TW201143957A - Apparatus and method for providing an inerting gas during soldering - Google Patents

Abstract

Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus that is placed atop of a solder reservoir and comprises a plurality of porous tubes that are in fluid communication with an inerting gas. In another aspect, there is provided a method for providing an inerting gas to a wave soldering apparatus comprising the steps of, among other things, placing an apparatus atop at least one edge of the solder reservoir wherein the apparatus comprises a plurality of tubes comprising one or more openings in fluid communication with an inerting gas source. In a further aspect, at least one of the tubes comprises a non-stick coating or is comprised of a porous non-stick material such as a sleeve.

Description

201143957 VI. INSTRUCTIONS: Cross-references to relevant applications The priority of the following applications is as follows: US Provisional Patent Application No. 61/313,376 E, filed March 12, 2011; 2G10 March 12美国Applicable US Provisional Patent Application No. 6i/3i3,372; US Provisional Patent Application No. 61/321,011, filed on April 5, 2010; 7010 ^ λ u £. Now, April 5 美国 US Provisional Patent Application No. 61/32G, 939; 2 (America's Provisional Patent No. 61/323, 6() No. 7; and 2〇 U.S. Patent Application Serial No. 61/365,6() No. 7 filed on the next day of July, ig. [Technical Field of the Invention] Described herein is an apparatus for providing inert gas during soldering and Method. More specifically, 'the apparatus and method for providing inert gas during the use of nitrogen and/or other chemical vapor welding are described herein. [Prior Art], workpiece such as printed wiring board or circuit board With smaller and smaller tears, the surface, the female looking for the surface must be coated with solder And engages a typical operation involving at least 4 less teach Jka ,, ^ '~ soft core, this patent or workpiece can be a printed circuit board in

The solder bath was applied to N na J to soften it. Conventional automatic wave soldering equipment includes a flux drive and a solder station that is provided to handle printed circuit boards. Printed Circuit Board > Very T+ ^ ^ Q test mobile track or conveyor belt transport, and its grip finger support. Help &,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The board is then passed through an oxidized ',' agent on the soft metal surface to reduce the amount of material to be emulsified. The receiver contacts the single- and multi-wave smelting solder in air or in an inert atmosphere. The inerting atmosphere is sputum, sputum (Ν2) and/or other inert gas and is often rhyme (four) limbs/money money = minimizes the formation of floating surfaces or oxides on the surface of the solder. . It is known that = or the presence of an oxide layer can cause jumps, bridges or other in the solder joint; : ^ The solder wave is generated by the wave solder (4) during the operation. The proximal end of the hole: hole...etc. Parallel to the solder wave and used to rotate the ruthenium and/or N2 gas to provide relatively low oxygen below the workpiece to be soldered. Symbol

Regarding the non-shock welding, the value of the inerting atmosphere containing N is further improved for the following reasons. The processing temperature using ordinary non-materials is significantly higher than that of conventional tin-free solders due to the improved refining point of 2 commonly used lead-free materials. This increase in processing temperature contributes to the formation of a floating surface. Moreover, the unreasonable cost is much higher than the cost of tin and ship solder, and the economic loss associated with solder waste due to the formation of floatation is more pronounced than that of error-free wave soldering. In addition, the (four) performance of the 'error-free solder is inherently inferior to the tin-wrong solder used for f. Therefore, the quality of the solder joint formed is more sensitive to the oxidation state on the surface of the error-free solder. It is well known that the inertization of the flux significantly reduces the formation of flocculation on the surface of the weld. Reducing the formation of the float not only saves the rod and reduces the maintenance requirements, but also improves the wetting of the thick material and ensures the quality of the resulting fin joint. In order to apply the inerting atmosphere to the current wave tanner, there is a 201143957 common method for the soldering of the solder. = The cage-like protective housing containing the diffuser is inserted into the μm, which forms an inert gas blanket across the solder reservoir, thus reducing the tendency of the solder to oxidize. These diffusers are often made by a customer and a hole s to introduce an inert gas such as N2 and/or other inerting ions into the soldering station. However, these porous tubes become solder splashes or flux vapor condensation during the wave soldering process. Once the diffusion tube is blocked, the efficiency of inertization is greatly reduced. Modern cleaning of such diffusing tubes, for example, using ultrasonic baths filled with cleaning solutions, is extremely difficult and time consuming. The cleaning of these tubes must be carried out regularly and can cause physical damage to such tubes. ^ Avoid these problems' typically—if they are blocked, replace the diffusers instead of cleaning them. This increases the overall cost of the end user. Accordingly, in order to facilitate the application of inertization by N2 and/or other inerting gases during wave soldering, we desire an apparatus, method, or both for at least one or more of the following objectives. First, we intend to reduce the N2 or other inert gas consumption for the inerting equipment and process such as, but not limited to, 12 cubic meters per hour (m3/hr) or less to meet the cost benefits of applying this technology. Next, we would like to reduce the concentration of 〇2 above the surface of the molten solder for the inerting device and method, for example, but not limited to, 2500 parts per million (Ppm) or less. Third, we intend to use equipment that is easy to set up and that still minimizes the cost of trimming for the inerting equipment and method. Furthermore, it is desirable for the apparatus or method to reduce or avoid clogging of the porous diffuser to ensure stable and long lasting inertization performance.

S 5 201143957 SUMMARY OF THE INVENTION The apparatus and method described herein are at least one or more objects for inerting with nitrogen and/or other inerting gases, which may be more than similar methods and equipment currently in use. Cost effective and more user friendly 0

