TWI413002B - 無線電頻辨識系統（ｒｆｉｄ）手環及其之製造方法 - Google Patents

無線電頻辨識系統（ｒｆｉｄ）手環及其之製造方法 Download PDF

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TWI413002B
TWI413002B TW095124829A TW95124829A TWI413002B TW I413002 B TWI413002 B TW I413002B TW 095124829 A TW095124829 A TW 095124829A TW 95124829 A TW95124829 A TW 95124829A TW I413002 B TWI413002 B TW I413002B
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layer
bottom layer
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radio frequency
frequency identification
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Robert Singleton
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Innovatier Inc
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/07762—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement making the record carrier wearable, e.g. having the form of a ring, watch, glove or bracelet
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/02—Mechanical actuation
    • G08B13/14—Mechanical actuation by lifting or attempted removal of hand-portable articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B29C2045/14532—Joining articles or parts of a single article injecting between two sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips

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Description

無線電頻辨識系統(RFID)手環及其之製造方法
本發明係有關於無線電頻辨識系統(RFID)手環及其之製造方法。
 發明背景
手環由功能到時尚有許多應用。例如，手環可用作表示手環穿戴者有資格進入管轄地或表演場地的門票。在涉及激烈的體育活動的情形或要顧客保存門票很麻煩的地方(例如，水上公園或音樂會)，使用手環則相當理想。無線電頻辨識(“RFID”)晶片可加入手環以增加功能。一般而言，RFID晶片是用來追蹤產品。帶有RFID晶片的物品可用網路系統追蹤。由於有RFID，網路系統能夠識別RFID晶片的位置，從而手環穿戴者的位置。
