TWI410602B - Heat dissipation device having a heat-conducting spreader - Google Patents

Abstract

A heat dissipation device includes a conductive member, a fin unit coupled to a bottom surface of the conductive member and a plurality of LED modules attached to a top surface of the conductive member. The conductive member comprises a first plate, a second plate parallel to the first plate and a plurality of posts embedded in a top surface of the first plate. Peripheries of the first and second plates are in a hermetical conjunction with each other to form a chamber containing phase-changeable working fluid, the first plate has a plurality of receiving recessions which are depressed downwardly from the top surface thereof and respectively receive the posts. A plurality of fasteners extend through the LED modules and are respectively engaged into the posts.

Description

Homothermal plate heat sink

The invention relates to a heat sink heat sink, in particular to a heat sink heat sink for dissipating heat of electronic components such as light-emitting diodes.

As a new generation of light source, the light-emitting diode light source can not replace the traditional incandescent lamp on a large scale, but it has the advantages of long working life, energy saving and environmental protection, and is generally favored by the market. Moreover, the module composed of the light-emitting diode can generate a high-power, high-brightness light source, which can completely replace the existing incandescent lamp for indoor and outdoor illumination, and will also replace the existing light source such as the traditional incandescent lamp widely and revolutionarily. And become the main light source in line with the theme of energy conservation and environmental protection.

However, the greater the power and brightness, the greater the heat generated by the LED or its module, and it is difficult to dissipate in a relatively small volume of the LED package. Therefore, the light-emitting diode still has a large heat-dissipation technology bottleneck, which is also the key point of the most difficult breakthrough in the marketization of high-power, high-brightness light-emitting diode lamps. At present, the heat dissipation scheme commonly used in the industry is to provide a heat sink in the lamp. The heat sink is generally made of a metal material with good thermal conductivity, and has a plurality of heat dissipation fins formed on the bottom plate and the bottom plate.

However, for some high-power light-emitting diode lamps, the heat generation is high, and the heat sink made of metal material alone is difficult to meet the heat dissipation requirement. However, if a fan is provided on the radiator to improve the heat dissipation efficiency, not only the lighting device will be noisy, but also the life and stability of the lighting device will be affected by the instability of the fan.

Due to the uniform temperature characteristics of large-area heat dissipation, the heat-dissipating structure of the soaking plate can be applied to the heat dissipation of the high-power LED lamp to ensure that the heat can be taken away in time, and the heat-dissipating structure light-emitting diode is adopted. The diode of the lamp needs to be closely attached to the heat dissipation structure of the heat equalizing plate. However, the current structure of the heat plate does not meet this requirement, so further improvement is needed.

In view of the above, it is necessary to provide a heat sink heat sink for dissipating heat from the LED module, and a heat sink heat sink for the LED module to be attached thereto.

A heat equalizing plate heat dissipating device comprises a heat equalizing plate, a heat sink group attached to a bottom surface of the heat equalizing plate, and a plurality of light emitting diode modules attached to the top surface of the heat equalizing plate, wherein the heat equalizing plate comprises a first a plate body and a second plate body combined with the first plate body, the first and second plate bodies together form a chamber for mounting a working fluid, and the plurality of fixing columns are mounted on the first plate body and located in the chamber In addition, a plurality of fixing members are coupled to the fixing columns through the LED modules, and the top surface of the first plate body is recessed with a plurality of recesses for accommodating the fixing columns, and the LEDs The first plate body is formed on the top surface of the first plate body, and the first plate body is formed with a protruding portion toward the second plate body at the recessed portion, and the protruding portions abut against the second plate body.

The fixing column embedded on the heat equalizing plate strengthens the strength of the heat equalizing plate to improve the stability of the heat equalizing plate, and can be directly screwed with the fixing member to install the light emitting diode module thereon.

The invention will now be further described in conjunction with the embodiments with reference to the accompanying drawings.

10‧‧‧Homothermal board

12‧‧‧ first board

120‧‧‧Depression

121‧‧‧Protruding

122‧‧‧Fixed edges

124‧‧‧Seal tube

14‧‧‧Second plate

16‧‧‧Fixed column

160‧‧‧ screw holes

20‧‧‧ Heat sink set

22‧‧‧ Heat sink

220‧‧‧Folding

30‧‧‧Lighting diode module

32‧‧‧ boards

320‧‧‧ column through hole

34‧‧‧Lighting diode components

100‧‧‧Fixed parts

1 is a perspective assembled view of a preferred embodiment of a heat sink heat sink of the present invention.

2 is an exploded perspective view of the heat sink heat sink of FIG. 1.

3 is a further exploded view of the heat sink heat sink of FIG. 2.

Figure 4 is an inverted view of Figure 3.

Referring to FIGS. 1 and 2, a heat equalizing plate heat dissipating device in a preferred embodiment of the present invention is configured to dissipate heat from a light emitting component mounted in the light emitting diode lamp. The heat sink heat dissipating device comprises a heat equalizing plate 10, a heat sink group 20 arranged on the bottom surface of the heat equalizing plate 10, and a plurality of light emitting diode modules 30 arranged side by side on the top surface of the heat equalizing plate 10.

