CN101605474A - Rfid腕带和rfid腕带的制造方法 - Google Patents

Rfid腕带和rfid腕带的制造方法 Download PDF

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CN101605474A
CN101605474A CNA200680025919XA CN200680025919A CN101605474A CN 101605474 A CN101605474 A CN 101605474A CN A200680025919X A CNA200680025919X A CN A200680025919XA CN 200680025919 A CN200680025919 A CN 200680025919A CN 101605474 A CN101605474 A CN 101605474A
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罗伯特·辛格尔顿
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Abstract

本发明提供一种RFID腕带及其制造方法，其中所述腕带由以下部分组成：底层，其具有顶面和底面；射频识别微处理器，其附接到所述底层的所述顶面；天线，其可操作地耦合到所述射频识别微处理器，且附接到所述底层的所述顶面；核心层，其位于所述底层上方，且附接到所述底层、所述射频识别微处理器和所述天线；以及顶层，其位于所述核心层上方，且附接到所述核心层。

Description

RFID腕带和RFID腕带的制造方法
技术领域
背景技术
腕带具有从功能性到时尚性的大量应用。举例来说，可将腕带用作入场券以指示所述腕带的佩戴者有资格进入集合地点或秀场。在涉及剧烈的身体活动的情况下或在对顾客来说保存入场券较累赘的情况(例如水上公园或音乐会)下，腕带是理想的。射频识别(“RFID”)芯片可并入到腕带中从而给予其增加的功能性。一般来说，RFID芯片用于跟踪产品。拥有RFID芯片的物品可被网络系统跟踪。由于RFID的缘故，网络系统能够识别RFID芯片且因此识别腕带的佩戴者的位置。
一般来说，在拥有RFID芯片的腕带中，使用压敏粘合剂来使两个衬底接合在一起，其中所述衬底中的一者含有RFID芯片。此构造对RFID芯片提供较少保护或根本不提供保护。具体地说，常规腕带使用较薄的衬底，所述衬底仅能够吸收少量的震动。另外，具有RFID芯片的常规腕带中所使用的材料较薄，且在被拉伸时具有分离且丧失连续性的可能性。因此，需要一种腕带和构造所述腕带的方法，其能够产生用于吸收增加量的震动、保护RFID电路且拥有增加的抗拉强度的RFID腕带。
发明内容
本发明的一个实施例涉及一种腕带，其包括：底层，其具有顶面和底面；射频识别微处理器，其附接到所述底层的顶面；天线，其可操作地耦合到所述射频识别微处理器，且附接到所述底层的顶面；核心层，其位于所述底层上方，且附接到所述底层、所述射频识别微处理器和所述天线；以及顶层，其位于所述核心层上方，且附接到所述核心层。
根据本发明另一实施例，所述腕带进一步包括电池，所述电池可操作地耦合到所述射频识别微处理器。
根据本发明又一实施例，一种用于制造腕带的方法包含：提供具有顶面和底面的底层；将射频识别微处理器附接到所述底层的所述顶面；在所述底层的所述顶面上形成天线，由此所述天线可操作地耦合到所述射频识别微处理器；在所述底层的所述顶面上形成禁用尾部(disabling tail)，由此所述禁用尾部可操作地耦合到所述天线；将底层装载到注射模制设备中；将位于底层的顶面上方的顶层装载到所述注射模制设备中；以及在顶层与底层的顶面之间注射热固性聚合材料。
应了解，前面的一般描述和以下的详细描述两者都仅仅是示范性和阐释性的，而并非限制所主张的本发明。
附图说明
通过以下描述内容、所附权利要求书和下文简要描述的附图中所示的随附示范性实施例，将明了本发明的这些和其它特征、方面和优势。
