CN108873422B

CN108873422B - Array substrate, display panel and cutting method thereof

Info

Publication number: CN108873422B
Application number: CN201810993730.4A
Authority: CN
Inventors: 张孝斌; 蔡宗翰; 康建松; 王建安; 陈国照
Original assignee: Xiamen Tianma Microelectronics Co Ltd
Current assignee: Xiamen Tianma Microelectronics Co Ltd
Priority date: 2018-08-29
Filing date: 2018-08-29
Publication date: 2021-07-09
Anticipated expiration: 2038-08-29
Also published as: CN108873422A

Abstract

The invention discloses an array substrate, a display panel and a cutting method thereof, and relates to the technical field of display, wherein the display panel is provided with a display area and a non-display area, the non-display area comprises a first non-display area surrounding the display area and a binding area positioned on one side of the first non-display area, the non-display area is provided with at least one first special-shaped boundary, the first special-shaped boundary comprises a first sub special-shaped boundary, and the first sub special-shaped boundary is positioned in the first non-display area; the array substrate includes: a substrate base plate; the first shading layer is positioned in the non-display area and arranged on one side of the substrate, and the orthographic projection of the first shading layer on the plane where the substrate is positioned is at least partially overlapped with the first sub-irregular boundary; and the driving circuit layer is positioned in the non-display area and is arranged on one side, far away from the substrate, of the first shading layer. The first shading layer which is arranged in the first non-display area and overlapped with the first sub-special-shaped boundary is used for shading the light energy of laser sputtering from entering the display panel, and the product yield is improved.

Description

Array substrate, display panel and cutting method thereof

Technical Field

The invention relates to the technical field of display, in particular to an array substrate, a display panel and a cutting method of the display panel.

Background

In the manufacturing process of the existing display panel, a whole display motherboard is usually cut to obtain a display panel with a suitable size and shape, wherein laser cutting is a common cutting method. The non-display area (i.e., the frame area) of the display motherboard is usually provided with some circuit structures, such as gate driving circuits, etc., and the circuit structures usually include electronic components.

According to the existing laser cutting process conditions, in the laser cutting process, a laser path is cut into a display mother board from the edge of the display mother board, the display mother board usually comprises a glass substrate, the laser cutting process can generate larger heat energy, laser generates scattering at the edge of the glass substrate due to the uneven edge of the glass substrate when passing through the edge of the display mother board, when scattered light irradiates a circuit structure in a non-display area on the display mother board, electronic components in the circuit structure are extremely possibly burnt and damaged, and the yield and reliability of products are greatly reduced.

Disclosure of Invention

In view of this, the present invention provides an array substrate, a display panel and a cutting method thereof, wherein a first light shielding layer is disposed at a position of a first non-display area corresponding to a first sub-irregular boundary to shield light energy of laser sputtering from entering the display panel, so as to reduce the possibility that the laser energy burns a driving circuit layer, thereby facilitating to improve the yield and reliability of products.

In a first aspect, the application provides an array substrate, which is provided with a display area and a non-display area, wherein the non-display area comprises a first non-display area surrounding the display area and a binding area located on one side of the first non-display area, the non-display area is provided with at least one first special-shaped boundary, the first special-shaped boundary comprises a first sub special-shaped boundary, and the first sub special-shaped boundary is located in the first non-display area;

the array substrate includes:

a substrate base plate;

the first shading layer is positioned in the non-display area and arranged on one side of the substrate, and the orthographic projection of the first shading layer on the plane of the substrate is at least partially overlapped with the first sub-irregular boundary; and the number of the first and second groups,

and the driving circuit layer is positioned in the non-display area and is arranged on one side of the first shading layer far away from the substrate.

In a second aspect, the present application provides a display panel, including an array substrate and a color film substrate that are oppositely disposed, where the array substrate is the array substrate provided by the present application; the display device is provided with a display area and a non-display area, wherein the non-display area comprises a first non-display area surrounding the display area and a binding area positioned on one side of the first non-display area;

the color film substrate is overlapped with the display area and the first non-display area, and is not overlapped with the binding area.

In a third aspect, the present application provides a method for manufacturing a display panel, including:

respectively manufacturing an array substrate and a color film substrate, wherein the array substrate is provided with a display area and a non-display area, the non-display area comprises a first non-display area surrounding the display area and a binding area positioned on one side of the first non-display area, the non-display area is provided with at least one first laser cutting track, the first laser cutting track comprises a first sub-laser cutting track, and the first sub-laser cutting track is positioned in the first non-display area; the array substrate includes: a substrate base plate; the first light shielding layer is positioned in the non-display area and arranged on one side of the substrate, and the orthographic projection of the first light shielding layer on the plane of the substrate is at least partially overlapped with the first sub-laser cutting track; the driving circuit layer is positioned in the non-display area and is arranged on one side, far away from the substrate, of the first shading layer;

the array substrate and the color film substrate are oppositely arranged and combined into a box, so that the color film substrate is overlapped with the display area and the first non-display area and is not overlapped with the binding area; the color film substrate is provided with a second laser cutting track, and the orthographic projection of the second laser cutting track on the plane of the substrate is superposed with the first sub-laser cutting track;

performing laser cutting on the display panel along the first laser cutting track and the second laser cutting track by using laser, forming a first special-shaped boundary on the array substrate, and forming a second special-shaped boundary on the color film substrate; the part of the first special-shaped boundary, which is positioned in the first non-display area, forms a first sub special-shaped boundary, and the orthographic projection of the second special-shaped boundary on the plane of the substrate base plate is superposed with the first sub special-shaped boundary.

Compared with the prior art, the array substrate, the display panel and the cutting method thereof provided by the invention at least realize the following beneficial effects:

in the array substrate, the display panel and the cutting method thereof, the array substrate is provided with a display area and a non-display area, the non-display area comprises a first non-display area surrounding the display area and a binding area located on one side of the first non-display area, a first special-shaped boundary is arranged in the non-display area, a driving circuit layer is usually arranged in the non-display area, and each first special-shaped boundary is formed in a laser cutting mode. The part that lies in first non-display area in the first dysmorphism border is first sub dysmorphism border and is nearest apart from the display area, at the in-process that adopts the mode of laser cutting to form first sub dysmorphism border, laser produces the scattering at substrate base plate edge, this application has set up first light shield layer in one side of substrate base plate and the position that first sub dysmorphism border corresponds, can effectively block the scattered light through this first light shield layer and shine the drive circuit layer in the array substrate, thereby reduce the possibility that laser energy burns the drive circuit layer, thereby be favorable to promoting the yield and the reliability of product.

Of course, it is not necessary for any product in which the present invention is practiced to achieve all of the above-described technical effects simultaneously.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a top view of an array substrate according to an embodiment of the present disclosure;

FIG. 2 is an AA' cross-sectional view of the array substrate provided in the embodiment of FIG. 1;

FIG. 3 is a BB' cross-sectional view of the array substrate provided in the embodiment of FIG. 1;

FIG. 4 is a diagram illustrating a relative position between a first light-shielding layer and a first irregular boundary according to an embodiment of the present disclosure;

fig. 5 is another top view of an array substrate according to an embodiment of the present disclosure;

FIG. 6 is another cross-sectional view of the array substrate in FIG. 1 according to an embodiment of the present invention;

fig. 7 is a top view of a display panel according to an embodiment of the present application;

FIG. 8 is a cross-sectional view of a display panel of the present application, as shown in FIG. 7, in a CC' cross-section;

fig. 9 is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;

FIG. 10 is a top view of the array substrate before laser cutting;

fig. 11 is a top view of a color filter substrate before laser cutting;

fig. 12 is a top view of the display panel after laser cutting.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

The following detailed description is to be read in connection with the drawings and the detailed description.

Fig. 1 is a top view of an array substrate provided in an embodiment of the present invention, fig. 2 is an AA 'cross-sectional view of the array substrate provided in the embodiment of the present invention, fig. 3 is a BB' cross-sectional view of the array substrate provided in the embodiment of fig. 1, fig. 4 is a relative position relationship diagram of a first light shielding layer and a first irregular boundary provided in the embodiment of the present invention, and referring to fig. 1 to fig. 4, an array substrate 100 provided in an embodiment of the present invention is provided with a display area 11 and a non-display area 12, the non-display area 12 includes a first non-display area 121 surrounding the display area 11 and a bonding area 122 located at one side of the first non-display area 121, the non-display area 12 has at least one first irregular boundary 50, the first irregular boundary 50 includes a first sub-irregular boundary 51, and the first sub-boundary 51 is located at the first non-display area 121;

referring to fig. 2, the array substrate 100 includes:

a base substrate 10;

the first shading layer 20 is positioned in the non-display area 12 and arranged on one side of the substrate 10, and the orthographic projection of the first shading layer 20 on the plane of the substrate 10 at least partially overlaps the first sub-irregular boundary 51; and the number of the first and second groups,

and the driving circuit layer 30 is positioned in the non-display area 12 and is arranged on one side of the first shading layer 20 far away from the substrate 10.

Specifically, please refer to fig. 1, fig. 2 and fig. 3 continuously, wherein fig. 2 is a cross-sectional view of a first non-display area 121 of the array substrate 100 of fig. 1, fig. 3 is a cross-sectional view of a display area 11 of the array substrate 100 of fig. 1, the first non-display area 121 of the array substrate 100 is provided with a driving circuit layer 30, the display area 11 is provided with a thin film transistor array layer 40, a bonding area 122 is generally provided with a fan-out routing structure, the display area 11 of the array substrate 100 is generally further provided with a plurality of sub-pixels 80 arranged along a first direction and a second direction, and electronic components in the driving circuit layer 30 are easily burned or even damaged after being affected by laser energy. The edge of the normal array substrate 100 is parallel or perpendicular to the first direction and the second direction, so that the array substrate 100 has a rectangular structure; the array substrate 100 provided in the embodiment of the present application has at least one first irregular boundary 50, where the first irregular boundary 50 refers to a boundary crossing both the first direction and the second direction, and the existence of the irregular boundary makes the display panel 300 to have a non-rectangular structure as a whole, and typically, each first irregular boundary 50 is obtained by laser cutting. In the array substrate 100 provided in the embodiment of the present application, a portion of the first irregular boundary 50 located in the first non-display area 121, that is, the first sub irregular boundary 51, is closest to the display area 11, and in a process of forming the first sub irregular boundary 51 by using a laser cutting method, laser generates scattering at an edge of the substrate 10, in the present application, the first light shielding layer 20 is disposed at a position corresponding to the first sub irregular boundary 51 on one side of the substrate 10, please refer to fig. 4, the first light shielding layer 20 can effectively block scattered light from irradiating electronic components in the driving circuit layer 30 in the array substrate 100, so as to reduce a possibility that laser energy burns the driving circuit layer 30, thereby facilitating improvement of yield and reliability of products after laser cutting.

It should be noted that fig. 1-4 only schematically show one position of the sub-pixel 80 and the first irregular boundary 50 on the display panel 300, and do not represent actual size, number and position, and in other embodiments of the present application, the size, number and position of the sub-pixel 80 and the first irregular boundary 50 can be flexibly set according to actual situations. In addition, fig. 4 only shows one structural form of the first light shielding layer 20, in some other embodiments of the present application, the first light shielding layer 20 may also be distributed throughout the first non-display region 121, or the first light shielding layer 20 may also be located in the bonding region 122, which is not specifically limited in this application.

In addition, referring to fig. 3, the thin film transistor array layer 40 in fig. 3 includes a buffer layer 41, a thin film transistor 42 on the buffer layer 41, and a planarization layer 43 on a side of the thin film transistor 42 away from the substrate 10. It should be noted that fig. 3 illustrates the thin film transistor 42 with a top-gate structure, that is, the gate metal layer 422 of the thin film transistor 42 is located on a side of the semiconductor active layer 421 away from the substrate 10, and in addition to this structure, the thin film transistor 42 may also be a bottom-gate structure, that is, the gate metal layer 422 of the thin film transistor 42 is located on a side of the semiconductor active layer 421 close to the substrate 10, which is not specifically limited in this application. Note that the buffer layer 41 may be formed of a material selected from an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum oxide (AlOx), aluminum nitride (AlNx), or the like, or an organic material such as acryl (acryl), Polyimide (PI), polyester, or the like. The buffer layer may comprise a single layer or multiple layers. The buffer layer 41 serves to block oxygen and moisture, prevent moisture or impurities from diffusing through the base substrate, and also serves to provide a flat surface on the upper surface of the base substrate.

It should be noted that fig. 2 is a cross-sectional view of the first non-display region 121 of the array substrate 100 shown in fig. 1, fig. 3 is a cross-sectional view of the display region 11 of the array substrate 100 shown in fig. 1, and the display region 11 and the first non-display region 121 share the buffer layer 41, that is, the buffer layer 41 is located on the entire surface of the substrate. With reference to fig. 2 and 3, a semiconductor active layer 421, a gate insulating layer 82, a gate metal layer 422, an interlayer insulating layer 83, a source-drain metal layer 84, and a planarization layer 43 are further provided on the buffer layer 41.

Optionally, in the array substrate 100 provided in this embodiment of the application, the same first special-shaped boundary 50 is located only in the first non-display area 121, and the same first special-shaped boundary 50 is located only in the bonding area 122, or the same first special-shaped boundary 50 is located in both the first non-display area 121 and the bonding area 122.

Specifically, in the array substrate 100 provided in the embodiment shown in fig. 1, two first special-shaped boundaries 50 are respectively disposed in the boundary areas of the first non-display area 121 and the bonding area 122, where the two first special-shaped boundaries 50 span the first non-display area 121 and the bonding area 122, that is, a part of the two first special-shaped boundaries is located in the first non-display area 121, and another part of the two first special-shaped boundaries is located in the bonding area 122. In addition to this structure, fig. 5 is a top view of the array substrate 100 provided in an embodiment of the present application, which further includes a first irregular boundary 61 only in the first non-display area 121 and a first irregular boundary 62 only in the bonding area 122, which is not particularly limited in this application.

Optionally, referring to fig. 4, in the array substrate 100 provided in the embodiment shown in fig. 4, the first special-shaped boundary 50 includes a plurality of second sub-special-shaped boundaries 52 located in the bonding area 122 in addition to the first sub-special-shaped boundary 51 located in the first non-display area 121, and each of the first sub-special-shaped boundary 51 and the second sub-special-shaped boundary 52 includes a plurality of special-shaped boundary segments, and the plurality of special-shaped boundary segments are at least one of straight line boundaries, arc line boundaries, and broken line boundaries. It should be noted that, in order to distinguish the first sub-irregular boundary 51 from the second sub-irregular boundary 52, the embodiment shown in fig. 4 uses lines with different thicknesses to respectively represent the first sub-irregular boundary 51 and the second sub-irregular boundary 52, and the two lines in the actual product are not distinguished by the thickness of the lines.

Specifically, the first sub-irregular boundary 51 and the second sub-irregular boundary 52 provided in the embodiment of the present application may be regarded as being composed of a plurality of irregular boundary segments, where the irregular boundary segments may be a straight boundary, an arc boundary, or a broken line boundary, or a combination of any two of the straight boundary, the arc boundary, and the broken line boundary, or include the straight boundary, the arc boundary, and the broken line boundary, which is not specifically limited in this application. The embodiment shown in fig. 4 shows a case where each of the irregular boundary segments in the first irregular boundary 50 is a straight boundary, while the irregular boundary segments in the first irregular boundary 50 in the embodiment shown in fig. 5 includes an arc boundary and a straight boundary, although fig. 4 and 5 only schematically illustrate the shape of the first irregular boundary 50, and in some other embodiments of the present application, the first irregular boundary 50 may also be embodied in other shape structures, which is not specifically limited in this application.

Optionally, referring to fig. 2 and fig. 3, in the array substrate 100 provided in the embodiment of the present application, the thickness of the first light shielding layer 20 is D1, and D1 is 0.1 μm or more and 0.2 μm or less.

Specifically, in the array substrate 100 provided in the embodiment of the present application, when the thickness of the first light shielding layer 20 is designed to be greater than or equal to 0.1 μm, the laser light scattered at the edge of the substrate 10 during the laser cutting process can be effectively blocked from irradiating the electronic components in the driving circuit layer 30, so that the possibility that the scattered light irradiates the driving circuit layer 30 to cause burning of the electronic components in the driving circuit layer 30 can be effectively reduced; in addition, in the present application, when the thickness of the first light-shielding layer 20 is designed to be less than or equal to 0.2 μm, the thickness is extremely thin, and the entire thickness of the array substrate 100 is hardly affected, which is advantageous for realizing the demand for thinning the array substrate 100.

Optionally, with continued reference to fig. 2 and fig. 3, in the array substrate 100 provided in the embodiment of the present application, the first light shielding layer 20 is a metal light shielding layer. In consideration of the fact that the metal material has better light shielding performance, in the embodiment of the present application, when the light shielding layer made of the metal material is used as the first light shielding layer 20, the light scattered from the edge of the substrate 10 during the laser cutting process can be better prevented from entering the driving circuit layer 30, so that the possibility that electronic components in the driving circuit layer 30 are burned is favorably reduced.

Optionally, in the array substrate 100 provided in this embodiment of the application, the first light shielding layer 20 includes molybdenum and titanium. Usually, the driving circuit layer 30 in the array substrate 100 is prepared at a higher temperature (for example, about 400 ℃), and since the first light shielding layer 20 is formed in the non-display region 12 on the substrate 10 before the driving function layer is prepared in the array substrate 100 provided in the embodiment of the present application, the first light shielding layer 20 is required to have a better high temperature resistance, so as to prevent the first light shielding layer 20 from changing its performance during the preparation process of the driving circuit layer 30 and failing to perform a light shielding function. Considering that both molybdenum and titanium have good high temperature resistance and their melting points reach thousands of degrees centigrade, when molybdenum or titanium is used as the first light shielding layer 20, the environmental temperature does not affect the performance of molybdenum and titanium in the preparation process of the subsequent driving circuit layer 30, so that the first light shielding layer 20 has good light shielding performance, and can effectively block laser scattered at the edge of the substrate 10 in the laser cutting process from irradiating electronic components in the driving circuit layer 30, thereby effectively reducing the possibility that scattered light irradiates the driving circuit layer 30 to cause electronic component burn in the driving circuit layer 30.

Optionally, fig. 6 is another AA' cross-sectional view of the array substrate 100 provided in the embodiment shown in fig. 1, in which the array substrate 100 further includes a first buffer layer 70 located in the non-display region 12, and the first buffer layer 70 is located on a side of the first light-shielding layer 20 away from the substrate 10;

the driving circuit layer 30 is located on a side of the first buffer layer 70 away from the first light-shielding layer 20.

Specifically, referring to fig. 6, the embodiment introduces a first buffer layer 70 between the driving circuit layer 30 and the first light shielding layer 20, and the first buffer layer 70 can absorb light energy of laser sputtering; in the laser cutting process, the first light shielding layer 20 can block scattered light scattered into the array substrate 100 through the edge of the substrate 10, and even if part of the scattered light passes through the first light shielding layer 20 without being successfully blocked, the first buffer layer 70 can absorb the part of the scattered light, so that the possibility that the scattered light enters the driving circuit layer 30 is further reduced, the possibility that the scattered light irradiates electronic components in the driving circuit layer 30 to burn the electronic components is further reduced, and the yield and the reliability of products after laser cutting are further improved.

Optionally, with reference to fig. 6, in the array substrate 100 provided in the embodiment of the present disclosure, the thickness of the first buffer layer 70 is D2, and D2 is greater than or equal to 40nm and less than or equal to 50 nm. Specifically, in the array substrate 100 provided in the embodiment of the present application, when the thickness of the first buffer layer 70 is designed to be greater than or equal to 40nm, the scattered light passing through the first light shielding layer 20 during the laser cutting process can be effectively absorbed, and when the thickness of the first buffer layer 70 is designed to be less than or equal to 50nm, the thickness of the array substrate 100 is very small due to the extremely thin thickness, so that the requirement for thinning the array substrate 100 can be further facilitated.

Optionally, referring to fig. 6, in the array substrate 100 provided in the embodiment of the present disclosure, the first buffer layer 70 includes polysilicon. Polycrystalline silicon has better light absorption performance, and when polycrystalline silicon is adopted as the first buffer layer 70 in the embodiment of the application, the polycrystalline silicon can better absorb scattered light formed in the laser cutting process, so that the scattered light can be effectively prevented from entering the driving circuit layer 30, the possibility of burning the electronic components in the driving circuit layer 30 under the irradiation of the scattered light is reduced, and the yield and the reliability of products after laser cutting can be improved.

Based on the same inventive concept, the present application further provides a display panel 300, fig. 7 is a top view of the display panel 300 provided in the embodiment of the present application, fig. 8 is a CC' cross-sectional view of the display panel 300 provided in the embodiment of the present application shown in fig. 7, referring to fig. 7 and fig. 8, the display panel 300 includes an array substrate 100 and a color filter substrate 200 that are oppositely disposed, and the array substrate 100 is the array substrate 100 provided in the embodiment of the present application;

the display panel 300 is provided with a display area 11 and a non-display area 12, the non-display area 12 including a first non-display area 121 surrounding the display area 11 and a binding area 122 located at one side of the first non-display area 121;

the color filter substrate 200 overlaps the display region 11 and the first non-display region 121, and does not overlap the bonding region 122.

Specifically, referring to fig. 7 and fig. 8, a display panel 300 provided in this embodiment of the present application is a liquid crystal 301 display panel 300, which includes a color film substrate 200 and an array substrate 100 that are oppositely disposed, and a liquid crystal 301 filled between the color film substrate 200 and the array substrate 100, and it should be noted that embodiments of the display panel 300 may refer to the above-mentioned embodiment of the array substrate 100, and repeated details are not repeated.

Based on the same inventive concept, the present application further provides a method for manufacturing the display panel 300, and fig. 9 is a flowchart of the method for manufacturing the display panel 300 according to the embodiment of the present application, where the method for manufacturing includes:

step 101, respectively manufacturing an array substrate 100 and a color filter substrate 200, wherein the structure of the array substrate 100 can be referred to in fig. 10, the structure of the color filter substrate 200 can be referred to in fig. 11, fig. 10 is a top view of the array substrate 100 before laser cutting, fig. 11 is a top view of the color filter substrate 200 before laser cutting, the array substrate 100 is provided with a display area 11 and a non-display area 12, the non-display area 12 includes a first non-display area 121 surrounding the display area 11 and a binding area 122 located on one side of the first non-display area 121, the non-display area 12 has at least one first laser cutting track 91, the first laser cutting track 91 includes a first sub-laser cutting track 911, and the first sub-laser cutting track 911 is located in the first non-display area 121; as can be seen from fig. 10, the first laser cut trajectory 91 further includes a second sub-laser cut trajectory 912 located at the bonding region 122; the array substrate 100 includes: a base substrate 10; the first shading layer 20 is positioned in the non-display area 12 and arranged on one side of the substrate 10, and the orthographic projection of the first shading layer 20 on the plane of the substrate 10 at least partially overlaps the first sub-laser cutting track 911; the driving circuit layer 30 is positioned in the non-display area 12 and is arranged on one side, far away from the substrate base plate 10, of the first shading layer 20;

102, oppositely arranging the array substrate 100 and the color film substrate 200 and forming a box, please refer to fig. 8, fig. 10 and fig. 11, so that the color film substrate 200 is overlapped with the display area 11 and the first non-display area 121 and is not overlapped with the bonding area 122; the color film substrate 200 is provided with a second laser cutting track 92, and the orthographic projection of the second laser cutting track 92 on the plane of the substrate 10 is superposed with the first sub-laser cutting track 911;

step 103, performing laser cutting on the display panel 300 along the first laser cutting track 91 and the second laser cutting track 92 by using laser, referring to fig. 12, where fig. 12 is a top view of the display panel 300 after the laser cutting, forming a first special-shaped boundary 50 on the array substrate 100, and forming a second special-shaped boundary on the color film substrate 200 (not shown in fig. 12, see fig. 1); a portion of the first shaped boundary 50 located in the first non-display area 121 forms a first sub-shaped boundary 51, and an orthographic projection of the second shaped boundary on the plane of the base substrate 10 coincides with the first sub-shaped boundary 51.

Specifically, referring to fig. 9, in the cutting method of the display panel 300 provided in the embodiment of the present application, the array substrate 100 and the color filter substrate 200 prepared in step 101 have the rectangular structures shown in fig. 10 and 11 before cutting, wherein the non-display area 12 of the array substrate 100 has a plurality of first laser cutting tracks 91, and in the subsequent laser cutting process, the laser is cut along the first laser cutting tracks 91; the first laser cutting track 91 includes a first sub-laser cutting track 911, and the first sub-laser cutting track 911 is located in the first non-display area 121. The first non-display area 121 of the array substrate 100 is provided with a driving circuit layer, the display area 11 is provided with a thin film transistor array layer, the binding area 122 is generally provided with a fan-out routing structure, the display area 11 of the array substrate 100 is also generally provided with a plurality of sub-pixels 80 arranged along a first direction and a second direction, wherein electronic components in the driving circuit layer 30 are easily burned or even damaged after being affected by laser energy. The array substrate 100 and the color filter substrate 200 are formed into a box in the step 102, the color filter substrate 200 has a second laser cutting track 92, and the orthographic projections of the second laser cutting track 92 and the first sub-laser cutting track 911 on the array substrate 100 are overlapped. In the laser cutting process of step 103, the first sub-laser cutting track 911 and the second laser cutting track 92 are closest to the display area 11, and in the laser cutting process, laser generates scattering at the edge of the substrate 10, in the present application, the first light shielding layer 20 is disposed at a position corresponding to the first sub-irregular boundary 51 on one side of the substrate 10, please refer to fig. 4, the scattered light can be effectively blocked from irradiating electronic components in the driving circuit layer 30 in the array substrate 100 by the first light shielding layer 20, so that the possibility that the laser energy burns the electronic components in the driving circuit layer 30 is favorably reduced, and the yield and reliability of the product after laser cutting are favorably improved.

Optionally, in the step 103, performing laser cutting on the display panel 300 along the first laser cutting track 91 and the second laser cutting track 92 by using laser, further including:

cutting the array substrate 100 along the first laser cutting track 91 by using laser, and then cutting the color film substrate 200 along the second laser cutting track 92; alternatively, the first and second electrodes may be,

the color film substrate 200 is cut along the second laser cutting track 92 by using laser, and then the array substrate 100 is cut along the first laser cutting track 91.

Specifically, in the cutting method of the display panel 300 provided in the embodiment of the present application, the array substrate 100 and the color filter substrate 200 that are arranged opposite to each other are respectively provided with the first laser cutting track 91 and the second laser cutting track 92 that are in one-to-one correspondence, and in the laser cutting process, the array substrate 100 and the color filter substrate 200 need to be respectively cut by adopting two laser cutting processes, so as to respectively form the special-shaped boundaries on the array substrate 100 and the color filter substrate 200, thereby forming the structure shown in fig. 12. In the actual cutting process, the array substrate 100 may be cut along the first laser cutting track 91, and then the color film substrate 200 may be cut along the second laser cutting track 92; or, the color filter substrate 200 is cut along the second laser cutting track 92, and then the array substrate 100 is cut along the first laser cutting track 91, which is not specifically limited in this application. Because the array substrate 100 provided by the present application is provided with the first light shielding layer 20 in the non-display area 12, scattered light can be effectively blocked from irradiating electronic components in the driving circuit layer 30 in the array substrate 100 through the first light shielding layer 20, so that the possibility that the laser energy burns the electronic components in the driving circuit layer 30 is reduced, thereby being beneficial to improving the yield and reliability of products.

Optionally, referring to fig. 6, the array substrate 100 provided in the embodiment of the present disclosure further includes a first buffer layer 70 located in the non-display region 12, where the first buffer layer 70 is located on a side of the first light shielding layer 20 away from the substrate 10;

Specifically, referring to fig. 6, the embodiment introduces a first buffer layer 70 between the driving circuit layer 30 and the first light shielding layer 20, and the first buffer layer 70 can absorb light energy of laser sputtering; in the laser cutting process, the first light shielding layer 20 can block scattered light scattered into the array substrate 100 through the edge of the substrate 10, and even if part of the scattered light passes through the first light shielding layer 20 without being successfully blocked, the first buffer layer 70 can absorb the part of the scattered light, so that the possibility that the scattered light enters the driving circuit layer 30 is further reduced, the possibility that the scattered light irradiates on electronic components in the driving circuit layer 30 to burn the electronic components is further reduced, and the yield and the reliability of products after laser cutting are further improved.

According to the embodiment, the array substrate, the display panel and the cutting method thereof provided by the invention at least realize the following beneficial effects:

Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. An array substrate is provided with a display area and a non-display area, wherein the non-display area comprises a first non-display area surrounding the display area and a binding area located on one side of the first non-display area, the non-display area is provided with at least one first special-shaped boundary, the first special-shaped boundary comprises a first sub special-shaped boundary, and the first sub special-shaped boundary is located in the first non-display area;

the array substrate includes:

a substrate base plate;

2. The array substrate of claim 1, wherein the same first irregular boundary is only located in the first non-display area and the same first irregular boundary is only located in the bonding area, or the same first irregular boundary is located in both the first non-display area and the bonding area.

3. The array substrate of claim 1, wherein the first shaped boundary further comprises a plurality of second sub shaped boundaries located in the bonding region, the first sub shaped boundary and the second sub shaped boundary each comprise a plurality of shaped boundary segments, and the plurality of shaped boundary segments are at least one of straight boundary, arc boundary and polyline boundary.

4. The array substrate of claim 1, wherein the first light shielding layer has a thickness D1, 0.1 μm D1 μm 0.2 μm.

5. The array substrate of claim 1, wherein the first light shielding layer is a metal light shielding layer.

6. The array substrate of claim 5, wherein the first light shielding layer comprises molybdenum and titanium.

7. The array substrate of claim 1, further comprising a first buffer layer in the non-display region, the first buffer layer being located on a side of the first light shielding layer away from the substrate;

the driving circuit layer is located on one side, far away from the first light shielding layer, of the first buffer layer.

8. The array substrate of claim 7, wherein the first buffer layer has a thickness of D2, 40nm D2 nm 50 nm.

9. The array substrate of claim 7, wherein the first buffer layer comprises polysilicon.

10. A display panel, comprising an array substrate and a color film substrate which are oppositely arranged, wherein the array substrate is the array substrate of any one of claims 1 to 9;

the display device is provided with a display area and a non-display area, wherein the non-display area comprises a first non-display area surrounding the display area and a binding area positioned on one side of the first non-display area;

11. A method for manufacturing a display panel, comprising:

12. The method for manufacturing a display panel according to claim 11, wherein the display panel is laser-cut along the first laser cutting track and the second laser cutting track by using laser, and further comprising:

cutting the array substrate along the first laser cutting track by using laser, and then cutting the color film substrate along the second laser cutting track; alternatively, the first and second electrodes may be,

and cutting the color film substrate along the second laser cutting track by using laser, and then cutting the array substrate along the first laser cutting track.

13. The method for manufacturing a display panel according to claim 11, wherein the array substrate further includes a first buffer layer in the non-display region, the first buffer layer being on a side of the first light-shielding layer away from the substrate;