CN108873422A - Array substrate, display panel and its cutting method - Google Patents
Array substrate, display panel and its cutting method Download PDFInfo
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- CN108873422A CN108873422A CN201810993730.4A CN201810993730A CN108873422A CN 108873422 A CN108873422 A CN 108873422A CN 201810993730 A CN201810993730 A CN 201810993730A CN 108873422 A CN108873422 A CN 108873422A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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Abstract
The invention discloses a kind of array substrate, display panel and its cutting methods, it is related to field of display technology, it is provided with viewing area and non-display area, non-display area includes the first non-display area for surrounding viewing area and the binding area positioned at the first non-display area side, non-display area has at least one the first special-shaped boundaries, first special-shaped boundary includes the special-shaped boundary of the first son, and the special-shaped boundary of the first son is located at the first non-display area；Array substrate includes：Underlay substrate；First light shield layer is located at non-display area, and the side of underlay substrate is arranged in, and the first light shield layer orthographic projection of plane and special-shaped boundary of the first son where underlay substrate is at least partly overlapping；And drive circuit layer, it is located at non-display area, side of first light shield layer far from underlay substrate is set.By being set to the first overlapping light shield layer of the special-shaped boundary of the first son in the first non-display area, is entered in display panel with blocking the light energy of laser sputtering, promote product yield.
Description
Technical field
The present invention relates to field of display technology, more particularly, to a kind of array substrate, display panel and its cutting side
Method.
Background technique
In the manufacturing process of existing display panel, usually the display master blank of monolith is cut to obtain be suitble to size and
The display panel of shape, wherein laser cutting is common cutting mode.Non-display area (i.e. frame region) on display master blank
Some circuit structures would generally be set, such as gate driving circuit etc. generally includes electronic component in circuit structure.
According to the process conditions of existing laser cutting, during laser cutting, laser path is from display
The edge of motherboard enters to switch in display master blank, and display master blank generally includes a glass substrate, and laser cutting process can generate larger
Thermal energy, radium-shine laser by display master blank edge when due to glass substrate edge out-of-flatness, cause laser in glass base
Edges of boards edge generates scattering, when scattering the circuit structure in illumination to display master blank in non-display area, it is most likely that lead to circuit knot
Electronic component is burnt and is damaged in structure, greatly reduces the yield and reliability of product.
Summary of the invention
In view of this, the present invention provides a kind of array substrate, display panel and its cutting method, in the first non-display area
With first the first light shield layer of the sub- corresponding position setting of heterotype edge circle, enter display panel to block the light energy of radium-shine sputtering
In, it burns the possibility of drive circuit layer to reduce radium-shine energy, to be conducive to be promoted the yield and reliability of product.
In a first aspect, the application provides a kind of array substrate, it is provided with viewing area and non-display area, the non-display area packet
It includes around the first non-display area of the viewing area and positioned at the binding area of first non-display area side, it is described non-display
Area has at least one the first special-shaped boundaries, and the described first special-shaped boundary includes the special-shaped boundary of the first son, the first son abnormity
Boundary is located at first non-display area；
The array substrate includes：
Underlay substrate；
First light shield layer is located at the non-display area, the side of the underlay substrate is arranged in, first light shield layer exists
The orthographic projection of plane where the underlay substrate and the special-shaped boundary of the first son are at least partly overlapping；And
Drive circuit layer is located at the non-display area, one of first light shield layer far from the underlay substrate is arranged in
Side.
Second aspect, the application provide a kind of display panel, including the array substrate being oppositely arranged and color membrane substrates, the battle array
Column substrate is array substrate provided herein；It is provided with viewing area and non-display area, the non-display area includes around institute
State the first non-display area of viewing area and the binding area positioned at first non-display area side；
The color membrane substrates and the viewing area and first non-display area are overlapping, and do not overlap with the binding area.
The third aspect, the application provide a kind of preparation method of display panel, including：
Array substrate and color membrane substrates are made respectively, and the array substrate is provided with viewing area and non-display area, described non-
Viewing area includes around the first non-display area of the viewing area and positioned at the binding area of first non-display area side, institute
Non-display area is stated at least one first laser cutting track, the first laser cutting track includes the first son laser cutting
Track, the first son laser cutting track are located at first non-display area；The array substrate includes：Underlay substrate；The
One light shield layer is located at the non-display area, the side of the underlay substrate is arranged in, first light shield layer is in the substrate base
The orthographic projection of plane where plate and the first son laser cutting track are at least partly overlapping；And drive circuit layer, it is located at institute
Non-display area is stated, the side of first light shield layer far from the underlay substrate is set；
The array substrate and the color membrane substrates are oppositely arranged and at box, make the color membrane substrates and the viewing area
It is overlapping with first non-display area, and do not overlapped with the binding area；The color membrane substrates have second laser cutting track,
Second laser cutting track orthographic projection of plane where underlay substrate is overlapped with the first son laser cutting track；
Using laser along the first laser cutting track and the second laser cutting track to the display panel into
Row laser cutting forms the first special-shaped boundary in the array substrate, and the second special-shaped boundary is formed on the color membrane substrates；
It is located at the part in first non-display area in described first special-shaped boundary and forms the special-shaped boundary of the first son, second abnormity
Boundary is in the orthographic projection of plane where the underlay substrate and the special-shaped overlapping margins of the first son.