图1是根据本发明一个实施例的RFID腕带的俯视横截面图。
图2是根据本发明另一实施例的RFID腕带的侧视横截面图。
图3是根据本发明一个实施例的RFID腕带的放大图。
图4是注射核心层之前，注射模制设备中的RFID腕带的侧视横截面图。
图5是注射核心层之后，注射模制设备中的RFID腕带的横截面图。
图6是根据本发明一个实施例的两个RFID腕带的俯视横截面图。
具体实施方式
下文将参考附图描述本发明的实施例。应了解，以下描述内容意在描述本发明的示范性实施例，且无意限制本发明。
根据本发明一个实施例，如图1和图2中所示，腕带1包括射频识别(“RFID”)微处理器10、天线20、底层30、顶层40和核心层50。另外，腕带1包含用于将腕带1扣紧到佩戴者的手腕的末端扣环(extremity loop)60。
底层30具有顶面31和底面32。底层30由任何不导电的已知常规塑料材料组成。举例来说，底层30可由PVC、尼龙、聚酯、聚丙烯、聚碳酸脂或teslin组成。底层30的底面32经配置以显示字迹或任何类型的识别标记。底层30的顶面31可由适合接纳导电墨水的塑料化合物组成。如图1中所示且下文所描述，底层30的顶面31经配置以接纳多个电路组件并使其垂直稳定。
如上文所述，多个电路组件可附接到底层30的顶面31。所述多个电路组件可根据需要位于底层30的顶面31上的任何地方。腕带1的目的和设计功能性将规定电路组件的位置。功能性还将规定在腕带1内包含何种类型的电路组件。仅出于示范性目的，腕带1中可组装有电池70、天线20和RFID微处理器10。另外，额外的电路组件可包含(但不限于)LED、柔性显示器和仿真器。
根据本发明一个实施例，底层30的顶面31经配置以接纳RFID微处理器10、电池70和天线20(图1中所示)。RFID微处理器10可以是几种已知RFID处理器中的任何一者。举例来说，可将Phillips SL2ICS20芯片用作RFID微处理器10。在本发明的一个实施例中，可将FCP2倒装芯片封装用作RFID微处理器10。RFID微处理器10经由电路迹线5可操作地连接到电池70和天线20。
如图1中所示，根据本发明一个实施例，天线20沉积在底层30的顶面31上。天线20可由许多材料中的任何一种材料组成。举例来说，天线20可由硬铜线组成。根据本发明另一实施例，用导电墨水将天线20印刷在底层30的顶面31上。如图1中所示，禁用尾部80也可操作地连接到天线20。
根据本发明一个实施例，如图3中所示，两个导电墨水层在底层30的顶面31上形成电路迹线5。第一导电墨水层5a形成天线20的主回路，并环绕禁用尾部80。第一导电墨水层5a还围绕腕带1的环60而延伸。在第一导电墨水层之后施加第二导电墨水层5b。如图3中所示，将介电涂层15定位在第一导电墨水层5a上、第二导电墨水层5b与第一导电墨水层5a相交之处。
如图2中所示，顶层40具有底面41和顶面42。顶层40由任何不导电的已知常规塑料材料组成。举例来说，顶层40可由PVC、尼龙、聚酯、聚丙烯、聚碳酸脂或teslin组成。顶层40的顶面42经配置以显示字迹或任何类型的识别标记。底面41经配置以与核心层50接触。
核心层50定位在顶层40与底层30之间，且连续接触顶层40的底面41和底层30的顶面31。核心层50由经配置以使定位在底层30的顶面31上的电路组件在垂直和水平方向上稳定的材料组成。另外，核心层50保护电路组件免受物理损坏。核心层50的厚度在0.005英寸到0.100英寸的范围内。优选地，核心层50比底层30的顶面31上存在的电路组件的厚度厚50％。
根据本发明一个实施例，核心层50由许多热固性聚合材料中的任何一者组成。由于其接合和粘合特性的缘故，核心热固性聚合层50使底层30与顶层40以及其余组件结合，以形成腕带1。
