TWI419825B - Micro - sensing of electronic components of the test classification machine - Google Patents

Micro - sensing of electronic components of the test classification machine Download PDF

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TWI419825B
TWI419825B TW98134178A TW98134178A TWI419825B TW I419825 B TWI419825 B TW I419825B TW 98134178 A TW98134178 A TW 98134178A TW 98134178 A TW98134178 A TW 98134178A TW I419825 B TWI419825 B TW I419825B
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micro
test
sensing electronic
machine
electronic components
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TW98134178A
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TW201113211A (en
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Hon Tech Inc
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微感測電子元件之測試分類機Micro-sensing electronic component test sorting machine

本發明係提供一種可有效縮減機構配置,並易於作多軸向角度運動測試,以大幅節省成本及提升測試品質之測試分類機。The invention provides a test sorting machine which can effectively reduce the configuration of the mechanism and is easy to perform multi-axial angular motion test, thereby greatly saving cost and improving test quality.

按,微感測電子元件於製作完成後,必須執行角度運動測試作業以確保品質,並淘汰出不良品,請參閱第1圖,係為目前微感測電子元件之測試分類機,其包含設於機台10前端之供料裝置11、複數個收料裝置12及空盤裝置13,其中,該供料裝置11係承置待測之微感測電子元件,複數個收料裝置12係承置不同等級完測之微感測電子元件,空盤裝置13則接收供料裝置11處之空料盤或補充收料裝置12處所需之空料盤,機台10之後端則設有角度運動測試裝置14,該角度運動測試裝置14係設有二角度測試機,請參閱第2圖,各角度測試機係設有升降機構、Y軸向旋轉機構及X軸向旋轉機構,該升降機構係以馬達141經傳動組142帶動一承置板143作升降位移,並於承置板143上架設有X軸向旋轉機構,該X軸向旋轉機構係以另一馬達144驅動第一承架145作X軸向旋轉角度運動,並於第一承架145上架設有Y軸向旋轉機構,該Y軸向旋轉機構係以又一馬達146驅動第二承架147作Y軸向旋轉角度運動,並以第二承架147承置具複數個測試座149之測試板148,測試板148可將微感測電子元件之測試訊號傳輸至測試器(圖未示出),測試器再將測試結果傳輸至中央控制單元,由中央控制單元控制各裝置作動,另於機台10上設有輸送裝置15,該輸送裝置15係以一可作X-Y-Z軸向位移之第一取放器151於供料裝置11處取出待測之微感測電子元件16,並移載至一可作X軸向位移之第一載台152上,第一載台152係將待測之微感測電子元件16載送至角度運動測試裝置14處,再以一可作X-Y-Z軸向位移之第二取放器153於第一載台152上取出待測之微感測電子元件16,並移載至角度測試機之測試座149上以進行旋轉角度測試作業,於測試作業完畢後,一可作X-Y-Z軸向位移之第三取放器154即於測試座149上取出完測之微感測電子元件16,並移載至一可作X軸向位移之第二載台155上,該第二載台155則將完測之微感測電子元件16載出角度運動測試裝置14,一可作X-Y-Z軸向位移之第四取放器156則於第二載台155取出完測之微感測電子元件16,並依檢測結果移載至收料裝置12而分類收置;惟,該角度測試機必須配置一升降機構供裝配X軸向旋轉機構及Y軸向旋轉機構,以帶動測試座149升降作動,又必須於X軸向旋轉機構上裝配Y軸向旋轉機構,方可使測試座149及微感測電子元件16作二軸向之旋轉角度運動測試,不僅角度測試機之各機構設計複雜,以致製作繁瑣耗時而增加成本,測試作業亦僅限於作X-Y軸向旋轉角度測試,致使檢測品質無法有效提升,再者,該輸送裝置15係必須於角度測試機處配置第二取放器153及第三取放器154,用以分別取放待測/完測之微感測電子元件16,不僅增加製作成本,亦相當佔用機台10空間,而不利於空間配置。According to the micro-sensing electronic components, after the completion of the production, the angular motion test must be performed to ensure the quality and eliminate the defective products. Please refer to Figure 1, which is the current tester for micro-sensing electronic components. The feeding device 11 at the front end of the machine table 10, the plurality of receiving devices 12 and the empty disk device 13, wherein the feeding device 11 is for holding the micro-sensing electronic components to be tested, and the plurality of receiving devices 12 are The micro-sensing electronic components are measured at different levels, and the empty disk device 13 receives the empty tray at the feeding device 11 or the empty tray required at the replenishing device 12, and the rear end of the machine table 10 is provided with an angle. The motion testing device 14 is provided with a two-angle testing machine. Referring to FIG. 2, each angle testing machine is provided with a lifting mechanism, a Y-axis rotating mechanism and an X-axis rotating mechanism. The motor 141 drives a receiving plate 143 for lifting displacement via the transmission group 142, and an X-axis rotating mechanism is mounted on the receiving plate 143, and the X-axis rotating mechanism drives the first carrier with another motor 144. 145 for X-axis rotation angle movement, and the first bearing The frame 145 is provided with a Y-axis rotation mechanism, and the Y-axis rotation mechanism drives the second frame 147 to drive the Y-axis rotation angle, and the second frame 147 carries the plurality of tests. The test board 148 of the socket 149, the test board 148 can transmit the test signal of the micro-sensing electronic component to the tester (not shown), and the tester transmits the test result to the central control unit, and the central control unit controls each device. Actuated, the machine 10 is provided with a conveying device 15 for taking out the micro-sensing electronic component 16 to be tested at the feeding device 11 by a first pick-and-placer 151 capable of axial displacement of XYZ. And transferring to a first stage 152 capable of X-axis displacement, the first stage 152 carries the micro-sensing electronic component 16 to be tested to the angular motion testing device 14, and then The second pick-and-place device 153 for XYZ axial displacement takes the micro-sensing electronic component 16 to be tested on the first stage 152 and transfers it to the test stand 149 of the angle tester for the rotation angle test operation. After the test operation is completed, a third pick-and-place 154 that can be used for XYZ axial displacement is tested. The micro-sensing electronic component 16 is taken out from the holder 149 and transferred to a second stage 155 which can be X-axis displaced. The second stage 155 will be finished with the micro-sensing electronic component 16 Carrying the angular motion testing device 14, a fourth pick-and-place device 156 capable of XYZ axial displacement takes the measured micro-sensing electronic component 16 on the second stage 155, and transfers to the receiving device according to the detection result. 12, the classification and storage; however, the angle tester must be equipped with a lifting mechanism for assembling the X-axis rotation mechanism and the Y-axis rotation mechanism to drive the test seat 149 to move up and down, and must be assembled on the X-axis rotation mechanism. The axial rotation mechanism can make the test socket 149 and the micro-sensing electronic component 16 perform the two-axis rotational angle motion test, and the design of each mechanism of the angle tester is complicated, so that the production is cumbersome and time-consuming, and the cost is increased. It is only limited to the XY axial rotation angle test, so that the detection quality cannot be effectively improved. Furthermore, the conveying device 15 must configure the second pick-and-placer 153 and the third pick-and-placer 154 at the angle testing machine for respectively taking Micro-sensing electronic element to be tested/completed Item 16, not only increases the production cost, but also occupies space of the machine 10, which is not conducive to space configuration.