Compared with prior art, array substrate provided by the invention, display panel and its cutting method, at least realize as
Under beneficial effect：
In array substrate provided herein, display panel and its cutting method, array substrate has viewing area and non-
Viewing area, non-display area include surrounding the first non-display area of viewing area and positioned at the binding area of the first non-display area side,
Non-display area is provided with the first special-shaped boundary, non-display area is usually provided with drive circuit layer, each first special-shaped boundary is logical
The mode for crossing laser cutting is formed.Be located in first special-shaped boundary the part in the first non-display area be the special-shaped boundary of the first son away from
Nearest from viewing area, during forming the first son abnormity boundary by the way of laser cutting, laser is on underlay substrate side
Edge generates scattering, the application in the side of underlay substrate position corresponding with the first sub- heterotype edge circle provided with the first light shield layer,
It can effectively stop to scatter illumination in the drive circuit layer into array substrate by first light shield layer, to reduce radium-shine energy
The possibility for drive circuit layer of burning, to be conducive to be promoted the yield and reliability of product.
Certainly, implementing any of the products of the present invention specific needs while must not reach all the above technical effect.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 show a kind of top view of array substrate provided by the embodiment of the present application；
Fig. 2 show a kind of AA ' sectional view of the provided array substrate of Fig. 1 embodiment；
Fig. 3 show a kind of BB ' sectional view of array substrate provided by Fig. 1 embodiment；
Fig. 4 show the first light shield layer provided by the embodiment of the present application and a kind of relative position on the first special-shaped boundary is closed
System's figure；
Fig. 5 show array substrate another kind top view provided by the embodiment of the present application；
Fig. 6 show another AA ' sectional view of array substrate provided by embodiment illustrated in fig. 1；
Fig. 7 show a kind of top view of display panel provided by the embodiment of the present application；
Fig. 8 show a kind of CC ' sectional view of the provided display panel of the application embodiment illustrated in fig. 7；
Fig. 9 show a kind of flow chart of the preparation method of display panel provided by the embodiment of the present application；
Figure 10 show a kind of top view for being cut by laser preceding array substrate；
Figure 11 show a kind of top view for being cut by laser preceding color membrane substrates；
Figure 12 show a kind of top view of display panel after laser cutting.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should be noted that：Unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
According to the process conditions of existing laser cutting, during laser cutting, laser path is from display
The edge of motherboard enters to switch in display master blank, and display master blank generally includes a glass substrate, and laser cutting process can generate larger
Thermal energy, radium-shine laser by display master blank edge when due to glass substrate edge out-of-flatness, cause laser in glass base
Edges of boards edge generates scattering, when scattering the circuit structure in illumination to display master blank in non-display area, it is most likely that lead to circuit knot
Electronic component is burnt and is damaged in structure, greatly reduces the yield and reliability of product.
In view of this, the present invention provides a kind of array substrate, display panel and its cutting method, in the first non-display area
With first the first light shield layer of the sub- corresponding position setting of heterotype edge circle, enter display panel to block the light energy of radium-shine sputtering
In, it burns the possibility of drive circuit layer to reduce radium-shine energy, to be conducive to be promoted the yield and reliability of product.
It is described in detail below in conjunction with the drawings and specific embodiments.
Fig. 1 show a kind of top view of array substrate provided by the embodiment of the present application, and Fig. 2 show Fig. 1 embodiment
A kind of AA ' sectional view of provided array substrate, Fig. 3 show a kind of section BB ' of array substrate provided by Fig. 1 embodiment
Figure, Fig. 4 show a kind of relative position relation figure of the first light shield layer provided by the embodiment of the present application and the first special-shaped boundary,
In conjunction with Fig. 1-Fig. 4, a kind of array substrate 100 of the embodiment of the present application is provided with viewing area 11 and non-display area 12, non-display area 12
It is non-aobvious including the first non-display area 121 around viewing area 11 and positioned at the binding area 122 of 121 side of the first non-display area
Show that area 12 has at least one the first special-shaped boundaries 50, the first special-shaped boundary 50 includes the special-shaped boundary 51 of the first son, and the first son is different
Shape boundary 51 is located at the first non-display area 121；
Referring to fig. 2, array substrate 100 includes：
Underlay substrate 10；
First light shield layer 20 is located at non-display area 12, the side of underlay substrate 10 is arranged in, the first light shield layer 20 is in substrate
The orthographic projection of 10 place plane of substrate and the special-shaped boundary 51 of the first son are at least partly overlapping；And
Drive circuit layer 30 is located at non-display area 12, the first side of the light shield layer 20 far from underlay substrate 10 is arranged in.
Specifically, continuing with referring to figure 1, figure 2 and figure 3, wherein Fig. 2 is the first non-display area in Fig. 1 array substrate 100
A kind of 121 sectional view, Fig. 3 are a kind of sectional views of viewing area 11 in Fig. 1 array substrate 100, and the first of array substrate 100 is non-
Viewing area 121 is provided with drive circuit layer 30, and viewing area 11 is provided with thin film transistor array layer 40, and binding area 122 is usually set
It is equipped with and is fanned out to Wiring structure, be further typically provided in the viewing area of array substrate 100 11 along first direction and second direction arrangement
Multiple sub-pixels 80, wherein the electronic component in drive circuit layer 30 after being influenced by radium-shine energy be easy is burnt
Even damage.Its edge is parallel or vertical with first direction and second direction in regular array substrate 100, makes array substrate
100 are presented rectangular configuration；And there are at least one the first special-shaped boundaries in array substrate 100 provided by the embodiment of the present application
50, which refers to the boundary intersected with first direction and second direction, and the presence on the abnormity boundary makes
It obtains 300 entirety of display panel and shows non-rectangle structure, in general, each first special-shaped boundary 50 is the mode being cut by laser
It obtains.In array substrate 100 provided by the embodiment of the present application, it is located at the first non-display area 121 in the first special-shaped boundary 50
In part be the first special-shaped boundary 51 of son apart from viewing area 11 recently, it is special-shaped that the first son is being formed by the way of using laser cutting
During boundary 51, laser generates scattering, side and first son of the application in underlay substrate 10 at 10 edge of underlay substrate
The corresponding position in special-shaped boundary 51 is provided with the first light shield layer 20, refers to Fig. 4, can effectively be stopped by first light shield layer 20
Illumination is scattered into the electronic component in the drive circuit layer 30 in array substrate 100, is burnt drive to reduce radium-shine energy
The possibility of dynamic circuit layer 30, to be conducive to the yield and reliability of product after improving laser cutting.
It should be noted that Fig. 1-Fig. 4 has been only shown schematically sub-pixel 80 and the first special-shaped boundary 50 in display surface
A kind of position on plate 300, does not represent actual size, quantity and position, in some other embodiment of the application, son
Size, quantity and the position on pixel 80 and the first special-shaped boundary 50 can flexibly be set according to the actual situation.In addition, only showing in Fig. 4
A kind of structure type for having gone out the first light shield layer 20, in some other embodiment of the application, the first light shield layer 20 can also divide
It is distributed in entire first non-display area 121 or the first light shield layer 20 may be additionally located at binding area 122, the application is to this without tool
Body limits.
In addition, referring to Fig. 3, the thin film transistor array layer 40 in Fig. 3 includes buffer layer 41, on buffer layer 41
Thin film transistor (TFT) 42 and planarization layer 43 positioned at thin film transistor (TFT) 42 far from 10 side of underlay substrate.It should be noted that
Fig. 3 is illustrated by taking the thin film transistor (TFT) 42 of top gate structure as an example, i.e. the gate metal layer 422 of thin film transistor (TFT) 42 is located at
Side of the semiconductor active layer 421 far from underlay substrate 10, in addition to such structure, thin film transistor (TFT) 42 can also be bottom grating structure,
I.e. the gate metal layer 422 of thin film transistor (TFT) 42 is located at semiconductor active layer 421 close to the side of underlay substrate 10, the application couple
This is without specifically limiting.It should be noted that above-mentioned buffer layer 41 can be by from such as silica (SiOx), silicon nitride
(SiNx), the inorganic material or such as acryl of silicon oxynitride (SiOxNy), aluminium oxide (AlOx) or aluminium nitride (AlNx) etc.
(acryl), the material selected in the organic material of polyimides (PI) or polyester etc. is formed.Buffer layer may include single layer or more
A layer.The buffer layer 41 prevents moisture or impurity from spreading by underlay substrate, and be also used in substrate for keeping off oxygen and moisture
Flat surface is provided on the upper surface of substrate.
It should be noted that Fig. 2 show a kind of section of the first non-display area 121 of array substrate 100 shown in Fig. 1
Figure, Fig. 3 show a kind of sectional view of the viewing area 11 of array substrate 100 shown in Fig. 1, viewing area 11 and the first non-display area
121 be to share buffer layer 41, that is to say, that above-mentioned buffer layer 41 is the whole surface positioned at underlay substrate.In conjunction with Fig. 2 and
Fig. 3 is additionally provided with semiconductor active layer 421, gate insulating layer 82, gate metal layer 422, layer insulation on buffer layer 41
Layer 83, source-drain electrode metal layer 84 and planarization layer 43.
Optionally, in array substrate 100 provided by the embodiment of the present application, the same first special-shaped boundary 50 is only located at first
Non-display area 121, same first special-shaped boundary 50 are only located at binding area 122, or, the same first special-shaped boundary 50 is located at the simultaneously
One non-display area 121 and binding area 122.
Specifically, in array substrate 100 provided by embodiment illustrated in fig. 1, in the first non-display area 121 and binding area
122 regions having a common boundary are respectively arranged with two first special-shaped boundaries 50, and the first non-display area is crossed on two first special-shaped boundaries 50
121 are located at the first non-display area 121 with binding area 122, that is, part, and another part, which is located at, binds area 122.Except such structure
Outside form, Fig. 5 show provided by the embodiment of the present application another top view of array substrate 100, in the embodiment, further includes
The the first special-shaped boundary 62 for being only located at the first special-shaped boundary 61 of the first non-display area 121 and being only located in binding area 122, this
Application is to this without specifically limiting.
Optionally, Fig. 4 is referred to, in array substrate 100 provided by embodiment illustrated in fig. 4, the first special-shaped boundary 50 is removed
Including being located at outside the special-shaped boundary 51 of the first son of the first non-display area 121, the first special-shaped boundary 50 further includes a plurality of positioned at binding
The special-shaped boundary 52 of second son in area 122, the special-shaped boundary 51 of the first son and the special-shaped boundary 52 of the second son include a plurality of special-shaped boundary
Section, a plurality of abnormity border segment is at least one of straight border, arc boundary and piecewise linear curves.It should be noted that for side
Just the special-shaped boundary 51 of the first son and the special-shaped boundary 52 of the second son are distinguished, embodiment illustrated in fig. 4 is distinguished with the lines of different thicknesses
Indicate the special-shaped boundary 51 of the first son and the special-shaped boundary 52 of the second son, there is no the differentiations of line weight both in actual product.
Specifically, the special-shaped boundary 51 of the first son provided by the embodiment of the present application and the special-shaped boundary 52 of the second son can be regarded as
Be made of a plurality of special-shaped border segment, special-shaped border segment herein can to straight border, arc boundary or piecewise linear curves, or
Person is combination both any in straight border, arc boundary and piecewise linear curves, or include simultaneously straight border, arc boundary and
Piecewise linear curves, the application is to this without specifically limiting.Embodiment illustrated in fig. 4 gives each heterotype edge in the first special-shaped boundary 50
Area under a person's administration is the situation of straight border, and the special-shaped border segment in the first special-shaped boundary 50 in embodiment illustrated in fig. 5 includes arc
Boundary and straight border, certain Fig. 4 and Fig. 5 are only the shape for schematically illustrating the first special-shaped boundary 50, in some of the application
In other embodiments, the first special-shaped boundary 50 can also be presented as other shape and structures, and the application is to this without specifically limiting.
Optionally, Fig. 2 and Fig. 3 are referred to, in the provided array substrate 100 of the embodiment of the present application, the first light shield layer 20
With a thickness of D1,0.1 μm≤D1≤0.2 μm.
Specifically, in array substrate 100 provided by the embodiment of the present application, when being by the thickness design of the first light shield layer 20
At >=0.1 μm, can effectively it stop in laser cutting process in the laser irradiation of the edge scatter of underlay substrate 10 to driving electricity
In electronic component in road floor 30, lead to drive circuit layer so as to effectively reduce scattering illumination to drive circuit layer 30
The possibility that electronic component in 30 is burnt；In addition, when the thickness design of the first light shield layer 20 is≤0.2 μm by the application, it is thick
It spends very thin, hardly the integral thickness of array substrate 100 is impacted, thus also help and realize array substrate 100
Slimming demand.
Optionally, continuing with referring to figs. 2 and 3, in array substrate 100 provided by the embodiment of the present application, the first shading
Layer 20 is metal light shield layer.In view of metal material has preferable shading performance, the embodiment of the present application is using metal material
When light shield layer is as the first light shield layer 20, it can preferably stop the edge scatter in laser cutting process by underlay substrate 10
Light enters drive circuit layer 30, to be conducive to reduce the possibility that electronic component is burnt in drive circuit layer 30.
Optionally, in array substrate 100 provided by the embodiment of the present application, the first light shield layer 20 includes molybdenum, titanium.Usual battle array
Drive circuit layer 30 is prepared under higher temperature (such as 400 DEG C or so) in column substrate 100, due to the embodiment of the present application
Non-display area 12 of the meeting on underlay substrate 10 generates first before preparing driving function layer in provided array substrate 100
Light shield layer 20 avoids the first light shield layer 20 in driving circuit therefore it is required that the first light shield layer 20 has preferable high temperature resistance
Performance change occurs in the preparation process of layer 30 and interception can not be played.In view of molybdenum and titanium are provided with preferable high temperature resistant
Performance, their fusing point reach thousands of degrees Celsius, therefore, when using molybdenum or titanium as the first light shield layer 20, subsequent drive
Environment temperature will not impact the performance of molybdenum and titanium in the preparation process of circuit layer 30, therefore enable to the first light shield layer
20 have preferable shading performance, can effectively stop to shine in laser cutting process in the laser of the edge scatter of underlay substrate 10
It is mapped in the electronic component in drive circuit layer 30, causes so as to effectively reduce scattering illumination to drive circuit layer 30
The possibility that electronic component in drive circuit layer 30 is burnt.
Optionally, Fig. 6 show another AA ' sectional view of array substrate 100 provided by embodiment illustrated in fig. 1, should
It further include the first buffer layer 70 positioned at non-display area 12 in array substrate 100 provided by embodiment, first buffer layer 70
In the first side of the light shield layer 20 far from underlay substrate 10；
Drive circuit layer 30 is located at side of the first buffer layer 70 far from the first light shield layer 20.
Specifically, Fig. 6 is referred to, it is slow which introduces first between drive circuit layer 30 and the first light shield layer 20
Layer 70 is rushed, which can absorb the light energy of radium-shine sputtering；During laser cutting, the first light shield layer 20
Can stop to enter the scattering light in array substrate 100 by the edge scatter of underlay substrate 10, though have some scattered light not by
When success stops and passes through the first light shield layer 20, first buffer layer 70 can also absorb this some scattered light, thus into one
Step reduces scattering light and enters the possibility of drive circuit layer 30, and then reduces scattering illumination and be mapped to electronics in drive circuit layer 30
The possibility burnt is caused on component to it, therefore is more conducive to the yield and reliability of product after improving laser cutting.
Optionally, continuing with referring to Fig. 6, in array substrate 100 provided by the embodiment of the present application, first buffer layer 70
With a thickness of D2,40nm≤D2≤50nm.Specifically, it in array substrate 100 provided by the embodiment of the present application, is buffered when by first
Layer 70 thickness design be >=40nm when, can in laser cutting process penetrate the first light shield layer 20 scattering light effectively inhale
Receive, and be by the thickness design of first buffer layer 70≤50nm when, since its thickness is very thin, to the thickness that array substrate 100 is whole
Degree influences slimming demand that is very little, thus also helping realization array substrate 100.
Optionally, Fig. 6 is referred to, in array substrate 100 provided by the embodiment of the present application, first buffer layer 70 includes more
Crystal silicon.Polysilicon has preferable photo absorption performance, when using polysilicon as first buffer layer 70 in the embodiment of the present application,
The polysilicon can preferably absorb the scattering light formed in laser cutting process, and scattering light can effectively be avoided to enter driving electricity
In road floor 30, reduces and cause the possibility burnt to it on the electronic component that scattering illumination is mapped in drive circuit layer 30, because
This is more conducive to the yield and reliability of product after improving laser cutting.
Based on the same inventive concept, the application also provides a kind of display panel 300, and Fig. 7 show the embodiment of the present application institute
A kind of top view of the display panel 300 of offer, Fig. 8 show the provided display panel 300 of the application embodiment illustrated in fig. 7
A kind of CC ' sectional view, referring to figs. 7 and 8, the display panel 300 include the array substrate 100 being oppositely arranged and color membrane substrates
200, array substrate 100 is array substrate 100 provided by the embodiment of the present application；
Display panel 300 is provided with viewing area 11 and non-display area 12, and non-display area 12 includes surround viewing area 11
One non-display area 121 and binding area 122 positioned at 121 side of the first non-display area；
Color membrane substrates 200 and viewing area 11 and the first non-display area 121 are overlapping, and do not overlap with binding area 122.
Specifically, Fig. 7 and Fig. 8 are referred to, display panel 300 provided by the embodiment of the present application is 301 display surface of liquid crystal
Plate 300 including the color membrane substrates 200 and array substrate 100 that are oppositely arranged and is filled in color membrane substrates 200 and array substrate
Liquid crystal 301 between 100, it should be noted that the embodiment of display panel 300 can be found in the implementation of above-mentioned array substrate 100
Example, overlaps will not be repeated.
Based on the same inventive concept, the application also provides a kind of preparation method of display panel 300, and Fig. 9 show this Shen
Please display panel 300 provided by embodiment preparation method a kind of flow chart, which includes：
Step 101 makes array substrate 100 and color membrane substrates 200 respectively, and wherein the structure of array substrate 100 can be found in
Figure 10, the structure of color membrane substrates 200 can be found in Figure 11, and Figure 10 show a kind of top view for being cut by laser preceding array substrate 100,
Figure 11 is shown be cut by laser before color membrane substrates 200 a kind of top view, array substrate 100 is provided with viewing area 11 and non-display
Area 12, non-display area 12 include surrounding the first non-display area 121 of viewing area 11 and positioned at 121 side of the first non-display area
Area 122 is bound, non-display area 12 has at least one first laser cutting track 91, and first laser cutting track 91 includes first
Son laser cutting track 911, the first son laser cutting track 911 are located at the first non-display area 121；As can be seen from Figure 10, first
Laser cutting track 91 further includes positioned at the second son laser cutting track 912 in binding area 122；Array substrate 100 includes：Substrate
Substrate 10；First light shield layer 20 is located at non-display area 12, the side of underlay substrate 10 is arranged in, the first light shield layer 20 is in substrate
The orthographic projection of 10 place plane of substrate and the first son laser cutting track 911 are at least partly overlapping；And drive circuit layer 30, position
In non-display area 12, the first side of the light shield layer 20 far from underlay substrate 10 is set；
Array substrate 100 and color membrane substrates 200 are oppositely arranged and at box by step 102, refer to Fig. 8, Figure 10 and figure
11, keep color membrane substrates 200 and viewing area 11 and the first non-display area 121 overlapping, and do not overlap with binding area 122；Color membrane substrates
200 have second laser cutting track 92, orthographic projection and the of the second laser cutting track 92 in 10 place plane of underlay substrate
One son laser cutting track 911 is overlapped；
Step 103, using laser along first laser cutting track 91 and second laser cutting track 92 to display panel 300
It is cut by laser, 2, Figure 12 show a kind of top view of display panel 300 after laser cutting referring to Figure 1, in array base
The first special-shaped boundary 50 is formed on plate 100, the second special-shaped boundary is formed on color membrane substrates 200, and (Figure 12 is not shown, reference can be made to figure
1)；It is located at the part in the first non-display area 121 in first special-shaped boundary 50 and forms the special-shaped boundary 51 of the first son, the second heterotype edge
Boundary is overlapped in the orthographic projection of 10 place plane of underlay substrate with the special-shaped boundary 51 of the first son.
Specifically, it refers to Fig. 9, in the cutting method of display panel 300 provided by the embodiment of the present application, passes through step
The array substrate 100 and color membrane substrates 200 of 101 preparations are in rectangular configuration shown in Figure 10 and Figure 11 before cutting, wherein array
The non-display area 12 of substrate 100 has a plurality of first laser cutting track 91, and during post laser cutting, laser is exactly
It is cut along the first laser cutting track 91；First laser cutting track 91 includes that the first son is cut by laser track
911, the first son laser cutting track 911 is located at the first non-display area 121.First non-display area 121 of array substrate 100 is arranged
There is drive circuit layer, viewing area 11 is provided with thin film transistor array layer, and binding area 122, which is usually provided with, is fanned out to Wiring structure,
Multiple sub-pixels 80 along first direction and second direction arrangement are further typically provided in the viewing area of array substrate 100 11,
Electronic component is easy to be burnt after being influenced by radium-shine energy and even damage in middle drive circuit layer 30.Pass through above-mentioned step
Rapid 102 by array substrate 100 and color membrane substrates 200 at box, there is second laser cutting track 92 on color membrane substrates 200, this
The orthographic projection overlapping of the first son laser cutting track 911 on dual-laser cutting track 92 and array substrate 100.In step 103
During laser cutting, the first son laser cutting track 911 and second laser cutting track 92 are nearest apart from viewing area 11,
During laser cutting, laser generates scattering at 10 edge of underlay substrate, and the application is in the side and first of underlay substrate 10
The sub- abnormity corresponding position in boundary 51 is provided with the first light shield layer 20, refers to Fig. 4, can effectively be hindered by first light shield layer 20
Gear scattering illumination is conducive to reduce radium-shine energy into the electronic component in the drive circuit layer 30 in array substrate 100
Amount is burnt the possibility of the electronic component in drive circuit layer 30, to be conducive to the yield of product after improving laser cutting and can
By property.
Optionally, in above-mentioned steps 103, using laser along first laser cutting track 91 and second laser cutting track 92
Display panel 300 is cut by laser, further for：
Array substrate 100 is cut along first laser cutting track 91 using laser, is then cut again along second laser
Track 92 is cut to cut color membrane substrates 200；Alternatively,
Color membrane substrates 200 are cut along second laser cutting track 92 using laser, are then cut again along first laser
Track 91 is cut to cut array substrate 100.
Specifically, in the cutting method of display panel 300 provided by the embodiment of the present application, the array substrate that is oppositely arranged
100 and color membrane substrates 200 on be respectively arranged with one-to-one first laser cutting track 91 and second laser cutting track 92,
During laser cutting, array substrate 100 and color membrane substrates 200 need to be carried out respectively using the process being cut by laser twice
Cutting to form special-shaped boundary in array substrate 100 and color membrane substrates 200 respectively, and then forms structure shown in Figure 12.?
In practical cutting process, first array substrate 100 can be cut along first laser cutting track 91, further along second laser
Cutting track 92 cuts color membrane substrates 200；Alternatively, first along second laser cutting track 92 to color membrane substrates 200 into
Row cutting, cuts array substrate 100 further along first laser cutting track 91, the application is to this without specifically limiting
It is fixed.Due in array substrate 100 provided herein, the first light shield layer 20 is provided in non-display area 12, by this
One light shield layer 20 can effectively stop to scatter illumination into the electronic component in the drive circuit layer 30 in array substrate 100, from
And reduce the possibility for the electronic component that radium-shine energy is burnt in drive circuit layer 30, thus be conducive to be promoted product yield and
Reliability.
Optionally, Fig. 6 is referred to, array substrate 100 provided by the embodiment of the present application further includes being located at non-display area 12
First buffer layer 70, first buffer layer 70 is located at the first side of the light shield layer 20 far from underlay substrate 10；
Drive circuit layer 30 is located at side of the first buffer layer 70 far from the first light shield layer 20.
Specifically, Fig. 6 is referred to, it is slow which introduces first between drive circuit layer 30 and the first light shield layer 20
Layer 70 is rushed, which can absorb the light energy of radium-shine sputtering；During laser cutting, the first light shield layer 20
Can stop to enter the scattering light in array substrate 100 by the edge scatter of underlay substrate 10, though have some scattered light not by
When success stops and passes through the first light shield layer 20, first buffer layer 70 can also absorb this some scattered light, thus into one
Step reduces scattering light and enters the possibility of drive circuit layer 30, and then reduces the electricity that scattering illumination is mapped in drive circuit layer 30
The possibility burnt is caused on sub- component to it, therefore is more conducive to the yield and reliability of product after improving laser cutting.
Through the foregoing embodiment it is found that array substrate provided by the invention, display panel and its cutting method, are at least realized
Following beneficial effect：
In array substrate provided herein, display panel and its cutting method, array substrate has viewing area and non-
Viewing area, non-display area include surrounding the first non-display area of viewing area and positioned at the binding area of the first non-display area side,
Non-display area is provided with the first special-shaped boundary, non-display area is usually provided with drive circuit layer, each first special-shaped boundary is logical
The mode for crossing laser cutting is formed.Be located in first special-shaped boundary the part in the first non-display area be the special-shaped boundary of the first son away from
Nearest from viewing area, during forming the first son abnormity boundary by the way of laser cutting, laser is on underlay substrate side
Edge generates scattering, the application in the side of underlay substrate position corresponding with the first sub- heterotype edge circle provided with the first light shield layer,
It can effectively stop to scatter illumination in the drive circuit layer into array substrate by first light shield layer, to reduce radium-shine energy
The possibility for drive circuit layer of burning, to be conducive to be promoted the yield and reliability of product.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (13)
1. a kind of array substrate, which is characterized in that be provided with viewing area and non-display area, the non-display area includes around described
First non-display area of viewing area and positioned at the binding area of first non-display area side, the non-display area has at least
One first special-shaped boundary, the described first special-shaped boundary include the special-shaped boundary of the first son, and the special-shaped boundary of the first son is located at institute
State the first non-display area；
The array substrate includes：
Underlay substrate；
First light shield layer is located at the non-display area, the side of the underlay substrate is arranged in, first light shield layer is described
The orthographic projection of plane where underlay substrate and the special-shaped boundary of the first son are at least partly overlapping；And
Drive circuit layer is located at the non-display area, the side of first light shield layer far from the underlay substrate is arranged in.
2. array substrate according to claim 1, which is characterized in that the same first special-shaped boundary is only located at described the
One non-display area, same described first special-shaped boundary are only located at the binding area, or, same described first special-shaped boundary while position
In first non-display area and the binding area.
3. array substrate according to claim 1, which is characterized in that the described first special-shaped boundary further includes a plurality of positioned at institute
The special-shaped boundary of the second son in binding area is stated, the special-shaped boundary of the first son and the special-shaped boundary of the second son include a plurality of abnormity
Border segment, a plurality of special-shaped border segment is at least one of straight border, arc boundary and piecewise linear curves.
4. array substrate according to claim 1, which is characterized in that first light shield layer with a thickness of D1,0.1 μm≤
D1≤0.2μm。
5. array substrate according to claim 1, which is characterized in that first light shield layer is metal light shield layer.
6. array substrate according to claim 5, which is characterized in that first light shield layer includes molybdenum, titanium.
7. array substrate according to claim 1, which is characterized in that further include the first buffering positioned at the non-display area
Layer, the first buffer layer are located at the side of first light shield layer far from the underlay substrate；
The drive circuit layer is located at side of the first buffer layer far from first light shield layer.
8. array substrate according to claim 7, which is characterized in that the first buffer layer with a thickness of D2,40nm≤
D2≤50nm。
9. array substrate according to claim 7, which is characterized in that the first buffer layer includes polysilicon.
10. a kind of display panel, which is characterized in that including the array substrate being oppositely arranged and color membrane substrates, the array substrate
For any array substrate of claim 1 to 9；
It is provided with viewing area and non-display area, the non-display area includes the first non-display area and position around the viewing area
In the binding area of first non-display area side；
The color membrane substrates and the viewing area and first non-display area are overlapping, and do not overlap with the binding area.
11. a kind of preparation method of display panel, which is characterized in that including：
Array substrate and color membrane substrates are made respectively, and the array substrate is provided with viewing area and non-display area, described non-display
Area include around the viewing area the first non-display area and positioned at the binding area of first non-display area side, it is described non-
Viewing area has at least one first laser cutting track, and the first laser cutting track includes that the first son is cut by laser rail
Mark, the first son laser cutting track are located at first non-display area；The array substrate includes：Underlay substrate；First
Light shield layer is located at the non-display area, the side of the underlay substrate is arranged in, first light shield layer is in the underlay substrate
The orthographic projection of place plane and the first son laser cutting track are at least partly overlapping；And drive circuit layer, it is located at described
The side of first light shield layer far from the underlay substrate is arranged in non-display area；
The array substrate and the color membrane substrates are oppositely arranged and at box, make the color membrane substrates and the viewing area and institute
It is overlapping to state the first non-display area, and is not overlapped with the binding area；The color membrane substrates have second laser cutting track, described
The orthographic projection of plane where underlay substrate of second laser cutting track is overlapped with the first son laser cutting track；
The display panel is swashed along the first laser cutting track and the second laser cutting track using laser
Light cutting forms the first special-shaped boundary in the array substrate, and the second special-shaped boundary is formed on the color membrane substrates；It is described
It is located at the part in first non-display area in first special-shaped boundary and forms the special-shaped boundary of the first son, the described second special-shaped boundary
In the orthographic projection of plane where the underlay substrate and the special-shaped overlapping margins of the first son.
12. the preparation method of display panel according to claim 11, which is characterized in that swashed using laser along described first
Light cutting track and the second laser cutting track are cut by laser the display panel, further for：
The array substrate is cut along the first laser cutting track using laser, then again along the second laser
Cutting track cuts the color membrane substrates；Alternatively,
The color membrane substrates are cut along the second laser cutting track using laser, then again along the first laser
Cutting track cuts the array substrate.
13. the preparation method of display panel according to claim 11, which is characterized in that the array substrate further includes position
In the first buffer layer of the non-display area, the first buffer layer is located at first light shield layer far from the underlay substrate
Side；
The drive circuit layer is located at side of the first buffer layer far from first light shield layer.
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| CN201810993730.4A CN108873422B (en) | 2018-08-29 | 2018-08-29 | Array substrate, display panel and cutting method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109794984A (en) * | 2018-12-26 | 2019-05-24 | 惠科股份有限公司 | Cutting mechanism, cutting method and display panel |
| CN110297345A (en) * | 2019-06-21 | 2019-10-01 | 厦门天马微电子有限公司 | Color membrane substrates, display panel and display device |
| CN111151894A (en) * | 2020-01-03 | 2020-05-15 | 深圳市华星光电半导体显示技术有限公司 | Special-shaped display panel and cutting method thereof |
| CN112309247A (en) * | 2019-07-25 | 2021-02-02 | 三星显示有限公司 | Display device and method for manufacturing the same |
| WO2021109250A1 (en) * | 2019-12-02 | 2021-06-10 | 深圳市华星光电半导体显示技术有限公司 | Color filter, manufacturing method therefor, and display device |
| CN113031325A (en) * | 2021-03-09 | 2021-06-25 | 厦门天马微电子有限公司 | Special-shaped display panel and display device |
| CN114460773A (en) * | 2022-01-27 | 2022-05-10 | 武汉华星光电技术有限公司 | Display panel to be cut, display panel and display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002224870A (en) * | 2001-01-31 | 2002-08-13 | Seiko Epson Corp | Laser cutting method, electrooptic device manufacturing method, optoelectronic device and electronic apparatus |
| CN101414073A (en) * | 2007-10-17 | 2009-04-22 | 株式会社日立显示器 | Liquid crystal display device and manufacturing method thereof |
| JP2010188411A (en) * | 2009-02-20 | 2010-09-02 | Fuji Xerox Co Ltd | Resin film medium and method of manufacturing the same |
| CN104741796A (en) * | 2015-04-20 | 2015-07-01 | 京东方科技集团股份有限公司 | Liquid crystal display panel and manufacturing method thereof and display device |
| CN107610597A (en) * | 2017-10-27 | 2018-01-19 | 武汉华星光电半导体显示技术有限公司 | The cutting method of display panel motherboard and display panel motherboard |
-
2018
- 2018-08-29 CN CN201810993730.4A patent/CN108873422B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002224870A (en) * | 2001-01-31 | 2002-08-13 | Seiko Epson Corp | Laser cutting method, electrooptic device manufacturing method, optoelectronic device and electronic apparatus |
| CN101414073A (en) * | 2007-10-17 | 2009-04-22 | 株式会社日立显示器 | Liquid crystal display device and manufacturing method thereof |
| JP2010188411A (en) * | 2009-02-20 | 2010-09-02 | Fuji Xerox Co Ltd | Resin film medium and method of manufacturing the same |
| CN104741796A (en) * | 2015-04-20 | 2015-07-01 | 京东方科技集团股份有限公司 | Liquid crystal display panel and manufacturing method thereof and display device |
| CN107610597A (en) * | 2017-10-27 | 2018-01-19 | 武汉华星光电半导体显示技术有限公司 | The cutting method of display panel motherboard and display panel motherboard |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109794984A (en) * | 2018-12-26 | 2019-05-24 | 惠科股份有限公司 | Cutting mechanism, cutting method and display panel |
| CN110297345A (en) * | 2019-06-21 | 2019-10-01 | 厦门天马微电子有限公司 | Color membrane substrates, display panel and display device |
| CN110297345B (en) * | 2019-06-21 | 2022-04-29 | 厦门天马微电子有限公司 | Color film substrate, display panel and display device |
| CN112309247A (en) * | 2019-07-25 | 2021-02-02 | 三星显示有限公司 | Display device and method for manufacturing the same |
| WO2021109250A1 (en) * | 2019-12-02 | 2021-06-10 | 深圳市华星光电半导体显示技术有限公司 | Color filter, manufacturing method therefor, and display device |
| US11513386B2 (en) | 2019-12-02 | 2022-11-29 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Color filter and manufacturing method thereof, and display device |
| CN111151894A (en) * | 2020-01-03 | 2020-05-15 | 深圳市华星光电半导体显示技术有限公司 | Special-shaped display panel and cutting method thereof |
| CN113031325A (en) * | 2021-03-09 | 2021-06-25 | 厦门天马微电子有限公司 | Special-shaped display panel and display device |
| CN113031325B (en) * | 2021-03-09 | 2022-10-11 | 厦门天马微电子有限公司 | Special-shaped display panel and display device |
| CN114460773A (en) * | 2022-01-27 | 2022-05-10 | 武汉华星光电技术有限公司 | Display panel to be cut, display panel and display device |
| CN114460773B (en) * | 2022-01-27 | 2023-09-26 | 武汉华星光电技术有限公司 | Display panel to be cut, display panel and display device |
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| CN108873422B (en) | 2021-07-09 |
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