TWI399802B - A cleaning function panel and a cleaning method for a substrate processing apparatus using the same - Google Patents

Description

Cleaning panel and cleaning method using the same

The present invention relates to a panel having a cleaning function and a cleaning method of a substrate processing apparatus using the same.

In a substrate processing apparatus or the like that transports each of the transport systems in physical contact with the substrate, if a foreign matter adheres to the substrate or the transport system, the subsequent substrates are sequentially contaminated. Therefore, it is necessary to periodically stop the apparatus and perform the cleaning process, so that there is a problem that the operation rate is lowered and the labor is required to be extremely large. This is a particularly serious problem for products such as flat panel displays that have a very serious influence on the quality of foreign matter attached to them. In order to solve such a problem, there has been proposed a method of removing a foreign matter adhering to a substrate processing apparatus by transferring a substrate to which an adhesive substance is fixed in a substrate processing apparatus (for example, Japanese Laid-Open Patent Publication No. Hei 10-154686).

However, when an adhesive substance is used for the cleaning layer, if the adhesiveness is too high, there is a problem that the contact portion between the adhesive substance and the transfer system is strong and cannot be peeled off, resulting in a problem of poor conveyance. This is particularly problematic in the case where the adhesion to the substrate is high, particularly for a substrate adsorption platform or the like. Moreover, this problem becomes large as the area of the substrate increases.

[Patent Document 1] Japanese Patent Laid-Open No. Hei 10-154686

The present invention has been made in view of the above problems of the prior art, and an object thereof is to provide a panel having a cleaning function and a cleaning method using a substrate processing apparatus using the same, which is capable of collecting foreign matter and having good transportability.

The present inventors conducted intensive studies on the above problems, and as a result, found that by using a plurality of combinations of panels having a cleaning function with a specific adhesive member locally attached to the surface, it is possible to simultaneously possess foreign matter. Collective and good transportability.

However, it is known that, for example, in a substrate processing apparatus including a substrate suction stage of a vacuum chuck type, a small amount of unevenness of the cleaning member affects adsorption, and there is a case where the smoothness of collection and transportation of foreign matter is insufficient.

Therefore, as a result of further research by the present inventors, by attaching a non-adhesive or micro-adhesive member to a portion of the support to which the cleaning member is attached, the substrate adsorption platform can be well adsorbed, and the present invention is completed. invention. As a result, a wide variety of substrate processing apparatuses can be realized with both foreign matter trapping property and good transportability.

That is, the present invention provides a cleaning method, which is characterized in that it is a cleaning method of a substrate processing apparatus, and a panel having a cleaning function is passed through the substrate processing apparatus; the panel having a cleaning function includes: a support; cleaning The member is partially attached to at least one surface of the support body and has an adhesive force (the adhesion is based on the test method JIS Z0237, and the peeling speed of the mirror wafer is 300 mm/min, the peeling angle: 90 The condition of ° is measured to be 0.10 N/20 mm or more; and a non-adhesive or microadhesive member attached to the remaining portion of the surface to which the cleaning member is attached.

Moreover, the present invention provides, as another aspect, a panel having a cleaning function, comprising: a support; a cleaning member partially attached to at least one surface of the support, and an adhesive force (the adhesive force system) Using the test method JIS Z0237 as the standard, the 矽 mirror wafer is measured at a peeling speed of 300 mm/min and a peeling angle of 90°) of 0.10 N/20 mm or more; and a non-adhesive or micro-adhesive member is attached. Attached to the remaining portion of the surface to which the cleaning member is attached.

In a preferred aspect of the invention, the thickness of the non-adhesive or microadhesive member is from 90% to 110% of the thickness of the cleaning member.

In a preferred aspect of the present invention, the cleaning member and the non-adhesive or micro-adhesive member pass through the cleaning function panel in the traveling direction of the substrate processing device. The front end to the rear end are attached to the surface of the support.

In a preferred aspect of the present invention, the adhesion of the non-adhesive or micro-adhesive member is determined by the test method JIS Z0237, and the peeling speed of the mirror wafer is 300 mm/min. The angle: measured under the condition of 90° is 1/2 or less of the above-mentioned adhesive force of the cleaning member.

In a preferred aspect of the present invention, the panel having the cleaning function of the plurality of sheets passes through the substrate processing apparatus in such a manner that the combination of the passage paths of the cleaning members covers the entire area to be cleaned.

In a preferred aspect of the invention, the substrate processing apparatus includes a substrate adsorption platform.

As described above, according to the cleaning method of the present invention, it is possible to provide a panel having a cleaning function and a cleaning method using a substrate processing apparatus using the same, which is capable of collecting foreign matter and having good transportability.

Hereinafter, the present invention will be described in detail with reference to the drawings. Each of the drawings illustrates the present invention, and the dimensions and ratios of the members of the drawings are not identical to the actual objects, and the present invention is not limited thereto. Moreover, the elements shown in the figures are not essential elements of the invention.

[term]

In the present specification, the term "processing device" means a manufacturing device and an inspection device.

In the present specification, the term "passing through the substrate processing device" means passing through not only the entire substrate processing device but also a part of the substrate processing device.

In the present specification, the term "adhesive force" refers to an adhesive force measured by a test method JIS Z0237 as a standard, with respect to a mirror wafer, a peeling speed of 300 mm/min, and a peeling angle of 90°.

[The overall structure of the panel with cleaning function]

The overall configuration of the panel having the cleaning function will be described with reference to Figs. 1 and 5 . BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view showing a preferred aspect of a panel having a cleaning function of the present invention. Figure 5 is a schematic view showing one of the preferred combinations of panels having a cleaning function and one aspect of the cleaning method of the present invention.