本發明之目的一,係提供一種微感測電子元件之測試分類機,包含供料裝置、收料裝置、角度運動測試裝置及輸送裝置,該供料裝置係容納待測之微感測電子元件,收料裝置係容納不同等級完測之微感測電子元件,角度運動測試裝置係設有至少一具測試座之多軸向關節式角度測試機,輸送裝置係於供料裝置處取出待測之微感測電子元件,並移載至角度測試機之測試座上,角度測試機即帶動測試座及微感測電子元件執行多軸向角度運動測試,於測試完畢後,輸送裝置再於測試座取出完測之微感測電子元件,並依測試結果將完測之微感測電子元件移載至收料裝置而分類收置;藉此,可有效縮減機構配置及簡化組裝作業,達到大幅節省設備成本之實用效益。A first object of the present invention is to provide a test sorting machine for micro-sensing electronic components, comprising a feeding device, a receiving device, an angular motion testing device and a conveying device, which are to accommodate the micro-sensing electronic components to be tested. The receiving device is for accommodating different levels of micro-sensing electronic components, and the angular motion testing device is provided with at least one multi-axial joint angle tester with test seats, and the conveying device is taken out at the feeding device for testing. The micro-sensing electronic component is transferred to the test socket of the angle tester, and the angle tester drives the test socket and the micro-sensing electronic component to perform the multi-axial angular motion test. After the test is completed, the transport device is tested again. The micro-sensing electronic component is taken out and the measured micro-sensing electronic components are transferred to the receiving device according to the test result, and the device is classified and stored; thereby, the mechanism configuration and the assembly operation can be effectively reduced, and the device can be greatly reduced. Save on the practical benefits of equipment costs.

本發明之目的二,係提供一種微感測電子元件之測試分類機,其中,該角度運動測試裝置係於一多軸向關節式之角度測試機上裝配測試座,而可使測試座上之微感測電子元件進行四軸以上之旋轉角度運動測試,使微感測電子元件作全方位之測試作業,不侷限於二軸向測試作業,達到提升測試品質之實用效益。A second object of the present invention is to provide a test sorting machine for micro-sensing electronic components, wherein the angular motion test device is mounted on a multi-axial joint type angle tester, and the test stand can be mounted on the test stand. The micro-sensing electronic component performs a rotational angle motion test of four or more axes, so that the micro-sensing electronic component can perform a full-scale test operation, which is not limited to the two-axis test operation, and achieves the practical benefit of improving the test quality.