^ V, limbs · j - ... a TT takes the loss of equipment from the TI gasification 'The device contains at least one groove at the bottom of the device' S Hai at least one groove is used to place At least one edge of the solder sump of the soldering solder is mounted on top of the at least one sidewall of the recess and at least one wall of the device defining a pod outside the solder reservoir; at least one opening from the top surface of the device, from the solder At least - a solder wave emitted by the sump passes through the at least one opening and strikes the workpiece as the workpiece travels on the mobile track; and a plurality of tubes including - or more openings, the tubes being in fluid communication with the source of the escaping gas, Wherein at least the tubes are present in the grab; wherein the device is located above the solder reservoir and under the workpiece to be soldered: forming an atmosphere and the guard to be soldered with the at least solder The gap between the vertices of the wave is substantially beneficial. Continue to catch only on the shell..., the threshold of the province. Further, it is placed under the solder reservoir and below the workpiece of the soft palate to form an atmosphere and the work to be soldered, and there is substantially no gap between the apexes of at least one solder wave. In a particular eight-body embodiment, the device ^ L ^ δ thermally conductive projections, i at least a portion of the continuation of the canine, is implemented and at least -f. On top of this, in the example t, an arbitrary cover is placed in the apparatus. The workpiece passes through the apparatus and passes through the cover, and includes a vent communicating with the ventilation system. ...cover additional package 201143957 In another form, a method for working atmosphere is provided, which provides inerting of the solid body, which comprises: providing a solder storage tank of molten solder, at least A spray-width comprising: a bath containing tan to produce at least a factory through the nozzle to melt at least the top of the sump from the top of the sump, which causes::: at least one of the equipment is placed in the a recess on the top surface and at least one gas on the top of the multi-helmeted edge, wherein the plurality of tubes are in fluid communication with the source of inertial wind, wherein the surface to be soft defined defines a workpiece of a gas force and The molten solder (the circumference and the workpiece to be soldered and the apex of the at least wave have substantially no gap between the workpiece and the trajectory of the at least one wave, so that the workpiece passes along the path with less, at least a part of the welding V Touching a portion of the thermal conductivity protrusion 4 that is emitted through the opening of the device to introduce an inert gas through the porous tube and enter at least -f to touch the material of the material Official heating to the melt The temperature of the melting point of the solder 2. In a specific embodiment, at least the crucible of the tubes - additionally comprising a non-stick coating or a porous sleeve comprising a non-stick material:, [Embodiment] At least one or more of the methods can be accomplished by methods and apparatus described herein with respect to inerting protection at 4 o'clock. The apparatus and methods described herein provide inertial protection during soldering, particularly for workpieces such as, for example, beta. Significant movement and rotation of the solder while the board is soldered and the solder surface = those specific embodiments that may occur to enhance oxidation. It is contemplated that the methods described herein can be used to "revision" existing wave soldering machines. In a particular embodiment, the apparatus described herein is placed on top of the tanner sump and under the transport mechanism or other transport mechanism for transporting the workpiece to be soldered. In a particular embodiment, There is substantially no gap between the workpiece to be soldered and the apex of the knowing wave. In other embodiments, (4) there is a gap between the soldered workpiece and the apex of the at least one solder wave. Most of the diffuser tubes in the 5H equipment are fluidly connected to inert gas sources such as nitrogen, inert gases (eg, helium, neon, argon, helium, gas, and ...), generating gas (eg, containing up to 5 weights) % hydrogen hydrogen and 氲 α )) or a combination thereof to provide an inerting atmosphere. The purpose of the equipment method described herein is defined by the surface of the workpiece to be soldered and the surface of the molten solder contained in the solder sump. The reduced oxygen (〇2) concentration in the atmosphere is, for example, but not limited to, 25 parts per million (ppm) or less. ~ The description and methods described herein are intended to be placed on a solder containing molten solder. The molten solder is held on top of the solder or above (e.g., 50 c). The apparatus described herein has an internal volume disposed on the solder reservoir to rely on the solder reservoir The upper shift-channel conveyance between the workpiece to be soldered and the surface of the molten tanner defines:: circumference. In a particular embodiment, the workpieces are supported by the moving rails or the belt fingers to support the side edges and the tabs are passed through the solder waves. In other embodiments, when the skin welder transports the workpieces through the 兮笪μ 曰 edge 尥4, the workpiece is placed on the pallet and the secondary strip. The material storage tank has a nozzle or a shower, which discharges a weld, a wave generated by a solder pump. The 5th solder pump is typically a basin. The #tü U allows the end user to control the solder flow and the peak of the damper 4 is low. The peak of the solder wave or 201143957 is suitable for processing conditions. The or more solder waves strike the surface of the workpiece to be soldered through - or more openings in the top surface as described herein. During this process, the apparatus stores a plurality of diffusion sources containing openings, orifices, slits, perforations or pores in fluid communication with the inert gas source example = N2, through the internal volume of the tube and through the interior volume The opening of the tube or the opening of the field enters the far atmosphere. In doing so, when the workpiece passes the solder wave, the lower surface, the front green, the back green, and the side edges of the workpiece are uniformly covered by the inert gas. In a particular embodiment of the apparatus and method described herein, the size of the apparatus placed on top of the solder reservoir is minimized to enhance inerting efficiency around the moving solder waves. In various embodiments, the static smelting solder surface, or the region outside the device path in the solder sump, can be covered by a material that can withstand the temperature of the molten solder contained in the solder sump. The apparatus and method described in FIG. 7 comprise a plurality of diffusion tubes having an internal volume and one or more openings, which may be, but are not limited to, pores, holes, slits, vents, orifices, perforations Or other means for allowing nitrogen and/or other inerting gases to pass through the internal volume of the tube and exit through the opening of the tube. In a particular embodiment, the tubes are porous and comprise an average pore size of about 0.2 microns (μm) or less to provide a laminar flow of inert or Ν2 gas exiting the porous tube. In various embodiments, the tubes are in fluid communication with a source of inert gas that supplies the inerting gas through the internal volume of the tube, such as, for example, Ν2 and openings or pores through the tubes. The surface of the smelting solder that leaves the sump is rounded to the area defined by the 201143957 work. As mentioned first, the equipment described in the text includes a majority of diffusers and ▲. P-contained outer cover. In a specific embodiment, the tubes may be located between the majority of the solder waves, and the board of the solder sump enters the side of the workpiece of the solder sump. The workpiece is n-phase 丨. ', perpendicular to the direction of the solder wave. Or a combination thereof. In these embodiments, there is no gap between the surface of the workpiece to be soldered and the surface 2 of the solder wave. In a particular embodiment, more of the tubes are, for example, such tubes. - or more embodiments in which a plurality of soft soldering waves are present, may additionally include a metal protrusion or slab, wherein at least a portion of the dog's exit pupil touches the molten solder and is in thermal contact with the tube The metal protrusion or fin allows the temperature of the tube to which it is connected to change

The melting point of the solder in the south of the solder is avoided; for example, the melting point U of the batch I avoids, for example, the clogging of the male chamber caused by the soldering splash and/or the vapor condensation of the flux. In a particular embodiment, the metal protrusions or fins that touch the or more battalions and the smelting + 々 枓 can be a component of the vertical wall of the apparatus. In various embodiments, the inner and/or outer sides of the solder bath may be provided with another tube. The use of one or more of the metal rods that conduct heat between at least one of the tubes and the molten solder bath avoids the problems associated with prior art and/or the contact of the beta-porous tube with the solder bath. In the specific embodiment of the apparatus and method described herein,

The number of radiant bones, for example, is not JJP - not limited to, one or more of the center diffusion between most solder waves contains a pointless coating. An example of a non-stick coating is a polytetrafluoroethylene (PTFE) coating, which is available under the registered trademark Teflon 8 without adhesion. • The green coating (Teflon is manufactured by D-Heart Co., Ltd., Wilmington, Delaware) turn up. To maintain the inert gas through the surface of the diffuser, 10 201143957 porous Teflon I 丄 v, such as a viscous sleeve, can be applied to at least a portion of the surface of the tube. In various embodiments, in the lead-free wave soldering process, when careful, the viscous coating should be used for the temperature of the molten solder or the above. C) can also maintain and finish (four) / s s (for example, in the evening, the non-adhesive coating package 4 specific embodiment of the retanning package 3 ThermolonTM non-stick coating, manufactured by South Korea's = molGn Co., Ltd., Moreover, (iv) c can maintain its integrity and avoid inorganic (mineral-based) coatings that increase the temperature to produce toxic vapors. The implementation of the central porous tube between one or more pairs of solder waves Example 'The co-solvent dissolved in the solder reservoir will directly contact the central diffuser surface between the first and second waves due to the continuous dynamic movement of the solder. When the liquid flux on the diffuser surface evaporates Or when thermally decomposed, solid flux residues may remain on the diffuser surface and cause blockage of the diffuser. For remedies, non-stick coatings or porous non-adhesive sleeves or coated non-stick coatings The metal shell made of the elongated hole can be applied to the porous tube or can cover at least a part of the porous tube. The letter will be non-adhesive coating or a non-adhesive sleeve or coated with a non-stick coating. Made of a narrow hole j metal shell added to the multi-sex expansion At least one of the tubes prevents the porous tube, such as the central tube, from being clogged with solid flux residues. The non-stick coating can also be applied to at least a portion of the inner surface of the device or the inner surface of the cap for ease of cleaning. In still another embodiment of the apparatus and method described herein, the apparatus additionally includes any cover mounted on the moving track to form a tunnel through which the workpieces pass. The optional cover additionally includes the wave soldering machine A venting port in fluid communication with the venting venting passageway that allows flux vapour to be collected from the atmosphere of the 201143957 side of the cover. In one embodiment, the venting cap is provided with a venting venting to the machine The center of the pipe. The single layer of metal cover of the hole is made. In another embodiment, the cover is made of a double metal sheet, and the double layer is connected to the ventilation and exhaust line of the furnace. This forms a boundary odor. In a particular embodiment, the distance between the two metal sheets can be between about 1/8" and about 屮. When a workpiece or circuit board passes under the cover, The flux vapor generated in the solder pad can be collected through the boundary trap, and the air surrounding the solder bath is trapped in the double layer spacer to ensure good inertization performance. For the top of the solder tank > In the case of a workpiece or circuit board, the inert gas generated by the majority of the diffuser of the inerting device can be drawn into the volume below the double layer spacing of the lid to form a boundary inert gas mist. To minimize the amount of air entering the volume. Figure 1 provides a specific embodiment of a porous tube or diffuser of the apparatus and method described herein. The perforated tube is described as a cylindrical tube having an internal volume 15, the interior Volume 15 allows inert gas such as nitrogen and/or other gases such as, but not limited to, an inert gas (eg, argon, helium, etc.), argon, or a combination thereof to flow through 'and with the inert gas source fluid (not shown) Connected. In a specific embodiment of the perforated tube 10, the perforated tube is made of stainless steel. However, materials for other porous tubes 10 are also applicable as long as the materials are not reactive to the material. The porous tube 1 is in fluid communication with the source of inerting gas through a gas conduit or other means (not shown). The perforated tube 10 additionally includes a plurality of perforations 20, pores or holes that allow gas to pass from the inner volume 15 through the perforations 20 from the soft solder bath, the surface of the molten solder (not shown), and the soft to be softened The welding industry _ people, 千 thousand (not shown) below the atmosphere defined by the combination and outflow. Despite the obscured section of the perforated tube, the shoulder is not cylindrical and has a circular cross section but other geometric shapes are expected, for example, but not limited to square, rectangular, elliptical, etc., can be used. The body is / / (9) so that, for example, using the circular hole shown in the specific example of Figure 1 to guide the gas flow and fill the _ ^ food in the way In another embodiment, the perforations 20 are: elongated holes or slits. In various embodiments, the perforations 2 can be truncated or angled to introduce gas flow from the interior into the step Soft knowing Luo (not shown) and / or welding thick, under ώ 3 τ,, and the gap between the workpiece ρ perforation 2 〇 average hole control can be between ι / \ λ mouth '• micro to 100 microns Or 0.1 to 10 microns, S 5.0 In a particular embodiment, the perforations 20 have an average pore size of about 0.2 microns or less. Optimum pore size and porosity of the perforations in the porous tube H) A laminar flow of gaseous N2 exiting the porous tube is sought. In various embodiments, it is preferred to minimize intrusion of air from the boundary of the soft pad (e.g., workpiece, conveyor belt, etc.) to be inerted. a laminar flow of N2 and/or other inerting gas. With regard to an alternative embodiment of the porous diffuser, the majority Official-or more, such as, but not limited to, a central diffuser between most solder waves, made by tubes made of concentric slits. Figure 23 & (side view) and 23b ( An example of such a specific embodiment is provided in a cross-sectional view. In this particular embodiment, the diffuser tube has one or more elongated holes 1110 and is surrounded by a concentric cover! 丨 2 。. 2〇 has - or more openings or slits 1130, which face down and allow the passage of inert gas 13 201143957. It is believed that the downward structure of the narrow holes will cause the liquid lubricant to enter the tube and block the one. The chance of more openings or less is minimized. In a particular embodiment, the concentric cover 1120 has a non-stick coating applied to at least a portion of its surface, such as any of the coatings described herein. Despite the diffusion tube 1 1 〇〇 The surrounding cover 1120 is shown to be cylindrical in shape and has a circular cross-section, and it is contemplated that other geometric shapes such as, but not limited to, rings, squares, circumflex, elliptical, etc. may be used. And 4 provide the design described in the text A top and isometric view of one of the specific embodiments. Referring to Figure 3a, the apparatus 30 is placed on the wave soldering apparatus 7 to provide an inerting atmosphere during the wave soldering operation. The wave soldering apparatus 7 includes a molten solder 80. a solder sump 75 and one or more nozzles 85 that discharge one or more solder waves (not shown) generated by a solder pump (not shown). Referring to both Figures 3a and 4, device 30 has The top surface 5 of the bracket removed by the device is such that the end user can more easily complete the float removal. The top surface 3 $ additionally includes at least one opening 40, at least one radiated from the molten solder 80 contained in the solder tank 75. Solder waves pass through the nozzle through the at least one opening and touch/sigma the workpiece through which the moving track (not shown) passes. Referring to Figures 3 & and FIG. 30, at least one recess 45 (shown in phantom in Figure 3) is additionally included on the bottom of the apparatus 3, which is placed on top of the edge of the solder reservoir 75. In a particular embodiment, more than one recess may be included which places the device on top of the solder reservoir 75 as shown in & The other specific embodiments described herein have only one recess 245 such as the embodiment illustrated in Figures 7 and 8. Yet another embodiment of the apparatus described herein does not have a recess or a plurality of flanges that allow the apparatus to be placed on or placed on a solder reservoir, such as the ones described in Figures n and 14. Example. Further, the side walls of the recess 45 of Figs. 3a and 4' and the front wall 33 or the rear wall 37 define a perforated hole S 5 in which the porous tube 55 (shown by a broken line in Fig. 3) is placed in the apparatus 3〇. 5 is in fluid communication with the source of inert gas 65 via a tube 6 . The inerting gas used in the apparatus and method described in the 'combined texts' may include nitrogen, hydrogen, an inert gas (e.g., helium, argon, neon, xenon, rock, etc.) or a combination thereof. In a particular embodiment, the inerting gas is preheated prior to introduction into the porous tube 55. The specific embodiment shown in Figures 4 and 4 can vary with the structure of the wave soldering machine. Referring now to Figure 4, device 30 additionally includes the molten solder surface (not shown), the workpiece (not shown), The inner wall 69 defined by the wall 33, the rear wall 37 and the side walls 43 and 47. The δ 30 further comprises at least one metal fin 57 in contact with the molten solder sump and at least the porous tube, the metal fin 57 The center of the porous tube 55 is heated to a temperature above the melting point of the molten solder. Figure 3b provides a top view of a specific embodiment of the apparatus 3 described herein, wherein the porous tube 55 is perpendicular to the solder wave Width orientation. For example, Fig. 3b 'e and 3' are placed on the wave soldering equipment 7〇 to provide a vibrating atmosphere during the wave soldering operation. The wave soldering apparatus 70' includes the molten solder 8〇. a solder sump 75" and one or more nozzles 85' that discharge one or more solder waves (not shown) produced by a solder pump (not shown). The device 30 has a cradle from the device The removed top surface 35 is used to make it easier for the end user to complete the float The top surface 35 further includes at least one opening 4〇, and at least one solder wave radiated from the solder sump 75' passes through the at least one opening 4〇, passes through the nozzle 85, and is touched. Along the moving track (not shown)

S 15 201143957 Workpiece. In other embodiments, the flanges described herein include edges that allow the device to be placed or placed on the solder reservoir. The porous s 55 is in fluid communication with the inert gas source 65' via the official 6'. As previously mentioned, the apparatus and method described in the context of the present invention: The chemical gas may comprise nitrogen, hydrogen, an inert gas (e.g., helium, argon, helium, nitrogen, etc.) or a combination thereof. In a particular embodiment, the inerting gas is preheated prior to introduction into the porous tube 55'. The embodiment shown can be varied with the structure of the wave soldering machine. Figure 5 provides an isometric view of any cover 9 置于 placed over the device 3 & moving track (not shown) so that the workpiece can travel. Any cover 90 is shown to have a viewable glass window 95. Any cover % additionally has a vent 流体 in fluid communication with the venting line (not shown) of the wave machine to remove any flux vapor within the atmosphere of the sinite station. Figure 6 provides the apparatus defined herein. A side view of a particular embodiment. As illustrated in Figure 6, 'the device 13 is placed on top of the wave soldering apparatus 17 by mounting the recess 145 on at least one edge of the solder reservoir 175 as shown. The solder reservoir 175 has The molten solder is contained 18. The moving rail (not shown) transports the workpiece 100 to be soldered in the upward direction indicated by the arrow 105 shown. At least one or more solder pumps (not shown) are used to pass through the nozzle 185. A plurality of solder waves 115. The majority of the solder waves 115 pass through the opening 107 in the device 13A to the underside of the worker #1. The inert gas is introduced into the porous fin 155 in the chamber 150 outside the solder reservoir. Shown in 6 In a preferred embodiment, the porous tube 155 is located at the inlet and outlet of the feed reservoir 175. In yet another embodiment, the porous tube 155 is oriented perpendicular to the direction of the weld 16 201143957 (not shown) to contact the molten solder. The metal of 180 is filled with the workpiece. At least one of the porous tubes 155 is connected to the protrusion 157. The inert gas is filled under 100 and described by the parallel cross-hatching of the parent and the area or atmosphere indicated by 120 above the surface of the molten solder. In the specific example shown in Figure 6, there is substantially no gap between the s-device and the apex of the solder wave "5. Figures 7 and 8 provide an alternative embodiment of the device 23A. There is only one recess 245 on the edge of the solder reservoir (not shown). At least one side wall and front wall 233 of the recess 245 of the device 230 defines a perforated tube 255 (shown in phantom in Figure 8) (d) 250. Apparatus 23 The internal volume is defined by the surface of the molten solder (not shown), the workpiece (not shown), the front wall 233, the rear wall 237, and the side walls 243 and 247. Referring to Figure 8, the device 23 is additionally At least one of the package 3 and the melt a material sump (not shown) and one of the porous tubes 255) (shown in phantom) contact metal fins for heating the core of the slab 255 above the slab The temperature of the solder melting point. Figures 9 through 13 provide a number of different embodiments of the apparatus described herein, which apparatus comprise a plurality of porous tubes. Figure 9 provides a specific embodiment in which one of the porous tubes 355 is located in the solder. a second porous tube 355 interposed between the solder waves, and a thermally conductive material 357 such as a metal fin, the thermally conductive material 357 contacting the molten solder 380 and the second portion. a porous tube 355, and heating the second porous tube to a temperature higher than the melting point of the solder, and the third porous tube 355, touching the wall of the device 33, the far wall being thermally conductive or extending to the molten solder 380. Apparatus 330 17 201143957 additionally includes a flange that facilitates placement of device 330 on top of solder reservoir 375. Figure 10 provides a specific embodiment of the apparatus 430, wherein the first porous tube 455 is located in a recess 45〇 outside the solder reservoir 475, and the second and second porous tubes 455, 430 comprise a thermally conductive material. For example, a metal fin 457 that touches the molten solder 48 and the second porous tube 455' and the third porous tube 455, and heats the porous tubes to a temperature above the solder refining point or above . Figure 11 provides a specific embodiment wherein the first porous tube 555, the first porous crucible 555' and the third porous tube 555" are attached to the inside of the solder reservoir 575, and each porous tube comprises a thermally conductive material such as a metal. The fin 557, the thermally conductive material touches the molten solder 58 and heats each porous tube to a temperature above the melting point of the solder. The device 530 does not have a recess for placing the device on top of the solder reservoir 575. Instead, the device 53 There are a plurality of flanges 567' which can place the device 53 on top of the solder reservoir 57.5. Figure 12 provides a specific embodiment of a device 63 having a plurality of grooves 645, wherein at least one side wall of the groove The front wall 633 or the rear wall 637 of the device 63 has a perforated tube 65 5 and 655, and the chamber 65 is. The device (4) is another porous tube 655 which is in contact with a heat conductive material such as a metal fin 657. The child thermally conductive material touches the molten solder 080 and heats the porous tube 655 to a temperature above the melting point of the solder. Figure 13 provides a specific embodiment of a device 730 having a plurality of grooves 745, at least the side walls of the grooves The device 7 The front 帛 733 or rear wall 737 of the 3 界定 defines a compartment having perforated tubes 755 and “5”. Apparatus η. 18 201143957 additionally includes an inner flange 752 ′ extending from the sidewall of the recess 745 into the solder reservoir 780 The inner flange 752 facilitates placement of the device 730 on top of the solder reservoir 775. Figure 14 provides a specific embodiment of the apparatus 930 described herein, wherein the first porous tube 955, the second porous tube 955', and the A three-porous tube 955' is attached to the inside of the solder reservoir 795, and one of the porous tubes or 955 further includes a thermally conductive material such as a metal fin 957 that contacts the molten solder 980 and The porous tube 955 is heated to a temperature above the melting point of the solder. The device 930 does not have a recess for placing the device on top of the solder reservoir 975. Rather, the device 930 has a plurality of flanges 967 that can hold the device 930 is placed atop solder reservoir 975. Apparatus 930 is shown to be comprised of a double wall of a material such as metal that defines at least one compartment 950 that houses at least one of the porous tubes, such as 955 and 955'. In the direction indicated by arrow 925 Above the device 93〇 and in contact with the solder wave from the nozzle 985, the plurality of porous tubes 955, 955, and 955" are in fluid communication with an inerting gas source such as Ns (not shown), the inerting gas The source provides an inerting atmosphere or n2 atmosphere through the tubes, to the volume defined by the double layer of material ' to 930 in the chamber 950, and to the interior defined by the molten solder surface 980, the workpiece 923 and the wall of the workpiece 93〇. Each product is 969. 15 through 17 provide a specific embodiment of apparatus 83 that additionally includes any cover 890 on the dome of the solder reservoir 88 to form a tunnel for the workpiece 9〇5 retained on the moving rail 9〇〇. Figure 15 provides an end view and Figures 16 and 17 provide side views of device 830. In a particular 201143957 embodiment, any cover 890 is in fluid communication with a vent tube of a wave soldering machine (not shown). Any cover 890 is constructed of a two-layer sheet, and the double-layer spacing is attached to the venting exhaust pipe 897 of the furnace to form a boundary gas trap. The optional cover 890 can be made from a double sheet of sheet metal or other suitable material. In a particular embodiment, the distance between the two metal sheets may be, but is not limited to, 1/8, to about 1/4". In the specific embodiment shown in Figures 15 through 17, any The lid 890 can include an inerting gas inlet 895 that is in fluid communication with an inert gas source (not shown) to more aid in cleaning the flux vapor and air exiting the solder joint. As shown in Figure 16, When a circuit board passes under the cover 890, the cosolvent vapor generated in the soldering zone can be collected through the boundary trap, and the air surrounding the solder sump 87 can also be trapped in the double-layered space below the cover 890. It helps to ensure a good inerting atmosphere. In the example where the solder tank 87 is not covered by the workpiece 905 shown in Fig. 17, the inert gas generated by the majority of the porous tubes 855 can be sucked to the cover. + 89 〇 of the double-layer spacing, thereby forming a boundary 惰 f· biochemical aerosol to minimize the external environment into the atmosphere 920 above the solder sump 8 (9). The equipment and method described herein A specific embodiment is shown in FIG. 21, for example. In a specific embodiment, an inert gas mist 1010, such as N2 and/or other inerting gas as described herein, is applied to the inlet or outlet of the solder sump 1 or both of the inlet and outlet to further surround the solder sump The intrusion of air is minimized. The salty gas mist 1〇1〇 will block the gap between the workpiece 1535 or the bottom or the top and bottom of the workpiece to be treated (Note: 1 005 should be indicated by X s The straight line on the side of the workpiece and the small rectangle should be deleted. 20 201143957 Except .) 'The workpiece 1〇〇5 uses the equipment 103 0 placed on the top of the solder tank 1 〇 2 and the top cover 1 δ standing on the top. 4〇 entering the solder sump In the embodiment or other embodiment shown in FIG. 21, the aerosol may be produced by one or more diffusion tubes having one or more openings, the openings containing elongated holes or perforations, wherein The tube, the box, the triangle or a combination thereof has a length parallel to the width of the solder wave and an inert gas flowing from the - or both ends. The narrow slit or small perforation allows for strong gas jetting to form the inert gas containing the inert gas. Aerosol In a particular embodiment, the narrowed or perforated diffuser tube can comprise a porous tube or a porous layer within the tube to minimize pressure drop along the length of the diffuser making the elongated holes or perforations. The diffusion tube 1〇5〇 formed into the elongated hole contains one or more openings or slits 1060'. The diffusion tube 050 can be used alone (as shown) or inserted into a porous diffuser (not shown) to generate an aerosol. With respect to an alternative example, Fig. 22b shows a section of a diffusion box 1070, and its top surface 1〇75 is made of a perforated plate and the other three surfaces are made of a solid plate 1〇78. Fig. 22b also shows an angle liter> The cross section of the gas director 1〇8〇, the bottom surface of the triangle J and the top edge 1090 having open slits. The bottom surface of the triangular gas director 1080 is in direct contact with the pores contained in the surface 1075. The gas is in fluid communication with the diffusion cell 1070 and is uniformly injected along the length of the diffuser. It is to be understood that the various embodiments and specific embodiments of the invention are described in detail, and it is obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope. 21 201143957 EXAMPLES Example 1: Effect of pore size of porous tubes on gas flow diagrams The three diffusers or porous directors listed in the following table have three different grades for testing. The lower level indicates the pore size and smallness of the diffuser: this test allows the N2 in the hood to flow through the seamless porous tubes and measure the pressures upstream (Pup) and downstream (P"n) to obtain a specific N2 flow rate. : Determine the pressure drop (ΔΡ) along the diffuser as follows: ΔΡ - Pup - Pdown Then calculate the average pressure along the diffuser:

Pave = (Pup + Pd〇wn)/2 When ΔΡ/Ρ_ is much smaller than 1, the gas flowing out of the diffuser can be selected as a laminar flow pattern. Conversely, when ΔΡ/ρ_ is close to i, the turbulent gas flow is usually dominant. With respect to a particular embodiment, it is preferred that the porous tube provides a laminar gas flow pattern. As shown in Table I and Figure 2, the AP/Pave of the 0.2-stage diffuser or perforated tube is minimal and well below 1 at the relevant & flow rate. Based on this result, select a Class 2 diffuser. The average pore size of the crucible, the 2-stage diffuser is about 〇.2 μιη. Figure 2 shows a porous tube with an average pore size of 0.2 μηη or the 0.2 diffuser grade at the relevant A flow rate (e.g., 6 m3/hr/diffuser). In contrast, U.S. Patent No. 6,234,380 teaches that a diffuser for the inertization of ν2 during wave soldering preferably has a pore size range of 0.3 to 2 μm or 〇.4 to 0.6 μm, which exceeds the optimum pore size of the layered layer. outer. 22 201143957 Table i: Porosity comparison of porous tubes

Embodiment 2: Effect of heated diffuser on 乂 inertization during wave soldering In this embodiment, at least one of the plurality of porous tubes is located between the two solder waves and has a protrusion into the molten solder The metal fins of the sump are such that the temperature of the porous tube diffuser can remain above the melting point of the solder. This heated diffuser avoids potential clogging problems such as splashing/solidification by solder and condensation by the flux vapor on the diffuser surface. Figure 9 shows an example of the structure used in this experiment. Figure 19 provides the results of the A concentration around the solder reservoir at positions i through 8 at the locations indicated in Figure 18, with the static plate on top of the solder reservoir and without the top cover (e.g., as shown in Figure 5). 2〇 Repeat the 〇2 analysis of the top cover and the ventilation device above it (such as the one shown in Figure 5). It has been observed visually that any soldering splash on the surface of the perforated tube will not cure in the second case. The solder droplets that have fallen on the surface of the central diffuser will automatically drip due to their high surface tension and the intrinsic properties of the diffuser surface. Furthermore, there is no evidence that the cosolvent vapor condenses on the surface of the diffuser. Figure 19 shows that the concentration of 〇2 in the vicinity of the molten solder wave is very low in terms of the flow rate of the very small amount of Η?, and the performance -Ba ^ ^ is kept with time because the expansion blockage has been eliminated. Similarly, the expansion of the government, the very small amount of N2 flow rate is not even if there is a ventilating device ^, a, 5 5 Hai and other molten solder waves near the 〇 2 concentration is also low ' ^ This performance can be 2 Blocking has been eliminated. Since the 矽 "Yi diffuser r ^ ... x is a fin, the diffuser can be set to be more efficient in cleaning the surface of the molten solder 囍 1. The present embodiment is 3. The non-viscous porous sleeve The application of the material to the center of the diffuser tube in this embodiment, in this embodiment, the volume ^ 丨 ... " the porous official at least - is located between the two solder waves and has - included in the _ _ ~ The metal fins of the solder reservoir are fused such that the temperature of the porous tube diffuser is maintained at the melting point of the solder. This heated diffuser avoids potential blocking problems, such as by solder splashing. Example of a structure used for the experiment by coagulating and solidifying vapour vapor on the surface of the diffuser. A sleeve made of ePTFE (expanded polytetraethylene) covers the central diffuser. The Eptfe system is formed. Tubular and white, made by ρΐιίιι& Scientific Ltd. under the part number TB3. The porous tube can only expand along the length of the official, but does not expand in the diameter direction. The material is known to be 315 °C test and has about 2 to 1〇 Average pore control of the meter. The wall thickness of the tube can range from 0001" to 0 002". The ePTFE sleeve on the porous diffusion tube is immersed in a molten solder bath at 260 ° C. The sleeve is not visible. Variety.

Connecting the ePTFE sleeve on the 12" long diffuser to the 85 psig N 24 201143957 source supplies the N2 flow rate of 4 NM3/Hr from the diffuser and there is no problem with the sleeve on the crucible surface. The diffuser (12" length and 3/8" outer diameter (〇.')) of the casing acts as a central diffuser in the apparatus described herein and has a flow rate of 4 NM3/Hr on the ~Diffuser The device is then mounted on a 260 C molten solder bath and the passing two solder waves touch the hot fins of the central diffuser. The liquid flux is continuously sprayed onto the ePTFE surface of the central diffuser. It was found that the ePTFE was completely non-adhesive to the liquid flux, and the molten solder sprayed on the ePTFE sleeve of the central diffuser could be easily dropped into the solder bath downwards. 1 provides an isometric view of a specific embodiment of a diffusion tube or porous tube comprising pores as described herein. Figure 2 shows the pressure along the porous tube affected by the pore size or grade of the diffusion tube described in Example 丨. The ratio is lower than the nitrogen (NO flow rate cubic meters per hour (m3) Relationship between /hr) Figure 3a provides a top view of one embodiment of the apparatus described herein. Figure 3b provides a top view of another embodiment of the apparatus described herein. Figure 4 provides Figure 3a An isometric view of a particular embodiment of the device described. Figure 5 provides an isometric view of any of the covers that can be placed on top of the mobile track. Figure 6 provides a specific embodiment 25 of Figure 3a mounted on a solder sump. Figure 7 provides an isometric view of a specific embodiment of the apparatus described herein. Figure 8 provides an isometric view of the embodiment illustrated in Figure 7 additionally comprising a plurality of tubes (shown in phantom), wherein At least one of the tubes includes a fin-like projection, wherein at least a portion of the fin-shaped projection contacts the molten solder. Figure 9 provides a side view of a particular embodiment of the apparatus for n2 inertization described herein, It comprises a plurality of tubes comprising one or more openings, wherein at least one of the tubes comprises fin-shaped projections in contact with the molten solder. Figure 丨〇 provides the specifics of the apparatus for inertization described herein. Implementation A side view of an example. Figure 11 provides a side view of a specific embodiment of the apparatus for N2 inertization described herein. Figure 12 provides a side view of a specific embodiment of the apparatus for inertization described herein. 13 provides a side view of a specific embodiment of the apparatus for inertization described herein. Figure 14 provides a side view of a specific embodiment of the apparatus for N2 inertization described herein. An end view of any of the covers on the moving track is provided in the specific embodiment of FIG. 6 to illustrate a workpiece or printed circuit of a side view of the embodiment illustrated by the underlying member of the cover on the mobile track. Example 26 201143957 Figure 1 7 provides a side view of the embodiment illustrated in Figure 15 with no circuit board passing underneath the cover. Figure 18 provides a picture demonstrating eight locations for measuring the concentration in Example 2. Figure 19 provides the results of the 〇2 concentration shown in Figure 18 for positions 1 to 8 with a plurality of porous diffusion tubes, wherein one of the plurality of tubes has a metal protrusion in contact with the solder bath of Example 2. And the towel is any positioning of the device on the moving rail and the top of the workpiece. Figure 20 provides the location of the apparatus shown in Figure 18 for a multi-portion diffuser tube! As a result of the concentration of 82, the majority of the tubes have the metal protrusions of the solder bath contact described in Example 2 of the tamping palladium and the arrangement of any of the lids connected to the ventilating means on the mobile track and the top of the workpiece. Figure 21 provides a specific embodiment of an aerosol that can be used in conjunction with the methods and apparatus described herein. 22a and 22b respectively provide a specific embodiment of the diffusion tube and the diffusion box described herein, wherein the diffusion unit comprises a plurality of elongated holes and is placed in a diffusion box, and the extension is in a diffusion box. | A plurality of openings are included to allow inert gas to pass through the openings. Figures 23a and 23b provide side and cross-sectional views, respectively, of an alternate embodiment of a diffuser tube.

S 27 201143957 [Description of main components] 10 Perforated pipe 15 Internal volume 20 Perforation 30 Equipment 30' Equipment 33 Front wall 35 Top surface 35? Top surface 37 Rear wall 40 Opening 405 Opening 43 Side wall 45 Groove 47 Side wall 50 Cabin 55 Perforated tube 55, porous diffuser 57 Metal tab 60 Tube 60, tube 65 Inert gas source 65? Inert gas source 69 Internal volume 70 Wave soldering equipment 705 Wave soldering equipment 15, Solder tank 75 Solder tank 805 Solder solder 80 Molten solder 85 Nozzle 85, Nozzle 90 Any cover 95 Glass window 97 Vent 100 Workpiece 105 Arrow 107 Opening 115 Solder wave 120 Ambient 130 Equipment 145 Groove 150 Cabin 155 Porous tube 157 Metal projection 170 Wave soldering equipment 175 Solder tank 28 201143957 180 Molten solder 185 Nozzle 230 Equipment 233 Front wall 237 Rear wall 243 Side wall 245 Groove 245 Groove 247 Side wall 250 Tank 255 Porous tube 257 Metal tab 269 Internal volume 330 Equipment 350 Pocket 355 Porous tube 3555 Second porous tube 355 , third porous tube 357 thermal conductive material 375 solder storage Slot 380 molten solder 430 apparatus 450 pocket 455. first perforated tube 4555 second perforated tube 455, third perforated tube 457. metal tab 475 solder reservoir 480 molten solder 530 device 555 first perforated tube 555 , second porous tube 555, third porous tube 557 metal. tab 567 flange 575 solder reservoir 580 molten solder 630 device 633 front wall 637 rear wall 645 groove 650 chamber 655 porous tube 655, porous tube 655, , Perforated tube 657 Metal tab 680 Molten solder 730 Equipment 29 201143957 733 Front wall 745 Groove 752 Internal flange 755''Perforated tube 780 Solder tank 855 Porous tube 880 Solder tank 895 Inert gas inlet 900 Moving rail 920 Above the solder tank Ambience 925 arrow 950 cabin 955' second perforated tube 957 metal fin 969 internal volume 980 molten solder 1005 workpiece to be treated 1020 solder sump 1040 top cover 1060 narrow hole 1075 top surface 1080 triangle gas guide 1100 diffuser 1120 concentric Cover 737 Rear wall 750 Cabin 755 Porous tube 775 Solder tank 830 Equipment 870 Solder tank 890 Any cover 897 Ventilation Trachea 905 Workpiece 923 Workpiece 930 Equipment 955 First Porous Tube 955" Third Porous Tube 967 Flange 975 Solder Tank 985 Nozzle 10 10 Inert Aerosol 1030 Equipment 1050 Made of Long and Thin Hole Diffusion Tube 1070 Diffusion Box 1078 Solid Plate 1090 Top edge 111 0 narrow hole 11 3 0 narrow hole 30

Claims (1)

201143957 VII. Scope of application: 1.- (4) for inert gas supply during soldering of workpieces, the device comprises: at least - a groove at the bottom of the device - the at least one groove is used for inclusion At least one edge of the solder sump of the molten solder, wherein at least the wall of the groove defines a cavity outside the solder sump; and an opening of the top surface of the V to the 4 ° from the solder sump Transmitting at least one solder wave through the at least one opening and touching the workpiece; and a plurality of tubes including - or more openings, the t being in fluid communication with the source of inerting gas 'where at least one of the tubes is present In the cabin, wherein the device is located above the solder tank and below the workpiece to be soldered to form an atmosphere and substantially no gap between the workpiece to be soldered and the apex of the at least one solder wave. 2. The apparatus of claim 1, further comprising: a thermally conductive projection, wherein at least a portion of the projection contacts the refining solder and the at least one tube. 3. The device of claim 2, wherein the thermally conductive projection comprises a metal fin. 4. The device of claim 2, wherein the at least one tube is present at a proximal end of the at least one solder wave of the beta. 31 201143957 5. The apparatus of claim 1, wherein the cover on the top of the rail is such that the sigma workpiece contains a venting D that communicates with the ventilation system. Further included is placed in the movement, wherein the cover is further as in the apparatus of claim 5, wherein the inner volume of the sheet and the inner exhaust line are in fluid communication. Wherein the cover comprises a majority of the volume of the boundary and the ventilation of the soldering furnace. 7. The apparatus of claim 6 is in fluid communication with the source of inerting gas, wherein the cover additionally comprises an input D 〇 8 · as claimed The apparatus of item 1, the pores and the average pore diameter of the porous tube therein, wherein the openings in the tubes are 0.2 μm or less. 9. If the scope of the patent application is borrowed, the apparatus of the invention includes a plurality of recesses wherein the grooves define a plurality of faces having the porous tubes. 10. The apparatus of claim 1, wherein the solder sump generates a plurality of solder waves and at least one tube is interposed between the solder waves. 11. Apparatus as claimed in claim 1 wherein the inerting gas comprises nitrogen. 32 201143957 12. A device containing 5% by weight or more of the material of the patent application, wherein the inerting gas contains a small amount of nitrogen. 13. For example, the gas of the nitrogen-nitrogen group is selected as the free nitrogen. The apparatus of claim 1 wherein the inerting gas comprises helium, argon, neon, krypton and combinations thereof. 14. A method for providing an inerting atmosphere when the material is contained, the method provides - The welder's include: one less nozzle, at least ~ stone pump to generate at least one solder wave from the raw; a device on which the device is contained at least one edge of the top surface of the top sump, at most one of the tubes And the workpiece to be soldered and the workpiece to be soldered and the at least one gap; the workpiece is passed along a path through the solder storage bath containing the molten solder, and the molten material is passed upward through the nozzle Having at least one opening disposed on the top surface of the at least one edge of the solder sump, in the flux-less recess, and a plurality of contained or a source of a source of gas, wherein the top surface of the material defines an atmosphere and a solder therein There is substantially no, between the apex of the wave, and at least one of the solder waves transmitted through the opening of the device; and through the tubes An inert gas and into the atmosphere, wherein the at least one touch to the pipe is inserted into the projecting portion of the thermally conductive molten solder - at least partly by means of the - pipe is heated to above the melting Jia: temperature of the melting point of the material. 33 201143957 15. The method of claim 4, wherein the thermally conductive projection comprises a metal fin. 16. The method of claim 14, wherein the at least one tube is present at the proximal end of the at least solder wave. 17. The method of claim 14, further comprising a cover through which the workpiece passes, wherein the cover additionally includes a vent 〇 in communication with the venting system. The method of claim 17, wherein the cover comprises A plurality of sheets defining an internal volume and wherein the internal volume is in fluid communication with a venting exhaust line of the soldering furnace. 19. The method of claim 1, wherein the lid further comprises an inlet in fluid communication with the source of inerting gas. 20. The method of claim 5, wherein the opening comprises pores and wherein the porous tube has an average pore diameter of 〇 2 μηη or less. 21. The method of claim 14, wherein the apparatus comprises a plurality of grooves wherein the grooves define a majority of the tubes. The method of claim 14, wherein the solder sump generates a plurality of solder waves and at least one tube is interposed between the solder waves. 23. The method of claim 14, wherein the inerting gas comprises nitrogen. 24. The method of claim 23, wherein the inerting gas further comprises 5% by weight or less of hydrogen. 25. The method of claim 1, wherein the inertated steroid comprises a group selected from the group consisting of nitrogen, hydrogen, helium, & gas scrubbing, hydrazine, hydrazine, hydrazine, and combinations thereof. gas. 26—a device comprising: an apparatus for providing an inert gas during soldering of a workpiece, the device package having at least one opening in a top surface of the device, emitting less from the solder sump - a solder wave passing through the at least one opening and touching the a plurality of tubes comprising - or more openings, the tubes being in fluid communication with a source of inerting gas, wherein at least the basins of the tubes are present in the chamber; and a thermal conductivity Protrusion, where the abrupt, ,, D, / out. At least a portion of p touches the molten solder and at least one tube, wherein the apparatus is located above the solder reservoir and below the workpiece to be soldered to form an atmosphere and a workpiece to be soldered and a vertex of the at least one solder wave There is virtually no gap between them. The apparatus of claim 26, wherein at least a portion of one of the porous tubes comprises a non-stick material. 36