013113875A1 (en) * | 2012-02-02 | 2013-08-08 | Centre De Recherche Public Henri Tudor | Superamphiphobic surfaces by atmospheric plasma polymerization |
| US20130243971A1 (en) * | 2012-03-14 | 2013-09-19 | Applied Materials, Inc. | Apparatus and Process for Atomic Layer Deposition with Horizontal Laser |
| KR101399894B1 (ko) * | 2012-03-21 | 2014-06-27 | 주식회사 테스 | 인젝터 모듈 및 이를 사용하는 플라즈마 반응 장치 |
| US9267205B1 (en) | 2012-05-30 | 2016-02-23 | Alta Devices, Inc. | Fastener system for supporting a liner plate in a gas showerhead reactor |
| FI124298B (en) * | 2012-06-25 | 2014-06-13 | Beneq Oy | Device for treating substrate surface and nozzle head |
| US8846545B2 (en) | 2012-08-31 | 2014-09-30 | Eastman Kodak Company | Method of forming patterned thin film dielectric stack |
| US8791023B2 (en) | 2012-08-31 | 2014-07-29 | Eastman Kodak Company | Patterned thin film dielectric layer formation |
| US8927434B2 (en) | 2012-08-31 | 2015-01-06 | Eastman Kodak Company | Patterned thin film dielectric stack formation |
| US8653516B1 (en) | 2012-08-31 | 2014-02-18 | Eastman Kodak Company | High performance thin film transistor |
| US9493874B2 (en) | 2012-11-15 | 2016-11-15 | Cypress Semiconductor Corporation | Distribution of gas over a semiconductor wafer in batch processing |
| US9527107B2 (en) * | 2013-01-11 | 2016-12-27 | International Business Machines Corporation | Method and apparatus to apply material to a surface |
| JP6333941B2 (ja) | 2013-03-11 | 2018-05-30 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 高温処理チャンバリッド及びそれを備えた処理チャンバ |
| NL2010893C2 (en) | 2013-05-30 | 2014-12-02 | Solaytec B V | Injector head for atomic layer deposition. |
| US9209513B2 (en) | 2013-06-07 | 2015-12-08 | Apple Inc. | Antenna window and antenna pattern for electronic devices and methods of manufacturing the same |
| US20140374806A1 (en) | 2013-06-19 | 2014-12-25 | Lee W. Tutt | Four terminal transistor |
| US8946070B2 (en) | 2013-06-19 | 2015-02-03 | Eastman Kodak Company | Four terminal transistor fabrication |
| US8937016B2 (en) | 2013-06-21 | 2015-01-20 | Eastman Kodak Company | Substrate preparation for selective area deposition |
| US8921236B1 (en) | 2013-06-21 | 2014-12-30 | Eastman Kodak Company | Patterning for selective area deposition |
| KR102173047B1 (ko) * | 2013-10-10 | 2020-11-03 | 삼성디스플레이 주식회사 | 기상 증착 장치 |
| CN106030761B (zh) | 2014-01-27 | 2019-09-13 | 威科仪器有限公司 | 用于化学气相沉积系统的晶片载体及其制造方法 |
| JP6204213B2 (ja) * | 2014-01-28 | 2017-09-27 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| US9153698B2 (en) | 2014-03-06 | 2015-10-06 | Eastman Kodak Company | VTFT with gate aligned to vertical structure |
| US9202898B2 (en) | 2014-03-06 | 2015-12-01 | Eastman Kodak Company | Fabricating VTFT with polymer core |
| US9123815B1 (en) | 2014-03-06 | 2015-09-01 | Eastman Kodak Company | VTFTs including offset electrodes |
| US9142647B1 (en) | 2014-03-06 | 2015-09-22 | Eastman Kodak Company | VTFT formation using selective area deposition |
| US9236486B2 (en) | 2014-03-06 | 2016-01-12 | Eastman Kodak Company | Offset independently operable VTFT electrodes |