本發明之目的三,係提供一種微感測電子元件之測試分類機,其中,該輸送裝置可於供、收料裝置處或角度運動測試裝置處設置取放器,用以移載待測/完測之微感測電子元件,而有效簡化機構配置,達到節省成本及減少機構佔用機台空間,以利於空間配置之實用效益。A third object of the present invention is to provide a test sorting machine for micro-sensing electronic components, wherein the transporting device can be provided with a pick-and-place device at the feeding and receiving device or the angular motion testing device for transferring the test/ The micro-sensing electronic components are completed, which effectively simplifies the configuration of the mechanism, saves costs and reduces the space occupied by the mechanism, so as to facilitate the practical benefits of space configuration.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如后:請參閱第3圖,本發明測試分類機係於機台20之前端設有供料裝置30、收料裝置40及空盤裝置50,該機台20之後端則設有角度運動測試裝置60,用以測試微感測電子元件,另於機台20上設有輸送裝置70,用以於供、收料裝置30、40及角度運動測試裝置60間移載待測/完測之微感測電子元件;該供料裝置30係容納至少一盛裝待測微感測電子元件之料盤31,收料裝置40係設有複數個空的料盤41,並可依測試結果分級盛裝良品之完測微感測電子元件、不良品之完測微感測電子元件及次級品之完測微感測電子元件,空盤裝置50則可接收供料裝置30處空的料盤31,或將空的料盤31補充於收料裝置40,請配合參閱第4、5圖,該角度運動測試裝置60係設有至少一角度測試機61,該角度測試機61係具有一為機械手臂之多軸向關節式角度運動機構611,該多軸向關節式之角度運動機構611係可作四軸(如X-Y-Z-θ)以上之全方位角度運動,並設有承架612供承置具複數個測試座614之測試板613,該測試座614可為常閉型測試座或常開型測試座,本實施例之測試座614係為常開型測試座,而於承架612上設有一可移動下壓常開型測試座614內微感測電子元件之下壓件615,用以下壓定位微感測電子元件,若測試座614為常閉型測試座時,承架612上可移動下壓之下壓件615,則會先移動下壓開啟常閉型測試座,以供待測之微感測電子元件置入常閉型測試座後,接著下壓件615移出脫離下壓常閉型測試座,常閉型測試座即會自動關閉定位微感測電子元件,無論常閉型測試座或常開型測試座,皆可使微感測電子元件避免於旋轉角度運動測試的過程中自測試座614內脫出,使得角度運動機構611可帶動測試座614及待測之微感測電子元件執行多軸向之旋轉角度運動測試作業,並使測試器(圖未示出)將測試結果傳輸至中央控制單元,由中央控制單元控制各裝置作動,該輸送裝置70係包含有承載機構71及移料機構72,該承載機構71係具有至少一載台,本實施例之承載機構71係於供料裝置30之後方設有供料載台711,用以承載待測之微感測電子元件,於收料裝置40之後方則設有收料載台712,用以承載完測之微感測電子元件,該移料機構72係設有至少一取放器,本實施例之移料機構72係設有第一取放器721及第二取放器722,該第一取放器721係可作X-Y-Z軸向位移,用以於供、收料裝置30、40及承載機構71間取放待測/完測之微感測電子元件,第二取放器722係設於角度測試機61之承架612上,並可作Y-Z軸向位移,用以於測試座614及承載機構71間取放待測/完測之微感測電子元件。In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment and a drawing will be described in detail. As follows: Referring to FIG. 3, the test sorting machine of the present invention is provided at the front end of the machine table 20. The feeding device 30, the receiving device 40 and the empty disk device 50, the rear end of the machine table 20 is provided with an angular motion testing device 60 for testing the micro sensing electronic components, and the conveying device 70 is provided on the machine table 20. For transferring the micro-sensing electronic component to be tested/finished between the feeding and receiving device 30, 40 and the angular motion testing device 60; the feeding device 30 is for accommodating at least one micro sensing electronic component to be tested The tray 31 and the receiving device 40 are provided with a plurality of empty trays 41, and the micro-sensing electronic components, the micro-sensing electronic components and the secondary products of the defective products can be classified according to the test results. After the measurement of the micro-sensing electronic component, the empty disk device 50 can receive the tray 31 empty at the feeding device 30, or replenish the empty tray 31 to the receiving device 40, please refer to the fourth and fifth figures. The angle motion testing device 60 is provided with at least one angle testing machine 61, and the angle testing machine 61 The utility model has a multi-axial joint type angular motion mechanism 611 which is a mechanical arm, and the multi-axial joint type angular motion mechanism 611 can be used for four-axis (for example, XYZ-θ) or more omnidirectional angular motion, and is provided with a frame. The test 612 is a normally closed test stand or a normally open test stand. The test stand 614 of the embodiment is a normally open test stand, and the test stand 614 is a normally open test stand. The carrier 612 is provided with a micro-sensing electronic component lower pressing member 615 in the movable lower pressing type test socket 614, and the micro sensing electronic component is positioned by the following pressure. If the test socket 614 is a normally closed type test socket, The support member 612 can move the lower pressing member 615, and then move the lower pressing to open the normally closed type test seat, so that the micro sensing electronic component to be tested is placed in the normally closed type test seat, and then the lower pressing member is pressed. The 615 is removed from the normally closed test stand, and the normally closed test stand automatically closes the positioning micro-sensing electronic component. Regardless of the normally closed test stand or the normally open test stand, the micro-sensing electronic components can be avoided. During the rotation angle motion test, it is taken out from the test seat 614, so that the angle is transported The mechanism 611 can drive the test socket 614 and the micro-sensing electronic component to be tested to perform a multi-axis rotational angle motion test operation, and cause the tester (not shown) to transmit the test result to the central control unit, and the central control unit Controlling the operation of each device, the transport device 70 includes a carrying mechanism 71 and a loading mechanism 72. The carrying mechanism 71 has at least one loading base. The carrying mechanism 71 of the present embodiment is provided behind the feeding device 30. The material loading stage 711 is configured to carry the micro sensing electronic component to be tested, and the receiving device 712 is disposed behind the receiving device 40 for carrying the measured micro sensing electronic component. The loading mechanism 72 The pick-up mechanism 72 of the embodiment is provided with a first pick-and-place mechanism 721 and a second pick-and-placer 722, and the first pick-and-placer 721 can be used for XYZ axial displacement. The micro-sensing electronic component to be tested/finished is taken between the feeding and receiving device 30, 40 and the carrying mechanism 71, and the second pick-and-place device 722 is disposed on the frame 612 of the angle testing machine 61, and The YZ axial displacement is used for picking up the test/testing between the test seat 614 and the bearing mechanism 71. Sensing electronics.

請參閱第6圖,本發明於初始狀態時,輸送裝置70之移料機構72係以第一取放器721作X-Y-Z軸向位移,於供料裝置30之料盤31上取出待測之微感測電子元件81,並移載置入於供料載台711上。Referring to FIG. 6, in the initial state, the material transfer mechanism 72 of the conveying device 70 is axially displaced by the first pick-and-placer 721, and the micrometer to be tested is taken out from the tray 31 of the feeding device 30. The electronic component 81 is sensed and placed on the loading stage 711.