通常，在帶有RFID晶片的手環中，壓敏膠(pressure sensitive adhesive)是用來把兩個基板綁在一起，而基板中之一個含有RFID晶片。這種結構只對RFID晶片提供一點點保護或沒有。特別是，習知手環是用只能吸收少量衝擊的薄基板。此外，用於有RFID晶片之習知手環的材料很薄且在被拉伸時有分離和失去連續性的傾向。因此，亟須一種手環以及製造該手環的方法，能夠製成衝擊吸收量有增加的RFID手環，能保護RFID電路，且抗拉強度有增加。
 發明概要
本發明之一具體實施例係有關於一種手環，其係包含：一有一頂面與一底面的底層；一附著於該底層之頂面的無線電頻辨識微處理器；一天線，其係可操作耦合於該無線電頻辨識微處理器且附著於該底層之頂面；一核心層，其係位於該底層上方且附著於該底層、該無線電頻辨識微處理器、及該天線；以及，一頂層，其係位於該核心層上方且附著於該核心層。
本發明之另一具體實施例，該手環更包含一可操作耦合於該無線電頻辨識微處理器的電池。
本發明之另一具體實施例，一種用於製造一手環的方法係包含：提供一有一頂面與一底面的底層；使一無線電頻辨識微處理器附著於該底層之頂面；在該底層之頂面上形成一天線，藉此該天線可操作耦合於該無線電頻辨識微處理器；在該底層之頂面上形成一去能尾端(disabling tail)，藉此該去能尾端可操作耦合於該天線；將該底層裝入一注射模塑裝置；將該頂層裝入該注射模塑裝置且位於該底層之頂面的上方；以及，注射熱塑型高分子材料於該頂層與該底層之頂面之間。
應瞭解，以上的一般描述與以下的詳細說明僅供示範及解釋，且對專利申請專利範圍不具限制性。
圖式簡單說明
由以下說明、申請專利範圍、及附圖中的示範具體實施例可更加明白本發明以上及其他的特徵、觀點、及優點。
第1圖為本發明RFID手環之一具體實施例的頂面橫截 面圖。
第2圖為本發明RFID手環另一具體實施例的側面橫截面圖。
第3圖為本發明RFID手環之一具體實施例的放大圖。
第4圖為注射模塑裝置中在注射核心層之前的RFID手環之側面橫截面圖。
第5圖為注射模塑裝置中在注射核心層之後的RFID手環之橫截面圖。
第6圖為兩個本發明RFID手環之一具體實施例的頂面橫截面圖。
 詳細說明
以下參考附圖說明本發明的具體實施例。應瞭解，以下說明旨在描述本發明的示範具體實施例，而不是要限制本發明。
根據本發明之一具體實施例，如第1與2圖所示，手環1包含一無線電頻辨識(“RFID”)微處理器10、一天線20、一底層30、一頂層40、以及一核心層50。此外，手環1包含肢環(extremity loop)60，其係用於使手環1繫於穿戴者的手腕。
底層30有一頂面31與一底面32。底層30係由任何習知不導電的塑膠材料製成。例如，底層30可由PVC、尼龍、聚酯、聚丙烯、聚碳酸酯、或特斯林(teslin)製成。底層30的底面32係經組配成可顯示文字或任一類型的識別標記。底層30的頂面31可由適合用來容納導電油墨的塑膠化合物 製成。如第1圖所示及以下所述，底層30的頂面31係經組配成可容納及使數個電路元件有垂直穩定性。
如上述，數個電路元件可附著於底層30的頂面31。按需要，該等數個電路元件可置於底層30的頂面31上任一處。手環1的目的及設計功能會明定該等電路元件的位置。功能性也會明定手環內包含那種類型的電路元件。例如，手環1可設有一電池70、一天線20、以及一RFID微處理器10。此外，額外的電路元件可包含(但不受限於)：LED、撓性顯示器及仿真器(emulator)。
根據本發明之一具體實施例，底層30的頂面31係經組配成可容納一RFID微處理器10、一電池70、及一天線20(第1圖)。RFID微處理器10可為數種習知RFID處理器中之任一種。例如，菲利浦SL2 ICS20晶片可用作RFID微處理器10。在本發明之一具體實施例中，以FCP2覆晶構裝(flip-chip package)用作RFID微處理器10。RFID微處理器10經由電路跡線(circuit trace)5而可操作連接至一電池70與一天線20。
如第1圖所示，根據本發明之一具體實施例，在底層30的頂面31上沉積天線20。天線20可由一些材料中之任一構成。例如，天線20可由固態銅線製成。根據本發明另一具體實施例，用導電油墨在底層30的頂面31上印製天線20。如第1圖所示，去能尾端80也可操作連接至天線20。