The cleaning function panel 100 includes: a support body 1; a cleaning member 2 partially attached to one surface of the support body 1; and a non-attachment attached to the remaining portion of the surface to which the cleaning member 2 is attached Adhesive or microadhesive member 3.

The cover sheet 4 is entirely attached over the surface of the cleaning member 2 opposite to the support 1 and the surface of the non-adhesive or microadhesive member 3 opposite to the support 1.

In FIG. 1, the cleaning member 2 and the non-adhesive or micro-adhesive member 3 are attached only to one surface of the support 1, but the cleaning member 2 and the non-adhesive or micro-adhesive member 3 may be attached to Support the other surface of the body 1.

The adhesion of the cleaning member 2 described above is 0.10 N/20 mm or more. The adhesive force of the cleaning member 2 is set to be high when the size of the foreign matter to be trapped is large, so as to secure the trapping property of the foreign matter. On the other hand, when the area of the cleaning member 2 is large, it is set to be low to secure good conveyability. Therefore, the adhesion of the cleaning member 2 is set in accordance with the balance between the two. The adhesion of the cleaning member 2 is preferably 0.50 N / 20 mm to 3 N / 20 mm.

Preferably, the cleaning member 2 and the non-adhesive or micro-adhesive member 3 are as shown in FIG. 5, and the cleaning function panel 100 passes through the cleaning function of the substrate processing device. The panel 100 is attached to the surface of the support body 1 from the front end to the rear end.

It is preferable that the cleaning member 2 and the non-adhesive or micro-adhesive member 3 have a rectangular shape (belt shape) having a certain thickness.

In the panel 100 having the cleaning function of the present invention, the ratio of the area of the cleaning member 2 to the area of the non-adhesive or micro-adhesive member 3 can be based on the adhesion of the cleaning member 2, the structure of the substrate processing apparatus to be cleaned, It is appropriately selected as the part to be cleaned. For example, when a transfer roller that has been subjected to mold release treatment or the like is used, the area of the cleaning member 2 and the area of the non-adhesive or microadhesive member 3 are used as the object of the adhesive portion having low adhesion to the adhesive substance. The ratio is set to about 50:50 to about 99:1. On the other hand, when a metal transfer roller and an adsorption platform having an adsorption function are used, the area of the cleaning member 2 is non-adhesive or slightly adhesive when the adhesion to the adhesive material is high. The ratio of the area of the member 3 is set to be about 1:99 to about 50:50.

In the panel 100 having the cleaning function, the number of the cleaning members 2 and the number of the non-adhesive or micro-adhesive members 3 are not particularly limited, but the larger the area of the main surface of the panel having the cleaning function, the larger the number It is better.

Further, the gap width between the adjacent cleaning member 2 and the non-adhesive or microadhesive member 3 is preferably 10 mm or less, more preferably 5 mm or less, so that the unevenness of the surface of the panel 100 having the cleaning function is minimized.

If the width of the gap between the adjacent cleaning member 2 and the non-adhesive or microadhesive member 3 is wide, there is a possibility that the suction of the panel 100 having the cleaning function is insufficient in the substrate suction platform of the vacuum chuck type.

The thickness of the non-adhesive or micro-adhesive member 3 is preferably 90% to 110% of the thickness of the cleaning member 2, and more preferably 95% to 105%, so as to minimize the unevenness of the surface of the panel 100 having the cleaning function. .

In the present specification, the "thickness of the cleaning member" and the "thickness of the non-adhesive or microadhesive member" mean the "thickness" at the time of use. Therefore, in other words, as will be described later, when the cleaning member 2 and/or the non-adhesive or microadhesive member 3 includes the separator, the thicknesses of the two members respectively refer to the thickness after the separator is removed.

The thickness of the cleaning member and the thickness of the non-adhesive or microadhesive member are usually 500 μm or less, preferably 3 to 300 μm, and more preferably 5 to 250 μm.

[Support]

The support 1 is not particularly limited, and a substrate (for example, a glass substrate, a plastic substrate, or a ceramic substrate) that is normally transported in the target device may be used.

The size and shape of the support body 1 are not particularly limited as long as they can pass through the object processing device (that is, the substrate processing device to which the cleaning function panel 100 is applied), but it is preferable to have the cleaning function to which the present invention is applied. The substrates processed by the substrate processing apparatus of the panel 100 are the same size and shape. For example, when the substrate is a flat panel display panel, the shape is a rectangular flat plate.

The thickness of the support 1 is also substantially the same as the thickness of the substrate to which the substrate processing apparatus of the panel 100 having the cleaning function of the present invention is applied, or the thickness obtained by subtracting the thickness of the cleaning member 2 from the thickness is preferable. The thickness of the support 1 differs depending on the substrate processing apparatus to which the present invention is applied. However, it is usually 50 mm or less, preferably 2 to 40 mm, and preferably 5 to 20 mm.

[Cleaning member]

The cleaning member 2 will be described with reference to Fig. 2 . Fig. 2 is a schematic cross-sectional view showing a preferred aspect of the cleaning member 2.

The cleaning member 2 includes: a support member 21 for a cleaning member; a surface provided on the opposite side of the support member 21 for the cleaning member, and an adhesion force (the adhesion is based on the test method JIS Z0237) a cleaning layer 22 of 0.10 N/20 mm or more with respect to a mirror wafer, a peeling speed of 300 mm/min, and a peeling angle of 90°; and a support 1 side provided on the support member 21 for the cleaning member The cleaning member on the surface is provided with an adhesive layer 23.

The cleaning member 2 is attached to the support 1 by the cleaning member using the adhesive layer 23.

Moreover, the cleaning member separator 24 is attached to the surface of the cleaning layer 22 opposite to the cleaning member supporting substrate 21. The cleaning member separating sheet 24 is used to protect the adhesive face of the cleaning layer 22, and is removed when the cleaning function panel 100 is used.

