CN204148684U - For providing the equipment of inert gas at the weld period of workpiece - Google Patents
For providing the equipment of inert gas at the weld period of workpiece Download PDFInfo
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- CN204148684U CN204148684U CN201420056872.5U CN201420056872U CN204148684U CN 204148684 U CN204148684 U CN 204148684U CN 201420056872 U CN201420056872 U CN 201420056872U CN 204148684 U CN204148684 U CN 204148684U
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- solder
- equipment
- inert gas
- diffuser
- workpiece
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- 239000011261 inert gas Substances 0.000 title claims abstract description 57
- 229910000679 solder Inorganic materials 0.000 claims abstract description 136
- 238000005476 soldering Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000012298 atmosphere Substances 0.000 claims description 26
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 17
- 229910052757 nitrogen Inorganic materials 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 29
- 230000009849 deactivation Effects 0.000 description 18
- 230000004907 flux Effects 0.000 description 14
- 239000007789 gas Substances 0.000 description 10
- 239000002699 waste material Substances 0.000 description 9
- 238000003466 welding Methods 0.000 description 9
- 239000003570 air Substances 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052754 neon Inorganic materials 0.000 description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009954 braiding Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052743 krypton Inorganic materials 0.000 description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- CVOFKRWYWCSDMA-UHFFFAOYSA-N 2-chloro-n-(2,6-diethylphenyl)-n-(methoxymethyl)acetamide;2,6-dinitro-n,n-dipropyl-4-(trifluoromethyl)aniline Chemical compound CCC1=CC=CC(CC)=C1N(COC)C(=O)CCl.CCCN(CCC)C1=C([N+]([O-])=O)C=C(C(F)(F)F)C=C1[N+]([O-])=O CVOFKRWYWCSDMA-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000013341 scale-up Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
Abstract
Describe a kind of for providing the equipment of inert gas at the weld period of workpiece.Equipment comprises: at least one groove in device bottom, for placing at least one edge of the solder accumulator wherein including slicken solder; At least one opening on equipment top surface, at least one solder wave sent from solder accumulator passes through via this at least one opening and contacts workpiece; And one or more diffuser tube, it comprises the one or more openings be connected that to circulate with inert gas source.This equipment reduces manufacture and material cost, the conversion that improves solder quality of connection and simplify Lead-Free Soldering Technology.
Description
Technical field
This document describes a kind of for providing equipment and the method for inert gas at weld period.More specifically, this document describes a kind of equipment and method for utilizing nitrogen and/or other inert gas to provide inert gas during wave-soldering.
background technology
The workpiece of such as printed circuit board (PCB) or circuit board and so on has the needs welding coating reduced gradually or the wettable surface connected.The general operation of wave-soldering comprises weldering bath, soldered printed circuit board (PCB) or workpiece is transmitted via it.Traditional automatic wave soldering equipment comprises the melting appartus, preheater and the welding bench that are arranged to process printed circuit board (PCB).Printed circuit board (PCB) is along moving track or conveyer belt transmission, and their side margins is supported by gripping finger.Flux is applied by making the foam of flux or hydrojet contact plank.Circuit board is subsequently by preheated zone, so that the oxide of the metal surface that solvent can be soldered reduces.Circuit board contacts with single or multiple slicken solder ripple subsequently in air or inert gas atmosphere.
Inert gas atmosphere is nitrogen (N normally
2) and/or other inert gas, and be often called as N
2inert gas.Welding in inert gas and/or nitrogen atmosphere makes the formation of the waste material on solder surface or oxide minimized.It is known that the existence of waste material and/or oxide skin(coating) can cause wire jumper, bridge joint or other defect in solder connection.What produced by Wave soldering apparatus during solder wave operation is the antipriming pipe parallel with solder wave or pipeline, for transmitting inert gas and/or N
2gas has the atmosphere of relative low oxygen to provide, especially by the below of soldered workpiece.
For Lead free wave sodering, comprise N
2the value of inert gas atmosphere increase further due to following reason.Use the treatment temperature of common lead-free solder significantly higher than common tin kupper solder treatment temperature, this melting point increased due to the lead-free solder jointly adopted causes.The rising for the treatment of temperature facilitates waste material and is formed.And the cost of lead-free solder generally far above the cost of conventional tin-lead solders, and forms the economic loss of the relevant economic loss of the solder waste product that causes much larger than Lead free wave sodering to waste material.In addition, compared with the wettability of conventional tin-lead solders, the wettability of lead-free solder is poor inherently.Therefore, the quality that the solder formed connects is more responsive to the state of oxidation on lead-free solder surface.