优选热固性材料是聚氨酯、环氧树脂和不饱和的聚酯聚合材料。具体地说，通过异氰酸盐与从环氧丙烷或三氯丁烯氧化物衍生的多元醇的缩合反应制得的聚氨脂是优选的。在可以使用的各种聚酯中，那些可进一步表征为是“乙烯不饱和的”的聚酯尤其优选，因为它们能够通过其双键与相容单体(也含有乙烯不饱和现象)且与制造出顶层40和底层30的材料交联。用于在本发明的实践中使用的更优选的环氧树脂材料将是那些由表氯醇(epichlorohydrin)与双酚A，或表氯醇，和脂族多元醇(例如丙三醇)制成的材料。它们尤其优选，因为它们能够与制造出顶层40和底层30的更优选材料(例如，聚氯乙烯)中的一些材料键合。
现将描述用于制造根据本发明的RFID腕带1的方法。
首先，提供底层30。底层30具有顶面31和底面32。电路迹线5存在于底层30的顶面31上。接下来，将多个电路组件放置到底层30的顶面31上，并将其电连接到电路迹线5。
如图4中所示，接着，将底层30作为一个完整的片装载到注射模制设备中。将顶面40放置到注射模制设备中，且将其定位成使得顶层40位于底层30的顶面31之上。具体地说，注射模制设备可以是反应注射模制机(其常被个别地称为“RIM”)。这些机器与能够对组成顶层40和底层30的聚合材料(例如，PVC)片中的至少一者执行低温低压成形操作的顶模制壳(top mold shell)90和底模制壳95相关联。此类顶模制壳和底模制壳90、95以聚合材料模制领域的技术人员众所周知的方式协作。
接着，注射模制设备经由喷嘴100(图4和图5中所示)在顶层40与底层30之间注射热固性聚合材料，从而用热固性聚合材料形成核心层50。
低温低压成形条件通常意味其中由热固性聚合材料组成的核心层50的温度小于顶层40和底层30的热变形温度且压力小于约500psi的成形条件。优选地，低温成形温度将比顶层40和底层30的热变形温度低至少10°F。许多聚氯乙烯(PVC)材料的热变形温度约为230°F。
优选地，使用闸道(gate)，其从相对较宽的流入区到在正形成的腕带1主体的前沿处或附近终止的相对较窄的核心区域逐渐变细。最优选地，这些闸道将从与热固性材料供应流道形成流体连接的相对较宽直径(例如，从约5mm到约10mm)注射口到其中闸道将热固性材料馈送到最终变成完工的腕带1的中心或核心的空隙空间中的相对较细直径(例如0.10mm)闸道/腕带边缘逐渐变窄。在优选的低温低压注射条件下，从约7.0毫米的初始直径逐渐变细为约0.13mm的最小直径的闸道将产生特别好的结果。
可以使用的另一可选特征是使用模制壳，所述模制壳具有一个或一个以上用于接纳可能特意注射到顶层40与底层30之间的空隙空间中以便将任何空气和/或其它气体(例如，通过当用于配制大多数聚合热固性材料的配料混合在一起时所发生的放热化学反应而形成的那些气体)从所述空隙空间中除去的“过量”聚合材料。这些热固性配料优选恰好在其注射到空隙空间中之前(例如，约30秒前)混合。
一旦已经注射了核心层50，就将经模制的结构从注射模制设备移除。根据本发明的一个实施例，从一个经模制的片中切出若干腕带1。图6描绘形成于一个片上的若干腕带1。接着，将完工的腕带1从过量的聚合材料(例如，通过修剪)移除，并将其切割成某些规定尺寸。修剪工艺还可移除一个切割/修剪操作中的过量材料。所属领域的技术人员还将清楚地了解，用于在商业性产生操作中制造此类腕带1的模制装置将最优选地具有模制壳，所述模制壳具有用于同时制造若干此类腕带1的多个空腔(例如，2个、4个、6个、8个等)。
本发明具有若干优势，其中包含生产一个或一个以上RFID腕带1的节省成本的方式。在制造和佩戴期间，核心层50对腕带1内的电路组件提供更大保护，这又降低了生产成本并提高了生产量。此外，本发明的方法可容易地适合于一次生产多个腕带1。
已经出于说明和描述的目的呈现了对本发明的优选实施例的以上描述内容。不希望所述描述内容是详尽的，或将本发明限于所揭示的精确形式，且根据上文的教示，修改和改变是可能的，或可通过实践本发明而获得所述修改和改变。选择并描述所述实施例是为了阐释本发明的原理，且作为实际应用来使所属领域的技术人员能够以适合于所预期的特定用途的各种实施例以及各种修改来利用本发明。希望本发明的范围由所附权利要求书及其等效物界定。