根據本發明之一具體實施例，如第3圖所示，有兩層導電油墨在底層30的頂面31上形成電路跡線5。第一層導電油墨5a係形成天線20的主迴路(main loop)且包圍去能尾端 80。第一層導電油墨5a也環繞手環1的肢環60延伸。在在第一層導電油墨後，塗上第二層導電油墨5b。如第3圖所示，在第二層導電油墨5b與第一層導電油墨5a相交處，佈置一電介質塗層15於第一導電油墨層5a的上面。
如第2圖所示，頂層40有一底面41與一頂面42。頂層40係由任何習知不導電的塑膠材料製成。例如，頂層40由PVC、尼龍、聚酯、聚丙烯、聚碳酸酯、或特斯林製成。頂層40之頂面42係經組配成可顯示文字或任一類型的識別標記。底面41係經組配成可與一核心層50接觸。
核心層50係位於頂層40與底層30之間且與頂層40的底面41和底層30的頂面31連續接觸。核心層50係由經組配成可使位於底層30頂面31上之電路元件在垂直及水平方向有穩定性的材料製成。此外，核心層50保護電路元件不被物理破壞。核心層50的厚度是在0.005至0.100英吋的範圍內。核心層50的厚度之50%大於在底層30頂面31上之電路元件的厚度較佳。
根據本發明之一具體實施例，核心層50係由一些熱塑型高分子材料中之任一製成。由於有黏著及附著性質，核心熱塑型高分子層50可整合底層30和頂層40以及其餘的元件以形成手環1。
較佳的熱塑材料為：聚胺甲酸酯、環氧樹脂、及不飽和聚酯高分子材料。特別是，由異氰酸(isocyanate)的縮合反應製成的聚胺酯(polyurethane)以及衍生自環氧丙烷或三氯基丁烯氧化物(trichlorobutylene oxide)的多元醇較佳。至 於各種可使用的聚酯，可進一步特徵化為“乙烯不飽和”的特別較佳，因為通過他們的雙鍵而能與相容單體(也有乙烯不飽和性)以及製成頂層40、底層30的材料交聯。實施本發明時適用的更佳環氧樹脂材料是由環氧氯丙烷(epichlorohydrin)與雙酚A、或環氧氯丙烷、以及脂肪族多元醇(aliphatic polyol，例如甘油)製成的。特別較佳是因為彼等能與製成頂層40、底層30的更佳材料(例如，聚氯乙烯)鍵結。
此時根據本發明描述一種用於製造RFID手環1的方法。
首先，提供一底層30。底層30有一頂面31與一底面32。底層30的頂面31上數條電路跡線5。接下來，將數個電路元件安置於底層30的頂面31上且電氣連接至該等電路跡線5。
如第4圖所示，然後，將底層30以整片方式裝入一注射模塑裝置。將頂層40放進注射模塑裝置且定位成使得頂層40是在底層30頂面31的上方。具體言之，該注射模塑裝置可為反應注射模塑機(常以“RIM”簡稱)。該等機器係與上型殼(top mold shell)90與一下型殼95有關，其係能進行冷、低壓、成形操作於製成頂層40及下層30的高分子材料(例如，PVC)中之至少一片。上與下型殼90、95合作的方式已為熟諳高分子材料模塑技藝者所習知。
然後，注射模塑裝置經由噴嘴100(第4與5圖)注入熱塑型高分子材料於頂層40與底層30之間由熱塑型高分子材料形成核心層50。
冷、低壓、成形條件通常是指以下的成形條件：由熱 塑型高分子材料組成的核心層50的溫度小於頂層40與底層30的熱變形溫度(heat distortion temperature)，而壓力約小於500 psi。冷成形溫度小於頂層40與底層30的熱變形溫度至少10℉較佳。多種聚氯乙烯(PVC)材料的熱變形溫度約為230℉。
使用由相對寬的流入區(inflow area)至相對窄的核心區向下變尖且末端在正被形成之手環1本體的前緣或附近的澆口(gate)較佳。最佳的是，該等澆口會由與熱塑材料供給澆道(runner)流體連接、直徑相對寬(例如，約5至約10毫米)的注射口(injection port)向下變窄到直徑相對薄(例如，0.10毫米)的澆口/手環邊緣，在此澆口把熱塑材料饋入空隙空間，最後變成製成手環1的中心或核心。由初始直徑約7.0毫米向下變尖成約0.13毫米最小直徑的澆口在較佳的冷、低壓注射條件下會產生特別良好的結果。