請參閱第7、8、9圖,由於角度測試機61之角度運動機構611可作至少X-Y-Z-θ四軸向位移,而可以角度運動機構611帶動第二取放器722直接位移至供料載台711處,使第二取放器722取出待測之微感測電子元件81,並移載至測試座614,於測試座614置入待測之微感測電子元件81後,該下壓件615即移動下壓微感測電子元件81,使微感測電子元件81穩固的電性接觸於測試座614,之後,該角度運動機構611即帶動測試座614及微感測電子元件81作X-Y-θ之旋轉角度運動測試,並使測試板613將待測之微感測電子元件81的測試訊號傳輸至測試器,測試器再將微感測電子元件81之測試結果傳輸至中央控制單元。Referring to Figures 7, 8, and 9, since the angular motion mechanism 611 of the angle testing machine 61 can perform at least XYZ-θ four-axis displacement, the angular motion mechanism 611 can drive the second pick-and-placer 722 to directly shift to the feeding load. At the stage 711, the second pick-and-place device 722 takes out the micro-sensing electronic component 81 to be tested and transfers it to the test socket 614. After the test socket 614 is placed in the micro-sensing electronic component 81 to be tested, the depression is performed. The member 615 moves the micro-sensing electronic component 81 downwardly to electrically connect the micro-sensing electronic component 81 to the test socket 614. Thereafter, the angular motion mechanism 611 drives the test socket 614 and the micro-sensing electronic component 81. The XY-θ rotation angle motion test is performed, and the test board 613 transmits the test signal of the micro-sensing electronic component 81 to be tested to the tester, and the tester transmits the test result of the micro-sensing electronic component 81 to the central control unit. .

請參閱第10圖,當角度測試機61執行測試作業時,移料機構72係以第一取放器721作X-Y-Z軸向位移,於供料裝置30之料盤31上取出下一待測之微感測電子元件82,並移載置入於供料載台711上。Referring to FIG. 10, when the angle tester 61 performs the test operation, the material transfer mechanism 72 is axially displaced by the first pick-and-placer 721, and the next test piece is taken out on the tray 31 of the feeding device 30. The electronic component 82 is micro-sensed and placed on the loading stage 711.

請參閱第11、12圖,當角度測試機61完成微感測電子元件81之角度運動測試作業後,下壓件615係離開完測之微感測電子元件81,第二取放器722即作Y-Z軸向位移,於測試座614中取出完測之微感測電子元件81,之後,角度運動機構611帶動第二取放器722位移至收料載台712處,使第二取放器722將完測之微感測電子元件81移載置入於收料載台712;請參閱第13圖,該角度運動機構611可再帶動第二取放器722位移至供料載台711,使第二取放器722取出下一待測之微感測電子元件82,並移載置入於測試座614中,以接續執行測試作業,此時,移料機構72係以第一取放器721作X-Y-Z軸向位移,於收料載台712上取出完測之微感測電子元件81,並依測試結果(如良品微感測電子元件、不良品微感測電子元件或次級品微感測電子元件),將完測之微感測電子元件81移載收置於收料裝置40之料盤41上,以完成分類收置作業。Referring to FIGS. 11 and 12, after the angle tester 61 completes the angular motion test operation of the micro-sensing electronic component 81, the lower pressing member 615 is separated from the measured micro-sensing electronic component 81, and the second pick-and-placer 722 is The YZ axial displacement is taken out, and the micro-sensing electronic component 81 is taken out in the test socket 614. Then, the angular motion mechanism 611 drives the second pick-and-placer 722 to the receiving stage 712 to make the second pick-and-placer 722, the completed micro-sensing electronic component 81 is placed on the receiving stage 712; referring to FIG. 13, the angular moving mechanism 611 can further drive the second pick-and-placer 722 to the feeding stage 711. The second pick-and-place device 722 takes out the next micro-sensing electronic component 82 to be tested, and the loading is placed in the test socket 614 to perform the test operation successively. At this time, the loading mechanism 72 is firstly picked and placed. The 721 is axially displaced by XYZ, and the measured micro-sensing electronic component 81 is taken out on the receiving stage 712, and according to the test result (such as good micro-sensing electronic components, defective micro-sensing electronic components or secondary products) Micro-sensing electronic component), transferring the completed micro-sensing electronic component 81 to the tray 41 of the receiving device 40 To complete the job classification stowed.