| WO2015134082A1 (en) | 2014-03-06 | 2015-09-11 | Eastman Kodak Company | Vtft with polymer core |
| US9153445B2 (en) | 2014-03-06 | 2015-10-06 | Eastman Kodak Company | Forming a VTFT with aligned gate |
| US9147770B1 (en) | 2014-03-06 | 2015-09-29 | Eastman Kodak Company | VTFT with extended electrode |
| US9117914B1 (en) | 2014-03-06 | 2015-08-25 | Eastman Kodak Company | VTFT with polymer core |
| US9093470B1 (en) | 2014-03-06 | 2015-07-28 | Eastman Kodak Company | VTFT formation using capillary action |
| US9178029B2 (en) | 2014-03-06 | 2015-11-03 | Eastman Kodak Company | Forming a VTFT gate using printing |
| US9198283B2 (en) | 2014-03-06 | 2015-11-24 | Eastman Kodak Company | Vertically spaced electrode structure |
| US9214560B2 (en) | 2014-03-06 | 2015-12-15 | Eastman Kodak Company | VTFT including overlapping electrodes |
| US9129993B1 (en) | 2014-03-06 | 2015-09-08 | Eastman Kodak Company | Forming a VTFT using printing |
| US9331205B2 (en) | 2014-03-06 | 2016-05-03 | Eastman Kodak Company | VTFT with post, cap, and aligned gate |
| EP2960059B1 (en) | 2014-06-25 | 2018-10-24 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
| US11267012B2 (en) * | 2014-06-25 | 2022-03-08 | Universal Display Corporation | Spatial control of vapor condensation using convection |
| US11220737B2 (en) | 2014-06-25 | 2022-01-11 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
| US9620501B1 (en) | 2014-09-16 | 2017-04-11 | Eastman Kodak Company | Enhancement-depletion mode circuit element with differential passivation |
| US9634145B2 (en) | 2014-10-29 | 2017-04-25 | Eastman Kodak Company | TFT substrate with variable dielectric thickness |
| US9368490B2 (en) | 2014-10-29 | 2016-06-14 | Eastman Kodak Company | Enhancement-depletion mode inverter with two transistor architectures |
| US9443887B1 (en) | 2015-06-12 | 2016-09-13 | Eastman Kodak Company | Vertical and planar TFTS on common substrate |
| US9368491B2 (en) | 2014-10-29 | 2016-06-14 | Eastman Kodak Company | Enhancement mode inverter with variable thickness dielectric stack |
| DE102014117492A1 (de) * | 2014-11-28 | 2016-06-02 | Aixtron Se | Vorrichtung zum Abscheiden einer Schicht auf einem Substrat |
| KR101533032B1 (ko) * | 2015-02-03 | 2015-07-01 | 성균관대학교산학협력단 | 박막 증착 장치 |
| US9653493B2 (en) | 2015-06-12 | 2017-05-16 | Eastman Kodak Company | Bottom-gate and top-gate VTFTs on common structure |
| US9401430B1 (en) | 2015-06-12 | 2016-07-26 | Eastman Kodak Company | VTFT with a top-gate structure |
| JP6811732B2 (ja) * | 2015-06-17 | 2021-01-13 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 処理チャンバ中のガス制御 |
| KR102420015B1 (ko) * | 2015-08-28 | 2022-07-12 | 삼성전자주식회사 | Cs-ald 장치의 샤워헤드 |
| US10566534B2 (en) | 2015-10-12 | 2020-02-18 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
| CH712199A1 (de) * | 2016-03-07 | 2017-09-15 | Fofitec Ag | Vorrichtung zur Abscheidung dünner Schichten auf einem Substrat und Rollenmaterial mit einem Substrat mit solchen Schichten. |