It is known that the waste material that the inertia in wave-soldering can reduce on slicken solder surface is significantly formed.Reduce waste material formation and not only protect solder material, alleviate maintenance requirement, and improve solder wet characteristic and ensure that the quality that formed solder connects.In order to apply inert atmosphere in existing wave soldering machines, the inner slicken solder accumulator caged protecting sheathing being provided with diffuser is inserted in a general measure.The inert gas that can be formed on solder accumulator covers, and therefore, reduces the possibility of solder oxidation.
Diffuser is generally made up of antipriming pipe, for by such as N
2and/or the inert gas of other inert gas and so on introduces welding bench.But antipriming pipe becomes and is easily splashed down by solder during wave-soldering process or the concentrated blocking of flux steam.Once diffuser tube blocking, deactivation efficiency will greatly reduce.The existing method (such as, adopting the ultrasonic bath being full of cleaning solvent) of cleaning diffuser tube is extremely difficult, and very time-consuming.The cleaning of these pipes must regularly perform, and can cause physical damnification to pipe.In order to avoid these problems, be generally after diffuser tube blocking, it is replaced, instead of clean.Which increases the overall cost of terminal use.
Thus, in order to promote the enforcement of deactivation at wave-soldering by N2 and/or other inert gas, expect equipment, method or both at least meet in following target one or more.First, expect that deactivation equipment and method reduce N
2or the consumption of other inert gas, such as but not limited to 12 cubic metres of (m per hour
3/ hr) or less, to meet the cost effect of application technology.The second, expect that deactivation equipment and method reduce the O of slicken solder surface
2concentration, such as but not limited to 2500/1000000ths (ppm) or less.3rd, expect that deactivation equipment and method use the equipment being convenient to install also minimally improvement cost.And, expect that the blocking of equipment and method reduction or elimination porous air diffuser pipe is to guarantee stable and permanent inertia performance.
Summary of the invention
Equipment described herein and method at least meet above-mentioned one or more for utilizing nitrogen and/or other inert gas to carry out in the target of deactivation, relative to the analogous method and apparatus of current use, it is effective and user friendly to become cost more.
In one embodiment, provide equipment, provide inert gas for the weld period at workpiece, equipment comprises: at least one groove in device bottom, for placing at least one edge of the solder accumulator wherein including slicken solder; At least one opening on equipment top surface, at least one solder wave sent from solder accumulator passes through via this at least one opening and contacts workpiece; And one or more diffuser tube, it comprises the one or more openings be connected that to circulate with inert gas source; Wherein apparatus arrangement is above solder accumulator and by below soldered workpiece, thus forms atmosphere, and wherein substantially there is not gap by between soldered workpiece and the tip of at least one solder wave.In a particular embodiment, equipment comprises the disposable porous sheath at least partially of the length of at least one diffuser tube in this one or more diffuser tube further.In certain embodiments, in one or more diffuser tube by porous sheath around at least one be attached to the lower surface of equipment, be in thus in the atmosphere above solder accumulator.In same or other embodiment, optional cover is arranged in equipment top, and workpiece is advanced by lid, and wherein this lid comprises the air vent be communicated with ventilating system further.
On the other hand, provide a kind of for providing the method for inert gas atmosphere during the wave-soldering of workpiece, comprise: wave soldering machines is provided, comprising: wherein contain the solder accumulator of slicken solder, at least one nozzle, at least one pump to produce from slicken solder bath up via at least one solder wave of nozzle, by the top of apparatus arrangement at least one edge of solder accumulator mouth, wherein equipment comprises at least one opening on upper surface, be at least one groove on the top at least one edge of solder accumulator, and comprise one or more diffuser tubes of the one or more openings be connected that to circulate with inert gas source, the length of one of wherein one or more diffuser tubes at least partially by disposable porous sheath around, and wherein soldered workpiece and equipment upper surface are defined atmosphere, and wherein substantially there is not space by between soldered workpiece and the tip of at least one solder wave, along path transferring work piece, what make workpiece contacts at least one solder wave that the opening via equipment sends at least partially, and make inert gas by diffuser tube and enter atmosphere.In a particular embodiment, one or more diffuser tube by disposable porous sheath around at least one diffuser tube be attached to the lower surface of equipment, it is in the atmosphere above solder accumulator thus.