請參閱第14圖,係本發明測試分類機之另一實施例,係於機台20之前端設有供料裝置30、收料裝置40及空盤裝置50,該機台20之後端則設有複數個角度運動測試裝置60A、60B、60C,用以測試微感測電子元件,另於機台20上設有輸送裝置70A,用以於供、收料裝置30、40及各角度運動測試裝置60A、60B、60C間移載待測/完測之微感測電子元件;該供料裝置30係容納至少一盛裝待測微感測電子元件之料盤31,收料裝置40係設有複數個空的料盤41,並可依測試結果分級盛裝良品之完測微感測電子元件、不良品之完測微感測電子元件及次級品之完測微感測電子元件,空盤裝置50則可接收供料裝置30處空的料盤31,或將空的料盤31補充於收料裝置40,各角度運動測試裝置60A、60B、60C均設有一角度測試機61A、61B、61C,以角度測試機61A為例,該角度測試機61A係具有一為機械手臂之多軸向關節式角度運動機構611A,該多軸向關節式之角度運動機構611A可作四軸(如X-Y-Z-θ)以上之全方位角度運動,並設有承架612A供承置具複數個測試座614A之測試板613A,該測試座614A係為常開型測試座,而於承架612A上設有一可移動下壓常開型測試座614A內微感測電子元件之下壓件615A,用以下壓定位微感測電子元件,使微感測電子元件避免於旋轉角度運動測試的過程中自測試座614A內脫出,使得角度運動機構611A可帶動測試座614A及待測之微感測電子元件執行多軸向之旋轉角度運動測試作業,並使測試器(圖未示出)將測試結果傳輸至中央控制單元,由中央控制單元控制各裝置作動,該輸送裝置70A係設有一移料機構72A,該移料機構72A係設有可同步作X-Y軸向位移之第一取放器721A及第二取放器722A,並使第一、二取放器721A、722A可分別作Z軸向位移,使第一取放器721A於供料裝置30及測試座614A間取放待測之微感測電子元件,第二取放器722A則於收料裝置40及測試座614A間取放完測之微感測電子元件。Referring to FIG. 14, another embodiment of the test sorting machine of the present invention is provided with a feeding device 30, a receiving device 40 and an empty disk device 50 at the front end of the machine table 20, and the rear end of the machine table 20 is provided. There are a plurality of angular motion testing devices 60A, 60B, 60C for testing micro-sensing electronic components, and a transport device 70A is provided on the machine 20 for feeding and receiving devices 30, 40 and various angular motion tests. The micro-sense electronic component to be tested/completed is transferred between the devices 60A, 60B, and 60C; the feeding device 30 houses at least one tray 31 for holding the micro-sensing electronic component to be tested, and the receiving device 40 is provided A plurality of empty trays 41, and according to the test results, the micro-sensing electronic components of the finished products, the micro-sensing electronic components of the defective products, and the micro-sensing electronic components of the sub-products, the empty discs The device 50 can receive the tray 31 empty at the feeding device 30, or replenish the empty tray 31 to the receiving device 40. Each angle motion testing device 60A, 60B, 60C is provided with an angle testing machine 61A, 61B, 61C, taking the angle tester 61A as an example, the angle tester 61A has a multi-axis of a mechanical arm To the articulated angular motion mechanism 611A, the multi-axial articulated angular motion mechanism 611A can perform an omnidirectional angular motion of four axes (eg, XYZ-θ) or more, and is provided with a frame 612A for mounting a plurality of test seats. 614A test board 613A, the test stand 614A is a normally open test stand, and the support 612A is provided with a movable lower pressure normally open type test seat 614A in the micro-sensing electronic component lower press part 615A, with the following The micro-sensing electronic component is pressed and positioned to prevent the micro-sensing electronic component from coming out of the test socket 614A during the rotation angle motion test, so that the angular motion mechanism 611A can drive the test socket 614A and the micro-sensing electronic component to be tested. Performing a multi-axis rotation angle motion test operation, and causing a tester (not shown) to transmit the test result to the central control unit, and the central control unit controls the operation of each device. The transport device 70A is provided with a transfer mechanism 72A. The moving mechanism 72A is provided with a first pick-and-placer 721A and a second pick-and-placer 722A which can be synchronously displaced by XY, and the first and second pick-and-placers 721A, 722A can be respectively displaced in the Z-axis. , the first pick and place device 721A is provided for Device 30 and the sensing electronics micro test to take place between the test blocks 614A, 722A of the second pick and place unit between the feed means 40 in the receiving seat 614A and testing to take place micro End element to sense the sensing electronics.

請參閱第15圖,該移料機構72A係以第一取放器721A作X-Y-Z軸向位移,於供料裝置30之料盤31上取出待測之微感測電子元件83,並移載置入於角度測試機61A之測試座614A內;請參閱第16、17、18圖,角度測試機61A之下壓件615A即移動下壓微感測電子元件83,使微感測電子元件83穩固的電性接觸於測試座614A,之後,該角度運動機構611A即帶動測試座614A及微感測電子元件83作X-Y-θ之旋轉角度運動測試,並使測試板613A將待測之微感測電子元件83的測試訊號傳輸至測試器,測試器再將微感測電子元件83之測試結果傳輸至中央控制單元。Referring to FIG. 15, the material transfer mechanism 72A is axially displaced by the first pick-and-placer 721A, and the micro-sensing electronic component 83 to be tested is taken out from the tray 31 of the feeding device 30, and moved. Into the test stand 614A of the angle tester 61A; please refer to the figures 16, 17, and 18, under the angle tester 61A, the presser 615A moves the micro-sensing electronic component 83 to stabilize the micro-sensing electronic component 83. Electrically contacting the test socket 614A, the angular motion mechanism 611A then drives the test socket 614A and the micro-sensing electronic component 83 to perform a rotational angle motion test of XY-θ, and causes the test board 613A to measure the micro-sensing to be tested. The test signal of the electronic component 83 is transmitted to the tester, and the tester transmits the test result of the micro-sensing electronic component 83 to the central control unit.

