TWI400440B - 異物檢查裝置 - Google Patents

異物檢查裝置 Download PDF

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Publication number
TWI400440B
TWI400440B TW097113962A TW97113962A TWI400440B TW I400440 B TWI400440 B TW I400440B TW 097113962 A TW097113962 A TW 097113962A TW 97113962 A TW97113962 A TW 97113962A TW I400440 B TWI400440 B TW I400440B
Authority
TW
Taiwan
Prior art keywords
foreign matter
inspected
unit
light
illumination
Prior art date
Application number
TW097113962A
Other languages
English (en)
Chinese (zh)
Other versions
TW200907325A (en
Inventor
見留範行
Original Assignee
佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佳能股份有限公司 filed Critical 佳能股份有限公司
Publication of TW200907325A publication Critical patent/TW200907325A/zh
Application granted granted Critical
Publication of TWI400440B publication Critical patent/TWI400440B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW097113962A 2007-04-20 2008-04-17 異物檢查裝置 TWI400440B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007111934A JP5063173B2 (ja) 2007-04-20 2007-04-20 異物検査装置

Publications (2)

Publication Number Publication Date
TW200907325A TW200907325A (en) 2009-02-16
TWI400440B true TWI400440B (zh) 2013-07-01

Family

ID=39871851

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097113962A TWI400440B (zh) 2007-04-20 2008-04-17 異物檢查裝置

Country Status (4)

Country Link
US (2) US7733471B2 (cg-RX-API-DMAC10.html)
JP (1) JP5063173B2 (cg-RX-API-DMAC10.html)
KR (1) KR101017510B1 (cg-RX-API-DMAC10.html)
TW (1) TWI400440B (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010032265A (ja) * 2008-07-25 2010-02-12 Canon Inc 異物検査装置、露光装置及びデバイス製造方法
NL2003263A (en) * 2008-08-20 2010-03-10 Asml Holding Nv Particle detection on an object surface.
KR20110061287A (ko) * 2009-12-01 2011-06-09 삼성모바일디스플레이주식회사 표면 검사장치, 이를 이용한 표면 검사방법 및 이를 구비하는 슬릿 코터
KR101330098B1 (ko) * 2012-05-10 2013-11-18 동우 화인켐 주식회사 광학 필름의 결함 판별 방법
US10156527B2 (en) * 2014-04-24 2018-12-18 Asml Holding N.V. Compact two-sided reticle inspection system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0743312A (ja) * 1993-07-29 1995-02-14 Canon Inc 表面状態検査装置及び該装置を備える露光装置
US5623340A (en) * 1994-02-22 1997-04-22 Nikon Corporation Foreign particle inspection apparatus
US20040145735A1 (en) * 2003-01-29 2004-07-29 Yeda Research And Development Company Ltd. Coherently controlled nonlinear Raman spectroscopy and microscopy

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5982727A (ja) * 1982-11-04 1984-05-12 Hitachi Ltd 異物検出方法及びその装置
US4889998A (en) 1987-01-29 1989-12-26 Nikon Corporation Apparatus with four light detectors for checking surface of mask with pellicle
JP3432273B2 (ja) * 1993-04-19 2003-08-04 株式会社東芝 異物検査装置及び異物検査方法
JP3253177B2 (ja) 1993-06-15 2002-02-04 キヤノン株式会社 表面状態検査装置
US5581348A (en) 1993-07-29 1996-12-03 Canon Kabushiki Kaisha Surface inspecting device using bisected multi-mode laser beam and system having the same
JP3878107B2 (ja) * 2002-11-06 2007-02-07 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0743312A (ja) * 1993-07-29 1995-02-14 Canon Inc 表面状態検査装置及び該装置を備える露光装置
US5623340A (en) * 1994-02-22 1997-04-22 Nikon Corporation Foreign particle inspection apparatus
US20040145735A1 (en) * 2003-01-29 2004-07-29 Yeda Research And Development Company Ltd. Coherently controlled nonlinear Raman spectroscopy and microscopy

Also Published As

Publication number Publication date
US7986403B2 (en) 2011-07-26
KR101017510B1 (ko) 2011-02-25
US20080259319A1 (en) 2008-10-23
JP2008268011A (ja) 2008-11-06
TW200907325A (en) 2009-02-16
JP5063173B2 (ja) 2012-10-31
US20100238434A1 (en) 2010-09-23
US7733471B2 (en) 2010-06-08
KR20080094581A (ko) 2008-10-23

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MM4A Annulment or lapse of patent due to non-payment of fees