Accompanying drawing explanation
Fig. 1 provides the isometric projection view of the embodiment of the diffuser tube comprising micropore described herein or antipriming pipe.
Fig. 2 a to 2f provides bottom view and the sectional view of the embodiment of diffuser tube described herein, and wherein micropore has the form of a line or multirow cannelure.
Fig. 3 a provides the side view of an embodiment of diffuser assembly described herein, and it comprises the protectiveness porous sheath at least partially of diffuser tube and the length around diffuser tube.
Fig. 3 b provides the sectional view of the diffuser assembly shown in Fig. 3 a.
Fig. 4 a provides the top view of an embodiment of equipment described herein.
Fig. 4 b provides the top view of another embodiment of equipment described herein.
Fig. 5 provides the isometric projection view of the embodiment of the equipment shown in Fig. 4 a.
Fig. 6 provides the isometric projection view of the optional lid that can be arranged on moving track top.
Fig. 7 provides the isometric projection view of the embodiment of equipment described herein.
Fig. 8 provides the isometric projection view of the embodiment shown in Fig. 7, it comprises multiple diffuser tube (shown in dotted line) further, and at least one wherein in multiple diffuser tube comprises the porous sheath at least partially of the length around diffuser tube further.
Fig. 9 provides the side view of the embodiment of the equipment for N2 deactivation described herein.
Figure 10 provides the side view of the embodiment of the equipment for N2 deactivation described herein.
Detailed description of the invention
At least one or more target of the prior art is realized by the method and apparatus for carrying out deactivation protection at weld period described herein.Equipment described herein and method provide the deactivation protection of weld period, especially for these embodiments that the wherein remarkable movement of the solder of the weld period of the workpiece of such as printed circuit board (PCB) and so on and the oxidation increased on rotation and its surface may occur.Can be expected that, equipment described herein and method can be used to such as re-construct existing wave soldering machines.In a particular embodiment, equipment described herein to be placed on above solder accumulator and in operation at moving track or for transmitting below other transmission mechanism by soldered workpiece.In a particular embodiment, by substantially very close to each other between soldered workpiece and the tip of at least one solder wave.In other embodiments, gap is had by between soldered workpiece and the tip of at least one solder wave.One or more diffuser tube in equipment and such as nitrogen, inert gas are (such as, helium, neon, argon gas, Krypton, xenon and combination thereof), forming gas (such as, the mixture of nitrogen and hydrogen, comprise the hydrogen up to 5% or less weight) or the inert gas source circulation of its combination and so on connect, to provide deactivation atmosphere.A target of equipment described herein and method is oxygen (O in the atmosphere defined on the surface of the slicken solder comprised in the surface of soldered workpiece and solder accumulator
2) concentration that reduces, such as but not limited to 2500/1000000ths (ppm) or less.
Equipment described herein and method are placed on the solder accumulator top of the slicken solder comprising the fusing point remaining on or exceed (such as, high 50 DEG C) solder by plan.Equipment described herein has the inner space arranging solder accumulator, be defined in thus the moving track above solder accumulator transmits along direction by the atmosphere between soldered workpiece and slicken solder surface.In a particular embodiment, workpiece is moved track or transmission refers to support in side margins, and protrudes through solder wave.In other embodiments, workpiece is supported on when being passed through wave soldering machines on pallet, fixture or frame.Have one or more nozzle in solder accumulator, it sprays the one or more solder waves produced by solder pump.Solder pump is generally variable speed pump, and it allows terminal use to control the solder stream from solder wave and raises or reduce the tip of solder wave or summit to adapt to process conditions.One or more solder wave by the one or more openings contact in the upper surface of equipment described herein to the surface by soldered workpiece.During this process, equipment comprises and having and such as N
2and so on inert gas source circulation connect one or more openings, through hole, groove, perforation or micropore one or more diffuser tubes, inert gas source is by the inner space of pipe and enter atmosphere via the opening of pipe or micropore.When so doing, side under the surface, the leading edge of workpiece, back edge and lateral edges are covered by inert gas by during solder wave equably at workpiece.