請參閱第19圖,當角度測試機61A執行測試作業時,移料機構72A之第一取放器721A則再次於供料裝置30之料盤31上取出下一待測之微感測電子元件84,並移載置入於角度測試機61B之測試座614B內,以執行旋轉角度運動測試作業;請參閱第20、21圖,當角度測試機61A完成微感測電子元件83之角度運動測試作業後,下壓件615A係離開完測之微感測電子元件83,移料機構72A係以第二取放器722A於測試座614A中取出完測之微感測電子元件83,由於第一取放器721A已於供料裝置30處取出另一待測之微感測電子元件85,而可使第一取放器721A將待測之微感測電子元件85置入於測試座614A中,以接續執行測試作業;請參閱第22圖,移料機構72A之第二取放器722A可依測試結果(如良品微感測電子元件、不良品微感測電子元件或次級品微感測電子元件),將完測之微感測電子元件83移載收置於收料裝置40之料盤41上,以完成分類收置作業。Referring to FIG. 19, when the angle tester 61A performs the test operation, the first pick-and-placer 721A of the transfer mechanism 72A takes out the next micro-sensing electronic component to be tested again on the tray 31 of the feeding device 30. 84, and the loading is placed in the test socket 614B of the angle tester 61B to perform the rotation angle motion test operation; please refer to FIGS. 20 and 21, when the angle tester 61A completes the angular motion test of the micro-sensing electronic component 83 After the operation, the lower pressing member 615A is separated from the measured micro-sensing electronic component 83, and the loading mechanism 72A takes out the micro-sensing electronic component 83 in the test socket 614A by the second pick-and-placer 722A, due to the first The pick-and-placer 721A has taken out another micro-sensing electronic component 85 to be tested at the feeding device 30, and the first pick-and-placer 721A can place the micro-sensing electronic component 85 to be tested into the test socket 614A. In order to continue the test operation; please refer to Figure 22, the second pick-and-placer 722A of the transfer mechanism 72A can be based on the test results (such as good micro-sensing electronic components, defective micro-sensing electronic components or secondary products) Measuring the electronic component), transferring the measured micro-sensing electronic component 83 to the receiving and receiving The feeding means 40 on the tray 41 to complete the job classification stowed.

據此,本發明測試分類機可有效縮減機構配置,並作多軸向之角度運動測試,以大幅節省成本及提升測試品質,實為一深具實用性及進步性之設計,然未見有相同之產品及刊物公開,從而允符發明專利申請要件,爰依法提出申請。Accordingly, the test sorting machine of the present invention can effectively reduce the mechanism configuration and perform multi-axial angular motion test, thereby greatly saving cost and improving test quality, and is actually a practical and progressive design, but there is no The same products and publications are made public, so that the requirements for invention patent applications are allowed, and the application is filed according to law.

[習式][Literature]

10...機台10. . . Machine

11...供料裝置11. . . Feeding device

12...收料裝置12. . . Receiving device

13...空盤裝置13. . . Empty disk device

14...角度運動測試裝置14. . . Angle motion test device

141...馬達141. . . motor

142...傳動組142. . . Drive set

143...承置板143. . . Bearing board

144...馬達144. . . motor

145...第一承架145. . . First carrier

146...馬達146. . . motor

147...第二承架147. . . Second carrier

148...測試板148. . . Test board

149...測試座149. . . Test stand

15...輸送裝置15. . . Conveyor

151...第一取放器151. . . First pick and place

152...第一載台152. . . First stage

153...第二取放器153. . . Second pick and place

154...第三取放器154. . . Third pick and place

155...第二載台155. . . Second stage

156...第四取放器156. . . Fourth pick and place

16...微感測電子元件16. . . Micro-sensing electronic component

[本發明][this invention]

20...機台20. . . Machine

30...供料裝置30. . . Feeding device

31...料盤31. . . Trays

40...收料裝置40. . . Receiving device

41...料盤41. . . Trays

50...空盤裝置50. . . Empty disk device

60、60A、60B、60C...角度運動測試裝置60, 60A, 60B, 60C. . . Angle motion test device

61、61A、61B、61C...角度測試機61, 61A, 61B, 61C. . . Angle tester

611、611A...角度運動機構611, 611A. . . Angle motion mechanism

612、612A...承架612, 612A. . . Shelf

613、613A...測試板613, 613A. . . Test board

614、614A、614B...測試座614, 614A, 614B. . . Test stand

615、615A...下壓件615, 615A. . . Lower pressing piece

70、70A...輸送裝置70, 70A. . . Conveyor

71...承載機構71. . . Carrying mechanism

711...供料載台711. . . Feeding platform

712...收料載台712. . . Receiving platform

72、72A...移料機構72, 72A. . . Transfer mechanism

721、721A...第一取放器721, 721A. . . First pick and place

722、722A...第二取放器722, 722A. . . Second pick and place

81、82、83、84、85...微感測電子元件81, 82, 83, 84, 85. . . Micro-sensing electronic component

第1圖:習式測試分類機之配置圖。Figure 1: Configuration diagram of the test test sorter.

第2圖:習式測試分類機之角度運動測試裝置之示意圖。Figure 2: Schematic diagram of the angular motion test device of the conventional test classifier.

第3圖:本發明測試分類機之各裝置配置圖。Figure 3: Configuration diagram of each device of the test sorting machine of the present invention.

第4圖:本發明測試分類機之角度運動測試裝置之示意圖(一)。Figure 4: Schematic diagram (I) of the angular motion test device of the test sorter of the present invention.

第5圖:本發明測試分類機之角度運動測試裝置之示意圖(二)。Figure 5: Schematic diagram of the angular motion test device of the test sorter of the present invention (2).

第6圖:本發明測試分類機之使用示意圖(一)。Figure 6: Schematic diagram of the use of the test sorter of the present invention (1).

第7圖:本發明測試分類機之使用示意圖(二)。Figure 7: Schematic diagram of the use of the test sorter of the present invention (2).

第8圖:本發明測試分類機之使用示意圖(三)。Figure 8: Schematic diagram of the use of the test sorter of the present invention (3).

第9圖:本發明測試分類機之使用示意圖(四)。Figure 9: Schematic diagram of the use of the test sorter of the present invention (4).

第10圖:本發明測試分類機之使用示意圖(五)。Figure 10: Schematic diagram of the use of the test sorter of the present invention (5).

第11圖:本發明測試分類機之使用示意圖(六)。Figure 11: Schematic diagram of the use of the test sorter of the present invention (6).

第12圖:本發明測試分類機之使用示意圖(七)。Figure 12: Schematic diagram of the use of the test sorter of the present invention (7).

