TWI415216B - 具有用於接合之鄰近儲存槽之半導體互連及其製造方法 - Google Patents

具有用於接合之鄰近儲存槽之半導體互連及其製造方法 Download PDF

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Publication number
TWI415216B
TWI415216B TW095147984A TW95147984A TWI415216B TW I415216 B TWI415216 B TW I415216B TW 095147984 A TW095147984 A TW 095147984A TW 95147984 A TW95147984 A TW 95147984A TW I415216 B TWI415216 B TW I415216B
Authority
TW
Taiwan
Prior art keywords
layer
dielectric layer
dielectric
patterned mask
forming
Prior art date
Application number
TW095147984A
Other languages
English (en)
Chinese (zh)
Other versions
TW200746358A (en
Inventor
查特基 里維克
Original Assignee
飛思卡爾半導體公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 飛思卡爾半導體公司 filed Critical 飛思卡爾半導體公司
Publication of TW200746358A publication Critical patent/TW200746358A/zh
Application granted granted Critical
Publication of TWI415216B publication Critical patent/TWI415216B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/063—Manufacture or treatment of conductive parts of the interconnections by forming conductive members before forming protective insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
TW095147984A 2006-01-25 2006-12-20 具有用於接合之鄰近儲存槽之半導體互連及其製造方法 TWI415216B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/339,132 US7579258B2 (en) 2006-01-25 2006-01-25 Semiconductor interconnect having adjacent reservoir for bonding and method for formation

Publications (2)

Publication Number Publication Date
TW200746358A TW200746358A (en) 2007-12-16
TWI415216B true TWI415216B (zh) 2013-11-11

Family

ID=38284743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147984A TWI415216B (zh) 2006-01-25 2006-12-20 具有用於接合之鄰近儲存槽之半導體互連及其製造方法

Country Status (5)

Country Link
US (2) US7579258B2 (https=)
JP (1) JP5138611B2 (https=)
CN (1) CN101496166B (https=)
TW (1) TWI415216B (https=)
WO (1) WO2007100404A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8134235B2 (en) * 2007-04-23 2012-03-13 Taiwan Semiconductor Manufacturing Co., Ltd. Three-dimensional semiconductor device
US8053900B2 (en) * 2008-10-21 2011-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect
US8796822B2 (en) * 2011-10-07 2014-08-05 Freescale Semiconductor, Inc. Stacked semiconductor devices
JP2016018879A (ja) * 2014-07-08 2016-02-01 株式会社東芝 半導体装置および半導体装置の製造方法
US10636767B2 (en) 2016-02-29 2020-04-28 Invensas Corporation Correction die for wafer/die stack
KR102724620B1 (ko) * 2019-11-19 2024-11-01 에스케이하이닉스 주식회사 반도체 메모리 장치
GB2589329B (en) * 2019-11-26 2022-02-09 Plessey Semiconductors Ltd Substrate bonding

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817572A (en) * 1992-06-29 1998-10-06 Intel Corporation Method for forming multileves interconnections for semiconductor fabrication
US6232219B1 (en) * 1998-05-20 2001-05-15 Micron Technology, Inc. Self-limiting method of reducing contamination in a contact opening, method of making contacts and semiconductor devices therewith, and resulting structures
US6887769B2 (en) * 2002-02-06 2005-05-03 Intel Corporation Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07112041B2 (ja) 1986-12-03 1995-11-29 シャープ株式会社 半導体装置の製造方法
JPH04258125A (ja) * 1991-02-13 1992-09-14 Nec Corp 半導体装置
US6097096A (en) 1997-07-11 2000-08-01 Advanced Micro Devices Metal attachment method and structure for attaching substrates at low temperatures
JP2002026056A (ja) * 2000-07-12 2002-01-25 Sony Corp 半田バンプの形成方法及び半導体装置の製造方法
DE10118422B4 (de) 2001-04-12 2007-07-12 Infineon Technologies Ag Verfahren zur Herstellung einer strukturierten metallhaltigen Schicht auf einem Halbleiterwafer
JP3735547B2 (ja) * 2001-08-29 2006-01-18 株式会社東芝 半導体装置及びその製造方法
US6962835B2 (en) 2003-02-07 2005-11-08 Ziptronix, Inc. Method for room temperature metal direct bonding
US7307005B2 (en) 2004-06-30 2007-12-11 Intel Corporation Wafer bonding with highly compliant plate having filler material enclosed hollow core
EP1732116B1 (en) 2005-06-08 2017-02-01 Imec Methods for bonding and micro-electronic devices produced according to such methods

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817572A (en) * 1992-06-29 1998-10-06 Intel Corporation Method for forming multileves interconnections for semiconductor fabrication
US6232219B1 (en) * 1998-05-20 2001-05-15 Micron Technology, Inc. Self-limiting method of reducing contamination in a contact opening, method of making contacts and semiconductor devices therewith, and resulting structures
US6887769B2 (en) * 2002-02-06 2005-05-03 Intel Corporation Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same

Also Published As

Publication number Publication date
TW200746358A (en) 2007-12-16
US7514340B2 (en) 2009-04-07
JP2009524932A (ja) 2009-07-02
CN101496166A (zh) 2009-07-29
CN101496166B (zh) 2010-11-03
WO2007100404A3 (en) 2008-10-09
US20070170585A1 (en) 2007-07-26
US20070170584A1 (en) 2007-07-26
JP5138611B2 (ja) 2013-02-06
US7579258B2 (en) 2009-08-25
WO2007100404A2 (en) 2007-09-07

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