In the specific embodiment of equipment described herein and method, the size being arranged in the equipment on solder accumulator top is minimized, to strengthen the deactivation efficiency near mobile solder wave.In this embodiment or other embodiment, the region of the footprint outside of the equipment in static slicken solder surface or solder accumulator can be coated with the high-temperature material of the temperature can standing the slicken solder comprised in solder accumulator.
Equipment described herein and method comprise one or more diffuser tube, it comprises inner space and one or more opening, opening can be but be not limited to allow nitrogen and/or other inert gas enter pipe inner space and by tube opening micropore out, hole, groove, pore, through hole, perforation or alternate manner.Opening can be arranged to one or more row, can stagger, or can have other regular or random layout arbitrarily.Opening can have the size of any appropriate to provide enough inert gas flows, and their size can change according to various factors (comprise the flow velocity of inert gas, by by the size etc. of the size of the inner space of deactivation and diffuser tube).In a particular embodiment, pipe is porous, and comprises about 0.05 to the mean pore size of about 0.5 micron (μm) (preferably about 0.2 micron), to provide from antipriming pipe deactivation out or N
2the laminar flow of gas.In another embodiment, pipe comprises one or more and emissions groove, to provide from diffuser tube deactivation out or N
2the laminar flow of gas.Such as, opening can be arranged to a line along the bottom of diffuser tube, and the inert gas flowed out from opening thus is down directed to the upper surface of the solder solder accumulator.In another embodiment, opening can be arranged to two the parallel row departing from about 0 to 45 ° (or departing from about 30 ° in each direction) with the bottom center line of diffuser in each direction, it is outwards guided downwards thus at inert gas from the atmosphere above diffuser tube flows into the slicken solder solder accumulator.In this embodiment, the row of opening can be spaced about 30 ° to about 120 °, or about 60 ° or about 90 °.In a particular embodiment, opening can be each length be about 0.3 to about 1.5mm(preferably length be about 0.5 to about 1.0mm) groove.Groove can separate about 0.5 to about 5mm(preferably about 1mm).
In these or other embodiment, pipe circulates with inert gas source and is connected, and inert gas source provides such as N by the inner space of pipe
2and so on inert gas, and the region that the surface being provided to the slicken solder in accumulator by opening or the micropore of pipe and the workpiece that transmits define.May be changed by the air-flow of diffuser tube described herein, but usually be in about 0.5 to about 8m
3the scope of/hr.
As previously described, equipment described herein comprises the housing comprising inner space, arranges one or more diffuser tube in inner space.In a particular embodiment, solder accumulator enter plate side, solder accumulator workpiece outlet side, vertical with solder wave line of propagation or its combine, pipe can be between multiple solder wave.In these embodiments, substantially there is not gap by between the surface of soldered workpiece and the surface of solder wave.In a particular embodiment, such as, exist between multiple solder wave wherein in these embodiments of one or more pipe, one or more pipe can comprise one or more disposable porous sheath at least partially around the length of diffuser tube or pipe further.Sheath can by sheath in the normal operation period by slicken solder and/or flux remain cover or blocking time can realize the periodic, simple of sheath and any harmless (that is, meeting ROHS) material suitably that cost effectively removes and replaces is made.Such as, sheath only can comprise fibrous glass or the fibrous glass shaped material of braiding, or comprises itself and other component.In these or other embodiment, selected sheath material should in Lead free wave sodering technique at normally used slicken solder temperature (such as, up to about 260 DEG C) or on keep its integrality.In a particular embodiment, porous sheath around one or more diffuser tubes at least one be attached to the lower surface of equipment, make thus in its atmosphere be in above solder accumulator.Use the next length around diffuser tube of one or more disposable porous sheath at least partially, can diffuser tube be protected and avoid solder spatter in prior art, submergence and/or make diffuser tube contact relevant problem with solder bath.Comprise central diffuser tube and one or more sidepiece diffuser tube in a particular embodiment, only central diffuser tube as described herein like that at least in part by porous sheath around.In an alternate embodiment, central diffuser and one or more sidepiece diffuser as described herein like that at least in part by porous sheath around.