第13圖:本發明測試分類機之使用示意圖(八)。Figure 13: Schematic diagram of the use of the test sorter of the present invention (8).

第14圖:本發明測試分類機另一實施例之各裝置配置圖。Figure 14 is a diagram showing the configuration of each device of another embodiment of the test sorting machine of the present invention.

第15圖:本發明測試分類機另一實施例之使用示意圖(一)。Figure 15 is a schematic view showing the use of another embodiment of the test sorting machine of the present invention (I).

第16圖:本發明測試分類機另一實施例之使用示意圖(二)。Figure 16: Schematic diagram of the use of another embodiment of the test sorter of the present invention (2).

第17圖:本發明測試分類機另一實施例之使用示意圖(三)。Figure 17 is a schematic view showing the use of another embodiment of the test sorter of the present invention (3).

第18圖:本發明測試分類機另一實施例之使用示意圖(四)。Figure 18: Schematic diagram of the use of another embodiment of the test sorter of the present invention (4).

第19圖:本發明測試分類機另一實施例之使用示意圖(五)。Figure 19 is a schematic view showing the use of another embodiment of the test sorting machine of the present invention (5).

第20圖:本發明測試分類機另一實施例之使用示意圖(六)。Figure 20: Schematic diagram of the use of another embodiment of the test sorter of the present invention (vi).

第21圖:本發明測試分類機另一實施例之使用示意圖(七)。Figure 21: Schematic diagram of the use of another embodiment of the test sorter of the present invention (7).

第22圖:本發明測試分類機另一實施例之使用示意圖(八)。Figure 22: Schematic diagram of the use of another embodiment of the test sorter of the present invention (VIII).

20...機台20. . . Machine

30...供料裝置30. . . Feeding device

31...料盤31. . . Trays

40...收料裝置40. . . Receiving device

41...料盤41. . . Trays

50...空盤裝置50. . . Empty disk device

60...角度運動測試裝置60. . . Angle motion test device

61...角度測試機61. . . Angle tester

611...角度運動機構611. . . Angle motion mechanism

612...承架612. . . Shelf

613...測試板613. . . Test board

614...測試座614. . . Test stand

615...下壓件615. . . Lower pressing piece

70...輸送裝置70. . . Conveyor

71...承載機構71. . . Carrying mechanism

711...供料載台711. . . Feeding platform

712...收料載台712. . . Receiving platform

72...移料機構72. . . Transfer mechanism

721...第一取放器721. . . First pick and place

722...第二取放器722. . . Second pick and place

Claims (12)