| US10020327B2 (en) | 2016-06-07 | 2018-07-10 | Eastman Kodak Company | Method for selective thin film deposition |
| JP2017218636A (ja) * | 2016-06-08 | 2017-12-14 | 株式会社神戸製鋼所 | 成膜装置 |
| US9859308B1 (en) | 2016-07-29 | 2018-01-02 | Eastman Kodak Company | Multiple TFTs on common vertical support element |
| US9799752B1 (en) | 2016-10-31 | 2017-10-24 | Eastman Kodak Company | Method for forming a thin-film transistor |
| US10501848B2 (en) | 2017-03-14 | 2019-12-10 | Eastman Kodak Company | Deposition system with modular deposition heads |
| US20180265977A1 (en) | 2017-03-14 | 2018-09-20 | Eastman Kodak Company | Deposition system with vacuum pre-loaded deposition head |
| US10422038B2 (en) | 2017-03-14 | 2019-09-24 | Eastman Kodak Company | Dual gas bearing substrate positioning system |
| US11248292B2 (en) | 2017-03-14 | 2022-02-15 | Eastman Kodak Company | Deposition system with moveable-position web guides |
| US10550476B2 (en) | 2017-03-14 | 2020-02-04 | Eastman Kodak Company | Heated gas-bearing backer |
| US10584413B2 (en) | 2017-03-14 | 2020-03-10 | Eastman Kodak Company | Vertical system with vacuum pre-loaded deposition head |
| US10400332B2 (en) * | 2017-03-14 | 2019-09-03 | Eastman Kodak Company | Deposition system with interlocking deposition heads |
| US10895011B2 (en) | 2017-03-14 | 2021-01-19 | Eastman Kodak Company | Modular thin film deposition system |
| US20180265970A1 (en) * | 2017-03-14 | 2018-09-20 | Eastman Kodak Company | Porous gas-bearing backer |
| US10435788B2 (en) | 2017-03-14 | 2019-10-08 | Eastman Kodak | Deposition system with repeating motion profile |
| KR102344996B1 (ko) * | 2017-08-18 | 2021-12-30 | 삼성전자주식회사 | 전구체 공급 유닛, 기판 처리 장치 및 그를 이용한 반도체 소자의 제조방법 |
| RU2679031C1 (ru) * | 2017-11-21 | 2019-02-05 | Открытое акционерное общество "Научно-исследовательский институт точного машиностроения" | Устройство для осаждения тонких пленок из газовой фазы |
| CN112888572B (zh) * | 2018-10-10 | 2024-04-16 | 科迪华公司 | 用于支撑和输送基板的系统和方法 |
| US11306396B2 (en) * | 2018-11-30 | 2022-04-19 | Meidensha Corporation | Oxide film forming device |
| TWI725444B (zh) * | 2019-06-04 | 2021-04-21 | 金碳洁股份有限公司 | 循環式磊晶沉積系統及其氣體分流模組 |
| CN110331383B (zh) * | 2019-07-29 | 2024-03-01 | 陕西煤业化工技术研究院有限责任公司 | 一种材料表面处理气体喷射装置 |
| NL2025781B1 (en) | 2020-06-08 | 2022-01-28 | Sald Ip B V | Atomic layer deposition head and method |
| NL2025783B1 (en) | 2020-06-08 | 2022-01-28 | Sald Ip B V | Atomic layer deposition head unit and method |
| CN114959651B (zh) * | 2022-05-23 | 2023-10-20 | 西安近代化学研究所 | 一种模块化的ald反应气体分布器、系统及制备涂层的方法 |
| GB2638181A (en) | 2024-02-14 | 2025-08-20 | Nanoprint Innovations Ltd | Gas manifold |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4590042A (en) * | 1984-12-24 | 1986-05-20 | Tegal Corporation | Plasma reactor having slotted manifold |
| US6521048B2 (en) * | 1994-07-18 | 2003-02-18 | Asml Us, Inc. | Single body injector and deposition chamber |
Family Cites Families (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3588176A (en) | 1968-11-13 | 1971-06-28 | Ibm | Article transport system and method |