In a specific embodiment of equipment described herein and method, one or more (the central diffuser tube such as but not limited between multiple solder wave) in multiple diffuser tube and/or can non-sticking lining be comprised around one or more protectiveness sheaths at least partially of this diffuser tube.The example of non-sticking lining is polytetrafluoroethylene (PTFE) (PTFE) coating, can from trade mark
non-sticking lining (Teflon is manufactured by the DuPont company in Wilmington, DE city) find polytetrafluorethylecoatings coatings.In these or other embodiment, selected non-sticking lining should keep its integrality at normally used slicken solder temperature (such as, up to about 260 DEG C) or more in Lead free wave sodering technique.In embodiment more specifically, non-sticking lining is made up of Thermolon non-sticking lining, inorganic (based on mineral products) coating, and this inorganic coating is manufactured by Thermolon company of Korea S and can keep its integrality at 450 DEG C and avoid producing toxic vapours at elevated temperatures.Exist in the embodiment of central antipriming pipe between one or more pairs of welding ripple wherein, due to the lasting dynamic mobile of slicken solder, the flux of the dissolving in solder accumulator directly can contact the central diffuser face be between first and second ripples.When the liquid flux on diffuser face evaporated or thermal decomposition time, Solid Fluxes is residual can be stayed on diffuser face, therefore makes diffuser block.In order to repair this, non-sticking lining or porous sleeve or sheath or the slotted metal shell being coated with non-sticking lining can be provided to diffuser tube, or can cover diffuser tube at least partially.Believe that the slotted metal shell adding non-sticking lining or porous sheath at least one in porous air diffuser pipe or be coated with non-sticking lining can prevent the antipriming pipe of such as mesotube and so on by the residual blocking of flux.Non-sticking lining also can be provided to the inner surface of equipment at least partially or the inner surface of top cover, easily to clean.
In the another embodiment of equipment described herein and method, equipment comprises the optional lid be arranged on moving track further, to form the passage that workpiece can be allowed to pass therethrough.Optional lid comprises passage further, and this passage circulates with the exhaust apparatus can collecting the wave soldering machines of flux steam from the atmosphere covering and is connected.In one embodiment, optional lid is made up of the single-layer metal lid with the medium pore be connected that to circulate with the exhaust apparatus of machine.In another embodiment, optional lid is made up of double-level-metal plate, and two layer of space is connected to heater exhaust device, therefore forms boundary gas trap.In a specific embodiment, the distance between double layer of metal thin plate can be in about 1/8 " to about 1/4 " scope in.When workpiece or circuit board pass through from lid below, the flux steam that welding region inside produces is collected by bound trap, and solder accumulator ambient air also can be trapped in two layer of space simultaneously, thus guarantees good deactivation performance.For the situation that there is not workpiece or circuit board at solder accumulator top, the inert gas produced from the multiple diffusers deactivation equipment can be inhaled in the space under the two layer of space of lid, form border inert gas curtain thus, to make the air entering this space minimum.
Fig. 1 provides an embodiment of antipriming pipe or the diffuser used in equipment described herein and method.Antipriming pipe 10 is depicted as cylindrical tube, it has and allows the air-flow of the inert gas of such as nitrogen and/or other (such as but not limited to inert gas (such as, argon gas, helium, neon etc.), hydrogen and combination thereof) and so on to flow therethrough and to circulate the inner space 15 be connected with inert gas source (not shown).In an embodiment of antipriming pipe 10, antipriming pipe is made up of stainless steel.But, also can apply other material for antipriming pipe 10, as long as material does not react with solder material.Antipriming pipe 10 is circulated with inert gas source by gas conduit or other device (not shown) and is connected.Antipriming pipe 10 comprises further and allows air-flow to enter via perforation 20 from inner space 15 to bathe multiple perforation 20 of atmosphere, micropore, groove or hole by the surface of slicken solder (not shown) and the weldering that defined the downside of soldered workpiece (not shown), or their combination.Although antipriming pipe 10 is shown as cylindrical and has circular cross-section, it should be understood that and can adopt other geometry, such as but not limited to annular, square, rectangle, ellipse etc.
Perforation 20 is designed such that such as to utilize the circular port shown in the embodiment of Fig. 1 straitly to guide air-flow, and makes it distribute in the whole length of welding accumulator (not shown).In another embodiment, perforation 20 can be longitudinal hole or groove.In these or other embodiment, angle can be cut sth. askew or have to perforation 20 further air-flow to be guided to weldering bath atmosphere (not shown) and/or the gap between solder bath and workpiece from inner space 15.The average-size of perforation 20 can be in the scope of 0.05 micron to 100 microns or 0.1 to 10 micron or 0.2 to 5.0 micron.The hole dimension of the perforation on antipriming pipe 10 and porous are optimized to from antipriming pipe gas N out
2laminar flow pressurization.In these or other embodiment, minimum for the air made from being entered by the border of the welding region of deactivation (such as, workpiece, conveyer belt etc.), N
2and/or the laminar flow of other inert gas is preferred.
Fig. 2 a, b, c, d, e and f further illustrate diffuser configuration, and its middle punch 20 has the form of a row or multi-row longitudinal hole or groove.The diagram that the mode that Fig. 2 a-f looks up diffuser tube 10 according to the direction from solder accumulator (not shown, Fig. 2 a, 2c and 2e) provides and illustrate such configuration from the diagram that the mode of diffuser tube 10 (Fig. 2 b, 2d and 2f) viewed from end provides.As shown in Fig. 2 a and b, perforation 20 is arranged to straight line along the bottom center line of diffuser tube 10.In the alternative embodiment shown in Fig. 2 c and d, in two row that the bottom center line that perforation 20 is disposed in diffuser tube 10 becomes 60 ° to locate.In another embodiment shown in Fig. 2 e and f, perforation 20 is arranged in three row, and wherein often row is spaced equal, between outmost two row and 90 °, the center line interval, bottom of diffuser tube 10.
In some embodiments of the invention; in described one or more diffuser tube at least one; such as but not limited to the central diffuser tube between multiple solder wave, protectiveness shell at least partially or the sheath of the length enclosing diffuser tube can be comprised further.Fig. 3 a (side view) and Fig. 3 b (sectional view) provides the example of this embodiment.In this embodiment, diffuser tube 10 has one or more groove 20, and its most of length is all surrounded by same sheath shaft 25.Diffuser tube 10 and sheath 25 jointly form diffuser assembly 55.Sheath 25 is porous, allows inert gas thus from the perforation 20 diffuser 10 by sheath 25, and out to enter inert atmosphere.Believe that the use of this protectiveness sheath can make liquid solder or flux remain to enter diffuser tube 10 and to block the chance of one or more opening 20 minimum.Although liquid solder or flux are residual may pollute sheath 25, it is originally disposable and occurring easily periodically remove and replace when polluting that sheath is designed to.Thus, non-flammable material suitable arbitrarily all can be used to form sheath, supposes that such material can bear required operating temperature (such as up to about 600 DEG C) and allow simple cost described herein effectively remove and replace.In a particular embodiment, sheath 25 is formed by the material of the fiber glass ends comprising braiding, makes the porous of textile material enough large to allow inert gas from diffuser tube 10 via sheath 25 out and enter the smooth flow of inert atmosphere thus.The inside diameter of sheath 25 should be selected based on the outer dia of diffuser tube 10, makes the flowing that can not hinder inert gas thus.Such as, diffuser tube has in an embodiment of the outer dia of about 9.5mm wherein, and sheath can have the inside diameter of about 10mm.And sheath 25 remains on appropriate location by any appropriate ways or is attached to diffuser tube 10.In one or more embodiments, sheath 25 is attached to diffuser tube 10 by (not shown) such as one or more Huantiao, clasp, locking ring, paper clip, clip, hooks.Although diffuser tube 10 and sheath 25 are shown as cylindrical and have circular cross-section, it should be understood that and can adopt other geometry, such as but not limited to annular, square, rectangle, ellipse etc.
