TWI403377B - Method of sealing wide frit using laser - Google Patents

Method of sealing wide frit using laser Download PDF

Info

Publication number
TWI403377B
TWI403377B TW099144898A TW99144898A TWI403377B TW I403377 B TWI403377 B TW I403377B TW 099144898 A TW099144898 A TW 099144898A TW 99144898 A TW99144898 A TW 99144898A TW I403377 B TWI403377 B TW I403377B
Authority
TW
Taiwan
Prior art keywords
laser beam
glass paste
glass
laser
width
Prior art date
Application number
TW099144898A
Other languages
Chinese (zh)
Other versions
TW201213030A (en
Inventor
Hong-Jin Park
Ei-Ho Choi
Sun-Pil Lee
Jung-Hyun Lee
Byoung-Chul Ham
Dae Han Song
Original Assignee
Lts Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lts Co Ltd filed Critical Lts Co Ltd
Publication of TW201213030A publication Critical patent/TW201213030A/en
Application granted granted Critical
Publication of TWI403377B publication Critical patent/TWI403377B/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/206Laser sealing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity

Abstract

A method of sealing wide frit using laser. The method includes emitting a laser beam to frit while moving the laser beam along a direction of application of the frit and reciprocating the laser beam with a width of the frit in a direction which crosses the direction of application of the frit; and disposing a center of the laser beam within the width of the frit while emitting the laser beam to the frit.

Description

使用雷射密封寬玻璃膠的方法Method of using a laser to seal a wide glass paste 【相關申請案參照】[Related application reference]

本申請案根據35 U.S.C. §119(a)之規定,主張2010年9月30日向韓國智財局申請的韓國專利申請案第10-2010-0094882號的權利,為了所有目的,其全文以引用方式併入本文中。The present application claims the benefit of Korean Patent Application No. 10-2010-0094882, filed on Sep. 30, 2010, to the Korean Intellectual Property Office, the entire disclosure of which is hereby incorporated by reference. Incorporated herein.

以下說明有關一種使用雷射密封寬玻璃膠的方法,尤其有關一種使用雷射密封寬玻璃膠,以使用適於保護易受周圍環境影響之OLED的玻璃膠,密封有機發光二極體(OLED)的方法。The following is a description of a method for using a laser-sealed wide glass paste, in particular, a method of using a laser-sealed wide glass paste to seal an organic light-emitting diode (OLED) using a glass paste suitable for protecting an OLED susceptible to the surrounding environment. Methods.

近來,可攜式薄板顯示裝置在作為顯示裝置上獲得越來越多的關注。有機發光二極體(OLED)顯示裝置是一種自發光顯示裝置,其具有大視角、優異的對比、及快速的回應速度,因而被視為下一代的顯示裝置。Recently, portable thin-film display devices have gained more and more attention as display devices. An organic light emitting diode (OLED) display device is a self-luminous display device which has a large viewing angle, excellent contrast, and fast response speed, and thus is regarded as a display device of the next generation.

然而,當濕氣或氧氣進入OLED,由於濕氣或氧氣引起電極氧化或剝落,將減少OLED顯示裝置的壽命。此外,暴露在濕氣或氧氣下將降低發光效率,因而改變光的顏色。However, when moisture or oxygen enters the OLED, the electrode is oxidized or peeled off due to moisture or oxygen, which will reduce the life of the OLED display device. In addition, exposure to moisture or oxygen will reduce the luminous efficiency, thus changing the color of the light.

因此,在製造OLED顯示裝置時,為防止濕氣進入,通常執行密封程序以使OLED與外在環境隔離。如密封方法的範例,為改良布置於OLED元件頂部及底部上的基板之間的黏著性及密封,使用玻璃膠作為密封劑。Therefore, in order to prevent moisture from entering when manufacturing an OLED display device, a sealing process is usually performed to isolate the OLED from the external environment. As an example of a sealing method, in order to improve the adhesion and sealing between substrates disposed on the top and bottom of the OLED element, glass glue is used as a sealant.

如圖1圖解的範例所示,在密封玻璃膠的方法中,在其上布置OLED元件20的基板10外圍部分施加玻璃膠,然後將雷射束L照射在玻璃膠30上,以熔化及固化玻璃膠30,及藉此密封內部。在此例中,在基板10及雷射源之間插入具有布置對應於玻璃膠30之通孔的遮罩40,以防止OLED元件20因雷射束L而損壞。As shown in the example illustrated in FIG. 1, in the method of sealing a glass paste, a glass paste is applied to a peripheral portion of a substrate 10 on which an OLED element 20 is disposed, and then a laser beam L is irradiated onto the glass paste 30 to be melted and cured. The glass glue 30, and thereby seals the interior. In this example, a mask 40 having a through hole corresponding to the glass paste 30 is interposed between the substrate 10 and the laser source to prevent the OLED element 20 from being damaged by the laser beam L.

然而,隨著OLED裝置的面積因對於電視等更大顯示裝置的要求而增加,也增加了玻璃膠的厚度及寬度,因此發射單一雷射束至玻璃膠,且以線性方向移動雷射束以熔化及固化玻璃膠的現有玻璃膠密封方法,無法處理既寬且厚的玻璃膠。However, as the area of the OLED device increases due to the demand for larger display devices such as televisions, the thickness and width of the glass glue are also increased, thereby emitting a single laser beam to the glass glue and moving the laser beam in a linear direction. The existing glass seal method for melting and curing glass glue cannot handle wide and thick glass glue.

由於具有高斯橫截面能量分布的雷射束一般無法在較寬玻璃膠的整個寬度上均勻地提供能量,因此無法實現遍及玻璃膠寬度的理想密封效能。Since a laser beam having a Gaussian cross-sectional energy distribution generally does not provide energy uniformly over the entire width of the wider glass paste, an ideal sealing performance across the width of the glass paste cannot be achieved.

以下說明有關使用雷射密封寬玻璃膠的方法,其能藉由以下方式改良寬玻璃膠的密封效能:在玻璃膠寬度上均勻地提供能量,同時調整移動雷射束的方式、發射至玻璃膠的雷射束數目、雷射束的配置、或雷射束的橫截面能量分布。The following is a description of a method for using a laser-sealed wide glass paste to improve the sealing performance of a wide glass paste by uniformly providing energy over the width of the glass paste while adjusting the manner in which the laser beam is moved and emitted to the glass paste. The number of laser beams, the configuration of the laser beam, or the cross-sectional energy distribution of the laser beam.

在一普遍性方面,提供一種使用雷射密封寬玻璃膠的方法,該方法包括:發射一雷射束至玻璃膠,同時沿著施加該玻璃膠的一方向移動該雷射束,及在一與施加該玻璃膠之該方向相交的方向中,使該雷射束在該玻璃膠之一寬度內往復運動;其中在將該雷射束發射至該玻璃膠時,該雷射束之一中心位在該玻璃膠之該寬度內。In a general aspect, a method of using a laser to seal a wide glass paste is provided, the method comprising: emitting a laser beam to a glass paste while moving the laser beam in a direction in which the glass glue is applied, and Retrieving the laser beam within a width of one of the glass pastes in a direction intersecting the direction in which the glass glue is applied; wherein a center of the laser beam is emitted when the laser beam is emitted to the glass paste Located within this width of the glass glue.

雷射束可利用檢流計掃描器在與施加玻璃膠之方向相交的方向中往復運動,及雷射束可利用線性移動單元沿著施加玻璃膠的方向移動,線性移動單元線性移動檢流計掃描器或玻璃膠所施加至的基板。The laser beam can be reciprocated in a direction intersecting the direction in which the glass glue is applied by the galvanometer scanner, and the laser beam can be moved in the direction in which the glass glue is applied by the linear moving unit, and the linear moving unit linearly moves the galvanometer The substrate to which the scanner or glass glue is applied.

在另一普遍性方面,提供一種使用雷射密封寬玻璃膠的方法,該方法包括:發射至少兩個雷射束至該玻璃膠,該兩個雷射束中心在與施加玻璃膠之一方向相交的一方向中彼此分開,同時沿著施加該玻璃膠之該方向移動該雷射束;其中在將該雷射束發射至該玻璃膠時,該等相應雷射束之中心位在該玻璃膠之一寬度內。In another general aspect, a method of using a laser to seal a wide glass paste is provided, the method comprising: emitting at least two laser beams to the glass frit, the two laser beams being centered in one direction with the application of the glass glue Separating from each other in one direction of intersection, while moving the laser beam in the direction in which the glass glue is applied; wherein when the laser beam is emitted to the glass paste, the center of the respective laser beam is at the glass One of the widths of the glue.

可使用四個布置使其中心形成菱形的光纖,菱形各邊的長度可落在該玻璃膠之寬度內,及可根據其上線性施加玻璃膠的區段或其上以曲線方式施加玻璃膠的區段,透過四個光纖中的至少兩個光纖,將該等雷射束發射至該玻璃膠。Four arrangements can be used to form a diamond-shaped fiber at the center, the length of each side of the diamond can fall within the width of the glass glue, and the glass glue can be applied in a curved manner according to the section on which the glass glue is applied linearly or thereon. The section transmits the laser beam to the glass paste through at least two of the four fibers.

在另一普遍性方面,提供一種使用雷射密封寬玻璃膠的方法,該方法包括:使用一繞射光學元件(DOE)透鏡,沿著與施加該玻璃膠之一方向相交的一方向,將一具有一平頂橫截面能量分布的雷射束發射至玻璃膠,同時在施加該玻璃膠的該方向中移動該雷射束。In another general aspect, a method of using a laser to seal a wide glass paste is provided, the method comprising: using a diffractive optical element (DOE) lens, in a direction intersecting one of the directions in which the glass glue is applied, A laser beam having a flat top cross sectional energy distribution is emitted to the glass glue while the laser beam is moved in the direction in which the glass glue is applied.

該雷射束可具有矩形橫截面。The laser beam can have a rectangular cross section.

該雷射束可具有線性橫截面。The laser beam can have a linear cross section.

該玻璃膠之寬度可等於或大於2 mm。The glass glue may have a width equal to or greater than 2 mm.

從以下「實施方式」、圖式及申請專利範圍中,將明白其他特徵及方面。Other features and aspects will be apparent from the following description of the embodiments, drawings and claims.

提供以下「實施方式」幫助讀者對本文所述方法、設備及/或系統獲得全面性瞭解。因此,熟習本技術者應可設想本文所述方法、設備、及/或系統的各種變更、修改、及等效作法。還有,為了更加清楚及簡潔之故,將省略熟知功能及構造的說明。The following "Implementation" is provided to assist the reader in obtaining a comprehensive understanding of the methods, devices, and/or systems described herein. Thus, various modifications, adaptations, and equivalents of the methods, devices, and/or systems described herein are contemplated by those skilled in the art. Also, descriptions of well-known functions and constructions are omitted for clarity and conciseness.

以下說明將根據以下假設來描述:施加至基板的玻璃膠厚度約2 mm或2 mm以上。對於行動電話顯示器所使用的有機發光二極體(OLED)顯示裝置而言,OLED顯示裝置的面積並不大,因此將OLED元件密封在內的玻璃膠寬度不超過約0.6至0.8 mm。然而,對電視顯示器所使用的OLED顯示裝置而言,由於其面積較大,玻璃膠寬度必須超過2 mm,以充分密封OLED元件。The following description will be described on the assumption that the thickness of the glass paste applied to the substrate is about 2 mm or more. For an organic light emitting diode (OLED) display device used in a mobile phone display, the area of the OLED display device is not large, so the width of the glass glue sealing the OLED element is not more than about 0.6 to 0.8 mm. However, for an OLED display device used in a television display, the glass paste width must exceed 2 mm due to its large area to sufficiently seal the OLED element.

圖2圖解使用雷射密封寬玻璃膠之方法範例的示意圖,及圖3圖解實施圖2所示方法的組態範例。2 illustrates a schematic diagram of an example of a method of using a laser to seal a wide glass paste, and FIG. 3 illustrates a configuration example of implementing the method of FIG. 2.

參考圖2及3所示範例,使用雷射密封寬玻璃膠的方法藉由以Z字形的方式移動雷射束L,將雷射束L照射至玻璃膠30。Referring to the examples shown in FIGS. 2 and 3, the laser beam L is irradiated to the glass paste 30 by moving the laser beam L in a zigzag manner by using a laser-sealed wide glass paste.

在此範例中,在將雷射束L照射至玻璃膠30時,使雷射束L沿著與施加玻璃膠30之方向A相交的方向B,在玻璃膠30的寬度W內往復運動,及同時,雷射束L沿著施加玻璃膠30的方向A移動以處理玻璃膠30。雷射束L在玻璃膠30之寬度W內往復運動的方向可與施加玻璃膠30的方向A垂直。此處,處理玻璃膠30是一種過程,其中照射雷射束L至玻璃膠30以熔化及固化玻璃膠30,及以此方式密封以玻璃膠30界定的內部區域。In this example, when the laser beam L is irradiated to the glass paste 30, the laser beam L is reciprocated within the width W of the glass paste 30 in the direction B intersecting the direction A in which the glass paste 30 is applied, and At the same time, the laser beam L is moved in the direction A in which the glass paste 30 is applied to process the glass paste 30. The direction in which the laser beam L reciprocates within the width W of the glass paste 30 may be perpendicular to the direction A in which the glass paste 30 is applied. Here, the treatment of the glass paste 30 is a process in which the laser beam L is irradiated to the glass paste 30 to melt and cure the glass paste 30, and in this manner, the inner region defined by the glass paste 30 is sealed.

因此,在雷射束L線性移動且在與線性移動方向相交的方向中往復運動時,雷射束L以Z字形方式移動,如圖2所示。Therefore, when the laser beam L linearly moves and reciprocates in a direction intersecting the linear moving direction, the laser beam L moves in a zigzag manner as shown in FIG.

當雷射束L以Z字形方式沿著施加玻璃膠30的方向A移動時,雷射束L的中心LC可落在玻璃膠30的寬度W內。由於雷射束L在中心的能量比在雷射束L邊緣的能量強,雷射束L的中心LC落在玻璃膠30的寬度W內對於熔化玻璃膠30的效率很有利。When the laser beam L moves in the zigzag manner along the direction A in which the glass paste 30 is applied, the center LC of the laser beam L may fall within the width W of the glass paste 30. Since the energy of the laser beam L at the center is stronger than the energy at the edge of the laser beam L, the center LC of the laser beam L falls within the width W of the glass glue 30, which is advantageous for the efficiency of melting the glass paste 30.

沿著與施加玻璃膠之方向A相交的方向B,以往復運動方式移動雷射束L,可利用檢流計掃描器60來實施。檢流計掃描器60可具有耦合至旋轉馬達之旋轉軸的反射鏡,使得反射鏡的入射光可利用馬達旋轉在所要方向中發射。一般而言,一對檢流計掃描器60可將雷射束L發射至平面上的所要位置。The laser beam L is moved in a reciprocating manner in a direction B intersecting the direction A in which the glass glue is applied, and can be implemented by the galvanometer scanner 60. The galvanometer scanner 60 can have a mirror coupled to the axis of rotation of the rotating motor such that incident light from the mirror can be emitted in a desired direction by motor rotation. In general, a pair of galvanometer scanners 60 can emit the laser beam L to a desired location on a plane.

在圖2及3所示範例中,由於雷射束L需要沿著與施加玻璃膠30之方向A相交的方向B,以往復運動方式在玻璃膠30的寬度W內快速及反覆移動,因此使用具有低機械慣性的檢流計掃描器60以往復運動方式移動雷射束L。尤其,由於在雷射束L的兩個邊緣,需要在沒有速度變動的情況下變更方向,使用具有低機械慣性的檢流計掃描器60比較有利。In the example shown in FIGS. 2 and 3, since the laser beam L needs to move in a direction B intersecting the direction A of the application of the glass paste 30 in a reciprocating manner in the width W of the glass paste 30, it is used in a reciprocating manner. A galvanometer scanner 60 having low mechanical inertia moves the laser beam L in a reciprocating manner. In particular, since it is necessary to change the direction without the speed variation at both edges of the laser beam L, it is advantageous to use the galvanometer scanner 60 having a low mechanical inertia.

此外,為沿著施加玻璃膠30的方向A移動雷射束L,線性移動單元可直接移動檢流計掃描器60,或移動玻璃膠30所施加至的基板10。為移動安裝在支架結構中的檢流計掃描器60或其上安裝基板10的基板支撐單元50,可採用熟習本技術者熟知的線性馬達、旋轉馬達、及滾珠螺桿的組合,且因此將省略詳細說明。Further, to move the laser beam L in the direction A in which the glass paste 30 is applied, the linear moving unit can directly move the galvanometer scanner 60 or move the substrate 10 to which the glass paste 30 is applied. In order to move the galvanometer scanner 60 mounted in the holder structure or the substrate supporting unit 50 on which the substrate 10 is mounted, a combination of a linear motor, a rotary motor, and a ball screw which are well known to those skilled in the art may be employed, and thus will be omitted Detailed description.

在上述使用雷射密封寬玻璃膠的方法中,雷射束在以Z字形方式移動以涵蓋玻璃膠的橫向寬度時照射,因而可以在玻璃膠的整個寬度上均勻地提供能量,藉此改良寬玻璃膠的密封效能。In the above method of using a laser-sealed wide glass paste, the laser beam is irradiated in a zigzag manner to cover the lateral width of the glass paste, so that energy can be uniformly supplied over the entire width of the glass paste, thereby improving the width. The sealing performance of glass glue.

此外,根據上述使用雷射密封寬玻璃膠的方法,使用檢流計掃描器沿著與施加玻璃膠之方向相交的方向移動雷射束,同時使雷射束在玻璃膠寬度內往復運動,使得可在沒有速度變動的情況下實現雷射束方向變更且不會受到機械慣性的影響。因此,可以減少玻璃膠處理時間。Further, according to the above method of using a laser-sealed wide glass paste, a galvanometer scanner is used to move the laser beam in a direction intersecting the direction in which the glass glue is applied, while reciprocating the laser beam within the width of the glass paste, so that The direction of the laser beam can be changed without speed fluctuations and without being affected by mechanical inertia. Therefore, the glass glue treatment time can be reduced.

圖4圖解另一使用雷射密封寬玻璃膠之方法範例的示意圖,及圖5圖解實施圖4所示方法的組態範例。Figure 4 illustrates a schematic diagram of another example of a method of using a laser-sealed wide glass paste, and Figure 5 illustrates a configuration example of implementing the method of Figure 4.

參考圖4及5所示範例,在使用雷射密封寬玻璃膠的方法中,將其邊緣重疊的至少兩個雷射束L照射至玻璃膠30。在圖4及5和圖2及3所示範例中,具有相同圖式參考數字的元件具有相同組態及功能,因此不再重複詳細說明。Referring to the examples shown in FIGS. 4 and 5, in the method of using a laser-sealed wide glass paste, at least two laser beams L whose edges are overlapped are irradiated to the glass paste 30. In the examples shown in FIGS. 4 and 5 and FIGS. 2 and 3, elements having the same reference numerals have the same configurations and functions, and thus detailed descriptions will not be repeated.

在圖4及5所示範例中,在將至少兩個雷射束L照射至玻璃膠30時,相應雷射束L的中心LC沿著與施加玻璃膠30之方向A相交的方向B彼此分開,及雷射束L沿著施加玻璃膠30的方向A移動以處理玻璃膠30。可提供三個或三個以上彼此分開的雷射束及將其照射至玻璃膠30,及在圖4及5所示範例中,將一對彼此分開的雷射束L照射至玻璃膠30。In the example shown in FIGS. 4 and 5, when at least two laser beams L are irradiated to the glass paste 30, the centers LC of the respective laser beams L are separated from each other in a direction B intersecting the direction A in which the glass paste 30 is applied. And the laser beam L is moved in the direction A in which the glass paste 30 is applied to process the glass paste 30. Three or more laser beams separated from each other may be provided and irradiated to the glass paste 30, and in the example shown in Figs. 4 and 5, a pair of laser beams L separated from each other are irradiated to the glass paste 30.

在此對雷射束L沿著施加玻璃膠30的方向A行進時,相應雷射束L的中心LC可落在玻璃膠30的寬度W內。類似於圖2所示範例,由於雷射束L在中心LC的能量比在邊緣的能量強,將雷射束的中心LC定位在玻璃膠30的寬度W內對於熔化玻璃膠30的效率比較有利。When the laser beam L travels in the direction A in which the glass paste 30 is applied, the center LC of the corresponding laser beam L may fall within the width W of the glass paste 30. Similar to the example shown in FIG. 2, since the energy of the laser beam L at the center LC is stronger than the energy at the edge, positioning the center LC of the laser beam within the width W of the glass glue 30 is advantageous for the efficiency of melting the glass paste 30. .

沿著施加玻璃膠的方向A移動此對雷射束L,同時將相應雷射束L的中心LC置於玻璃膠30的寬度W內,一般可由布置在與方向A相交之方向B中的一對光纖70實施。此時,每個光纖70的中心可落在玻璃膠30的寬度W內。線性移動單元可移動安裝在支架結構上的此對光纖70,或可移動其上安裝基板的基板支撐單元50。線性移動單元可藉由採用熟習本技術者熟知的線性馬達、旋轉馬達及滾珠螺桿的組合來實施,因此將不重複詳細說明。The pair of laser beams L are moved in the direction A in which the glass glue is applied, while the center LC of the corresponding laser beam L is placed within the width W of the glass paste 30, generally by one of the directions B intersecting the direction A. The fiber 70 is implemented. At this time, the center of each of the optical fibers 70 may fall within the width W of the glass paste 30. The linear moving unit can move the pair of optical fibers 70 mounted on the support structure, or can move the substrate supporting unit 50 on which the substrate is mounted. The linear movement unit can be implemented by a combination of a linear motor, a rotary motor, and a ball screw which are well known to those skilled in the art, and thus detailed description will not be repeated.

如圖5所示範例顯示,可使用具有中心形成菱形的四個光纖70沿著施加玻璃膠的方向A移動此對雷射束L,同時將相應雷射束L的中心LC置於玻璃膠的寬度W內。在此例中,菱形各邊的長度可比玻璃膠30的寬度W短。As shown in the example shown in FIG. 5, the pair of laser beams 70 having a centrally formed diamond shape can be used to move the pair of laser beams L in the direction A in which the glass paste is applied, while the center LC of the corresponding laser beam L is placed in the glass paste. Width W. In this case, the length of each side of the diamond may be shorter than the width W of the glass paste 30.

可根據玻璃膠30所施加區段的形狀,選擇性使用光纖70傳輸雷射束L。The laser beam 70 can be selectively transmitted using the optical fiber 70 in accordance with the shape of the section to which the glass paste 30 is applied.

例如,如圖5(a)所示範例顯示,針對垂直施加玻璃膠30的區段,可使用其中心分別在R2及R3的光纖70傳輸要照射至玻璃膠30的雷射束,及可不使用其中心分別在R1及R4的其餘光纖70傳輸雷射束。此外,如圖5(b)所示範例顯示,針對以曲線方式施加玻璃膠30的區段,可使用其中心分別在R1及R2的光纖70傳輸要照射至玻璃膠30的雷射束,及可不使用其中心分別在R3及R4的其餘光纖傳輸雷射束。此外,如圖5(c)所示範例顯示,針對水平施加玻璃膠30的區段,可使用其中心分別在R1及R4的光纖70傳輸要照射至玻璃膠30的雷射束,及可不使用其中心分別在R2及R3的其餘光纖70傳輸雷射束。此外,可根據施加玻璃膠30的形狀(直線或曲線)或方向(垂直或水平),使用不同之光纖70的組合。For example, as shown in the example of FIG. 5(a), for the section in which the glass paste 30 is applied vertically, the laser beam to be irradiated to the glass paste 30 may be transmitted at the center of the fibers 70 of R2 and R3, respectively, and may not be used. A laser beam is transmitted at the center of the remaining fibers 70 of R1 and R4, respectively. In addition, as shown in the example shown in FIG. 5(b), for the section in which the glass paste 30 is applied in a curved manner, the laser beam to be irradiated to the glass paste 30 can be transmitted using the optical fiber 70 whose centers are respectively at R1 and R2, and The laser beam can be transmitted without using the remaining fibers of the center of R3 and R4, respectively. In addition, as shown in the example shown in FIG. 5(c), for the section in which the glass paste 30 is horizontally applied, the laser beam to be irradiated to the glass paste 30 may be transmitted at the center of the fibers 70 of R1 and R4, respectively, and may not be used. The center of the laser beam 70 transmits the laser beam at the remaining fibers 70 of R2 and R3, respectively. Further, a combination of different optical fibers 70 can be used depending on the shape (straight or curved) or direction (vertical or horizontal) of the glass glue 30 applied.

在考量玻璃膠30的密封效能下,可沿著與施加玻璃膠30之方向垂直的方向B,均勻地施加能量(具有平頂能量分布)至玻璃膠30,以熔化及固化玻璃膠30。因此,當使用一對光纖70以處理玻璃膠30時,可能需要旋轉光纖70,致使根據玻璃膠30係垂直、水平或以曲線方式施加,連接兩個光纖70之中心的虛線可以與施加玻璃膠30的方向A垂直。然而,如參考圖5所示,採用布置使其中心形成菱形的四個光纖70,因此可根據施加玻璃膠30的形狀或方向,選擇傳輸雷射束L的光纖70,且不需要旋轉光纖70。Under consideration of the sealing performance of the glass paste 30, energy (having a flat top energy distribution) can be uniformly applied to the glass paste 30 in a direction B perpendicular to the direction in which the glass paste 30 is applied to melt and cure the glass paste 30. Therefore, when a pair of optical fibers 70 are used to process the glass paste 30, it may be necessary to rotate the optical fibers 70 such that the glass glue 30 is applied vertically, horizontally or in a curved manner, and the dashed line connecting the centers of the two optical fibers 70 can be applied with the glass glue. The direction A of 30 is vertical. However, as shown in FIG. 5, four optical fibers 70 are arranged such that their centers form a diamond shape, so that the optical fiber 70 transmitting the laser beam L can be selected depending on the shape or direction of the application glass paste 30, and the rotating optical fiber 70 is not required. .

如上述,在使用雷射密封寬玻璃膠的方法中,沿著玻璃膠的寬度方向配置複數個彼此分開的雷射束以對應於玻璃膠的橫向寬度,及將雷射束發射至玻璃膠以提供均勻能量,藉此改良寬玻璃膠的密封效能。As described above, in the method of using a laser-sealed wide glass paste, a plurality of mutually separated laser beams are disposed along the width direction of the glass paste to correspond to the lateral width of the glass paste, and the laser beam is emitted to the glass paste. Provides uniform energy to improve the sealing performance of wide glass glue.

此外,上述使用雷射密封寬玻璃膠的方法根據施加玻璃膠的形狀或方向,從四個光纖中選擇傳輸雷射束的光纖,因此不需要裝設額外元件以旋轉光纖,及藉此可以簡化整體的設備結構。In addition, the above method of using a laser-sealed wide glass paste selects an optical fiber for transmitting a laser beam from among four optical fibers according to the shape or direction of applying the glass paste, so that it is not necessary to install an additional component to rotate the optical fiber, and thereby simplifying The overall equipment structure.

圖6圖解另一使用雷射密封寬玻璃膠之方法範例的示意圖,及圖7圖解實施圖6所示方法的組態範例。Figure 6 illustrates a schematic diagram of another example of a method of using a laser-sealed wide glass paste, and Figure 7 illustrates a configuration example of implementing the method of Figure 6.

參考圖6及7所示範例,使用雷射密封寬玻璃膠的方法將能量分布均勻化的雷射束發射至玻璃膠。在圖6及7和圖2至5所示範例中,具有相同圖式參考數字的元件具有相同組態及功能,因此不再重複這些元件的詳細說明。Referring to the examples shown in Figures 6 and 7, a laser beam that homogenizes the energy distribution is emitted to the glass paste using a method of laser sealing a wide glass paste. In the examples shown in FIGS. 6 and 7 and FIGS. 2 to 5, elements having the same reference numerals have the same configurations and functions, and thus detailed description of these elements will not be repeated.

在圖6及7所示範例中,繞射光學元件(DOE)透鏡80藉由以下方式處理玻璃膠30:將沿著與施加玻璃膠30之方向A相交的方向B具有平頂橫截面能量分布的雷射束L發射至玻璃膠30,且同時沿著方向A移動雷射束L。In the example shown in Figures 6 and 7, the diffractive optical element (DOE) lens 80 treats the glass glue 30 by having a flat top cross-sectional energy distribution in a direction B intersecting the direction A of the application glass glue 30. The laser beam L is emitted to the glass paste 30 while moving the laser beam L in the direction A.

DOE透鏡80是一種光學元件,能將具有高斯能量分布的雷射束轉換成具有平頂能量分布或半平頂能量分布的雷射束。將具有高斯分布的光束轉換成具有平頂或半平頂能量分布的光束的裝置稱為均勻器,及DOE透鏡80係為一種均勻器。The DOE lens 80 is an optical element that converts a laser beam having a Gaussian energy distribution into a laser beam having a flat top energy distribution or a semi-flat top energy distribution. A device that converts a beam having a Gaussian distribution into a beam having a flat top or semi-flat top energy distribution is referred to as a homogenizer, and the DOE lens 80 is a homogenizer.