一種微感測電子元件之測試分類機,包含:機台;供料裝置:係設於機台上,用以容納待測之微感測電子元件;收料裝置:係設於機台上,用以容納完測之微感測電子元件;角度運動測試裝置:係設於機台上,並設有具測試座之多軸向關節式角度測試機,該角度測試機係設有多軸向關節式之角度運動機構,並於角度運動機構上設有承架,供裝設具至少一測試座之測試板,該測試板上之測試座係為常開型測試座,以承置微感測電子元件,另承架上設有一可移動下壓微感測電子元件之下壓件,使角度測試機帶動微感測電子元件作多軸向旋轉角度運動測試;輸送裝置:係設於機台上,用以於供、收料裝置及角度運動測試裝置間移載待測/完測之微感測元件;中央控制單元:係用以控制及整合各裝置作動,以執行自動化作業。 A test classification machine for micro-sensing electronic components, comprising: a machine table; a feeding device: is arranged on the machine platform to accommodate the micro-sensing electronic components to be tested; and the receiving device is arranged on the machine platform. The micro-sensing electronic component is used for accommodating the measurement; the angular motion testing device is arranged on the machine table, and is provided with a multi-axial joint angle testing machine with a test seat, and the angle testing machine is provided with multi-axial An articulated angle motion mechanism, and a frame on the angle motion mechanism for mounting a test board having at least one test seat, the test seat on the test board is a normally open test seat for bearing a micro sense The electronic component is measured, and a lower pressing member of the micro-sensing electronic component is arranged on the frame, so that the angle testing machine drives the micro-sensing electronic component to perform multi-axial rotation angle motion test; the conveying device is set on the machine. On the stage, it is used to transfer the micro-sensing components to be tested/completed between the feeding and receiving device and the angle motion testing device; the central control unit is used to control and integrate the devices to perform the automation work. 一種微感測電子元件之測試分類機,包含:機台;供料裝置:係設於機台上,用以容納待測之微感測電子元件;收料裝置:係設於機台上,用以容納完測之微感測電子元件;角度運動測試裝置:係設於機台上,並設有具測試座之多軸向關節式角度測試機,該角度測試機係設有多軸向關節式之角度運動機構,並於角度運動機構上設有承架,供裝設具至少一測試座之測試板,該測試板上之測試座係為常閉型測試座,以承置微感測電子元件,另承架上設有一可移動下壓開啟常閉型測試座之下壓件,使角度測試機帶動微感測電子元件作多軸向旋轉角度運動測試; 輸送裝置:係設於機台上,用以於供、收料裝置及角度運動測試裝置間移載待測/完測之微感測元件;中央控制單元:係用以控制及整合各裝置作動,以執行自動化作業。 A test classification machine for micro-sensing electronic components, comprising: a machine table; a feeding device: is arranged on the machine platform to accommodate the micro-sensing electronic components to be tested; and the receiving device is arranged on the machine platform. The micro-sensing electronic component is used for accommodating the measurement; the angular motion testing device is arranged on the machine table, and is provided with a multi-axial joint angle testing machine with a test seat, and the angle testing machine is provided with multi-axial An articulated angle motion mechanism, and a frame is provided on the angle motion mechanism for mounting a test board having at least one test seat, and the test seat on the test board is a normally closed test seat for bearing a micro sense The electronic component is tested, and a movable lower pressing open normal pressure type test seat lower pressing member is arranged on the frame, so that the angle testing machine drives the micro sensing electronic component to perform multi-axial rotation angle motion test; Conveying device: is arranged on the machine for transferring the micro sensing components to be tested/finished between the feeding and receiving device and the angle motion testing device; the central control unit is used for controlling and integrating the devices To perform automated work. 依申請專利範圍第1或2項所述之微感測電子元件之測試分類機,其中,該供料裝置係設有複數個料盤,用以承置待測之微感測電子元件。 The test sorting machine for micro-sensing electronic components according to claim 1 or 2, wherein the feeding device is provided with a plurality of trays for receiving the micro-sensing electronic components to be tested. 依申請專利範圍第1或2項所述之微感測電子元件之測試分類機,其中,該收料裝置係設有複數個料盤,用以承置不同測試結果之完測微感測電子元件。 The test sorting machine for micro-sensing electronic components according to claim 1 or 2, wherein the receiving device is provided with a plurality of trays for receiving micro-sensing electrons of different test results. element. 依申請專利範圍第1或2項所述之微感測電子元件之測試分類機,其中,該角度運動機構係為機械手臂。 The test sorting machine for micro-sensing electronic components according to claim 1 or 2, wherein the angular motion mechanism is a mechanical arm. 依申請專利範圍第1或2項所述之微感測電子元件之測試分類機,其中,該輸送裝置係設有承載機構及移料機構,該承載機構係於供、收料裝置及角度運動測試裝置間承載待測/完測之微感測電子元件,移料機構係於供、收料裝置、角度運動測試裝置及承載機構間移載待測/完測之微感測電子元件。 The test sorting machine for micro-sensing electronic components according to claim 1 or 2, wherein the conveying device is provided with a carrying mechanism and a feeding mechanism, the loading mechanism is attached to the feeding and receiving device and the angular movement The micro-sense electronic components to be tested/completed are carried between the test devices, and the transfer mechanism is used to transfer the micro-sensing electronic components to be tested/completed between the supply and receiving devices, the angular motion test device and the support mechanism. 依申請專利範圍第6項所述之微感測電子元件之測試分類機,其中,該承載機構係設有至少一載台,用以承載待測/完測之微感測電子元件。 The test classification machine for micro-sensing electronic components according to claim 6, wherein the carrier mechanism is provided with at least one carrier for carrying the micro-sensing electronic components to be tested/finished. 依申請專利範圍第7項所述之微感測電子元件之測試分類機,其中,該承載機構係設有供料載台及收料載台,用以分別承載待測/完測之微感測電子元件。 According to the test classification machine of the micro-sensing electronic component described in claim 7, wherein the carrier mechanism is provided with a feeding stage and a receiving stage for respectively carrying the micro-sensing to be tested/finished Measuring electronic components. 依申請專利範圍第6項所述之微感測電子元件之測試分類機,其中,該移料機構係設有第一取放器及第二取放器,第一取放器係設於供、收料裝置之上方,並可作X-Y-Z軸向位移,用以於供、收料裝置及承載機構間移載待測/完測 之微感測電子元件,第二取放器係設於角度運動測試裝置之角度測試機上,而可作Y-Z軸向位移,用以於角度測試機之測試座及承載機構間移載待測/完測之微感測電子元件。 According to the test classification machine of the micro-sensing electronic component described in claim 6, wherein the material-feeding mechanism is provided with a first pick-and-place device and a second pick-and-place device, and the first pick-and-place device is provided for Above the receiving device, and can be used as XYZ axial displacement for transferring and testing between the feeding and receiving device and the supporting mechanism. The micro-sensing electronic component, the second pick-and-place device is disposed on the angle tester of the angle motion testing device, and can be used as the YZ axial displacement for transferring between the test socket and the bearing mechanism of the angle testing machine. / Complete micro-sensing electronic components. 依申請專利範圍第1或2項所述之微感測電子元件之測試分類機,其中,該輸送裝置係設有移料機構,用以於供、收料裝置及角度運動測試裝置間移載待測/完測之微感測電子元件。 The test sorting machine for micro-sensing electronic components according to claim 1 or 2, wherein the conveying device is provided with a material moving mechanism for transferring between the feeding and receiving device and the angle motion testing device. Micro-sensing electronic components to be tested/completed. 依申請專利範圍第10項所述之微感測電子元件之測試分類機,其中,該移料機構係設有可作X-Y-Z軸向位移之第一、二取放器,第一取放器係於供料裝置及角度運動測試裝置間移載待測之微感測電子元件,第二取放器則於收料裝置及角度運動測試裝置間移載完測之微感測電子元件。 The test classification machine for micro-sensing electronic components according to claim 10, wherein the material-feeding mechanism is provided with first and second pick-and-placers for XYZ axial displacement, and the first pick-and-place device The micro-sensing electronic component to be tested is transferred between the feeding device and the angular motion testing device, and the second pick-and-place device transfers the micro-sensing electronic component between the receiving device and the angular motion testing device. 依申請專利範圍第1或2項所述之應用於微感測電子元件之測試分類機,更包含於機台上設有空盤裝置,用以收置空的料盤,並依需要將空的料盤補充於收料裝置。 The test sorting machine for micro-sensing electronic components according to the scope of claim 1 or 2 of the patent application, further comprising an empty disk device on the machine table for collecting empty trays and emptying as needed The tray is replenished to the receiving device.
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TW200930525A (en) * 2007-11-26 2009-07-16 Yaskawa Denki Seisakusho Kk Vertical multi-joint robot

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