| FI57975C (fi) * | 1979-02-28 | 1980-11-10 | Lohja Ab Oy | Foerfarande och anordning vid uppbyggande av tunna foereningshinnor |
| NL8203318A (nl) | 1982-08-24 | 1984-03-16 | Integrated Automation | Inrichting voor processing van substraten. |
| JPS61294812A (ja) * | 1985-06-24 | 1986-12-25 | Hitachi Ltd | 気相浮上エピタキシヤル成長装置 |
| JPS62142783A (ja) * | 1985-12-18 | 1987-06-26 | Canon Inc | プラズマcvd法による堆積膜形成装置 |
| JP2679073B2 (ja) * | 1987-01-27 | 1997-11-19 | 旭硝子株式会社 | 常圧cvd用ガス導入ノズル |
| US4809744A (en) * | 1987-10-08 | 1989-03-07 | James River Corporation | Uniform fluid distribution system |
| DE4011933C2 (de) * | 1990-04-12 | 1996-11-21 | Balzers Hochvakuum | Verfahren zur reaktiven Oberflächenbehandlung eines Werkstückes sowie Behandlungskammer hierfür |
| CA2016970A1 (en) * | 1990-05-16 | 1991-11-16 | Prasad N. Gadgil | Inverted diffusion stagnation point flow reactor for vapor deposition of thin films |
| US5137047A (en) | 1990-08-24 | 1992-08-11 | Mark George | Delivery of reactive gas from gas pad to process tool |
| EP0518524B1 (en) * | 1991-05-30 | 1996-09-04 | Hitachi, Ltd. | Valve and semiconductor fabricating equipment using the same |
| US5851602A (en) * | 1993-12-09 | 1998-12-22 | Applied Materials, Inc. | Deposition of high quality conformal silicon oxide thin films for the manufacture of thin film transistors |
| US5589002A (en) * | 1994-03-24 | 1996-12-31 | Applied Materials, Inc. | Gas distribution plate for semiconductor wafer processing apparatus with means for inhibiting arcing |
| JPH0945624A (ja) * | 1995-07-27 | 1997-02-14 | Tokyo Electron Ltd | 枚葉式の熱処理装置 |
| US5595602A (en) * | 1995-08-14 | 1997-01-21 | Motorola, Inc. | Diffuser for uniform gas distribution in semiconductor processing and method for using the same |
| US6183565B1 (en) | 1997-07-08 | 2001-02-06 | Asm International N.V | Method and apparatus for supporting a semiconductor wafer during processing |
| US5981970A (en) | 1997-03-25 | 1999-11-09 | International Business Machines Corporation | Thin-film field-effect transistor with organic semiconductor requiring low operating voltages |
| US6302964B1 (en) * | 1998-06-16 | 2001-10-16 | Applied Materials, Inc. | One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system |
| US6148761A (en) * | 1998-06-16 | 2000-11-21 | Applied Materials, Inc. | Dual channel gas distribution plate |
| US6289842B1 (en) * | 1998-06-22 | 2001-09-18 | Structured Materials Industries Inc. | Plasma enhanced chemical vapor deposition system |
| KR100331544B1 (ko) * | 1999-01-18 | 2002-04-06 | 윤종용 | 반응챔버에 가스를 유입하는 방법 및 이에 사용되는 샤워헤드 |
| EP1879213B1 (en) * | 1999-05-26 | 2012-03-14 | Tokyo Electron Limited | Plasma processing apparatus |
| US6245192B1 (en) * | 1999-06-30 | 2001-06-12 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
| US6432832B1 (en) * | 1999-06-30 | 2002-08-13 | Lam Research Corporation | Method of improving the profile angle between narrow and wide features |
| JP2001064777A (ja) * | 1999-08-30 | 2001-03-13 | Ebara Corp | ガス噴射ヘッド |