Fig. 4 a and 4b provides the top view of the embodiment of equipment 30 described herein.With reference to figure 4a, equipment 30 is placed on Wave soldering apparatus 70 to provide inert gas atmosphere during wave-soldering operation.Wave soldering apparatus 70 comprises solder accumulator 75 containing slicken solder 80 and one or more nozzle 85, and it sends the one or more solder wave (not shown) produced by solder pump (not shown).With reference to figure 4a and 4b, equipment 30 has the upper surface 35 that can remove from equipment remainder, makes waste material remove thus for terminal use, becomes relatively simple.Upper surface 35 comprises at least one opening 40 further, and at least one solder wave that the slicken solder 80 comprised from solder accumulator 75 sends also contacts the workpiece passed through along moving track (not shown) by nozzle 85 via this opening 40.With reference to figure 4a and 4b, equipment 30 comprises at least one groove 45 (as shown in the dotted line in Fig. 4 a) on bottom equipment 30 further, and it is in the top, edge of solder accumulator 75.In a particular embodiment, equipment 30 can comprise more than one groove, allows the top of place apparatus 30 to solder accumulator 75, as shown in Figs. 4a and 4b.Other embodiment of equipment described herein has an only groove 45, such as, embodiment shown in Fig. 7 to 9.Another embodiment again of equipment described herein does not have one or more groove, but has multiple flange and be arranged or be placed on solder accumulator, shown in embodiment as shown in Figure 10 with permission equipment.Refer again to Fig. 4 a and 4b, diffuser assembly 55 to circulate with inert gas source 65 via pipeline 60 and is connected.As previously described, the inert gas that equipment described herein and method use can comprise nitrogen, hydrogen, inert gas (such as helium, argon gas, neon, Krypton, xenon etc.) and combination thereof.In a particular embodiment, inert gas is preheated before being introduced into diffuser assembly 55.It should be understood that the embodiment shown in Fig. 4 a and 4b can change according to the configuration of wave soldering machines.Such as, although Fig. 4 a depicts is positioned to provide with diffuser assembly 55, Fig. 4 b of the width parallel of solder wave the top view that wherein diffuser assembly 55 is oriented to the embodiment of the described herein equipment 30 vertical with the width of solder wave.In these and other embodiment, diffuser assembly can be attached to the lower surface of equipment 30.Diffuser assembly 55 can be attached to equipment 30 to locate arbitrarily and to pass through suitable means for attachment (such as by screw, nut, latch, paper clip, clip, hook etc.) arbitrarily.
Fig. 5 provides the isometric projection view of the embodiment of the equipment 30 that literary composition describes.As shown in Figure 5, equipment 30 comprises the inner space 69 that slicken solder surface (not shown), workpiece (not shown), antetheca 33, rear wall 37 and sidewall 43 and 47 defines further.
Fig. 6 provides the isometric projection view of optional lid 90, and it is arranged in the top of the moving track (not shown) that equipment 30 and workpiece transmit via it.Optional lid 90 is shown as the glass window 95 having and can for check.Optional lid 90 also has the air vent 97 be connected that to circulate with the exhaust apparatus (not shown) of wave soldering machines, to remove any flux steam in the atmosphere of welding bench.
Fig. 7 and 8 provides the alternative embodiment of equipment 230, wherein only there is the groove 245 be positioned on the edge of solder accumulator (not shown).At least one of the sidewall of groove 245 defines cavity 250 with the antetheca 233 of equipment 230, and it comprises diffuser tube 210 (as shown in phantom in fig).Equipment 230 comprises the inner space 269 that slicken solder surface (not shown), workpiece (not shown), antetheca 233, rear wall 237 and sidewall 243 and 247 defines further.With reference to figure 8, equipment 230 comprises at least one diffuser assembly 255 (shown in dotted line) of the lower surface of the equipment of being attached to 230 further.
Fig. 9 and 10 provides the various embodiments of equipment described herein, and it comprises multiple porous air diffuser pipe and/or diffuser assembly.Fig. 9 provides an embodiment; the solder accumulator 375 that one of them diffuser tube 310 is positioned at chamber 350 is outside; diffuser assembly 355 ' between solder wave comprises the diffuser tube at least partially that protected property porous sheath (not illustrating separately) has encased its length, and the second diffuser assembly 355 ' ' on the lower surface that is attached to equipment 330 or wall.Equipment 330 also comprises flange 367, for auxiliarily equipment 330 being placed to the top of solder accumulator 375.
Figure 10 provides an embodiment; wherein the first diffuser assembly 555, second diffuser assembly 555 ' and the 3rd diffuser assembly 555 " be positioned at the inert atmosphere of solder accumulator 575, and also each diffuser assembly comprises the diffuser tube at least partially that protected property porous sheath (not illustrating separately) has encased its length.Equipment 530 does not have the top that equipment is positioned to solder accumulator 575 by groove.On the contrary, equipment 530 has multiple flange 567 is disposed in solder accumulator 575 top with permission equipment 530.
Other advantage of apparatus and method according to the invention including reduced manufacture and material cost, the solder quality of connection of improvement and the conversion to Lead-Free Soldering Technology of simplification.Consider manufacture and material cost, observed the minimizing of the 20-40% that solder consumes, the minimizing of 40-90% that waste material is formed, the minimizing of 10-30% that flux consumes and the 70-80% of plant maintenance minimizing, and the lower cost of prebox plate cleaning, the board defect of minimizing and reprocessing and higher production run time.Other advantage of equipment described herein is, they easily can scale up and reduce, and can be configured to meet the solder tank with various different size.