另一可用的視需要特徵是使用具有用於容納“過剩”高分子材料的一或更多容器的型殼，目的是要注入過剩高分子材料於頂層40及下層30之間的空隙空間以便把任何空氣及/或其他氣體(例如，當使用來表示大部份高分子熱塑材料之成份混合在一起時出現的發熱化學反應所形成的氣體)擠出該空隙空間。在注入空隙空間之前(約30秒)混合該等熱塑成份較佳。
一旦核心層50已注射，由該注射模塑裝置移出模製結構。根據本發明之一具體實施例，由一模製片體切出數個手環1。第6圖繪出形成於一片體的數個手環1。然後，將製 成手環1由過剩高分子材料(例如，修整)移出且切成預定的尺寸。修整加工也在一次切割/修整操作中移除過剩的材料。熟諳此藝者也應瞭解，在商業生產作業中，用於製造手環1的模塑裝置大部份會有具有數個空腔(例如，2個、4個、6個、8個、等等)的型殼供同時製作數個手環1。
本發明有數種優點，包括以有成本效益的方式製造一或更數個RFID手環1。在製造及穿戴期間，核心層59對手環1內的電路元件提供更多保護，因而可降低製造成本且提高產出。此外，本發明方法容易設計成一次可製造數個手環1。
以上為了圖解說明及描述本發明，已描述本發明的較佳具體實施例。不希望徹底窮舉或把本發明限定成所揭示的精確形式，且有可能基於上述教導或實施本發明獲得修改及變體。該等具體實施例係經選定及描述以便用來解釋本發明的原理且為實際的應用使得熟諳此藝者能在各種具體實施例中利用本發明且有各種修改適合用於本發明所涵蓋的特殊用途。希望用附上的申請專利範圍及其等價陳述界定本發明的範疇。
1‧‧‧手環
5‧‧‧電路跡線
5a‧‧‧第一層導電油墨
5b‧‧‧第二層導電油墨
10‧‧‧無線電頻辨識(“RFID”)微處理器
15‧‧‧電介質塗層
20‧‧‧天線
30‧‧‧底層
31‧‧‧頂面
32‧‧‧底面
40‧‧‧頂層
41‧‧‧底面
42‧‧‧頂面
50‧‧‧核心層
60‧‧‧肢環
70‧‧‧電池
80‧‧‧去能尾端
90‧‧‧上型殼
95‧‧‧下型殼
100‧‧‧噴嘴
第1圖為本發明RFID手環之一具體實施例的頂面橫截面圖。
第2圖為本發明RFID手環另一具體實施例的側面橫截面圖。
第3圖為本發明RFID手環之一具體實施例的放大圖。
第4圖為注射模塑裝置中在注射核心層之前的RFID手 環之側面橫截面圖。
第5圖為注射模塑裝置中在注射核心層之後的RFID手環之橫截面圖。
第6圖為兩個本發明RFID手環之一具體實施例的頂面橫截面圖。
1‧‧‧手環
5‧‧‧電路跡線
10‧‧‧無線電頻辨識("RFID")微處理器
20‧‧‧天線
30‧‧‧底層
60‧‧‧肢環
70‧‧‧電池
80‧‧‧去能尾端

Claims (21)

  1. 一種手環，其係包含：一有一頂面與一底面的底層；一附著於該底層之該頂面的無線電頻辨識微處理器；一天線，其係可操作地耦合於該無線電頻辨識微處理器且附著於該底層之該頂面；一核心層，其係位於該底層上方且附著該底層，用以包覆該無線電頻辨識微處理器以及該天線；以及一頂層，其係位於該核心層上方且附著於該核心層；其中該核心層係藉由注射熱塑型高分子材料於該頂層與該底層之該頂面之間而形成。
  2. 如申請專利範圍第1項的手環，其更包含一可操作地耦合於該無線電頻辨識微處理器的電池。
  3. 如申請專利範圍第1項的手環，其中該底層之頂面有數個電路跡線，彼等係經組配成可操作地耦合該天線於該無線電頻辨識微處理器。
  4. 如申請專利範圍第3項的手環，其中該等數個電路跡線有一第一電路層與一第二電路層，藉此在該第一電路層與該第二電路層相交之該底層頂面位置有一電介質塗層係位於該第一與該第二電路層之間。
  5. 如申請專利範圍第3項的手環，其中該等電路跡線係以導電油墨形成。