| US6503330B1 (en) * | 1999-12-22 | 2003-01-07 | Genus, Inc. | Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition |
| JP3578398B2 (ja) * | 2000-06-22 | 2004-10-20 | 古河スカイ株式会社 | 成膜用ガス分散プレート及びその製造方法 |
| KR100516844B1 (ko) * | 2001-01-22 | 2005-09-26 | 동경 엘렉트론 주식회사 | 처리 장치 및 처리 방법 |
| SG94753A1 (en) * | 2001-02-06 | 2003-03-18 | Inst Of High Performance Compu | Microvalve devices |
| US7456439B1 (en) * | 2001-03-22 | 2008-11-25 | T-Ram Semiconductor, Inc. | Vertical thyristor-based memory with trench isolation and its method of fabrication |
| EP1804274A3 (en) * | 2001-03-28 | 2007-07-18 | Tadahiro Ohmi | Plasma processing apparatus |
| SG104976A1 (en) * | 2001-07-13 | 2004-07-30 | Asml Us Inc | Modular injector and exhaust assembly |
| WO2003063222A1 (en) * | 2002-01-24 | 2003-07-31 | Sumitomo Precision Products Co., Ltd. | Ozone-processing device |
| US6793733B2 (en) * | 2002-01-25 | 2004-09-21 | Applied Materials Inc. | Gas distribution showerhead |
| US7356764B2 (en) | 2002-04-24 | 2008-04-08 | Intel Corporation | System and method for efficient processing of XML documents represented as an event stream |
| US20050084610A1 (en) | 2002-08-13 | 2005-04-21 | Selitser Simon I. | Atmospheric pressure molecular layer CVD |
| US6821563B2 (en) * | 2002-10-02 | 2004-11-23 | Applied Materials, Inc. | Gas distribution system for cyclical layer deposition |
| JP4364494B2 (ja) * | 2002-10-07 | 2009-11-18 | 積水化学工業株式会社 | プラズマ表面処理装置 |
| US20040142558A1 (en) * | 2002-12-05 | 2004-07-22 | Granneman Ernst H. A. | Apparatus and method for atomic layer deposition on substrates |
| US7218873B2 (en) | 2003-03-31 | 2007-05-15 | Canon Kabushiki Kaisha | Image generating apparatus |
| US7601223B2 (en) * | 2003-04-29 | 2009-10-13 | Asm International N.V. | Showerhead assembly and ALD methods |
| US20050178336A1 (en) | 2003-07-15 | 2005-08-18 | Heng Liu | Chemical vapor deposition reactor having multiple inlets |
| US20050103265A1 (en) * | 2003-11-19 | 2005-05-19 | Applied Materials, Inc., A Delaware Corporation | Gas distribution showerhead featuring exhaust apertures |
| US7380707B1 (en) | 2004-02-25 | 2008-06-03 | Jpmorgan Chase Bank, N.A. | Method and system for credit card reimbursements for health care transactions |
| JP2006005316A (ja) * | 2004-06-21 | 2006-01-05 | Seiko Epson Corp | プラズマ処理装置 |
| KR100731164B1 (ko) * | 2005-05-19 | 2007-06-20 | 주식회사 피에조닉스 | 샤워헤드를 구비한 화학기상 증착 방법 및 장치 |
| US7456429B2 (en) * | 2006-03-29 | 2008-11-25 | Eastman Kodak Company | Apparatus for atomic layer deposition |
| US8348683B2 (en) | 2010-10-28 | 2013-01-08 | The Wiremold Company | Electrical pop out device |
| US7789961B2 (en) * | 2007-01-08 | 2010-09-07 | Eastman Kodak Company | Delivery device comprising gas diffuser for thin film deposition |
| US20080166880A1 (en) * | 2007-01-08 | 2008-07-10 | Levy David H | Delivery device for deposition |
| US11136667B2 (en) * | 2007-01-08 | 2021-10-05 | Eastman Kodak Company | Deposition system and method using a delivery head separated from a substrate by gas pressure |
| US8182608B2 (en) * | 2007-09-26 | 2012-05-22 | Eastman Kodak Company | Deposition system for thin film formation |