The cleaning member 2 may not have the "substrate-free" support member 21 for the cleaning member. However, it is preferable to have the substrate as described above by the ease of reuse of the panel 100 having the cleaning function described later. .

Examples of the support member base material 21 for the cleaning member include a polyethylene film, a polyethylene terephthalate film, an acetonitrile film, a polycarbonate film, a polypropylene film, or a polyamide film. Plastic film, but not limited to this. The support member base material 21 for cleaning members may be a single layer or a multilayer body. The thickness of the support member 21 for the cleaning member can be appropriately selected, but it is usually 500 μm or less, preferably 3 to 300 μm, and most preferably 5 to 250 μm. The surface of the supporting member supporting substrate 21 may be subjected to a conventional surface treatment (for example, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment or the like, or chemically or physically treated) and adhesion described later. Coating treatment of a coating agent such as a substance to improve adhesion and retention to an adjacent layer.

The cleaning layer 22 is adjusted to an adhesive strength (measured by the test method JIS Z0237 as a standard, relative to a mirror wafer, peeling speed: 300 mm/min, peeling angle: 90°), and adjusted to 0.10 N/20 mm or more. The adhesive is composed of.

As the adhesive, for example, a rubber-based, acrylic-based, vinyl alkyl ether-based, anthrone-based, polyester-based, polyamidiamine-based, urethane-based, and styrene-diene block copolymer can be used. Adhesives and other known adhesives (for example, Japanese Laid-Open Patent Publication No. SHO 56-61468, Japanese Patent Application Laid-Open No. Hei 61-174857, Japanese Patent Application Laid-Open No. 63-17981, or Japanese Patent Laid-Open No. 56- One or two or more kinds of the adhesives described in the publication No. 13040 and the like. Further, the adhesive may contain a suitable additive such as a crosslinking agent, a crosslinking accelerator, an adhesion-imparting agent, a plasticizer, a filling agent, and an anti-aging agent.

The adhesion of the cleaning layer 22 (i.e., the adhesion of the cleaning member 2) is as described above, and when the size of the foreign matter to be trapped is large, the adhesion is set to ensure the trapping property of the foreign matter. On the other hand, when the area of the cleaning layer 22 is large, it is set to a low adhesion to secure its good conveyability. Therefore, the adhesion of the cleaning layer 22 is set in accordance with the balance between the two.

The adhesion of the cleaning layer 22 can be adjusted according to the type and amount of the adhesive component, and an ultraviolet curable compound and an ultraviolet polymerization initiator are added for ultraviolet irradiation treatment, or a heat-expandable microsphere is added for heat treatment. Implemented by appropriate methods.

As the above adhesive, it is preferred to use a natural rubber or various synthetic rubbers as a rubber-based adhesive for the base polymer; or an alkyl group having a carbon number of 20 or less (for example, methyl, ethyl, propyl, butyl, pentyl) Base, hexyl, heptyl, 2-ethylhexyl, isooctyl, isodecyl, dodecyl, lauryl, tridecyl, pentadecyl, hexadecyl, heptadecyl, ten An octyl, pentadecyl, and eicosyl group of an acrylic acid or an methacrylic acid ester, that is, one or two or more acrylic copolymers of an acrylic alkyl ester as an acrylic polymer of a base polymer Adhesives, etc.

In addition, the acryl-based copolymer may be copolymerized with one or two or more selected from the following monomer components, for example, in order to improve the cohesive force, the heat resistance, and the like. a carboxyl group-containing monomer (for example, acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid); an acid anhydride monomer (for example, anhydrous maleic acid, anhydrous clothing) Hydroxyl-containing monomer (for example, hydroxymethyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, (methyl) Hydroxyhexyl acrylate, hydroxyoctyl (meth) acrylate, hydroxydecyl (meth) acrylate, hydroxydodecyl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl methacrylate); a sulfonic acid group-containing monomer (for example, styrenesulfonic acid, allylsulfonic acid, 2-(methyl)acrylamidoxime-2-methylpropanesulfonic acid, (meth)acrylamidamine propanesulfonic acid, (A) Sulfonyl acrylate, (meth) propylene phthalic acid sulfonic acid); (N-substituted) guanamine monomer (eg (meth) acrylamide, N, N-dimethyl (methyl) Acrylamide, N-butyl Base (meth) acrylamide, N-methylol (meth) acrylamide, N-methylolpropane (meth) acrylamide; (meth) acrylate alkyl amine monomer ( For example, amine methyl (meth)acrylate, aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and tert-butylaminoethyl (meth)acrylate) (meth)acrylic alkoxyalkyl monomer (for example, methoxyethyl (meth)acrylate, ethoxyethyl (meth)acrylate); N-cyclohexylmaleimide, N - isopropyl maleimide, N-lauryl maleimide, maleimide monomer (for example, N-phenylmaleimide); itaconimide monomer ( For example, N-methyl itaconimine, N-ethyl itaconimine, N-butyl itaconimine, N-octyl ketimine, N-2-ethylhexyl amide醯imine, N-cyclohexyl ketimine, N-lauryl ketimine); amber quinone imine monomer (eg N-(methyl) propylene oxymethylene succinimide , N-(methyl) propylene 醯-6-oxyhexamethylene succinimide, N-(methyl) propylene 醯-8-oxy octamethyl succinimide); vinyl monomer (for example Vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidine, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinyl Imidazole, vinyl oxazole, vinyl morpholine, N-vinyl carboxylic acid decylamine, styrene, α-methylstyrene, N-vinyl caprolactam); cyanoacrylate monomer (eg Acrylonitrile, methacrylonitrile); epoxy group-containing acrylic monomer (for example, glycidyl (meth)acrylate); glycol-based acrylate monomer (for example, polyethylene glycol (meth)acrylate, Polypropylene glycol (meth)acrylate, methoxyethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate); acrylate monomer (for example, tetrahydrofuran (meth) acrylate, ( Fluoromethyl methacrylate, decyl ketone (meth) acrylate, 2-methoxyethyl acrylate); polyfunctional monomer (eg hexanediol di(meth)acrylate, di(meth)acrylic acid) (poly)ethylene glycol ester, di(meth)acrylic acid (poly)propylene glycol ester, neopentyl glycol di(meth)acrylate, di(a) Pentaerythritol acrylate, trimethylolpropane tris(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyacrylate, amine An acid ester acrylate); an olefin type monomer (for example, isoprene, butadiene, isobutylene); and a vinyl ether.

The crosslinking agent is not particularly limited, and examples thereof include an epoxy crosslinking agent, an isocyanate crosslinking agent, and a melamine crosslinking agent. In particular, an isocyanate crosslinking agent such as an aromatic isocyanate such as toluene diisocyanate or xylene diisocyanate or an alicyclic isocyanate such as isophorone diisocyanate or an aliphatic isocyanate such as hexamethylene diisocyanate; It is better.

The crosslinking accelerator is not particularly limited, and examples thereof include tin-based catalysts such as dibutyltin oxide and dibutyltin distearate.

The ultraviolet curable compound is not particularly limited as long as it can be cured by ultraviolet rays, and may be used alone or in combination of two or more.

Specific examples of the ultraviolet curable compound include trimethylolpropane triacrylate, tetramethylol methanetetramethacrylate, pentaerythritol monohydroxy acrylate, and 1,4-butylene glycol diacrylate. 1,6-hexanediol acid acrylate, polyethylene glycol diacrylate, and the like.

As the ultraviolet curable compound, an ultraviolet curable resin such as an ester (meth) acrylate having a (meth) acrylonitrile group at the molecular terminal, a urethane (meth) acrylate, or an epoxy (for example) may be used. Methyl) acrylate, melamine (meth) acrylate, acrylic resin (meth) acrylate, thiol-ene addition resin having allyl group at the molecular end, photocationic polymerization resin, polyvinyl cinnamate, etc. A photosensitive reactive group-containing polymer or an oligopolymer, such as a polymer containing a cinnamyl group, a diazo aryl phenol resin, and a acrylamide polymer.

Further, as the ultraviolet curable compound, a polymer which reacts with ultraviolet rays (for example, epoxidized polybutadiene, unsaturated polyester, polyglycidyl methacrylate, polypropylene decylamine, polyethylene oxime) may also be used. Alkane, etc.).

As the ultraviolet polymerization initiator, a known polymerization initiator can be appropriately selected. The amount of the ultraviolet polymerization initiator is preferably from 0.1 to 10 parts by weight, preferably from 1 to 5 parts by weight, per 100 parts by weight of the ultraviolet curable compound. Further, the ultraviolet polymerization initiator and the ultraviolet polymerization accelerator may be used in combination. The ultraviolet polymerization accelerator is not particularly limited, and a known ultraviolet polymerization accelerator such as p-dimethyl ester amino benzoic acid isoamyl ester or p-dimethyl ester amino benzoic acid ethyl ester can be used.

Further, an appropriate additive such as a thermal polymerization initiator may be used to obtain an appropriate modulus of elasticity before and after ultraviolet curing. The thermal polymerization initiator is not particularly limited, and a known thermal polymerization initiator such as benzoquinone peroxide or azobisisobutyronitrile may be used.

As the heat-expandable microspheres, for example, heat-expandable microspheres in which a suitable substance is contained in a shell-forming substance by a coagulation method or an interfacial polymerization method, such as isobutane, propane, and the like, may be used. A pentane or the like which is easily gasified and exhibits thermal expansion. The heat-expandable microspheres to be used preferably have a volume expansion ratio of the heat-expandable microspheres of 5 times or more, preferably 10 times or more.

The shell-forming substance is not particularly limited as long as it is a thermally fusible substance or a substance which is destroyed by thermal expansion, for example, a vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethacrylic acid. Methyl ester, polyacrylonitrile, polyvinylidene chloride and polyfluorene.

The thickness of the cleaning layer 22 (after drying) is not particularly limited and is usually about 5 to 200 μm.

The material of the adhesive layer for the cleaning member 23 is not particularly limited as long as it can sufficiently adhere to the support member 21 for the cleaning member, and a general adhesive (for example, an acrylic adhesive or a rubber system) can be used. A pressure sensitive adhesive such as an adhesive or an ultraviolet curable hardening type pressure-sensitive adhesive or a hot peeling mold pressure adhesive. From the viewpoint of reusing the support member 21 for a cleaning member, it is preferred to use an ultraviolet curable hardenable pressure-sensitive adhesive or a hot-peelable pressure-sensitive adhesive. The thickness of the adhesive layer 23 (after drying) of the cleaning member is usually 10 to 50 μm.

The cleaning member separator 24 can be a substrate made of a plastic film or paper which has been surface-coated by a release agent such as an anthrone-based resin, a long-chain alkyl acrylate resin, or a fluorine-based resin. Or a substrate having a small adhesiveness such as a non-polar polymer such as polyethylene or polypropylene.

Further, the thickness of the cleaning member separator 24 is usually 10 to 300 μm, preferably 20 to 100 μm.

[non-adhesive or slightly adhesive components]

The non-adhesive or microadhesive member 3 will be described with reference to Figs. 3 and 4 . Figure 3 is a schematic cross-sectional view showing one aspect of the non-adhesive member 3a in one aspect of the non-adhesive member using the panel having the cleaning function of the present invention, and Figure 4 is a view showing the use of the cleaning function of the present invention. A schematic cross-sectional view of one of the microadhesive members 3b in one of the microadhesive members of the panel. The non-adhesive member 3a of Fig. 3 and the microadhesive member 3b of Fig. 4 are included in the non-adhesive or microadhesive member 3 of Fig. 1.

