JP2008268011A - 異物検査装置 - Google Patents
異物検査装置 Download PDFInfo
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- JP2008268011A JP2008268011A JP2007111934A JP2007111934A JP2008268011A JP 2008268011 A JP2008268011 A JP 2008268011A JP 2007111934 A JP2007111934 A JP 2007111934A JP 2007111934 A JP2007111934 A JP 2007111934A JP 2008268011 A JP2008268011 A JP 2008268011A
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- inspected
- foreign matter
- light
- reticle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
【解決手段】 被検査面(1a)に照射光を斜入射させる照射手段(4)と、前記被検査面に対して前記照射手段と同じ側に配置された、前記被検査面上の異物で生じる散乱光を検出する第1,第2の検出手段(8,9)と、を備え、前記第1,第2の検出手段は、前記照射手段の照射光の入射面に関して互いに逆側に配置されていることを特徴とする構成とした。
【選択図】 図1
Description
図1(A)、(B)に、第1の実施形態の異物検査装置を示す。
図6(A)、(B)に、本発明の第2の実施形態の異物検査装置を示す。
1b、1c、1d レチクル側面
2 ペリクル枠
3 異物
5 照明領域
10 光学系全体ユニット
20 偏光方向
41 半導体レーザー
42 コリメータレンズ
43 λ/2板
71、81、91 結像レンズ
72、82、92 ラインセンサー
101 回路パターン領域
102、104 回路パターン
103L、103R、105、106 パターン回折光
Claims (8)
- 被検査面に照射光を斜入射させる照射手段と、
前記被検査面に対して前記照射手段と同じ側に配置された、前記被検査面上の異物で生じる散乱光を検出する第1,第2の検出手段と、を備え、
前記第1,第2の検出手段は、前記照射手段の照射光の入射面に関して互いに反対側に配置されていることを特徴とする異物検査装置。 - 前記照射手段は、前記照射光として直線偏光光を前記被検査面に入射させ、
前記照射手段は、前記被検査面に入射させる直線偏光光の偏光方向を変更する変更手段を有することを特徴とする請求項1記載の異物検査装置。 - 前記第1の検出手段と前記第2の検出手段とは、切り換えて使用されることを特徴とする請求項1記載の異物検査装置。
- 前記第1の検出手段と前記第2の検出手段とは、切り換えて使用され、
前記変更手段は、前記第1の検出手段と前記第2の検出手段との切り換えに応じて、前記被検査面に入射させる直線偏光光の偏光方向を変更することを特徴とする請求項2記載の異物検査装置。 - 前記照射手段、前記第1の検出手段、および前記第2の検出手段を一体として前記被検面に対して相対的に往復駆動することで、その被検査面を前記照射光で第1方向とその第1方向と逆方向である第2方向とにスキャンし、
前記第1方向へのスキャンの際には、前記第1の検出手段で前記散乱光を検出し、
前記第2方向へのスキャンの際には、前記第2の検出手段で前記散乱光を検出し、
前記第1方向へのスキャンの際と前記第2方向へのスキャンの際とで、前記被検査面に入射させる直線偏光光の偏光方向を変更することを特徴とする請求項4記載の異物検査装置。 - 前記被検査面は、パターンを持つレチクルの表面であり、
前記照射手段は、前記被検査面上に直線状の照明領域を形成し、その直線状の照明領域は前記レチクルの側面に対して傾いていることを特徴とする請求項1記載の異物検査装置。 - 前記第1,第2の検出手段の検査結果を比較することで、最終的な検査結果を得ることを特徴とする請求項1乃至6のいずれか1項記載の異物検査装置。
- 前記被検査面の座標毎に前記第1,第2の検出手段の検査結果を比較し、検出された粒子サイズのうち小さい方を最終的な検査結果として採用することを特徴とする請求項7記載の異物検査装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007111934A JP5063173B2 (ja) | 2007-04-20 | 2007-04-20 | 異物検査装置 |
US12/105,194 US7733471B2 (en) | 2007-04-20 | 2008-04-17 | Foreign substance inspection apparatus |
TW097113962A TWI400440B (zh) | 2007-04-20 | 2008-04-17 | 異物檢查裝置 |
KR1020080035407A KR101017510B1 (ko) | 2007-04-20 | 2008-04-17 | 이물검사장치 |
US12/790,614 US7986403B2 (en) | 2007-04-20 | 2010-05-28 | Foreign substance inspection apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007111934A JP5063173B2 (ja) | 2007-04-20 | 2007-04-20 | 異物検査装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008268011A true JP2008268011A (ja) | 2008-11-06 |
JP2008268011A5 JP2008268011A5 (ja) | 2010-06-03 |
JP5063173B2 JP5063173B2 (ja) | 2012-10-31 |
Family
ID=39871851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007111934A Active JP5063173B2 (ja) | 2007-04-20 | 2007-04-20 | 異物検査装置 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7733471B2 (ja) |
JP (1) | JP5063173B2 (ja) |
KR (1) | KR101017510B1 (ja) |
TW (1) | TWI400440B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010049250A (ja) * | 2008-08-20 | 2010-03-04 | Asml Holding Nv | オブジェクト表面上における粒子検出 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010032265A (ja) * | 2008-07-25 | 2010-02-12 | Canon Inc | 異物検査装置、露光装置及びデバイス製造方法 |
KR20110061287A (ko) | 2009-12-01 | 2011-06-09 | 삼성모바일디스플레이주식회사 | 표면 검사장치, 이를 이용한 표면 검사방법 및 이를 구비하는 슬릿 코터 |
KR101330098B1 (ko) * | 2012-05-10 | 2013-11-18 | 동우 화인켐 주식회사 | 광학 필름의 결함 판별 방법 |
US10156527B2 (en) * | 2014-04-24 | 2018-12-18 | Asml Holding N.V. | Compact two-sided reticle inspection system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5982727A (ja) * | 1982-11-04 | 1984-05-12 | Hitachi Ltd | 異物検出方法及びその装置 |
JPH07146245A (ja) * | 1993-04-19 | 1995-06-06 | Toshiba Corp | 異物検査装置及び異物検査方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4889998A (en) * | 1987-01-29 | 1989-12-26 | Nikon Corporation | Apparatus with four light detectors for checking surface of mask with pellicle |
JP3253177B2 (ja) * | 1993-06-15 | 2002-02-04 | キヤノン株式会社 | 表面状態検査装置 |
JP2962972B2 (ja) * | 1993-07-29 | 1999-10-12 | キヤノン株式会社 | 表面状態検査装置及び該装置を備える露光装置 |
US5581348A (en) * | 1993-07-29 | 1996-12-03 | Canon Kabushiki Kaisha | Surface inspecting device using bisected multi-mode laser beam and system having the same |
JPH07229844A (ja) * | 1994-02-22 | 1995-08-29 | Nikon Corp | 異物検査装置 |
JP3878107B2 (ja) * | 2002-11-06 | 2007-02-07 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
US7256885B2 (en) * | 2003-01-29 | 2007-08-14 | Yeda Research And Development Company Ltd. | Coherently controlled nonlinear Raman spectroscopy and microscopy |
-
2007
- 2007-04-20 JP JP2007111934A patent/JP5063173B2/ja active Active
-
2008
- 2008-04-17 US US12/105,194 patent/US7733471B2/en not_active Expired - Fee Related
- 2008-04-17 TW TW097113962A patent/TWI400440B/zh active
- 2008-04-17 KR KR1020080035407A patent/KR101017510B1/ko active IP Right Grant
-
2010
- 2010-05-28 US US12/790,614 patent/US7986403B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5982727A (ja) * | 1982-11-04 | 1984-05-12 | Hitachi Ltd | 異物検出方法及びその装置 |
JPH07146245A (ja) * | 1993-04-19 | 1995-06-06 | Toshiba Corp | 異物検査装置及び異物検査方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010049250A (ja) * | 2008-08-20 | 2010-03-04 | Asml Holding Nv | オブジェクト表面上における粒子検出 |
Also Published As
Publication number | Publication date |
---|---|
TW200907325A (en) | 2009-02-16 |
US7733471B2 (en) | 2010-06-08 |
US7986403B2 (en) | 2011-07-26 |
JP5063173B2 (ja) | 2012-10-31 |
KR20080094581A (ko) | 2008-10-23 |
US20100238434A1 (en) | 2010-09-23 |
KR101017510B1 (ko) | 2011-02-25 |
US20080259319A1 (en) | 2008-10-23 |
TWI400440B (zh) | 2013-07-01 |
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