Claims (17)

1.一种腕带，其包括：
底层，其具有顶面和底面；
射频识别微处理器，其附接到所述底层的所述顶面；
天线，其可操作地耦合到所述射频识别微处理器，且附接到所述底层的所述顶面；
核心层，其定位在所述底层上方，且附接到所述底层、所述射频识别微处理器和所述天线；以及
顶层，其定位在所述核心层上方，且附接到所述核心层。
2.根据权利要求1所述的腕带，其进一步包括电池，所述电池可操作地耦合到所述射频识别微处理器。
3.根据权利要求1所述的腕带，其中所述底层的所述顶面具有多个电路迹线，所述电路迹线经配置以可操作地将所述天线耦合到所述射频识别微处理器。
4.根据权利要求3所述的腕带，其中所述多个电路迹线具有第一电路层和第二电路层，由此介电涂层在所述底层的所述顶面上、所述第一电路层与所述第二电路层相交的位置处定位在所述第一电路层与所述第二电路层之间。
5.根据权利要求3所述的腕带，其中所述电路迹线用导电墨水形成。
6.根据权利要求1所述的腕带，其中所述底层和所述顶层由非导电塑料材料组成。
7.根据权利要求1所述的腕带，其中所述核心层由热固性聚合材料组成。
8.根据权利要求1所述的腕带，其进一步包括用于将所述腕带扣紧到佩戴者的手腕的多个末端扣环。
9.一种腕带，其包括：
底层，其具有顶面和底面；
射频识别微处理器，其附接到所述底层的所述顶面；
天线，其可操作地耦合到所述射频识别微处理器，且附接到所述底层的所述顶面；
电池，其可操作地耦合到所述射频识别微处理器，且附接到所述底层的所述顶面；
核心层，其定位在所述底层上方，且附接到所述底层、所述射频识别微处理器和所述天线；以及
顶层，其定位在所述核心层上方，且附接到所述核心层。
10.一种腕带，其包括：
底层，其具有顶面和底面；
多个电路组件，其附接到所述底层的所述顶面；
天线，其可操作地耦合到所述多个电路组件，且附接到所述底层的所述顶面；
核心层，其定位在所述底层上方，且附接到所述底层、所述多个电路组件和所述天线；以及
顶层，其定位在所述核心层上方，且附接到所述核心层。
11.根据权利要求10所述的腕带，其中所述多个电路组件中的一者包含至少一个射频识别微处理器。
12.根据权利要求10所述的腕带，其中所述多个电路组件中的一者包含至少一个电池，所述电池可操作地耦合到所述射频识别微处理器。
13.一种用于制造腕带的方法，其包括：
提供具有顶面和底面的底层；
将射频识别微处理器附接到所述底层的所述顶面；
在所述底层的所述顶面上形成天线，由此所述天线可操作地耦合到所述射频识别微处理器；
在所述底层的所述顶面上形成禁用尾部，由此所述禁用尾部可操作地耦合到所述天线；
将所述底层装载到注射模制设备中；
将定位在所述底层的所述顶面上方的所述顶层装载到所述注射模制设备中；以及在所述顶层与所述底层的所述顶面之间注射热固性聚合材料。
14.根据权利要求13所述的方法，其进一步包括在所述腕带上形成用于将所述腕带扣紧到佩戴者的手腕的多个末端扣环。
15.根据权利要求13所述的方法，其中多个腕带由一个底层形成。
16.根据权利要求15所述的方法，其进一步包括：将所述经注射的顶层和底层从所述注射模制设备移除，且切下所述多个腕带。
17.一种用于制造腕带的方法，其包括：
提供具有顶面和底面的底层；
将射频识别微处理器附接到所述底层的所述顶面；
将电池附接到所述底层的所述顶面，使得其向所述射频识别微处理器提供功率；
在所述底层的所述顶面上形成天线，由此所述天线可操作地耦合到所述射频识别微处理器；
在所述底层的所述顶面上形成禁用尾部，由此所述禁用尾部可操作地耦合到所述天线；
将所述底层装载到注射模制设备中；
将定位在所述底层的所述顶面上方的顶层装载到所述注射模制设备中；以及
在所述顶层与所述底层的所述顶面之间注射热固性聚合材料。
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CN103340726A (zh) * 2013-06-25 2013-10-09 四川品杰科技有限公司 一种夜光rfid腕带
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EP1910971A4 (en) 2009-11-25
AU2006270395A1 (en) 2007-01-25
EP1910971A2 (en) 2008-04-16
BRPI0612822A2 (pt) 2012-12-11
IL188689A0 (en) 2008-08-07
ATE533373T1 (de) 2011-12-15
TW200713067A (en) 2007-04-01
WO2007011514A2 (en) 2007-01-25
US7607249B2 (en) 2009-10-27
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RU2008105743A (ru) 2009-08-20
US20070012771A1 (en) 2007-01-18

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