TWI401131B - 於軟焊時提供惰性化氣體的設備及方法 - Google Patents

於軟焊時提供惰性化氣體的設備及方法 Download PDF

Info

Publication number
TWI401131B
TWI401131B TW100108427A TW100108427A TWI401131B TW I401131 B TWI401131 B TW I401131B TW 100108427 A TW100108427 A TW 100108427A TW 100108427 A TW100108427 A TW 100108427A TW I401131 B TWI401131 B TW I401131B
Authority
TW
Taiwan
Prior art keywords
solder
workpiece
tube
tubes
wave
Prior art date
Application number
TW100108427A
Other languages
English (en)
Chinese (zh)
Other versions
TW201143957A (en
Inventor
Chun Christine Dong
Gregory Khosrov Arslanian
Ranajit Ghosh
Victor Wang
Jerry Wu
Original Assignee
Air Prod & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/040,594 external-priority patent/US8220699B2/en
Application filed by Air Prod & Chem filed Critical Air Prod & Chem
Publication of TW201143957A publication Critical patent/TW201143957A/zh
Application granted granted Critical
Publication of TWI401131B publication Critical patent/TWI401131B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
TW100108427A 2010-03-12 2011-03-11 於軟焊時提供惰性化氣體的設備及方法 TWI401131B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US31337210P 2010-03-12 2010-03-12
US31337610P 2010-03-12 2010-03-12
US32093910P 2010-04-05 2010-04-05
US32101110P 2010-04-05 2010-04-05
US32360710P 2010-04-13 2010-04-13
US36560710P 2010-07-19 2010-07-19
US13/040,594 US8220699B2 (en) 2010-03-12 2011-03-04 Apparatus and method for providing an inerting gas during soldering

Publications (2)

Publication Number Publication Date
TW201143957A TW201143957A (en) 2011-12-16
TWI401131B true TWI401131B (zh) 2013-07-11

Family

ID=45100927

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100108427A TWI401131B (zh) 2010-03-12 2011-03-11 於軟焊時提供惰性化氣體的設備及方法

Country Status (4)

Country Link
KR (1) KR101265871B1 (ko)
CN (1) CN102275024B (ko)
SG (1) SG174695A1 (ko)
TW (1) TWI401131B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2835204B1 (en) * 2012-04-16 2017-03-15 Tanigurogumi Corporation Soldering device and soldering method
CN104249208B (zh) * 2013-06-26 2018-03-06 联想企业解决方案（新加坡）私人有限公司 波峰焊装置及其喷嘴
SG10201405819TA (en) * 2013-09-27 2015-04-29 Air Prod & Chem Apparatus and method for providing an inerting gas during soldering
CN105945378B (zh) * 2016-05-20 2019-06-18 深圳市劲拓自动化设备股份有限公司 波峰焊锡机及其氮气保护装置
CN116511642B (zh) * 2023-07-04 2024-02-20 西科沃克瑞泰克热处理设备制造(天津)有限公司 一种钎焊炉的可调式氮气输送管

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5361969A (en) * 1991-12-06 1994-11-08 Electrovert Ltd. Gas shrouded wave improvement
US5568894A (en) * 1993-06-04 1996-10-29 Electrovert Ltd. Applying flux to a solder wave for wave soldering an element
TW200902200A (en) * 2007-01-18 2009-01-16 Linde Ag Device and method of selective soldering

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5176307A (en) * 1991-02-22 1993-01-05 Praxair Technology, Inc. Wave soldering in a protective atmosphere enclosure over a solder pot
US5240169A (en) * 1991-12-06 1993-08-31 Electrovert Ltd. Gas shrouded wave soldering with gas knife
US5203489A (en) * 1991-12-06 1993-04-20 Electrovert Ltd. Gas shrouded wave soldering
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations
US5509598A (en) * 1994-05-31 1996-04-23 The Boc Group, Inc. Wave soldering apparatus and process
DE19541445B4 (de) * 1995-11-07 2005-02-10 Linde Ag Verfahren zum Wellenlöten von Werkstücken unter Schutzgas sowie hierfür vorgesehene Vorrichtung
ATE501805T1 (de) * 2006-05-23 2011-04-15 Linde Ag Vorrichtung und verfahren zum wellenlöten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5361969A (en) * 1991-12-06 1994-11-08 Electrovert Ltd. Gas shrouded wave improvement
US5568894A (en) * 1993-06-04 1996-10-29 Electrovert Ltd. Applying flux to a solder wave for wave soldering an element
TW200902200A (en) * 2007-01-18 2009-01-16 Linde Ag Device and method of selective soldering

Also Published As

Publication number Publication date
KR101265871B1 (ko) 2013-05-20
TW201143957A (en) 2011-12-16
KR20110103369A (ko) 2011-09-20
CN102275024B (zh) 2013-07-17
SG174695A1 (en) 2011-10-28
CN102275024A (zh) 2011-12-14

Similar Documents

Publication Publication Date Title
TWI462794B (zh) 於軟焊時提供惰性化氣體的設備及方法
US8220699B2 (en) Apparatus and method for providing an inerting gas during soldering
TWI401131B (zh) 於軟焊時提供惰性化氣體的設備及方法
US20140027495A1 (en) Apparatus And Method For Providing An Inerting Gas During Soldering
TWI604911B (zh) 於軟焊時提供惰性化氣體的設備及方法
JP4393576B1 (ja) 電気機器の分解方法
JPH08507254A (ja) ガスナイフジェットを備えるはんだノズル
JP2009148817A (ja) リフロー装置
US20100012709A1 (en) Reflow furnace
JPH05185208A (ja) 波溶接機の溶接浴を不活性化する装置
IE61783B1 (en) Mass soldering system providing an improved fluid blast
US20100276475A1 (en) Gas feed device for a wave soldering or tinning machine
TWI556901B (zh) 於軟焊時提供惰性氣體的設備
US20220117092A1 (en) Continuous etching system
JPS60257971A (ja) 半田付け装置および方法
CN204148684U (zh) 用于在工件的焊接期间提供惰性气体的设备
JP6366984B2 (ja) フロー半田付け装置
JP2001119134A (ja) はんだ付け装置
JP2002057449A (ja) ガス供給装置およびハンダ付け装置
KR101568473B1 (ko) 스나우트의 기체유동 조절장치
JPS62267066A (ja) ウエ−ブハンダ付け方法
JPH05206621A (ja) プリント配線板の半田を塗布する方法およびその装置
JPH0832222A (ja) 噴流式ハンダ付け装置
KR20150045835A (ko) 스나우트의 기체유동 조절장치 및 이를 이용한 도금강판 제조장치
JPH06328239A (ja) はんだ付け装置