Referring to FIG. 3 and FIG. 4 , the heat-receiving plate 10 is rectangular, and is a phase-change heat-conducting casing with a working fluid sealed therein, and includes a first plate body 12 and a first plate body 12 combined with the edge of the first plate body 12 The second plate body 14 and a plurality of fixing posts 16 are embedded on the top surface of the first plate body 12. A plurality of recessed portions 120 are recessed on the top surface of the first plate body 12. The first plate body 12 is protruded from a surface corresponding to the recessed portion 120 to form a protruding portion 121. The recessed portion 120 is in a plurality of columns. Arranged, and each column corresponds to a light-emitting diode module 30, and the recessed portion 120 is sized to accommodate the fixed post 16. The The bottom of the corresponding protrusion portion 121 of the recessed portion 120 can abut against the top surface of the second plate body 14 to strengthen the strength of the heat equalizing plate 10, and the bottom portion thereof can also be separated from the top surface of the second plate body 14 to facilitate the working fluid. Pass through. The first plate body 12 protrudes toward the LED module 30 to form a cavity (not labeled), and the periphery of the cavity is formed with a fixed edge 122. The fixed edge 122 and the periphery of the second plate 14 The sealing body 124 is closed to close the cavity. The sealing edge 122 is provided with a sealing tube 124 communicating with the cavity. The working liquid of the heat equalizing plate 10 can be injected into the cavity of the heat equalizing plate 10 through the sealing tube 124. The cavity top surface and the fixed edge 122 of the first plate body 12 are parallel to the first plate body 12. Each of the fixing posts 16 has a flat cylindrical shape with a flat top end portion and a bottom end portion, and a bottom portion thereof is sealingly welded to the bottom of the recess portion 120 of the first plate body 12 to embed the fixing post 16 in the recess portion 120, and The top of the first plate body 12 is flush with the top surface of the first plate body 12. Each of the fixing posts 16 defines a screw hole 160 extending through the central axis.

The heat sink group 20 includes a plurality of heat sinks 22 arranged in parallel with each other. Each heat sink 22 has a rectangular shape, and a flange 220 is vertically bent at an upper end edge thereof. When all the heat sinks 22 are arranged together, they are The flanges 220 collectively form a plane that is attached to the bottom surface of the heat equalizing plate 10. The fins 22 are perpendicular to the bottom surface of the heat equalizing plate 10 and are parallel to the opposite sides of the heat equalizing plate 10.

The light emitting diode modules 30 are disposed side by side on the top surface of the heat equalizing plate 10, and each of the light emitting diode modules 30 includes a strip circuit board 32 and a plurality of light emitting diodes mounted on the circuit board 32. Element 34. The light emitting diode elements 34 are arranged in two rows and arranged along the length of the circuit board 32. The circuit board 32 defines a row of through holes 320 between the two rows of light emitting diode elements 34. Each LED module A row of through holes 320 corresponds to the screw holes 160 of the row of fixing posts 16 on the heat equalizing plate 10, so that the fixing member 100 passes through the row of through holes 320 and is screwed with the corresponding one of the column holes 160, and the light emitting diodes are The module 30 is fixed to the top surface of the heat equalizing plate 10. A heat conductive medium may be disposed between the light emitting diode module 30 and the heat equalizing plate 10 to improve the thermal conductivity between the light emitting diode module 30 and the heat equalizing plate 10.

When the above-mentioned light-emitting diode lamp is used, the heat generated by the light-emitting diode element 34 can be directly absorbed by the heat-receiving plate 10 and evenly distributed to the heat sink group 20, and the heat is released from the heat sink group 20 into the surrounding air. The heat equalizing plate 10 is a phase change element, and can distribute heat to the heat sink group 20 in a timely and effective manner to be radiated to the surrounding environment, thereby improving heat dissipation efficiency. In addition, the fixing column 16 embedded on the heat equalizing plate 10 strengthens the strength of the heat equalizing plate 10 to improve the stability of the heat equalizing plate 10, and can be directly screwed with the fixing member 100 to facilitate the mounting of the LED module 30. On it.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧Homothermal board

20‧‧‧ Heat sink set 20

30‧‧‧Lighting diode module

Claims (8)

A heat equalizing plate heat dissipating device comprises a heat equalizing plate, a heat sink group attached to a bottom surface of the heat equalizing plate and a plurality of light emitting diode modules attached to the top surface of the heat equalizing plate, wherein the improvement is: the soaking heat The plate includes a first plate body and a second plate body combined with the first plate body. The first and second plate bodies together form a chamber for mounting a working fluid, and the plurality of fixing posts are mounted on the first plate body and The plurality of fixing members are disposed outside the chamber, and the plurality of fixing members are coupled to the fixing columns through the LED modules. The top surface of the first plate body is recessed with a plurality of recessed portions for accommodating the fixing columns. The light emitting diode is mounted on the top surface of the first plate body, and the first plate body is formed with a protruding portion toward the second plate body at the recessed portion, and the protruding portions abut against the second plate body. The heat equalizing plate heat dissipating device according to claim 1, wherein the top surface of the fixing column is flush with the top surface of the first plate body. The heat-sink heat-dissipating device according to claim 1, wherein the fixing column is provided with a screw hole, and has a bottom end portion combined with the bottom portion of the recess portion and a surface coplanar with the top surface of the first plate body. Top part. The heat sink heat sink of claim 1, wherein the first body protrudes toward the LED module to form a cavity and a fixed edge surrounding the cavity, the fixed edge and the fixed edge The second plate is combined. The heat absorbing plate heat dissipating device of claim 4, wherein the first plate body and the cavity have a corresponding rectangular shape, and the first plate body and the top surface and the fixed edge of the cavity are parallel to each other. The heat equalizing plate heat dissipating device according to claim 4, wherein the fixing A sealing tube for injecting and sealing the working fluid is disposed on the edge. The heat sink heat dissipating device of claim 1, wherein each of the light emitting diode modules comprises a strip circuit board and a plurality of light emitting diode components mounted on the circuit board, wherein the circuit board is opened There are a plurality of through holes through which the fixing member passes and is screwed to the screw holes of the heat equalizing plate fixing column. The heat sink heat dissipating device according to claim 7, wherein the through holes of each of the light emitting diode modules are arranged in a row and correspond to one of the screw holes on the heat equalizing plate.