  6. 如申請專利範圍第1項的手環，其中該底層與該頂層由不導電塑膠材料構成。
  7. 如申請專利範圍第1項的手環，其中該核心層由熱塑型高分子材料構成。
  8. 如申請專利範圍第1項的手環，其更包含數個肢環，其係用於使該手環繫於穿戴者的手腕。
  9. 一種手環，其係包含：一有一頂面與一底面的底層；一附著於該底層之該頂面的無線電頻辨識微處理器；一天線，其係可操作地耦合於該無線電頻辨識微處理器且附著於該底層之該頂面；一電池，其係可操作地耦合於該無線電頻辨識微處理器且附著於該底層之該頂面；一核心層，其係位於該底層上方且附著該底層、該無線電頻辨識微處理器以及該天線；以及一頂層，其係位於該核心層上方且附著於該核心層；其中該核心層係藉由注射熱塑型高分子材料於該頂層與該底層之該頂面之間而形成。
  10. 一種手環，其係包含：一有一頂面與一底面的底層；數個電路元件，其係附著於該底層之該頂面；一天線，其係可操作地耦合於該等數個電路元件且 附著於該底層之該頂面；一核心層，其係位於該底層上方且附著於該底層、該等數個電路元件及該天線；以及一頂層，其係位於該核心層上方且附著於該核心層；其中該核心層係藉由注射熱塑型高分子材料於該頂層與該底層之該頂面之間而形成。
  11. 如申請專利範圍第10項的手環，其中該等數個電路元件中之一個包含至少一無線電頻辨識微處理器。
  12. 如申請專利範圍第11項的手環，其中該等數個電路元件中之一個包含至少一電池，其係可操作地耦合於該無線電頻辨識微處理器。
  13. 一種用於製造手環的方法，其係包含下列步驟：提供一有一頂面與一底面的底層；使一無線電頻辨識微處理器附著於該底層之該頂面；在該底層之該頂面上形成一天線，藉此該天線可操作地耦合於該無線電頻辨識微處理器；在該底層之該頂面上形成一去能尾端，藉此該去能尾端可操作地耦合於該天線；將該底層裝入一注射模塑裝置；將位在該底層之該頂面上方之一頂層裝入該注射模塑裝置；以及注射熱塑型高分子材料於該頂層與該底層之該頂 面之間。
  14. 如申請專利範圍第13項的方法，其更包含在該手環上形成數個用於使該手環繫於穿戴者之手腕的肢環。
  15. 如申請專利範圍第13項的方法，其中數個手環係形成自一底層。
  16. 如申請專利範圍第15項的方法，其更包含：自該注射模塑裝置移出經注射之頂層和底層且切成該等數個手環。
  17. 如申請專利範圍第13項的方法，其中該熱塑型高分子材料係在小於該頂或底層之一熱變形溫度之一溫度注射，以及在小於500psi之一壓力注射。
  18. 如申請專利範圍第17項的方法，其中該頂或底層之該熱變形溫度為230℉。
  19. 一種用於製造手環的方法，其係包含下列步驟：提供一有一頂面與一底面的底層；使一無線電頻辨識微處理器附著於該底層之該頂面；使一電池附著於該底層之該頂面，使得它可提供電力給該無線電頻辨識微處理器；在該底層之該頂面上形成一天線，藉此該天線可操作地耦合於該無線電頻辨識微處理器；在該底層之頂面上形成一去能尾端，藉此該去能尾端可操作地耦合於該天線；將該底層裝入一注射模塑裝置；將位在該底層之該頂面上方之一頂層裝入該注射 模塑裝置；以及注射熱塑型高分子材料於該頂層與該底層之該頂面之間。
  20. 如申請專利範圍第19項的方法，其中該熱塑型高分子材料係在小於該頂或底層之一熱變形溫度之一溫度注射，以及在小於500psi之一壓力注射。
  21. 如申請專利範圍第20項的方法，其中該頂或底層之該熱變形溫度為230℉。
TW095124829A 2005-07-15 2006-07-07 無線電頻辨識系統（ｒｆｉｄ）手環及其之製造方法 TWI413002B (zh)

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ATE533373T1 (de) 2011-12-15
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