More than define various term.For above undefined use term in the claims, defining the most widely given by term that those of ordinary skill in the art reflect in the patent of at least one printed publication or publication should be given.And all patents quoted in the application, test program and other document are incorporated to herein by application completely, make for the disclosure all authorities wherein allowing this merging not inconsistent with the application.
The lower limit of the upper limit of one group of numerical value and one group of numerical value has been adopted to describe specific embodiments of the invention and feature.For the purpose of clear, only specifically disclose concrete scope at this.It should be understood, however, that the scope can conceived from any lower limit to any upper limit, the meaning contrary unless otherwise explicitly indicated.Similarly, the scope from any lower limit can enumerate with other lower values any the scope clearly do not enumerated, and the scope from any upper limit can combine to enumerate the scope clearly do not enumerated with other upper limit any.In addition, scope comprises each point between its end points or is worth separately, even without clearly enumerating.Therefore, each point or separately value can be used as its oneself lower limit or the upper limit and other is put or independent value or other lower limit or the upper limit combine, to enumerate the scope clearly do not enumerated arbitrarily arbitrarily.All numerical value is the value that " approximately " or " being similar to " represents, and considers experience error and change that those of ordinary skill in the art can expect.
Although disclosed embodiments of the invention and and alternative embodiment, those of ordinary skill in the art can envision without departing from the spirit and scope of the present invention from various change of the present invention, amendment and replacement.The present invention is only limited by the statement of claims.
Claims (10)
1., for providing an equipment for inert gas at the weld period of workpiece, described equipment comprises:
At least one groove in device bottom, for placing at least one edge of the solder accumulator wherein including slicken solder;
At least one opening on equipment top surface, at least one solder wave sent from solder accumulator passes through via this at least one opening and contacts workpiece; And
One or more diffuser tube, it comprises one or more porous sheaths at least partially of one or more opening of circulating with inert gas source and being connected and the length around at least one diffuser tube in this one or more diffuser tube, wherein each diffuser tube and around porous sheath jointly comprise diffuser assembly;
Wherein apparatus arrangement is above solder accumulator and by below soldered workpiece, thus forms atmosphere, and wherein substantially there is not gap by between soldered workpiece and the tip of at least one solder wave.
2. equipment according to claim 1, wherein porous sheath comprises braided material.
3. equipment according to claim 2, wherein at least one diffuser assembly is in the nearside of at least one solder wave.
4. equipment according to claim 1, comprises lid further, and its top being arranged in moving track passes therethrough to make workpiece, and wherein this lid comprises the air vent be communicated with ventilating system further.
5. equipment according to claim 4, wherein this lid comprises the multiple thin plates defining inner space, and wherein circulate with the exhaust apparatus of soldering furnace and be connected in inner space.
6. equipment according to claim 5, wherein this lid comprises the entrance be connected that to circulate with inert gas source further.
7. equipment according to claim 1, the opening wherein in diffuser tube is arranged to length one or more along diffuser tube and the cannelure of seniority among brothers and sisters.
8. equipment according to claim 1, wherein at least one diffuser assembly is attached to the lower surface of equipment.
9. equipment according to claim 1, wherein solder accumulator produces multiple solder wave, and at least one diffuser assembly is inserted between solder wave.
10. equipment according to claim 1, wherein inert gas comprises nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420056872.5U CN204148684U (en) | 2014-01-29 | 2014-01-29 | For providing the equipment of inert gas at the weld period of workpiece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420056872.5U CN204148684U (en) | 2014-01-29 | 2014-01-29 | For providing the equipment of inert gas at the weld period of workpiece |
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| CN204148684U true CN204148684U (en) | 2015-02-11 |
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| CN201420056872.5U Expired - Lifetime CN204148684U (en) | 2014-01-29 | 2014-01-29 | For providing the equipment of inert gas at the weld period of workpiece |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801809A (en) * | 2014-01-29 | 2015-07-29 | 气体产品与化学公司 | Device and method for providing inert gas during welding |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801809A (en) * | 2014-01-29 | 2015-07-29 | 气体产品与化学公司 | Device and method for providing inert gas during welding |
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