In FIG. 3, the non-adhesive member 3a includes a support substrate 3a1 for a non-adhesive member, and an adhesive layer for a non-adhesive member provided on the surface of the support 1 side of the non-adhesive member support substrate 3a1. 3a3.

The non-adhesive member 3a is followed by the support 1 by the non-adhesive member using the adhesive layer 3a3.

The support substrate 3a1 for the non-adhesive member is the same as those exemplified for the support member 21 for cleaning members, but is not limited thereto.

The thickness of the support substrate 3a1 for the non-adhesive member is determined such that the thickness of the cleaning member 2 is substantially the same as the thickness of the non-adhesive member 3a, and is usually 500 μm or less, preferably 3 to 300 μm. The degree of ~250 μm is optimal.

The material of the non-adhesive member adhesive layer 3a3 is the same as that exemplified as the above-described cleaning member adhesive layer 23, but is not limited thereto.

The thickness of the adhesive layer for the non-adhesive member 3a3 (after drying) is generally substantially the same as the thickness of the adhesive layer 23 for the cleaning member, and specifically, it is usually 10 to 50 μm.

In FIG. 4, the microadhesive member 3b includes a support substrate 3b1 for a microadhesive member, and a surface on the side opposite to the support 1 of the support substrate 3b1 for the microadhesive member, and an adhesive force ( The adhesion is measured by the test method JIS Z0237 as a standard, and the measurement is performed on the mirror wafer, the peeling speed: 300 mm/min, and the peeling angle: 90°, which is 1/2 or less of the adhesion of the cleaning member 2 described above. The microadhesive layer 3b2; and the adhesion layer 3b3 for the microadhesive member provided on the surface of the support 1b side of the microadhesive member support substrate 3b1.

The microadhesive member 3b is attached to the support 1 by the adhesion layer 3b3 by the microadhesive member. Moreover, the separator 3b4 for microadhesive members is attached to the surface of the microadhesive layer 3b2 on the opposite side to the adhesive layer 3b3 for microadhesive members. The separator 10b4 for the microadhesive member is used to protect the microadhesive surface of the microadhesive layer 3b2, and is removed when the panel 100 having the cleaning function is used.

The microadhesive member 3b may be a "substrate-free" support substrate 3b1 for a non-adhesive member. However, as will be described later, the panel 100 having a cleaning function is easy to reuse, and has a substrate as described above. It is better.

The support substrate 3b1 for the microadhesive member is the same as those exemplified for the support member 21 for cleaning members, but is not limited thereto.

The thickness of the support substrate 3b1 for the microadhesive member is determined such that the thickness of the cleaning member 2 is substantially the same as the thickness of the non-adhesive member 3a, and is usually 500 μm or less, preferably 3 to 300 μm. The degree of ~250 μm is optimal.

The material of the microadhesive layer 3b2 is the same as that exemplified for the cleaning layer 22, but is not limited thereto.

The adhesion of the microadhesive layer 3b2 is preferably 1/2 or less, or 1/3 or less of the adhesion of the cleaning member 2. In the present invention, there is no lower limit to the adhesive force of the above-mentioned microadhesive layer 3b2, and the object of the present invention can be attained even if the adhesive force is 0N/20 mm. The adhesion of the microadhesive layer 3b2 is set such that the total adhesion of the panel 100 having the cleaning function reaches a desired strength.

The adjustment of the adhesion of the microadhesive layer 3b2 can be carried out in the same manner as the adjustment of the adhesion of the cleaning layer 22.

The thickness of the microadhesive layer 3b2 (after drying) is not particularly limited, but is usually about 5 to 200 μm.

The material of the adhesive layer 3b3 for the micro-adhesive member is the same as that exemplified for the cleaning member-attached layer 23, but is not limited thereto.

The thickness (after drying) of the adhesive layer 3b3 for the microadhesive member is usually substantially the same as the thickness of the adhesive layer 23 for the cleaning member, and specifically, it is usually 10 to 50 μm.

The separator 3b4 for the microadhesive member may be the same as those exemplified for the separator for cleaning member 24, but is not limited thereto.

Further, the separator 3b4 for microadhesive members is preferably 10 to 300 μm, preferably 20 to 100 μm.

[covering sheet]

The cover sheet 4 is used to peel off the separation piece (the cleaning member separation piece 24 and the micro-adhesive member separation piece 3b4) of the cleaning member 2 and the micro-adhesive member 3b together, as long as it is a tape capable of peeling the separation piece. (such as pressure-sensitive adhesive tape), there are no specific restrictions. The cover sheet 4 is removed together with the separator when the panel of the cleaning function of the present invention is used.

[Cleaning method]

The panel processing apparatus to be cleaned can be cleaned by the substrate processing apparatus to be cleaned by using the panel 100 having the cleaning function of the present invention in the same manner as the substrate to be processed by the substrate processing apparatus.

The panel 100 having the cleaning function is conveyed in the substrate processing apparatus, and is moved while being in contact with the portion to be cleaned, so that the foreign matter adhering to the device can be easily and surely cleaned and removed without any problem of conveyance.

The panel having the cleaning function of the present invention and the cleaning method of the present invention are suitably applied even to a substrate processing apparatus including a substrate adsorption platform (for example, a substrate for substrate adsorption by vacuum casting).

Preferably, the cleaning member 2 is routed through the path to cover the entire area to be cleaned so that the plurality of panels 100 having the cleaning function pass through the substrate processing apparatus.

Specifically, as shown in FIG. 5, the combination (100a, 100b, 100c) of the above-mentioned cleaning function panel 100 of a plurality of sheets having different positions of the cleaning member 2 is sequentially arranged in the order of a, b, and c. The direction of the white (open) arrow moves in the area to be cleaned so that the passage of the path of the cleaning member 2 covers the entire area to be cleaned. As a result, the entire area of the cleaning object can be cleaned without any omission. In Fig. 5, the left end view is a top view of the panel 100 with the cleaning function, the middle view is a side view of the panel with the cleaning function, and the right end diagram shows the outline of the method of cleaning the transport roller by the panel 100 with the cleaning function. Figure.

After the use of the cleaning function panel 100, the adhesive material of each of the adhesive layers is a normal pressure-sensitive adhesive, by physically peeling off the cleaning member and the non-adhesive or micro-adhesive member; In the case of ultraviolet curing of the sexy pressure-sensitive adhesive, ultraviolet irradiation is performed; when the adhesive is pressed and released, the cleaning member and the non-adhesive or micro-adhesive member can be removed, and the support can be reused. The production of the panel 100 with a cleaning function.

Further, when the cleaning member and the non-adhesive or micro-adhesive member are substrate-free, they are dissolved and removed by a solvent, and the support can be reused in the production of the panel 100 having the cleaning function.

[Examples]

Hereinafter, the present invention will be described based on examples, but the present invention is not limited thereto. Further, the following "parts" means parts by weight.

(Example 1)

100 parts of an acrylic polymer (weight average molecular weight: 500,000) obtained from a monomer mixture containing 70 parts of 2-ethylhexyl acrylate, 30 parts of ethyl acrylate and 5 parts of hydroxyethyl acrylate 3 parts of an isocyanate-based crosslinking agent (diphenylmethane diisocyanate) and a tin-based crosslinking accelerator (di-n-octyltin laurate) 0.02 parts of a toluene solution (hereinafter referred to as toluene solution A), after drying This was applied to one side (cleaning layer) of a polyester film having a thickness of 50 μm so as to have a thickness of 10 μm, and a polyester-separated sheet having a thickness of 38 μm was attached to the surface thereof.

Next, 100 parts of an acrylic polymer (weight average molecular weight: 500,000) obtained from a monomer mixture containing 70 parts of 2-ethylhexyl acrylate, 30 parts of ethyl acrylate, and 5 parts of hydroxyethyl acrylate. a solution containing 0.02 parts of a toluene-based crosslinking agent (diphenylmethane diisocyanate) and a tin-based crosslinking accelerator (di-n-octyltin laurate) in a toluene solution (hereinafter referred to as toluene solution B). The thickness of the dried film was applied to the other side of the polyester film (the adhesive layer for the cleaning member), and a polyester-based separator having a thickness of 50 μm was attached to the surface to prepare a cleaning member. The cleaning layer adhesion of the cleaning member was measured (by the test method JIS Z0237 as a standard, relative to the mirror wafer, peeling speed: 300 mm/min, peeling angle: 90°), and the result was 1.50 N/20 mm.

Next, the toluene solution B was applied to one surface of a polyester film having a thickness of 50 μm so as to have a thickness of 40 μm after drying, and a polyester-based separator having a thickness of 38 μm was attached to the surface to form a non-adhesive member.

Next, on a glass plate having a thickness of 5 mm, a length of 300 mm, and a width of 200 mm, as shown in FIG. 5, the cleaning member and the non-adhesive member having a width of 20 mm were attached so as not to overlap the position of the cleaning member, and 5 pieces of the cleaning function were produced. Transfer the components.

On the other hand, the adsorption platform of the glass substrate processing apparatus was removed, and a foreign matter of 0.3 μm or more was measured by a laser type foreign matter measuring device, and as a result, there were 22,000 in a region of 300 mm × 200 mm.

Then, the separators on the cleaning layer side of the five transporting members having the cleaning function obtained were peeled off and sequentially conveyed in a substrate processing apparatus having the above-described platform in which 22,000 foreign materials were attached, and as a result, the separation was smoothly performed. Thereafter, the wafer table is removed, and a foreign matter of 0.3 μm or more is measured by a laser type foreign matter measuring device. As a result, it is 1100 in the region, and 3/4 or more of the number of foreign matter adhered before cleaning can be removed.

(Example 2)

An amine group was uniformly mixed with respect to 100 parts of an acrylic polymer (weight average molecular weight: 700,000) obtained from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate, and 5 parts of acrylic acid. 50 parts of formate acrylate, 3 parts of benzyl methyl ketal, and 3 parts of diphenylmethane diisocyanate were used as an ultraviolet curing type adhesive solution C. The ultraviolet curable adhesive solution C was applied to a polyethylene terephthalate film having a thickness of 75 μm after drying to a thickness of 30 μm, and dried and irradiated with ultraviolet rays (1000 mJ/cm ² ) on the surface thereof. A polyester-based separator (cleaning layer) having a thickness of 38 μm was attached. Then, on the other side of the polyester film, the toluene solution B (the adhesive for cleaning member) of Example 1 was applied so as to have a thickness of 20 μm after drying, and a polyester-separated sheet having a thickness of 50 μm was attached to the surface thereof. Make a cleaning member. The adhesion of the cleaning member was measured (standard test wafer JIS Z0237, peeling speed: 300 mm/min, peeling angle: 90°), and the result was 0.65 N/20 mm.

Next, the toluene solution B of Example 1 was applied to one surface of a polyester film having a thickness of 75 μm so as to have a thickness of 50 μm after drying, and a polyester-separated sheet having a thickness of 38 μm was attached to the surface to form a non-adhesive member.

Next, on a glass plate having a thickness of 5 mm, a length of 300 mm, and a width of 200 mm, a cleaning member having a width of 50 mm and a non-adhesive member were attached in such a manner that the position of the cleaning member was not repeated, and two pieces of the cleaning function were produced. Transfer the components.

On the other hand, the adsorption platform of the glass substrate processing apparatus was removed, and a foreign matter of 0.3 μm or more was measured by a laser type foreign matter measuring device, and as a result, there were 29,000 in the area of 300 mm × 200 mm.

Then, the separators on the side of the cleaning layer of the two transporting members having the cleaning function obtained were peeled off, and sequentially transported to the substrate processing apparatus with the above-mentioned platform on which the 29,000 foreign materials were attached, and the result was smooth. Carry out the transfer. Then, the wafer table is unloaded, and a foreign matter of 0.3 μm or more is measured by a laser type foreign matter measuring device. As a result, 2,200 are in the region, and 3/4 or more of the number of foreign matter adhered before cleaning can be removed.

(Example 3)

100 parts of an acrylic polymer (weight average molecular weight: 500,000) obtained from a monomer mixture containing 70 parts of 2-ethylhexyl acrylate, 30 parts of ethyl acrylate and 5 parts of hydroxyethyl acrylate The toluene solution A of Example 1 containing 0.02 parts of an isocyanate crosslinking agent (diphenylmethane diisocyanate) and a tin crosslinking accelerator (di-n-octyltin laurate) was dried to a thickness of This was applied to one side of a polyester film having a thickness of 50 μm in a manner of 10 μm to form a clean layer, and a polyester-separated sheet having a thickness of 38 μm was attached to the surface thereof. Thereafter, the toluene solution B of Example 1 was applied to the other side of the polyester film (the adhesive for cleaning member) so as to have a thickness of 30 μm after drying, and a polyester-separated sheet having a thickness of 50 μm was attached to the surface thereof. Make a cleaning member. The cleaning layer adhesion of the cleaning member was measured (measured by the test method JIS Z0237 as the standard, the peeling speed of the mirror wafer: 300 mm/min, peeling angle: 90°), and the result was 1.50 N/20 mm.

Next, the toluene solution B was applied to one surface of a polyester film having a thickness of 25 μm (adhesive for a microadhesive member) so as to have a thickness of 10 μm after drying, and a polyester-based separator having a thickness of 50 μm was bonded to the surface thereof. Thereafter, 100 parts of an acrylic polymer (weight average molecular weight: 450,000) obtained from a monomer mixture containing 50 parts of 2-ethylhexyl acrylate, 50 parts of ethyl acrylate, and 5 parts of hydroxyethyl acrylate. 30 parts of heat-expandable microspheres ( Matsumoto microsphere F50D), 3 parts of isocyanate-based crosslinking agent (diphenylmethane diisocyanate), and tin-based crosslinking accelerator (di-n-octyltin laurate) 0.02 parts The toluene solution D was applied to the other side of the polyester film so as to have a thickness of 55 μm after the expansion heat treatment, and dried (micro-adhesive layer (unexpanded treatment)), and a polyester system having a thickness of 50 μm was attached to the surface. Separate the pieces. Further, heat treatment (120 ° C × 5 minutes) was carried out to expand the microadhesive layer to form a microadhesive member. The adhesion of the microadhesive layer of the microadhesive member was measured (measured by the test method JIS Z0237 as the standard, the spectacles wafer, the peeling speed: 300 mm/min, and the peeling angle: 90°), and the result was 0.02 N/20 mm. .

Next, on a glass plate having a thickness of 5 mm, a length of 300 mm, and a width of 200 mm, as shown in FIG. 5, the cleaning member and the micro-adhesive member having a width of 20 mm were attached so that the position of the cleaning member was not repeated, and five pieces of the cleaning function were produced. member.

On the other hand, the adsorption platform of the glass substrate processing apparatus was removed, and a foreign matter of 0.3 μm or more was measured by a laser type foreign matter measuring device, and as a result, there were 28,000 in the area of 300 mm × 200 mm.

Then, the separators on the cleaning layer side of the five transporting members having the cleaning function obtained were peeled off and sequentially conveyed in a substrate processing apparatus having the above-described platform in which 22,000 foreign materials were attached, and as a result, the separation was smoothly performed. Thereafter, the wafer stage is removed, and a foreign matter of 0.3 μm or more is measured by a laser type foreign matter measuring device. As a result, 1,500 pieces are placed in the area, and 3/4 or more of the number of foreign matters adhered before cleaning can be removed.

(Example 4)

The amino group was uniformly mixed with 100 parts of an acrylic polymer (weight average molecular weight: 700,000) obtained from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate and 5 parts of acrylic acid. 30 parts of formate acrylate, 3 parts of benzyl methyl ketal, and 3 parts of diphenylmethane diisocyanate were used as an ultraviolet curing type adhesive solution E. The ultraviolet curable adhesive solution E was applied to a polyethylene terephthalate film having a thickness of 75 μm after drying to a thickness of 30 μm, and dried and irradiated with ultraviolet rays (1000 mJ/cm ² ) on the surface thereof. A polyester separator (cleaning layer) having a thickness of 38 μm was attached. Then, on the other side of the polyester film, the toluene solution B of Example 1 (adhesive for cleaning member) was applied to a thickness of 20 μm after drying, and a polyester separator having a thickness of 50 μm was attached to the surface thereof. , made into a micro-adhesive member. The adhesion of the microadhesive layer of the microadhesive member was measured (by the test method JIS Z0237 as a standard, relative to the mirror wafer, peeling speed: 300 mm/min, peeling angle: 90), and the result was 0.90 N/20 mm.

Next, 100 parts of an acrylic polymer (weight average molecular weight: 700,000) obtained from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate, and 5 parts of acrylic acid was uniformly mixed. 200 parts of urethane acrylate, 3 parts of benzyl methyl ketal, and 3 parts of diphenylmethane diisocyanate were used as an ultraviolet curing type adhesive solution F. The ultraviolet curable adhesive solution F was applied to a polyethylene terephthalate film having a thickness of 50 μm after drying to a thickness of 35 μm, and dried and irradiated with ultraviolet rays (1000 mJ/cm ² ) on the surface. A polyester separator (microadhesive layer) having a thickness of 38 μm was attached. Thereafter, on the other side of the polyester film, the toluene solution B (adhesive for microadhesive members) of Example 1 was applied so as to have a thickness of 40 μm after drying, and a polyester having a thickness of 50 μm was attached to the surface. The sheet is made into a micro-adhesive member. The adhesion of the microadhesive layer of the microadhesive member was measured (by the test method JIS Z0237 as a standard, relative to the mirror wafer, peeling speed: 300 mm/min, peeling angle: 90), and the result was 0.06 N/20 mm.

Next, on a glass plate having a thickness of 5 mm, a length of 300 mm, and a width of 200 mm, the cleaning member and the micro-adhesive member having a width of 50 mm were attached in accordance with Example 1 so that the position of the cleaning member was not repeated, and two conveying members having a cleaning function were produced. .

On the other hand, the adsorption platform of the glass substrate processing apparatus was removed, and a foreign matter of 0.3 μm or more was measured by a laser type foreign matter measuring device, and as a result, there were 27,000 in a region of 300 mm × 200 mm.

Then, the separators of the two transporting members having the cleaning function obtained above were peeled off and sequentially conveyed in a substrate processing apparatus having the above-described platform in which 27,000 foreign bodies were attached, and as a result, the conveyance was smoothly performed. Thereafter, the wafer table is unloaded, and a foreign matter of 0.3 μm or more is measured by a laser type foreign matter measuring device. As a result, 2,100 are in the region, and 3/4 or more of the number of foreign matter adhered before cleaning can be removed.

(Comparative Example 1)

The cleaning member of Example 1 was attached to the glass plate in its entirety to produce a conveying member having a cleaning layer. Then, it is transported in the substrate processing apparatus having the above adsorption platform, and as a result, it is fixed to the wafer stage and cannot be transported.

(Comparative Example 2)

The cleaning member of Example 2 was attached to the glass plate in its entirety to produce a conveying member having a cleaning layer. Then, it is transported in the substrate processing apparatus having the above adsorption platform, and as a result, it is fixed to the wafer stage and cannot be transported.

[Industrial availability]

The invention can be utilized for cleaning of substrate processing equipment.

1. . . Support

2. . . Cleaning member

3. . . Non-adhesive or microadhesive member

3a. . . Non-adhesive member

3b. . . Microadhesive member

3a1. . . Support substrate for non-adhesive members

3a3. . . Adhesive member

3b1. . . Supporting substrate for microadhesive members

3b2. . . Microadhesive layer

3b3. . . Adhesive layer for microadhesive members

3b4. . . Separator for microadhesive members

4. . . Cover sheet

5. . . Transport roller

twenty one. . . Supporting substrate for cleaning member

twenty two. . . Cleaning layer

twenty three. . . Cleaning member with adhesive layer

twenty four. . . Separator for cleaning member

100. . . Clean panel

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view showing a preferred aspect of a panel having a cleaning function of the present invention.

Fig. 2 is a schematic cross-sectional view showing a preferred aspect of a cleaning member.

Figure 3 is a schematic cross-sectional view showing one aspect of the non-adhesive member of the panel having the cleaning function of the present invention.

Figure 4 is a schematic cross-sectional view showing one aspect of the microadhesive member of the panel having the cleaning function of the present invention.

Figure 5 is a schematic view showing one of the preferred combinations of panels having a cleaning function and one aspect of the cleaning method of the present invention.

1. . . Support

2. . . Cleaning member

3. . . Non-adhesive or micro-adhesive member

4. . . Cover sheet

100. . . Clean panel

Claims (6)

A cleaning method for a substrate processing apparatus, characterized in that: a panel having a cleaning function is passed through the substrate processing apparatus; the panel having a cleaning function comprises: a support; and a cleaning member partially attached to the support On at least one surface, formed by an adhesive, and the adhesion is based on the test method JIS Z0237, and the peeling speed of the mirror wafer is 300 mm/min, and the peeling angle is 90°. The condition is determined to be 0.10 N/20 mm or more; and a non-adhesive or micro-adhesive member attached to the remaining portion of the surface to which the cleaning member is attached, and having a thickness relative to the cleaning member It has a thickness of 90% to 110% and is formed by an adhesive. The cleaning method of claim 1, wherein the cleaning member and the non-adhesive or micro-adhesive member are in the traveling direction of the panel having the cleaning function through the front surface of the panel having the cleaning function, The rear end is attached to the surface of the above support. The cleaning method of claim 1, wherein the adhesion of the non-adhesive or micro-adhesive member is based on the test method JIS Z0237, and the peeling speed of the mirror wafer is 300 mm/min, the peeling angle The measurement was carried out under conditions of 90°, which is 1/2 or less of the above-mentioned adhesive force of the cleaning member. The cleaning method of claim 1, wherein the combination of the passage paths of the cleaning members covers the entire area to be cleaned, so that the plurality of sheets are The above-described panel having a cleaning function passes through the above substrate processing apparatus. The cleaning method of claim 1, wherein the substrate processing apparatus includes a substrate adsorption platform. A cleaning function panel comprising: a support body; a cleaning member partially attached to at least one surface of the support body, formed by an adhesive, and an adhesive force (the adhesive force is tested by a test method) JIS Z0237 is a standard, which is measured at a peeling speed of 300 mm/min and a peeling angle of 90° for a mirror wafer) of 0.10 N/20 mm or more; and a non-adhesive or micro-adhesive member. It is attached to the remaining portion of the surface to which the cleaning member is attached, and has a thickness of 90% to 110% with respect to the thickness of the cleaning member, and is formed by an adhesive.