| US7851380B2 (en) * | 2007-09-26 | 2010-12-14 | Eastman Kodak Company | Process for atomic layer deposition |
| US7858144B2 (en) * | 2007-09-26 | 2010-12-28 | Eastman Kodak Company | Process for depositing organic materials |
| US7572686B2 (en) * | 2007-09-26 | 2009-08-11 | Eastman Kodak Company | System for thin film deposition utilizing compensating forces |
| US7972898B2 (en) * | 2007-09-26 | 2011-07-05 | Eastman Kodak Company | Process for making doped zinc oxide |
| US20090079328A1 (en) * | 2007-09-26 | 2009-03-26 | Fedorovskaya Elena A | Thin film encapsulation containing zinc oxide |
| US8211231B2 (en) * | 2007-09-26 | 2012-07-03 | Eastman Kodak Company | Delivery device for deposition |
| US20090095222A1 (en) * | 2007-10-16 | 2009-04-16 | Alexander Tam | Multi-gas spiral channel showerhead |
| FR2925980B1 (fr) * | 2007-12-28 | 2010-06-04 | St Microelectronics Sa | Plot de contact electrique |
| CN102709731A (zh) | 2012-05-04 | 2012-10-03 | 东莞高得电工器材有限公司 | 一种防触电的电源插座 |
-
2007
- 2007-01-08 US US11/620,740 patent/US7789961B2/en active Active
- 2007-12-26 JP JP2009544853A patent/JP5466019B2/ja not_active Expired - Fee Related
- 2007-12-26 EP EP07868038.6A patent/EP2102383B1/en active Active
- 2007-12-26 EP EP15183410.8A patent/EP2980271B1/en active Active
- 2007-12-26 EP EP14150790.5A patent/EP2743372A1/en not_active Withdrawn
- 2007-12-26 WO PCT/US2007/026326 patent/WO2008085474A2/en not_active Ceased
- 2007-12-26 EP EP14150797.0A patent/EP2730674B1/en active Active
-
2008
- 2008-01-07 TW TW097100593A patent/TWI419992B/zh not_active IP Right Cessation
-
2010
- 2010-06-11 US US12/813,552 patent/US20100248423A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4590042A (en) * | 1984-12-24 | 1986-05-20 | Tegal Corporation | Plasma reactor having slotted manifold |
| US6521048B2 (en) * | 1994-07-18 | 2003-02-18 | Asml Us, Inc. | Single body injector and deposition chamber |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010515823A (ja) | 2010-05-13 |
| TW200839028A (en) | 2008-10-01 |
| EP2102383A2 (en) | 2009-09-23 |
| US7789961B2 (en) | 2010-09-07 |
| US20080166884A1 (en) | 2008-07-10 |
| EP2980271B1 (en) | 2018-02-21 |
| EP2730674B1 (en) | 2015-09-09 |
| EP2730674A1 (en) | 2014-05-14 |
| US20100248423A1 (en) | 2010-09-30 |
| EP2980271A1 (en) | 2016-02-03 |
| JP5466019B2 (ja) | 2014-04-09 |
| WO2008085474A3 (en) | 2008-11-06 |
| EP2102383B1 (en) | 2017-01-25 |
| EP2743372A1 (en) | 2014-06-18 |
| WO2008085474A2 (en) | 2008-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI419992B (zh) | 用於薄膜沈積之輸送裝置 | |
| US7572686B2 (en) | System for thin film deposition utilizing compensating forces | |
| US8211231B2 (en) | Delivery device for deposition | |
| US10351954B2 (en) | Deposition system and method using a delivery head separated from a substrate by gas pressure | |
| US20080166880A1 (en) | Delivery device for deposition | |
| JP2010541236A (ja) | 反応性ガスを空間的に分離するガス配送ヘッドを用い、配送ヘッドを通過する基板の移動を伴う、薄膜形成のための方法及び堆積装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |