1328488 99·5·4 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種切割設備及切割製程，且特別是 有關於一種應用雷射光源的切割設備及切割製程。 【先前技術】 液晶顯示器主要是由兩個玻璃基板中間夾著一層液 晶層所構成，因此玻璃基板切割成型的良 ，。於習知技術中，是__刀輪來切财璃基板，但 是玻璃基板於切割處易產生碎裂且會磨耗切割刀輪。因 此，習知技術亦有採用雷射切割的方法來切割玻璃基板， 其實施方式通常是藉由單獨的雷射光源直接對玻璃基板進 行切割，或是先藉由-雷射光源在玻璃基板的邊緣先形成 -起始裂紋，再採用較高能量的另—雷射光源由起始裂纹 處對玻絲錢行蝴H藉由單獨諸光源直接對 玻璃基板進行_的方式·存在在玻璃基板切割處容易 產生碎裂_題，而上賴由另絲先形成起始裂 紋的方法雖織獲得較良好的⑽效果，但因為使用了兩 個光源’因此成本較高。再者，上述方法有時會藉由聚焦 ，組，聚焦光源以獲得能量較高的切割光束，但此種切割 光束受限於本身的形狀、能量分布，以及玻璃基板的材& 特性等等㈣’錄無法達到最㈣切割效果。 【發明内容】 本發明關於-種切割設備，其所需的設備成本較低而 且其結構較為簡化。 5 1328488 99-5·4 本發明關於-種切割製程，具有較高的切割製程良率 與產出。 為具體描述本發明之内容，在此提出一種切割設備， 其具有加工光源、光調變元件、聚焦鏡組、整型鏡组 工件位置感測ϋ。加:^統輸出—光東，而光調變元件接 收光束’並可輸出子光束與第二子光束至少其中之 -。第-子光束與第二子光束分別沿第—統與第二光路 到達工件。聚焦鏡組位於第一光路上，可用以聚焦第一子 光束。整型鏡組位於第二光路上，可用以將第二子光 束’而且第一子光束之形狀與切割光束之形 狀實質上不同。工件位置感測器用以感測工件的位置資 :回=由工件的位置資訊來對先調變元件的光輪出進 為具體描述本發明之内容，在此裎屮^ ^由-切_來切割_工件在。此二種具:製^1328488 99·5·4 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a cutting apparatus and a cutting process, and more particularly to a cutting apparatus and a cutting process for applying a laser light source. [Prior Art] The liquid crystal display is mainly composed of a liquid crystal layer sandwiched between two glass substrates, so that the glass substrate is cut and formed well. In the prior art, the __ cutter wheel cuts the glass substrate, but the glass substrate is prone to chipping at the cutting portion and will wear the cutting wheel. Therefore, the prior art also uses a laser cutting method to cut a glass substrate, and the embodiment thereof usually directly cuts the glass substrate by a separate laser light source, or firstly uses a laser source on the glass substrate. The edge is first formed - the initial crack, and then the higher energy of the other - laser source is used to cut the glass substrate from the initial crack to the glass substrate by means of separate light sources. It is easy to produce a fragmentation problem, and the method of forming the initial crack by the other silk has a better (10) effect, but because of the use of two light sources', the cost is higher. Furthermore, the above method sometimes obtains a higher energy cutting beam by focusing, grouping, and focusing the light source, but the cutting beam is limited by its shape, energy distribution, and the material & characteristics of the glass substrate, and the like. (4) 'The record cannot achieve the most (four) cutting effect. SUMMARY OF THE INVENTION The present invention relates to a cutting apparatus which requires a lower equipment cost and a simplified structure. 5 1328488 99-5·4 The present invention relates to a cutting process with a high cutting process yield and output. In order to specifically describe the contents of the present invention, there is proposed a cutting apparatus having a processing light source, a light modulation element, a focusing lens group, and an integral lens group workpiece position sensing port. Add: ^ system output - Guangdong, and the light modulation component receives the beam ' and can output at least - the sub-beam and the second sub-beam. The first sub-beam and the second sub-beam respectively reach the workpiece along the first and second optical paths. The focusing mirror is located on the first optical path and can be used to focus the first sub-beam. The integer lens group is located on the second optical path and can be used to substantially separate the shape of the second sub-beam 'and the first sub-beam from the shape of the cutting beam. The position sensor of the workpiece is used to sense the position of the workpiece: back = the position of the workpiece to the light wheel of the first modulation component is specifically described in the content of the present invention, where 裎屮 ^ ^ by - cutting _ to cut _The workpiece is in. These two kinds of equipment: system ^
，出第-子光束與第二子光束至少其中之…第 I ^第二子^分別沿第—光路與第二光路 鏡組位於第一光路上，可用以聚焦第-子光束。ϋ焦 位於第二光路上，可用以將第m子;^束整型鏡組 ^ , g ^ 將第一子先束整型為一切割光 H束之形狀與切割光束之形狀實質上不 成一起始肢’並以起始做麵點 1328488 99-5-4 割工件，以及藉由工件位置感測器感測工件的位置資訊， 並且藉由工件的位置資訊來對光調變元件的光輸出進行回 授控制。 綜上所述，本發明之切割設備只需一個加工光源即可 達到製造起始裂紋及切割的功效，因此本發明之切割設備 - 所需的設備成本較低而且其結構較為簡化。 ▲為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉實施例，並配合所附圖式，作詳細說明如 w 下。 【實施方式】 圖1繪示本發明一實施例之一種切割設備的示意圖。 請參照圖1，本發明之切割設備100適合用來進行一切割 t程以切割-卫件11()。切割設備具有—加工光 120、一光調變元件13〇、一聚焦鏡組14〇以及一整型鏡組 150。其中，工件11〇可沿方向a的加工路徑（未繪示 移動。 ® 加工光源120輸出一光束122 ’而光調變元件13〇接 收光，122且輸出子光束122a與子光束122b至少其中之 一。當工件110移至第一光路L1時，子光束122a沿第一 光路L1到達工件11〇，以對工件11〇進行加工；而當工件 110移至第二光路L2時，子光束122b沿第二光路L2到達 工件110 ’以對工件110進行加工。加工光源120例如是 雷射光源，而雷射光源可以是二氧化碳雷射、Nd:YAG雷 射、鈦-藍寶石雷射、半導體二極體雷射或是其他適合的^ 7 1328488 99-5-4 射光源。於本實施例中，加工光源12G是二氧化碳雷射為 本發明之實施範例，但不限於此。於本實施例中，光調變 疋件130例如是分光器，而分光器接收光束122之後，可 同時輸出子光束122a與子光束122b，且分光器的光反射 f與穿透率的比例可以視實際需求調整，例如可以較佳地 疋 50%/50%，也可以是 60%/4〇%、7〇%/3〇%、8〇%/2〇%或 90/〇/10/〇等荨的比例，還可以是 4〇%/6〇%、3〇%/7〇〇/〇、 20%/80%或1〇%/9〇%等等的比例。 另外’在第-光路L1上，配置聚焦鏡組14〇以聚焦 子光束122a ’㊉且在第二光路L2上，配置整型鏡組15〇 以將子光束122b整型成一切割光束u2b，。其中，子光束 122a的形狀與切割光束122b，的形狀實質上不同，亦即子 光束122a與切割光束122b，到達工件表面時，二者的形狀 實質上不同。也就是，操作者從工件的上面或下面來觀看 (又稱為俯視圖、上視圖、或平行於辑上面的剖面圖)子 光束122a與切割光束122b，時，二者的形狀實質上不同。 舉例來說，子光束122a實質上呈現的形狀，例如是實質上 呈圓點狀、實質上呈正方形、實f上呈三角形、實質上呈 五邊形或是其他適合的點狀，以在工# UG上形成起始裂 紋，而切割光束122b，實質上呈現的形狀例如是實質上呈 線形、實質上呈矩形、實質上呈橢圓形、實質上呈三角形、 實質上呈長方形或是其他適合切割工件11()的形狀。本發 明之實_是以子光束122a實質上呈_形狀例如是實 質上呈圓點狀及切割光束㈣，實f上呈現的形狀例如是 ^^«488 99-5-4 實質上呈線形為實施範例，但不限於此。 請同時參照圖1、圖2A與圖2B，力太狢B日+ ^ =切割製程中，加工光源二出一 接收光束咖輸出子光束⑽與子光束而= 的k 。工件u〇沿方向A移動，且工件110移動 會經過第—光路1^與第二光路i 移=啦件11G沿方向A移動時，僅有工件no 動而所輸出的子光^122a與子光束1221?㈣動為實施 ::光=Γ此，亦可選擇性地將所輸出的子光束_ i = 反於方向A (如·· ·Α)的方向移動而工 的子是卫件⑽沿方向Α移動而且將所輸出 =子先束122a與子光束122b沿相反於方向Α (如：_Α) 2向移動。子光束122a經聚焦鏡組⑽聚焦後，會在沿 者。A移動的工件11〇邊緣形成一起始裂紋⑽然後， 击19^，1〇々方向動至第二光路L2時，藉由切割光 束22b以起始裂紋11〇a為起點切割工件㈣，以形成一 具有特定深度的割痕110b。工件11〇可為 面板具有複數個顯示單元，而且基板可以用於顯^面板之 成品、顯示面板之半成品或是母片。其中，顯示面板之成 品包含複數單元，而_面板之钱品包含彩色遠 光片及/或是畫素陣列基板…般而言，基板之材質是包含 無機透明材質（如：玻璃、石英、或其它材質）'有機透 明材質（如：聚婦類、聚義、聚醇類、聚醋類、橡膠、 熱塑性聚合物、熱固性聚合物、聚芳香烴類、聚甲基丙醯 1328488 99-5^ I甲酯類、聚碳酸酯類、或其它、或上述之衍生物、或上 ，之組合）、或上述之組合。舉例來說，基板可以是用在 彩色濾光片中及/或是晝素陣列基板中做為基底之用，且以 無機透明材質之玻璃為實施範例，但不以此為限。如圖3 所不、’工件300的基板310上至少配置有多個晝素陣列 32〇,並藉由本發明之切割設備1〇〇在基板31〇之預定割線 (未繪示）上切割出多條割痕312，以劃分出多個晝素陣 列基板P。其中，每一個畫素陣列320至少包含複數個晝 素，每一個晝素，包含至少一掃描線、至少一交錯該掃描 線之資料線、至少一個切換元件（如：電晶體）連接上述 掃描線及上述資料線、及至少一電容電性連接至上述切換 元件。 在其他實施例中，顯示面板之成品包含複數個顯示單 元，每一顯示單元，至少包含一晝素陣列基板、一相對於 上述晝素陣列基板之彩色滤光片、及一設置於晝素陣列基 板與彩色遽光片之間的具有介電係數之層別，而上述具有 介電係數之層別的材料包含液晶材料，則顯示面板稱為液 晶顯示面板（如：穿透型顯示面板、半穿透型顯示面板、 反射型顯示面板、彩色濾光片於主動層上（eol〇r fllter 〇n array)之顯示面板、主動層於彩色濾光片上（array 〇n c〇1〇r filter)之顯示面板、垂直配向型（VA)顯示面板、水平 切換型（IPS)顯示面板、多域垂直配向型（MVA)顯 示面板、扭曲向列型（TN)顯示面板'超扭曲向列型（) 顯示面板、圖案垂直配向型（PVA)顯示面板、超級圖案 1328488 99-5-4 垂直配向型（S-PVA)顯示面板、先進大視角型（ASV) 顯示面板、邊緣電場切換型（FFS)顯示面板、連續焰火 狀排列型（CPA)顯示面板.、軸對稱排列微胞型（asm) 顯示面板、光學補償彎曲排列型（〇CB)顯示面板、超 級水平切換型（S-IPS)顯示面板、先進超級水平切換型 (AS-IPS)顯示面板、極端邊緣電場切換型（uj?fs)顯 示面板、高分子穩定配向型顯示面板、雙視角型 (dual-view)顯示面板、三視角型（triple-view)顯示 面板、二維顯示面板（three-dimensional)或其它型面板、 或上述之組合）、有機電激發光材料，則顯示面板稱為有 機電激發光顯示面板（如：螢光有機電激發光顯示面板、 填光有機電激發光顯示面板、或上述之組合），或上述之 組合。其中，有機電激發光顯示面板之有機電激發光材料 包含小分子發光材料、高分子發光材料、或上述之組合。 承上所述，本發明之切割設備1〇〇可藉由一加工光源 120搭配光調變元件13〇而產生子光束U2a與子光束 122b，並藉由聚焦鏡組14〇以聚焦子光束12厶，且藉由整 型鏡組15〇以整型子光束l22b使其成為切割光束。 本發明之切割設備100只需一個加工光源12〇即可達到製 造起始裂紋110a及切割的功效，因此本發明之切割設備 1〇〇所需的設備成本較低而且錢馳為簡化。另外，本 發明之切割設備100藉由整型鏡組15〇來整型子光 122b，使子光束122b具有適於切割卫件m的形狀以辦 加切割製程的良率與產出。 9 1328488 99-5-4 請再參照圖1 ’在加工光源120與光調變元件i3〇之 間，較佳地’還可配置一光束強度均勻元件160，用以均 勻化光束122的強度分佈，例如··從原有強度之高斯分佈 光束轉變成實質上均勻強度分佈之光束，但亦可不使用光 束強度均勻元件160。另外’在第一光路L1或第二光路 L2上可配置反射鏡組170，依情況改變子光束122a或子 光束122b的方向。當然，也可以同時在第一光路[I及第 二光路L2上配置反射鏡組170，並可依情況改變子光束 122a及子光束122b的方向，但亦可不使用反射鏡組17〇。 而且，光調變元件130與反射鏡組17〇之間的距離D是可 以調整的。具體而言’光調變元件130與反射鏡組17〇之 間的距離例如實質上是，但*限於此。再 者，在工件110❸加工路徑上，較佳地，可配置冷卻裝置 ⑽以在切割絲122b，切割工件110之後冷卻工件110， 並，由熱脹冷縮的原理使工件110從割痕110b延伸至特定 特定的長度’或者是同時延伸至特定的深度及特 疋ΐ長度，但亦可不使用冷卻裳置180。冷卻裝置⑽可 噴^冷卻流體的裝置，而冷卻流體包括液體(如： 7盘魚ζ急態线、液態惰性氣體(如：減、氦氣、氖氣、 Ϊ化氣、氣氣、或上述至少二者的混合）、液態 ‘=如.匕氦氣、氖氣、氬氣、氪氣、氤氣、氣 氣^上迷至少二者的混合)）、或上述混合。 示了上述的分光器之外，光調變元件13〇也可以是快 12 1328488 99-5-4 門器（shutter)、轉動器或是其他適合的光調變元件。以 下將詳細介紹光調變元件130為快門器或是轉動器的例 子。 圖4繪示本發明一實施例之另一種切割設備的示意 圖。請參照圖4，切割設備400與切割設備1〇〇相似，主 要的差異之處在於本實施例之光調變元件13〇例如是快門 器或是轉動器。 當光調變元件130為快門器時，在本實施例中，如圖 5A所示，快門态132具有可以切換的開窗區（亦稱為光穿 透區）132a與反射區132b。快門器132更具有一邊框132c ，繞開窗區132a與反射區132b。若輸入至快門器132的 光束122 (如圖4所示）的方向及位置固定，則快門器132 可藉由沿方向B來回移動以調整從快門器132輸出的子光 ，的方向。舉例來說，如圖5B所示，當快門器132的開 窗區132a移至光束122的光路上時，光束122通過開窗區 132a而成為沿第一光路。行進的子光束122& ^或者是如 圖5C所示’當快門器132的反射區13沘移至光束122的 光路上時，光束122被反射區132b反射而成為沿第二光路 L2行進的子光束i22b。 當光調變元件130是轉動器時，轉動器可具有至少一 個可以切換賴窗區（麵為光穿透區）與反射區。在本 實施例中’如圖6A所示，轉動器134具有兩個可以切換 的開窗區134a與反射區134b。當^，在其他未繪示的實 施例中’轉_可具有適當數目_窗區與反射區。轉動 13 1328488 99-5-4 器134 ’較佳地，更具有一邊框134c以及一轉轴i34d，而 邊框134c圍繞開窗區134a與反射區134b，且轉軸134d 位於邊框134c中央並與開窗區134a以及反射區134b相 連。若輸入至轉動器134的光束122 (如圖4所示）的方 向及位置固定，則轉動器134可藉由旋轉轉軸134d，使轉 動器134沿方向C1或方向C2旋轉以調整從轉動器134輸 出的子光束的方向，也可以是使轉動器134沿方向C1及 方向C2來回旋轉以調整從轉動器134輸出的子光束的方 向。舉例來說，如圖6B所示，當轉動器134的開窗區134a 轉至光束122的光路上時，光束122通過開窗區134a而成 為沿第一光路L1行進的子光束122&。或者是如圖6(：所 示，當轉動器134的反射區134b轉至光束122的光路上 時，光束122被反射區134b反射而成為沿第二光路L2行 進的子光束122b。另外，旋轉器丨34可傾斜一適當角度以 調整其所輸出的子光束的方向。 請再參照圖4，當光調變元件13〇為快門器或轉動器 時，切割設備400 ’較佳地，還可具有連接光調變元件13〇 的-驅動裝i 190，但*限於此，而驅動裝f 19〇包括一 馬達、-恤馬達或其找置，本實補是以舰馬達為 實施例，但不限於此。請同時參照目4、® 5A〜圖5C與 圖6A〜圖6C，在本實施例中，切割設備4〇〇於切割製程 中’可依情況藉由驅動裝置19〇來切換快門_ 132或是轉 動器134的開窗區132a、134a以及反射區mb、⑽的 位置’以控制光束122到達的是開窗區132a、13如或是反 1328488 99-5-4 射區132a、134a。另外，在工件110的加工路徑旁’較佳 地’可配置至少一感測器S以感測工件11〇的位置資訊， 並且可藉由工件110的位置資訊來對光調變元件13〇的光 輸出進行回授控制，但亦可不使用感測器S。舉例來說， 感測器S感測到工件no的位置資訊後，切割裝置4〇〇藉 由工件110的位置資訊來控制光調變元件13〇的光輸出變 強欠弱、開啟或是關閉。又或者是，當感測器s感測到 沿方向A移動的工件110到達第一光路L1時，切割裝置 400藉由驅動裝置190控制光調變元件13〇,使光調變元件 I30只輸出子光束122a至工件110邊緣，以在工件11()邊 緣製造起始裂紋ll〇a。另外，當感測器s感測到沿方向A 移動的工件110到達第二光路L2或感測器s感測到沿方 向A移動的工件110離開第一光路L1時，切割裝置4〇〇 藉由驅動裝置190控制光調變元件13〇,使光調變元件13〇 僅輸出子光束122b經整型鏡組150整型成切割光束i22b, 至工件110，以在工件11〇上形成具有特定深度或特定長 度或者是特定深度及特定長度的割痕110b。如此一來，可 集中光束122的能量成為子光束122a或子光束mb，相 對降低於切鄕程中提供給加王絲120 量，進而節 省切割製程所需的成本。 綜上所述，本發明之切割設備只需-個加工光源即可 達到製造輕裂紋及_的功效，因此本發明之切割設備 :需，設備成本較低而且其結構較為簡化。本發明之切割 設備是使用雷射光源來切割，因此屬於非接觸式的加工^ 15 99-5-4 法，於切割處較不易產生碎裂且不會有 在使設備藉二^ r 適於切割工件的形狀，以增加切 二==本發明之切割設備可藉由分光器來 見只際#求娜子光束的能量，如此—來，可 用於本發明之切割設備的雷射光 s 時的光源選擇性，進叫低了=製本發明技術 ，本發明已財關揭露如上，財並賴以限定 屬領域中具有通常知識者，在不脫離本發 月之精神和跑圍内，當可作些許之更動與潤飾，因此本發 ，之保護翻當視後社巾請專職_界定者為準。 【圖式簡單說明】 圖1、’’曰示本發明_實施例之—種切割設備的示意圖。 圖2Α與圖2Β為本發明-實施例之切割製程的示意圖。 圖3為本發明一實施例之工件的示意圖。 圖4緣示本發明—實施例之另—種觸設備的示意圖。 圖5Α為圖4之-種光調變元件的正視圖 圖犯與圖5C為圖5Α的光調變元件的側視圖。 圖6Α為圖4之另一種光調變元件的正視圖。 圖6Β與圖6C為圖6Α的光調變元件的侧視圖。 【主要元件符號說明】 100、400 :切割設備 110' 300 : τ 件 110a :起始裂紋 110b、312 :割痕 1328488 99-5-4 120 :加工光源 122 :光束 122a、122b :子光束 122b’ ：切割光束 130:光調變元件 132:快門器 132a、134a:開窗區 132b、134b :反射區 φ 132c、134c :邊框 134 :轉動器 134d :轉軸 140 :聚焦鏡組 150 :整型鏡組 160:光束強度均勻元件 170 :反射鏡組 180 :冷卻裝置 190 :驅動裝置 _ 310 :基板 320 :晝素陣列 A、B、Cl、C2 :方向 D :距離 L :光路 - P:畫素陣列基板 S :感測器 17At least one of the first sub-beam and the second sub-beam is located. The first ^ second sub-section is respectively located along the first optical path and the second optical path group on the first optical path, and can be used to focus the first sub-beam. The focus is located on the second optical path, and can be used to set the mth sub-group; ^ beam shaping lens group ^, g ^ shaping the first sub-beam into a cutting light H beam shape and the shape of the cutting beam is substantially not together The starting limb 'cuts the workpiece with the starting point 1328488 99-5-4, and senses the position information of the workpiece by the workpiece position sensor, and the light output of the optical modulation component is performed by the position information of the workpiece. Feedback control. In summary, the cutting apparatus of the present invention can achieve the effect of manufacturing initial cracking and cutting by only one processing light source, and therefore the cutting apparatus of the present invention - the required equipment cost is low and its structure is simplified. The above and other objects, features, and advantages of the present invention will become more apparent from the aspects of the invention. Embodiments FIG. 1 is a schematic diagram of a cutting device according to an embodiment of the present invention. Referring to Figure 1, the cutting apparatus 100 of the present invention is adapted to perform a cutting process to cut the guard 11(). The cutting apparatus has a processing light 120, a light modulation element 13A, a focusing lens group 14A, and an integral lens group 150. Wherein, the workpiece 11 〇 can be processed along the direction a (the movement is not shown. The processing light source 120 outputs a light beam 122 ′ while the light modulation element 13 〇 receives the light 122 and outputs at least the sub-beam 122 a and the sub-beam 122 b 1. When the workpiece 110 moves to the first optical path L1, the sub-beam 122a reaches the workpiece 11〇 along the first optical path L1 to process the workpiece 11〇; and when the workpiece 110 moves to the second optical path L2, the sub-beam 122b follows The second optical path L2 reaches the workpiece 110' to process the workpiece 110. The processing light source 120 is, for example, a laser light source, and the laser light source may be a carbon dioxide laser, a Nd:YAG laser, a titanium-sapphire laser, or a semiconductor diode. Laser or other suitable light source of the light source. In the present embodiment, the processing light source 12G is a carbon dioxide laser, which is an embodiment of the invention, but is not limited thereto. In this embodiment, the light The modulation element 130 is, for example, a beam splitter, and after the beam splitter receives the light beam 122, the sub-beam 122a and the sub-beam 122b can be simultaneously output, and the ratio of the light reflection f to the transmittance of the beam splitter can be adjusted according to actual needs, for example, Better疋50%/50%, or 60%/4〇%, 7〇%/3〇%, 8〇%/2〇%, or 90/〇/10/〇, etc., or 4〇 %/6〇%, 3〇%/7〇〇/〇, 20%/80% or 1〇%/9〇%, etc. In addition, 'on the first-light path L1, the focusing lens group 14 is configured to Focusing the sub-beams 122a' on the second optical path L2, the shaping lens group 15 is arranged to shape the sub-beam 122b into a cutting beam u2b, wherein the shape of the sub-beam 122a and the shape of the cutting beam 122b are substantially Differently, that is, when the sub-beam 122a and the cutting beam 122b reach the surface of the workpiece, the shapes of the two are substantially different. That is, the operator views from above or below the workpiece (also referred to as a top view, a top view, or a parallel view). In the above cross-sectional view, the sub-beam 122a and the cut beam 122b are substantially different in shape. For example, the sub-beam 122a has a substantially rendered shape, for example, a substantially circular dot, substantially square. , the real f is triangular, substantially pentagon or other suitable point shape to form a starting crack on the worker # UG, and the cutting beam 122 b, the substantially present shape is, for example, substantially linear, substantially rectangular, substantially elliptical, substantially triangular, substantially rectangular or other shape suitable for cutting the workpiece 11(). _ is that the sub-beam 122a has a substantially _ shape, for example, a substantially circular dot shape and a cut beam (four), and the shape presented on the real f is, for example, ^^«488 99-5-4, which is substantially linear, but is an embodiment, but Please refer to FIG. 1 , FIG. 2A and FIG. 2B at the same time, in the process of the force of the B-day + ^ = cutting process, the processing light source outputs a sub-beam (10) and a sub-beam and the value of k. When the workpiece u〇 moves in the direction A, and the workpiece 110 moves through the first optical path 1^ and the second optical path i to move the slider 11G in the direction A, only the workpiece no is output and the sub-lights 122a and sub-outputs are output. The beam 1221?(4) is implemented as:: light=Γ, and the output sub-beam _ i = can be selectively moved in the direction opposite to the direction A (such as ···Α), and the worker is the guard (10) Moving in the direction Α and moving the output = sub-beam 122a and sub-beam 122b in a direction opposite to the direction Α (eg: _Α) 2 . After the sub-beam 122a is focused by the focusing mirror group (10), it will be along the edge. A moving workpiece 11〇 edge forms an initial crack (10). Then, when the 19^, 1〇々 direction is moved to the second optical path L2, the workpiece (4) is cut by starting the crack 11〇a from the cutting beam 22b to form a workpiece (4). A cut 110b having a specific depth. The workpiece 11 can have a plurality of display units for the panel, and the substrate can be used for the finished product of the panel, the semi-finished product of the display panel or the mother chip. Wherein, the finished product of the display panel comprises a plurality of units, and the money of the _ panel comprises a color high beam and/or a pixel array substrate. Generally, the material of the substrate comprises an inorganic transparent material (eg glass, quartz, or Other materials) 'organic transparent materials (such as: poly women, poly meaning, polyalcohols, polyacetates, rubber, thermoplastic polymers, thermosetting polymers, polyaromatic hydrocarbons, polymethyl propyl hydrazine 1328488 99-5^ Imethyl esters, polycarbonates, or other, or a derivative thereof, or a combination thereof, or a combination thereof. For example, the substrate may be used as a substrate in a color filter and/or a matrix of a halogen substrate, and the glass of the inorganic transparent material is used as an example, but not limited thereto. As shown in FIG. 3, at least a plurality of pixel arrays 32 are disposed on the substrate 310 of the workpiece 300, and the cutting device 1 of the present invention cuts a plurality of predetermined secants (not shown) on the substrate 31〇. A strip 312 is formed to divide the plurality of halogen array substrates P. Each of the pixel arrays 320 includes at least a plurality of pixels, each of the pixels, including at least one scan line, at least one data line interlaced with the scan lines, and at least one switching element (eg, a transistor) connected to the scan lines. And the data line and the at least one capacitor are electrically connected to the switching element. In other embodiments, the finished product of the display panel comprises a plurality of display units, each display unit comprising at least one halogen array substrate, a color filter relative to the halogen array substrate, and a pixel array disposed on the pixel array. a layer having a dielectric coefficient between the substrate and the color light-emitting sheet, and the material having the layer of the dielectric coefficient includes a liquid crystal material, and the display panel is called a liquid crystal display panel (eg, a transmissive display panel, half A transmissive display panel, a reflective display panel, a color filter on the active layer (eol〇r fllter 〇n array) display panel, and an active layer on the color filter (array 〇nc〇1〇r filter) Display panel, vertical alignment type (VA) display panel, horizontal switching type (IPS) display panel, multi-domain vertical alignment type (MVA) display panel, twisted nematic (TN) display panel 'super twisted nematic type () Display panel, pattern vertical alignment type (PVA) display panel, super pattern 1328488 99-5-4 vertical alignment type (S-PVA) display panel, advanced large viewing angle (ASV) display panel, edge electric field switching type (FFS) Display panel, continuous flame-like arrangement (CPA) display panel, axisymmetric array microcell type (asm) display panel, optical compensation curved alignment type (〇CB) display panel, super horizontal switching type (S-IPS) display panel , Advanced Super Horizontal Switching (AS-IPS) display panel, extreme edge electric field switching type (uj?fs) display panel, polymer stabilized alignment display panel, dual-view display panel, three-view type ( Triple-view) display panel, two-dimensional display panel (three-dimensional or other type of panel, or a combination thereof), organic electroluminescent material, the display panel is called an organic electroluminescent display panel (eg, fluorescent An electromechanical excitation light display panel, a filled organic electroluminescent display panel, or a combination thereof, or a combination thereof. The organic electroluminescent material of the organic electroluminescence display panel comprises a small molecule luminescent material, a polymer luminescent material, or a combination thereof. As described above, the cutting apparatus 1 of the present invention can generate the sub-beam U2a and the sub-beam 122b by combining the processing light source 120 with the optical modulation element 13 ,, and focus the sub-beam 12 by the focusing mirror group 14厶, and by the integral lens group 15〇, the shaped beam 11b is made into a cutting beam. The cutting apparatus 100 of the present invention can achieve the effect of manufacturing the initial crack 110a and the cutting by only one processing light source 12, so that the equipment cost required for the cutting apparatus 1 of the present invention is low and the cost is simplified. In addition, the cutting apparatus 100 of the present invention shapes the sub-lights 122b by the integral lens group 15b so that the sub-beams 122b have a shape suitable for cutting the guard m to increase the yield and yield of the cutting process. 9 1328488 99-5-4 Referring again to FIG. 1 'between the processing light source 120 and the light modulation element i3, preferably, a beam intensity uniform element 160 may be configured to homogenize the intensity distribution of the beam 122. For example, a beam of Gaussian distribution from the original intensity is converted into a beam of substantially uniform intensity distribution, but the beam intensity uniform element 160 may not be used. Further, the mirror group 170 may be disposed on the first optical path L1 or the second optical path L2, and the direction of the sub-beam 122a or the sub-beam 122b may be changed as appropriate. Of course, the mirror group 170 may be disposed on the first optical path [I and the second optical path L2 at the same time, and the directions of the sub beam 122a and the sub beam 122b may be changed depending on the case, but the mirror group 17〇 may not be used. Moreover, the distance D between the light modulation element 130 and the mirror group 17A is adjustable. Specifically, the distance between the optical modulation element 130 and the mirror group 17A is, for example, substantially, but * is limited thereto. Further, in the processing path of the workpiece 110, preferably, the cooling device (10) may be disposed to cool the workpiece 110 after the cutting wire 122b, the workpiece 110 is cut, and the workpiece 110 is extended from the slit 110b by the principle of thermal expansion and contraction. Up to a particular length 'either simultaneously to a particular depth and feature length, but without the use of a cooling skirt 180. The cooling device (10) can spray a device for cooling the fluid, and the cooling fluid includes a liquid (for example, a 7-fish surimi line, a liquid inert gas (such as: reduced, helium, neon, xenon, gas, or the like) Mixing at least two), liquid '= such as: helium, neon, argon, helium, neon, gas, and at least two of them)), or the above mixture. In addition to the above-described splitter, the light modulation element 13 can also be a fast shutter, a rotator or other suitable light modulation element. An example in which the optical modulation element 130 is a shutter or a rotator will be described in detail below. Fig. 4 is a schematic view showing another cutting apparatus according to an embodiment of the present invention. Referring to Fig. 4, the cutting apparatus 400 is similar to the cutting apparatus 1A, and the main difference is that the light modulation element 13 of the present embodiment is, for example, a shutter or a rotator. When the light modulation element 130 is a shutter, in the present embodiment, as shown in Fig. 5A, the shutter state 132 has a windowed area (also referred to as a light-permeability area) 132a and a reflective area 132b that can be switched. The shutter 132 further has a frame 132c that surrounds the window region 132a and the reflective region 132b. If the direction and position of the light beam 122 (shown in FIG. 4) input to the shutter 132 is fixed, the shutter 132 can adjust the direction of the sub-light output from the shutter 132 by moving back and forth in the direction B. For example, as shown in Figure 5B, when the windowed region 132a of the shutter 132 is moved to the optical path of the beam 122, the beam 122 passes through the window opening region 132a to become along the first optical path. The traveling sub-beams 122 & ^ or as shown in FIG. 5C 'When the reflection region 13 of the shutter 132 is moved to the optical path of the light beam 122, the light beam 122 is reflected by the reflection region 132b to become a child traveling along the second optical path L2 Beam i22b. When the light modulation element 130 is a rotator, the rotator may have at least one switchable window region (the surface is a light penetrating region) and a reflective region. In the present embodiment, as shown in Fig. 6A, the rotator 134 has two window regions 134a and 134b which are switchable. When ^, in other embodiments not shown, the 'turn_ can have an appropriate number _ window area and reflection area. Rotating 13 1328488 99-5-4 134 ′′ preferably has a frame 134c and a rotating shaft i34d, and the frame 134c surrounds the window opening 134a and the reflection area 134b, and the rotating shaft 134d is located at the center of the frame 134c and opens the window. The area 134a and the reflection area 134b are connected. If the direction and position of the beam 122 (shown in FIG. 4) input to the rotator 134 is fixed, the rotator 134 can rotate the rotator 134 in the direction C1 or the direction C2 by rotating the rotating shaft 134d to adjust the slave rotator 134. The direction of the output sub-beams may also be such that the rotator 134 is rotated back and forth in the direction C1 and the direction C2 to adjust the direction of the sub-beams output from the rotator 134. For example, as shown in Fig. 6B, when the window opening 134a of the rotator 134 is turned to the optical path of the beam 122, the beam 122 passes through the window opening region 134a to become the sub-beam 122& which travels along the first optical path L1. Alternatively, as shown in Fig. 6 (:, when the reflection area 134b of the rotator 134 is turned to the optical path of the light beam 122, the light beam 122 is reflected by the reflection area 134b to become the sub-beam 122b traveling along the second optical path L2. The device 34 can be tilted by an appropriate angle to adjust the direction of the sub-beams it outputs. Referring again to Figure 4, when the light modulation element 13 is a shutter or a rotator, the cutting device 400' preferably There is a driving device i 190 connected to the light modulation element 13 ,, but * is limited thereto, and the driving device f 19 〇 includes a motor, a shirt motor or its like, and the present invention is a ship motor as an embodiment, but In this embodiment, the cutting device 4 is in the cutting process, and the shutter can be switched by the driving device 19〇 as occasion demands. _132 or the window opening areas 132a, 134a of the rotator 134 and the position of the reflection areas mb, (10) to control the light beam 122 to reach the window opening areas 132a, 13 such as or the inverse 1328488 99-5-4 shot area 132a, 134a. Additionally, at least one sensing can be configured 'better' next to the processing path of the workpiece 110. S senses the position information of the workpiece 11〇, and can feedback control the light output of the light modulation element 13〇 by the position information of the workpiece 110, but the sensor S may not be used. For example, the sense After the detector S senses the position information of the workpiece no, the cutting device 4 controls the light output of the light modulation component 13 变 to be weak, open or closed by the position information of the workpiece 110. When the sensor s senses that the workpiece 110 moving in the direction A reaches the first optical path L1, the cutting device 400 controls the light modulation element 13〇 by the driving device 190, so that the light modulation element I30 outputs only the sub-beam 122a to The edge of the workpiece 110 is used to fabricate an initial crack ll 〇 a at the edge of the workpiece 11 . In addition, when the sensor s senses that the workpiece 110 moving in the direction A reaches the second optical path L2 or the sensor s senses the edge When the workpiece 110 moving in the direction A leaves the first optical path L1, the cutting device 4 控制 controls the optical modulation element 13 〇〇 by the driving device 190, so that the optical modulation element 13 〇 outputs only the sub-beam 122 b through the integer lens group 150 Forming a cutting beam i22b to the workpiece 110 to form a special on the workpiece 11 A depth or a specific length or a specific depth and a specific length of the cut 110b. In this way, the energy of the concentrated beam 122 can be reduced to the sub-beam 122a or the sub-beam mb, which is relatively reduced to the amount of the superfilament 120 provided during the cutting process. In addition, the cutting device of the present invention can achieve the effect of manufacturing light cracks and _ only by processing the light source, so the cutting device of the invention needs: the equipment cost is low. Moreover, the structure thereof is relatively simplified. The cutting device of the invention is cut by using a laser light source, and therefore belongs to the non-contact processing method 15 15 99-5-4, which is less prone to chipping at the cutting place and does not have equipment By using the shape of the workpiece to cut the shape of the workpiece to increase the cutting 2 == the cutting device of the present invention can see the energy of the only sub-beam by the spectroscope, so that it can be used in the cutting device of the present invention. The light source selectivity of the laser light s, the low input = the technology of the present invention, the present invention has been disclosed as above, and the financial resources are limited to the general knowledge in the field, without departing from the spirit of this month and In the running quarter, when you can make some changes and retouching, so the hair, the protection of the turn after the social towel, please full-time _ defined. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1, ''' shows a schematic view of a cutting apparatus of the present invention. 2A and 2B are schematic views of a cutting process of the present invention. 3 is a schematic view of a workpiece in accordance with an embodiment of the present invention. Figure 4 is a schematic illustration of another type of touch device of the present invention. Figure 5 is a front elevational view of the light modulation element of Figure 4 and Figure 5C is a side view of the light modulation element of Figure 5A. Figure 6 is a front elevational view of another light modulation element of Figure 4. 6A and 6C are side views of the light modulation element of Fig. 6A. [Main component symbol description] 100, 400: Cutting device 110' 300: τ device 110a: initial crack 110b, 312: slit 1328488 99-5-4 120: processing light source 122: light beam 122a, 122b: sub-beam 122b' : cutting beam 130: light modulation element 132: shutter 132a, 134a: window opening area 132b, 134b: reflection area φ 132c, 134c: frame 134: rotator 134d: shaft 140: focusing lens group 150: integral lens group 160: beam intensity uniform element 170: mirror group 180: cooling device 190: driving device_310: substrate 320: halogen array A, B, Cl, C2: direction D: distance L: optical path - P: pixel array substrate S : sensor 17