來自DOE透鏡80的雷射束L可具有矩形橫截面,如圖7(a)所示範例顯示,或具有線性橫截面,如圖7(b)所示範例顯示。The laser beam L from the DOE lens 80 may have a rectangular cross section, as shown in the example shown in Fig. 7(a), or have a linear cross section, as shown in the example shown in Fig. 7(b).

如以上參考圖6及7所述,在使用雷射密封寬玻璃膠的方法中,為對應於玻璃膠的寬度,橫跨玻璃膠的寬度發射具有平頂能量分布的雷射束,及以此方式在玻璃膠的整個寬度上均勻地提供能量。因此,可以改良玻璃膠的密封效能。As described above with reference to FIGS. 6 and 7, in the method of using a laser-sealed wide glass paste, a laser beam having a flat top energy distribution is emitted across the width of the glass paste corresponding to the width of the glass paste, and The way is to provide energy evenly over the entire width of the glass glue. Therefore, the sealing performance of the glass glue can be improved.

上文已經說明若干範例。但應明白,可進行各種修改。例如,如果以不同順序執行所述技術,及/或如果在所述系統、架構、裝置、或電路中的組件以不同方式組合及/或為其他組件或其等效物取代或補充,仍可達成適當結果。據此,其他實施例均在以下申請專利範圍的範疇中。Several examples have been described above. However, it should be understood that various modifications can be made. For example, if the techniques are performed in a different order, and/or if the components in the system, architecture, device, or circuit are combined in different ways and/or replaced or supplemented with other components or equivalents thereof, Achieve the appropriate results. Accordingly, other embodiments are within the scope of the following claims.

10...基板10. . . Substrate

20...OLED元件20. . . OLED component

30...玻璃膠30. . . Glass glue

40...遮罩40. . . Mask

50...支撐單元50. . . Support unit

60...檢流計掃描器60. . . Galvanometer scanner

70...光纖70. . . optical fiber

80...繞射光學元件(DOE)透鏡80. . . Diffractive optical element (DOE) lens

A...施加玻璃膠的方向A. . . Direction of applying glass glue

B...與施加玻璃膠之方向A相交的方向B. . . The direction intersecting the direction A in which the glass glue is applied

L...雷射束L. . . Laser beam

LC...雷射束中心LC. . . Laser beam center

W...寬度W. . . width

圖1為圖解使用雷射密封寬玻璃膠之普遍性方法範例的示圖。1 is a diagram illustrating an example of a general method of using a laser to seal a wide glass paste.

圖2為圖解使用雷射密封寬玻璃膠之方法範例的示意圖。2 is a schematic diagram illustrating an example of a method of sealing a wide glass paste using a laser.

圖3為圖解實施圖2所示方法之組態範例的示圖。FIG. 3 is a diagram illustrating a configuration example of implementing the method shown in FIG.

圖4為圖解另一使用雷射密封寬玻璃膠之方法範例的示意圖。4 is a schematic diagram illustrating another example of a method of using a laser to seal a wide glass paste.

圖5為圖解實施圖4所示方法之組態範例的示圖。Fig. 5 is a diagram illustrating a configuration example of implementing the method shown in Fig. 4.

圖6為圖解另一使用雷射密封寬玻璃膠之方法範例的示意圖。Figure 6 is a schematic diagram illustrating another example of a method of using a laser to seal a wide glass paste.

圖7為圖解實施圖6所示方法之組態範例的示圖。Fig. 7 is a diagram illustrating a configuration example of implementing the method shown in Fig. 6.

在圖式及「實施方式」中,除非另外說明,否則應明白相同圖式參考數字係指相同元件、特徵、及結構。為了清楚、圖解、及方便之故,將誇大這些元件的相對尺寸及描繪。Throughout the drawings, the same reference numerals refer to the same elements, features, and structures. The relative size and depiction of these elements will be exaggerated for clarity, illustration, and convenience.

30...玻璃膠30. . . Glass glue

A...施加玻璃膠的方向A. . . Direction of applying glass glue

B...與施加玻璃膠之方向A相交的方向B. . . The direction intersecting the direction A in which the glass glue is applied

L...雷射束L. . . Laser beam

LC...雷射束中心LC. . . Laser beam center

W...寬度W. . . width

Claims (1)

一種使用雷射密封寬玻璃膠的方法,該方法包含:發射至少兩個雷射束至該玻璃膠,該兩個雷射束中心在與施加玻璃膠之一方向相交的一方向中彼此分開,同時沿著施加該玻璃膠之該方向移動該雷射束;其中在將該雷射束發射至該玻璃膠時,該等相應雷射束之中心位在該玻璃膠之一寬度內,且其中使用四個布置使其中心形成一菱形的光纖,該菱形各邊的一長度落在該玻璃膠之一寬度內,及根據其上線性施加該玻璃膠的一區段或其上以一曲線方式施加該玻璃膠的一區段,透過該四個光纖中的至少兩個光纖,將該等雷射束發射至該玻璃膠。 A method of using a laser to seal a wide glass paste, the method comprising: emitting at least two laser beams to the glass paste, the centers of the two laser beams being separated from one another in a direction intersecting one of the directions in which the glass glue is applied, Simultaneously moving the laser beam in the direction in which the glass glue is applied; wherein when the laser beam is emitted to the glass paste, the center of the respective laser beam is within a width of the glass paste, and wherein Four arrangements are used to form a diamond-shaped fiber at the center, a length of each side of the diamond falling within a width of the glass paste, and a section of the glass glue applied thereto linearly thereon or in a curved manner A section of the glass paste is applied through at least two of the four fibers to emit the laser beam to the glass paste.
TW099144898A 2010-09-30 2010-12-21 Method of sealing wide frit using laser TWI403377B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100094882A KR101189526B1 (en) 2010-09-30 2010-09-30 Method for sealing wide frit using laser

Publications (2)

Publication Number Publication Date
TW201213030A TW201213030A (en) 2012-04-01
TWI403377B true TWI403377B (en) 2013-08-01

Family

ID=46136155

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099144898A TWI403377B (en) 2010-09-30 2010-12-21 Method of sealing wide frit using laser

Country Status (2)

Country Link
KR (1) KR101189526B1 (en)
TW (1) TWI403377B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101398020B1 (en) * 2012-11-30 2014-05-30 주식회사 엘티에스 Apparatus for sealing frit using laser
KR102049445B1 (en) 2013-05-31 2019-11-28 삼성디스플레이 주식회사 Laser beam irradiation apparatus and manufacturing method of organic light emitting display device using the same
KR102216677B1 (en) * 2014-08-01 2021-02-18 삼성디스플레이 주식회사 Display sealing apparatus and method for manufacturing display apparatus using the same
CN107331796B (en) * 2016-04-29 2020-05-01 上海微电子装备(集团)股份有限公司 Packaging method of laser scanning sealed glass packaging body
JP6725351B2 (en) * 2016-07-14 2020-07-15 株式会社Gsユアサ Electric storage element and method for manufacturing electric storage element
CN107785499B (en) * 2016-08-30 2020-01-24 上海微电子装备(集团)股份有限公司 Laser packaging method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100711879B1 (en) * 2006-02-14 2007-04-25 삼성에스디아이 주식회사 Flat panel display device and fabrication method thereof
JP2009104841A (en) * 2007-10-22 2009-05-14 Toshiba Corp Sealing device, sealing method, electronic device, and manufacturing method of electronic device
TWI328488B (en) * 2007-09-20 2010-08-11 Au Optronics Corp Cutting apparatus and cutting process
KR20100105386A (en) * 2009-03-17 2010-09-29 가부시기가이샤 디스코 Optical system and laser processing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100671642B1 (en) 2006-01-26 2007-01-19 삼성에스디아이 주식회사 Method of manufacturing organic light emitting display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100711879B1 (en) * 2006-02-14 2007-04-25 삼성에스디아이 주식회사 Flat panel display device and fabrication method thereof
TWI328488B (en) * 2007-09-20 2010-08-11 Au Optronics Corp Cutting apparatus and cutting process
JP2009104841A (en) * 2007-10-22 2009-05-14 Toshiba Corp Sealing device, sealing method, electronic device, and manufacturing method of electronic device
KR20100105386A (en) * 2009-03-17 2010-09-29 가부시기가이샤 디스코 Optical system and laser processing apparatus

Also Published As

Publication number Publication date
TW201213030A (en) 2012-04-01
KR101189526B1 (en) 2012-10-11
KR20120033392A (en) 2012-04-09

Similar Documents

Publication Publication Date Title
TWI403377B (en) Method of sealing wide frit using laser
EP2203946B1 (en) Frit sealing with a variable laser beam
US10967457B2 (en) Laser beam irradiation apparatus and method of manufacturing organic light-emitting display device by using the same
EP2745974B1 (en) Laser beam irradiation apparatus and substrate sealing method
KR20070088682A (en) Method of sealing glass substrates
JP4995315B2 (en) Laser beam irradiation apparatus used for substrate sealing, substrate sealing method, and organic light emitting display device manufacturing method
CN102311220B (en) Bombardment with laser beams device and the base plate seals device comprising bombardment with laser beams device
CN109434307A (en) A kind of laser cutting method and laser cutting device of flexible screen
US10606168B2 (en) Mask, masking exposure method, mask system and pattern control device
KR100910047B1 (en) A Sealing Method of FPD using Flexible Irradiating Area of Laser
TWI434606B (en) Sealing device and sealing process use the same
US9201245B2 (en) Optical system and substrate sealing method
KR102015845B1 (en) Laser irradiation device and fabrication method for organic light emitting diodes using the same
JP6692003B2 (en) Flexible light emitting device manufacturing method and manufacturing apparatus
CN111264007B (en) Laser light source device and method for manufacturing same
JPWO2019215831A1 (en) Flexible light emitting device manufacturing method and manufacturing apparatus
JPWO2019215829A1 (en) Flexible light emitting device manufacturing method and manufacturing apparatus
US20140290847A1 (en) Optical system and substrate sealing method
KR101244290B1 (en) Apparatus for sealing frit using laser
KR101427689B1 (en) Apparatus and Method for frit sealing of curved substrate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees