TWI392403B - Plasma jet electrode device and system thereof - Google Patents

Plasma jet electrode device and system thereof Download PDF

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TWI392403B
TWI392403B TW96111261A TW96111261A TWI392403B TW I392403 B TWI392403 B TW I392403B TW 96111261 A TW96111261 A TW 96111261A TW 96111261 A TW96111261 A TW 96111261A TW I392403 B TWI392403 B TW I392403B
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plasma jet
plasma
electrode
jet electrode
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TW96111261A
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TW200840426A (en
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Yueh Yun Kuo
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Yueh Yun Kuo
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電漿噴流電極裝置及其系統Plasma jet electrode device and system thereof

本發明是關於一種電漿噴流電極裝置,尤指一種可在低溫常壓下製造出非平衡式電漿噴流,而能改善電漿處理面積與均勻性,使能達到更理想之工件表面處理效果的電漿噴流電極裝置。The invention relates to a plasma jet electrode device, in particular to an unbalanced plasma jet which can be produced under low temperature and normal pressure, thereby improving plasma processing area and uniformity, so as to achieve a more ideal surface treatment effect of the workpiece. Plasma jet electrode device.

按,近年來利用氣體游離(電漿)原理,以氣態氧化法去除污染物已陸續研究發展中,例如電子束法(Electron Beam)、電暈放電法(Corona Discharge)、微波法(Microwave)、高週波電漿(Radio Frequency,RF)、介電質放電法(Dielectric Barrier Discharge,DBD)等,皆已被證實具有一定的處理效果,其中,介電質放電法因在常壓下即可進行有效放電,且成本較低,為目前非熱電漿去除污染物的研究主流之一,且該介電質電漿放電法已被廣泛應用於塑膠薄膜印製處理、礦石靜電篩選分離器、臭氧產生器、表面改質、表面清洗、放射廢棄物以及排放廢氣等之處理工程等,惟,該非熱電漿仍屬於偏高溫狀態,且對於工件表面處理,仍有偏處一隅及處理效果不均之缺點,尚有待進一步加以改善。According to the principle of gas free (plasma) in recent years, the removal of pollutants by gaseous oxidation has been studied and developed, such as Electron Beam, Corona Discharge, Microwave, High frequency (Radio Frequency, RF), Dielectric Barrier Discharge (DBD), etc., have been confirmed to have a certain processing effect, wherein the dielectric discharge method can be carried out under normal pressure Effective discharge, and low cost, is one of the current research mainstream of non-thermal plasma removal of pollutants, and the dielectric plasma discharge method has been widely used in plastic film printing processing, ore electrostatic screening separator, ozone generation Treatment, surface modification, surface cleaning, radiation waste, and exhaust gas treatment, etc., however, the non-thermal plasma is still in a high temperature state, and there are still some disadvantages of uneven treatment and uneven treatment effect on the surface treatment of the workpiece. It still needs further improvement.

本發明提供一種「電漿噴流電極裝置」,其具有一定位座,於定位座中設置一陶瓷管,陶瓷管中設置一圓盤,圓盤上佈設數個傾斜貫穿的斜孔,圓盤中設置一高壓金屬電極,高壓金屬電極與陶瓷管間形成一介電質放電電漿區域,定位座周面設置一旋轉座,旋轉座底端設置一底盤,底盤內壁設置一接地電極,接地電極與高壓金屬電極間形成一低溫非平衡式電漿區域,底盤底端設置一噴嘴頭,噴嘴頭上設置數個斜孔。The invention provides a "plasma jet electrode device", which has a positioning seat, a ceramic tube is arranged in the positioning seat, a disc is arranged in the ceramic tube, and a plurality of oblique holes penetrating through the disc are arranged on the disc. A high-voltage metal electrode is arranged, a dielectric discharge plasma region is formed between the high-voltage metal electrode and the ceramic tube, a rotating seat is arranged on the circumferential surface of the positioning seat, a bottom plate is arranged at the bottom end of the rotating base, and a ground electrode is disposed on the inner wall of the chassis, and the ground electrode is disposed A low temperature unbalanced plasma region is formed between the high voltage metal electrode, a nozzle head is disposed at the bottom end of the chassis, and a plurality of inclined holes are disposed on the nozzle head.

藉此設計,可將電線連接至電源供應器,使電氣線路能傳送產生電漿使用之交流高頻高壓電力,以及將底盤接地,而低溫常壓之大氣與電漿製程氣體則由氣管進入,且經由圓盤上所佈設的斜孔流過介電質放電電漿區域所產生的電漿以紊流方式將電漿予以霧化,而於後續之低溫非平衡式電漿區域產生低溫非平衡式電漿,並藉由噴嘴頭旋轉機制外加斜孔噴流設計,將低溫常壓非平衡式電漿旋轉噴出,即可改變電漿處理面積與均勻性。By this design, the wires can be connected to the power supply, so that the electric circuit can transmit the alternating high-frequency and high-voltage power generated by the plasma, and the chassis is grounded, and the atmospheric and plasma process gases at low temperature and normal pressure are entered by the air pipe. And the plasma generated by flowing the dielectric discharge plasma region through the oblique hole disposed on the disk atomizes the plasma in a turbulent manner, and generates low temperature non-equilibrium in the subsequent low temperature unbalanced plasma region. The plasma is modified by the nozzle head rotation mechanism and the oblique hole jet design to rotate the low-temperature and normal-pressure unbalanced plasma to change the plasma treatment area and uniformity.

為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。The above and other objects, features and advantages of the present invention will become more <RTIgt;

請配合參照第一圖及第二圖所示,本發明之「電漿噴流電極裝置」,其具有一定位座10,於定位座10中設置一陶瓷管20,陶瓷管20中設置一圓盤30,圓盤30上佈設數個傾斜貫穿的斜孔31,其立體示意圖如第二圖所示,圓盤30中設置一高壓金屬電極40,高壓金屬電極40為一中空圓柱體,較易於散熱,高壓金屬電極40與陶瓷管20間形成一介電質放電電漿區域A,另外,以及定位座10上設置一頂蓋60,頂蓋60中設置一螺孔61,螺孔61中設置一氣管62,高壓金屬電極40之頂端設置一接頭421,接頭421處接續設置一電線42,電線42由氣管62穿出且接續至一高壓電端,氣管62與電線42之間形成空隙,使外界空氣以及電漿製程氣體可由氣管62進入陶瓷管20中進行反應。Referring to the first and second figures, the "plasma electrode assembly" of the present invention has a positioning base 10, a ceramic tube 20 is disposed in the positioning base 10, and a disc is disposed in the ceramic tube 20. 30, a plurality of obliquely extending oblique holes 31 are arranged on the disk 30, and the three-dimensional schematic view is as shown in the second figure. A high-voltage metal electrode 40 is disposed in the disk 30, and the high-voltage metal electrode 40 is a hollow cylinder, which is easy to dissipate heat. A dielectric discharge plasma region A is formed between the high voltage metal electrode 40 and the ceramic tube 20, and a top cover 60 is disposed on the positioning base 10. A screw hole 61 is disposed in the top cover 60, and a screw hole 61 is disposed in the screw hole 61. A connecting end 421 is disposed at the top end of the high-pressure metal electrode 40, and a wire 42 is disposed at the joint 421. The electric wire 42 is passed through the air pipe 62 and connected to a high-voltage electric end, and a gap is formed between the air pipe 62 and the electric wire 42 to make a gap. The outside air and the plasma process gas may enter the ceramic tube 20 from the gas pipe 62 for reaction.

上述經由氣管62處進入陶瓷管20中的電漿製程氣體可為空氣(Air)、氬氣(Ar)、二氧化碳(CO2)、氮氣(N2)、氦氣(He)、氧氣(O2)或是其相互混合之氣體。The plasma process gas entering the ceramic tube 20 via the gas pipe 62 may be air, argon (Ar), carbon dioxide (CO2), nitrogen (N2), helium (He), oxygen (O2) or a gas that is mixed with each other.

又,定位座10周面設置一旋轉座50,旋轉座50之底端設置一底盤70,底盤70內壁設置一接地電極71,接地電極71與高壓金屬電極40間形成一低溫非平衡式電漿區域B,底盤70之底端設置一噴嘴頭72,用以將低溫非平衡式電漿噴出,其中,以本實施例而言,噴嘴頭72上可設置一個以上的斜孔73,例如複數個以放射線方式分佈之斜孔73,請參照第一圖所示。Moreover, a rotating seat 50 is disposed on the circumferential surface of the positioning base 10, and a bottom plate 70 is disposed at a bottom end of the rotating base 50. A ground electrode 71 is disposed on the inner wall of the chassis 70, and a low temperature unbalanced electric power is formed between the ground electrode 71 and the high voltage metal electrode 40. In the slurry region B, a nozzle head 72 is disposed at the bottom end of the chassis 70 for ejecting the low temperature unbalanced plasma. In the embodiment, more than one oblique hole 73 may be disposed on the nozzle head 72, for example, a plurality of For the oblique holes 73 distributed in a radial manner, please refer to the first figure.

上述之圓盤30可為不銹鋼材,於圓盤30中設置一內螺紋,以及在高壓金屬電極40頂端周面設置一外螺紋,外螺紋可螺設在內螺紋中,使高壓金屬電極40固結定位在圓盤30之中。The disc 30 may be a stainless steel material, an internal thread is disposed in the disc 30, and an external thread is disposed on the peripheral surface of the top end of the high-voltage metal electrode 40, and the external thread may be screwed into the internal thread to make the high-voltage metal electrode 40 The consolidation is positioned within the disk 30.

上述定位座10中設置一陶瓷管20,是在定位座10中形成內環槽11,使陶瓷管20可置入定位座10而定位在內環槽11上。A ceramic tube 20 is disposed in the positioning base 10, and an inner ring groove 11 is formed in the positioning base 10 so that the ceramic tube 20 can be placed in the positioning seat 10 and positioned on the inner ring groove 11.

上述陶瓷管20中設置一圓盤30,是在陶瓷管20中形成內環槽21,使圓盤30可置入陶瓷管20中且定位在內環槽21上。A disc 30 is disposed in the ceramic tube 20, and an inner ring groove 21 is formed in the ceramic tube 20 so that the disc 30 can be placed in the ceramic tube 20 and positioned on the inner ring groove 21.

上述圓盤30上佈設複數個傾斜貫穿的斜孔31,如第二圖所示,較佳者,該等複數個斜孔31係呈同方向45度的傾斜角度,使流經其間的氣流能於介電質放電電漿區域A中產生漩渦急湍流動之紊流,使產生的電漿能充分混合予以霧化,但不應以此為限,只要是係呈同方向的傾斜角度均可以具有不同程度產生漩渦急湍流動之紊流的效果。The disc 30 is provided with a plurality of obliquely extending oblique holes 31. As shown in the second figure, preferably, the plurality of inclined holes 31 are inclined at an angle of 45 degrees in the same direction, so that the airflow flowing therethrough can The turbulent flow of the vortex turbulent flow is generated in the dielectric discharge plasma region A, so that the generated plasma can be fully mixed and atomized, but it should not be limited thereto, as long as the inclination angles in the same direction can have The effect of turbulent flow of turbulent turbulence flows to varying degrees.

上述高壓金屬電極40頂端設置一金屬連接件41及接頭421,是在高壓金屬電極40中設置一穿孔,且於穿孔中設置一階層槽401,以及連接件41中亦設置另一穿孔,穿孔中設置另一階層槽411,連接件41插設在高壓金屬電極40的階層槽401中,接頭421則係插設在連接件41的階層槽411中,連接件41及接頭421皆為導電金屬件,而可將電線42連接至接頭421,氣管62為絕緣體與外界相通,以及電線42穿出氣管62且末端接至一電源供應器(圖中未顯示),使電氣線路能傳送產生電漿使用之交流高頻高壓電力於高壓金屬電極40上,其中,陶瓷管20接地處理,且高壓金屬電極40與陶瓷管20之間所形成的介電質放電電漿區域A具有一比例尺寸的間距,底盤70接地處理,高壓金屬電極40與接地電極71之間所形成的低溫非平衡式電漿區域B亦具有一比例尺寸的間距,其中,所述介電質放電電漿區域A與低溫非平衡式電漿區域B所具有的比例尺寸之間距,是依通入其中的電漿製程氣體及所施予大小不同的電壓,而形成不同的比例尺寸,其通入電壓與間距的比值為1~5,例如:通入5kv(仟伏特)的電壓,其間距尺寸可為1~5mm;通入4kv(仟伏特)的電壓,其間距尺寸可為0.8~4mm(公釐);通入3kv(仟伏特)的電壓,其間距尺寸可為0.6~3mm(公釐);通入2kv(仟伏特)的電壓,其間距尺寸可為0.4~2mm(公釐);通入1kv(仟伏特)的電壓,其間距尺寸可為0.2~1mm(公釐),其餘可設定的仟伏特以上的高電壓與間距尺寸的關係可依此類推。A metal connecting member 41 and a joint 421 are disposed at the top end of the high-voltage metal electrode 40. A through hole is disposed in the high-voltage metal electrode 40, and a layer of the groove 401 is disposed in the through hole, and another through hole is disposed in the connecting member 41. The other layer slot 411 is disposed, the connector 41 is inserted into the layer slot 401 of the high voltage metal electrode 40, and the connector 421 is inserted into the layer slot 411 of the connector 41. The connector 41 and the connector 421 are conductive metal members. The electric wire 42 can be connected to the joint 421, the air pipe 62 is connected to the outside by the insulator, and the electric wire 42 passes through the air pipe 62 and the end is connected to a power supply (not shown), so that the electric circuit can be transmitted to generate plasma. The alternating high frequency and high voltage power is applied to the high voltage metal electrode 40, wherein the ceramic tube 20 is grounded, and the dielectric discharge plasma region A formed between the high voltage metal electrode 40 and the ceramic tube 20 has a proportional size spacing. The chassis 70 is grounded, and the low temperature unbalanced plasma region B formed between the high voltage metal electrode 40 and the ground electrode 71 also has a proportional size pitch, wherein the dielectric discharge plasma region A and The interval between the proportional dimensions of the low-temperature non-equilibrium plasma region B is based on the plasma process gas and the voltages of different sizes applied thereto, and different ratios are formed, and the ratio of the input voltage to the pitch is formed. For 1~5, for example, the voltage of 5kv (仟V) can be 1~5mm; the voltage of 4kv (仟V) can be 0.8~4mm (mm); The voltage of 3kv (仟V) can be 0.6~3mm (mm); the voltage of 2kv (仟V) can be 0.4~2mm (mm); 1kv (仟) The voltage of the volts can be 0.2 to 1 mm (mm), and the relationship between the high voltage and the pitch size of the remaining volts can be deduced by analogy.

所述之定位座10頂端設置一頂蓋60,是在定位座10頂端周面設置外螺紋,且於頂蓋60下端內壁面上設置內螺紋,頂蓋60之內螺紋可螺設在定位座10頂端之外螺紋上,其中,頂蓋60之材質可為鐵氟龍。A top cover 60 is disposed on the top end of the positioning base 10, and an external thread is disposed on the peripheral surface of the top end of the positioning base 10, and an internal thread is disposed on the inner wall surface of the lower end of the top cover 60. The internal thread of the top cover 60 can be screwed on the positioning seat. The top cover 60 may be made of Teflon.

較佳者,為了提高電漿噴流電極裝置1之電漿處理面積與均勻度,本發明上述之定位座10周面可設置一旋轉座50,如第一圖所示,是在定位座10周面設置一外環槽12,於外環槽12處設置一軸承13,並於旋轉座50內壁設置內環槽51,旋轉座50之內環槽51套設在軸承13上,藉由軸承13的轉動,可使旋轉座50可於定位座10表面進行旋轉動作,該旋轉座50底端設置一底盤70,是在旋轉座50底緣周面設置外螺紋,以及在底盤70內壁面設置內螺紋,使旋轉座50之外螺紋可螺入底盤70之內螺紋中加以螺合定位。Preferably, in order to improve the plasma processing area and uniformity of the plasma jet electrode device 1, the above-mentioned positioning seat 10 of the present invention can be provided with a rotating base 50 on the circumferential surface thereof, as shown in the first figure, at the positioning seat 10 weeks. An outer ring groove 12 is disposed on the surface, a bearing 13 is disposed on the outer ring groove 12, and an inner ring groove 51 is disposed on the inner wall of the rotary base 50. The inner ring groove 51 of the rotary seat 50 is sleeved on the bearing 13 by the bearing. The rotation of the rotating seat 50 can be rotated on the surface of the positioning base 10. The bottom of the rotating base 50 is provided with a bottom plate 70, which is provided with external threads on the peripheral surface of the bottom edge of the rotating base 50, and is disposed on the inner wall surface of the chassis 70. The internal thread enables the external thread of the rotary base 50 to be screwed into the internal thread of the chassis 70 for screwing and positioning.

若無旋轉座50的設置,該定位座10亦可以直接設置一底盤70,定位座10與底盤70可以以一體成形的方式製成,或相互間以螺合方式連接亦可。If the rotating base 50 is not provided, the positioning base 10 can also be directly provided with a chassis 70. The positioning base 10 and the chassis 70 can be integrally formed or screwed together.

上述之底盤70底端設置一噴嘴頭72,是在底盤70底端形成一向下延伸的凸部701,於凸部701周面設置外螺紋,以及在噴嘴頭72的內壁面上設置內螺紋,噴嘴頭72的內螺紋可螺合在凸部701周面的外螺紋中,其中,噴嘴頭72上所設置的複數個斜孔73,係呈向外傾斜之擴散狀或是放射線狀分佈。A nozzle head 72 is disposed at a bottom end of the chassis 70, and a downwardly extending convex portion 701 is formed at a bottom end of the chassis 70, an external thread is disposed on a circumferential surface of the convex portion 701, and an internal thread is disposed on an inner wall surface of the nozzle head 72. The internal thread of the nozzle head 72 can be screwed into the external thread of the circumferential surface of the convex portion 701. The plurality of oblique holes 73 provided on the nozzle head 72 are outwardly inclined and diffused or radiated.

請參照第三圖所示,本發明之電漿噴流電極裝置1可將電源供應器(圖中未顯示)所提供的交流高頻高壓電力經由電線42、接頭421及連接件41傳至高壓金屬電極40,而低溫常壓的大氣與電漿製程氣體,則可由氣管62進入陶瓷管20中,且經由圓盤30上所佈設的斜孔31流過介電質放電電漿區域A所產生的電漿,則形成紊流而將電漿予以霧化,霧化的電漿可經由低溫非平衡式電漿區域B產生低溫非平衡式電漿,並藉由噴嘴頭72之旋轉機制外加斜孔73噴流設計,將低溫常壓非平衡式電漿旋轉噴出,因此,本發明之設計可增加電漿處理面積與均勻性,使更具良好的電漿處理功效。Referring to the third figure, the plasma jet electrode device 1 of the present invention can transmit the AC high-frequency high-voltage power provided by the power supply (not shown) to the high-voltage metal via the wire 42, the joint 421 and the connecting member 41. The electrode 40, and the atmospheric and plasma process gas at a low temperature and normal pressure, can enter the ceramic tube 20 from the gas pipe 62, and flow through the dielectric discharge plasma region A through the inclined hole 31 disposed on the disk 30. The plasma forms a turbulent flow to atomize the plasma, and the atomized plasma can generate a low temperature unbalanced plasma through the low temperature unbalanced plasma region B, and the inclined hole is added by the rotation mechanism of the nozzle head 72. The 73 jet flow design rotates the low temperature normal pressure unbalanced plasma. Therefore, the design of the invention can increase the plasma treatment area and uniformity, and make the plasma processing effect more good.

再者,本發明之噴嘴頭亦可以設計成一字形,如第四圖所示,低溫常壓非平衡式電漿藉由一字形設計的噴嘴頭74可以形成一線狀的電漿處理區域,使本發明之電漿噴流電極裝置1應用範疇更廣泛,若是配合旋轉座50的設置,更可以形成一均勻的面狀電漿處理區域,提高處理效果。Furthermore, the nozzle head of the present invention can also be designed in a shape of a line. As shown in the fourth figure, the low-temperature atmospheric-pressure unbalanced plasma can form a linear plasma processing area by the nozzle head 74 of the in-line design. The plasma jet electrode device 1 of the invention has a wider application range. If the rotating seat 50 is provided, a uniform planar plasma processing region can be formed to improve the treatment effect.

此外,請參照第五圖所示,本發明之電漿噴流電極裝置1更包含一磁性體80,如磁鐵等,位於噴嘴頭72之周圍,由於該磁性體80之設置,可以提供一磁場給噴嘴頭72,提高通過噴嘴頭72之電漿中電子與分子的相互碰撞機率,使其增高游離狀態,使低溫常壓非平衡式電漿提高濃度,進而使電漿處理效果提高。In addition, as shown in FIG. 5, the plasma jet electrode device 1 of the present invention further includes a magnetic body 80, such as a magnet, etc., located around the nozzle head 72. Due to the arrangement of the magnetic body 80, a magnetic field can be provided. The nozzle head 72 increases the probability of collision between electrons and molecules in the plasma passing through the nozzle head 72, thereby increasing the free state, increasing the concentration of the low-temperature normal-pressure non-equilibrium plasma, and further improving the plasma treatment effect.

本發明之電漿噴流電極裝置1可進一步包含一前驅物流量控制器(圖中未顯示),用以提供並控制前驅物至低溫非平衡式電漿區域B中,其中前驅物係為有機、無機或金屬有機等鍍膜製程氣體(例如:四乙氧基矽烷、氧氣、聚乙烯、甲烷、乙炔等)或蝕刻製程氣體(例如:氫氣、四氯化碳等),使本發明之電漿噴流電極裝置1藉以應用至鍍膜或蝕刻製程上。The plasma jet electrode assembly 1 of the present invention may further comprise a precursor flow controller (not shown) for providing and controlling the precursor to the low temperature unbalanced plasma region B, wherein the precursor is organic, a coating process gas such as inorganic or metal organic (for example, tetraethoxy decane, oxygen, polyethylene, methane, acetylene, etc.) or an etching process gas (for example, hydrogen, carbon tetrachloride, etc.) to cause the plasma jet of the present invention The electrode device 1 is applied to a coating or etching process.

根據上述之構想,本發明亦提供一種電漿噴流電極系統2,請參照第六圖以及第七圖所示,本發明之電漿噴流電極系統2包含至少一個電漿噴流電極裝置1,並以一支架90將該些電漿噴流電極裝置1定位,支架90具有至少一容置空間,該些容置空間可與 電漿噴流電極裝置1相容,使電漿噴流電極裝置1可固定於容置空間中,容置空間與電漿噴流電極裝置1固定的方式,例如利用彼此的嵌合結構,或是利用扣環螺絲等零件來加以固定,固定方式並不限定。根據實際的設計需求,可以設計將電漿噴流電極裝置1以線性排列,如第七圖所示,亦可以利用複數個電漿噴流電極裝置1以面狀排列,如第八圖與第九圖所示,可以藉以大幅增加低溫常壓非平衡式電漿的處理面積。According to the above concept, the present invention also provides a plasma jet electrode system 2, as shown in the sixth and seventh figures, the plasma jet electrode system 2 of the present invention comprises at least one plasma jet electrode device 1 and A bracket 90 positions the plasma jet electrode devices 1 , and the bracket 90 has at least one accommodating space, and the accommodating spaces can be combined with The plasma jet electrode device 1 is compatible, so that the plasma jet electrode device 1 can be fixed in the accommodating space, and the accommodating space is fixed to the plasma jet electrode device 1 by, for example, using a fitting structure of each other, or using a buckle. Parts such as ring screws are fixed, and the fixing method is not limited. According to the actual design requirements, the plasma jet electrode device 1 can be designed to be linearly arranged. As shown in the seventh figure, a plurality of plasma jet electrode devices 1 can also be arranged in a planar manner, as shown in the eighth and ninth views. As shown, the processing area of the low-temperature atmospheric non-equilibrium plasma can be greatly increased.

上述電漿噴流電極系統2在以電漿處理工件(圖中未顯示)時,往往會有使工件溫度升高的狀況產生,故本發明之電漿噴流電極系統2亦提供一冷卻裝置91,請參照第十圖與第十一圖,冷卻裝置91設置於支架90之一側端,如第十一圖所示,當支架90移動並令電漿噴流電極裝置1移動處理工件時,該冷卻裝置91係為一氣冷式冷卻裝置,可以提供一氣流向下吹向工件,使提供該工件周圍之熱對流,進而降低工件本身之溫度。When the plasma jet electrode system 2 processes the workpiece by plasma (not shown), the temperature of the workpiece is often increased. Therefore, the plasma jet electrode system 2 of the present invention also provides a cooling device 91. Referring to FIG. 11 and FIG. 11 , the cooling device 91 is disposed at one side end of the bracket 90. As shown in FIG. 11 , when the bracket 90 moves and moves the plasma jet electrode device 1 to process the workpiece, the cooling is performed. The device 91 is an air-cooled cooling device that provides a flow of gas downwardly directed toward the workpiece to provide thermal convection around the workpiece, thereby reducing the temperature of the workpiece itself.

此外,本發明之電漿噴流電極系統2更進一步包含一導引裝置92,其係為滾輪,連接於支架90之下方,用以導引支架90沿著一預定方向移動,使保持電漿噴流電極裝置1與工件(圖中未顯示)之固定距離,不僅提供電漿處理之均勻性,亦可以維持支架90之穩定運作;此外,導引裝置92可以藉由一可調整之連接件920連接於支架90下方,藉由連接件920具有可以調整高度的功能,使導引裝置92可以符合不同處理工件與電漿噴流電極裝置1之距離的要求,使電漿噴流電極系統2具有更彈性的應用,符合使用者所需的特定應用目的。In addition, the plasma jet electrode system 2 of the present invention further includes a guiding device 92, which is a roller, is connected below the bracket 90 for guiding the bracket 90 to move along a predetermined direction to maintain the plasma jet. The fixed distance between the electrode device 1 and the workpiece (not shown) not only provides uniformity of plasma processing, but also maintains stable operation of the bracket 90; in addition, the guiding device 92 can be connected by an adjustable connecting member 920. Below the bracket 90, the connecting member 920 has a function of height adjustment, so that the guiding device 92 can meet the requirements of different processing workpieces from the plasma jet electrode device 1, so that the plasma jet electrode system 2 has more flexibility. The application meets the specific application goals required by the user.

綜上所述,本發明之電漿噴流電極裝置1與電漿噴流電極系統2改善了低溫常壓非平衡式電漿之處理面積與均勻性,使電漿噴流電極裝置之運用範疇更廣,不僅可以用以清潔,亦可以用於蝕刻上,提高了電漿噴流電極裝置及其系統之產業應用面,極具有產業價值。In summary, the plasma jet electrode device 1 and the plasma jet electrode system 2 of the present invention improve the processing area and uniformity of the low-temperature atmospheric-pressure non-equilibrium plasma, and make the plasma jet electrode device have a wider application range. It can be used not only for cleaning but also for etching, which improves the industrial application of the plasma jet electrode device and its system, and has great industrial value.

雖然本發明已以較佳實施例揭露如上,然其並非用以限定本 發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above in the preferred embodiments, it is not intended to limit the present invention. The invention is to be understood as being limited by the scope of the appended claims.

10‧‧‧定位座10‧‧‧ Positioning Block

11‧‧‧內環槽11‧‧‧ Inner ring groove

12‧‧‧外環槽12‧‧‧ outer ring groove

13‧‧‧軸承13‧‧‧ Bearing

20‧‧‧陶瓷管20‧‧‧Ceramic tube

21‧‧‧內環槽21‧‧‧ Inner ring groove

30‧‧‧圓盤30‧‧‧ disc

31‧‧‧斜孔31‧‧‧ oblique hole

40‧‧‧高壓金屬電極40‧‧‧High-voltage metal electrode

401‧‧‧階層槽401‧‧‧ class slot

41‧‧‧連接件41‧‧‧Connecting parts

411‧‧‧階層槽411‧‧‧ class slot

42‧‧‧電線42‧‧‧Wire

421‧‧‧接頭421‧‧‧ joint

50‧‧‧旋轉座50‧‧‧ rotating seat

51‧‧‧內環槽51‧‧‧ Inner ring groove

60‧‧‧頂蓋60‧‧‧ top cover

61‧‧‧螺孔61‧‧‧ screw holes

62‧‧‧氣管62‧‧‧ trachea

70‧‧‧底盤70‧‧‧Chassis

701‧‧‧凸部701‧‧‧ convex

71‧‧‧接地電極71‧‧‧Ground electrode

72、74‧‧‧噴嘴頭72, 74‧‧‧ nozzle head

73‧‧‧斜孔73‧‧‧ oblique hole

80‧‧‧磁性體80‧‧‧ magnetic body

90‧‧‧支架90‧‧‧ bracket

91‧‧‧冷卻裝置91‧‧‧Cooling device

92‧‧‧導引裝置92‧‧‧ Guidance device

920‧‧‧連接件920‧‧‧Connecting parts

A‧‧‧介電質放電電漿區域A‧‧‧ dielectric discharge plasma area

B‧‧‧低溫非平衡式電漿區域B‧‧‧Low temperature unbalanced plasma area

第一圖為本發明之電漿噴流電極裝置的剖面示意圖。The first figure is a schematic cross-sectional view of a plasma jet electrode device of the present invention.

第二圖為本發明之電漿噴流電極裝置中圓盤的立體示意圖。The second figure is a schematic perspective view of a disk in the plasma jet electrode assembly of the present invention.

第三圖為本發明之電漿噴流電極裝置中電漿運作的剖面示意圖。The third figure is a schematic cross-sectional view of the operation of the plasma in the plasma jet electrode assembly of the present invention.

第四圖為本發明之另一電漿噴流電極裝置的剖面示意圖。The fourth figure is a schematic cross-sectional view of another plasma jet electrode device of the present invention.

第五圖為本發明之再一電漿噴流電極裝置的剖面示意圖。Figure 5 is a cross-sectional view showing still another plasma jet electrode assembly of the present invention.

第六圖為本發明之電漿噴流電極系統的立體示意圖。Figure 6 is a perspective view of the plasma jet electrode system of the present invention.

第七圖為第六圖中電漿噴流電極系統的俯視示意圖。The seventh figure is a schematic top view of the plasma jet electrode system in the sixth figure.

第八圖為本發明之另一電漿噴流電極系統的立體示意圖。The eighth figure is a perspective view of another plasma jet electrode system of the present invention.

第九圖為第八圖中電漿噴流電極系統的俯視示意圖。The ninth drawing is a top plan view of the plasma jet electrode system in the eighth figure.

第十圖為本發明之電漿噴流電極系統增設冷卻裝置的立體示意圖。Figure 11 is a perspective view showing the addition of a cooling device to the plasma jet electrode system of the present invention.

第十一圖為第十圖中電漿噴流電極系統的側視剖面示意圖。Figure 11 is a side cross-sectional view of the plasma jet electrode system of the tenth figure.

第十二圖為本發明之電漿噴流電極系統增設導引裝置的立體示意圖。Figure 12 is a perspective view showing the addition of a guiding device for the plasma jet electrode system of the present invention.

10...定位座10. . . Positioning seat

11...內環槽11. . . Inner ring groove

12...外環槽12. . . Outer ring groove

13...軸承13. . . Bearing

20...陶瓷管20. . . ceramic pipe

21...內環槽twenty one. . . Inner ring groove

30...圓盤30. . . disc

31...斜孔31. . . Oblique hole

40...高壓金屬電極40. . . High voltage metal electrode

401...階層槽401. . . Hierarchy slot

41...連接件41. . . Connector

411...階層槽411. . . Hierarchy slot

42...電線42. . . wire

421...接頭421. . . Connector

50...旋轉座50. . . Rotating seat

51...內環槽51. . . Inner ring groove

60...頂蓋60. . . Top cover

61...螺孔61. . . Screw hole

62...氣管62. . . trachea

70...底盤70. . . Chassis

701...凸部701. . . Convex

71...接地電極71. . . Ground electrode

72...噴嘴頭72. . . Nozzle head

73...斜孔73. . . Oblique hole

A...介電質放電電漿區域A. . . Dielectric discharge plasma region

B...低溫非平衡式電漿區域B. . . Low temperature unbalanced plasma region

Claims (22)

一種電漿噴流電極裝置,其具有一定位座,於該定位座中設置一陶瓷管,該陶瓷管中設置一圓盤,該圓盤上佈設複數個呈同方向傾斜貫穿的斜孔,該圓盤中設置一高壓金屬電極,該高壓金屬電極與該陶瓷管之間形成一介電質放電電漿區域,該定位座之底端設置一底盤,該底盤之內壁設置一接地電極,該接地電極與該高壓金屬電極之間形成一低溫非平衡式電漿區域,該底盤之底端設置一噴嘴頭,用以將低溫非平衡式電漿噴出。 A plasma jet electrode device having a positioning seat, wherein a ceramic tube is disposed in the positioning seat, and a disc is disposed in the ceramic tube, and the disc is provided with a plurality of inclined holes obliquely penetrating in the same direction, the circle A high-voltage metal electrode is disposed in the disk, and a dielectric discharge plasma region is formed between the high-voltage metal electrode and the ceramic tube. A bottom plate is disposed at a bottom end of the positioning seat, and a ground electrode is disposed on an inner wall of the chassis. A low temperature unbalanced plasma region is formed between the electrode and the high voltage metal electrode, and a nozzle head is disposed at the bottom end of the chassis for ejecting the low temperature unbalanced plasma. 一種電漿噴流電極裝置,其具有一定位座,於該定位座中設置一陶瓷管,該陶瓷管中設置一圓盤,該圓盤上佈設複數個呈同方向傾斜貫穿的斜孔,該圓盤中設置一高壓金屬電極,該高壓金屬電極與該陶瓷管之間形成一介電質放電電漿區域,該定位座周面設置一旋轉座,使該定位座可以相對於該旋轉座進行旋轉運動,該旋轉座之底端設置一底盤,該底盤之內壁設置一接地電極,該接地電極與該高壓金屬電極之間形成一低溫非平衡式電漿區域,該底盤之底端設置一噴嘴頭,用以將低溫非平衡式電漿噴出。 A plasma jet electrode device having a positioning seat, wherein a ceramic tube is disposed in the positioning seat, and a disc is disposed in the ceramic tube, and the disc is provided with a plurality of inclined holes obliquely penetrating in the same direction, the circle A high-voltage metal electrode is disposed in the disk, and a dielectric discharge plasma region is formed between the high-voltage metal electrode and the ceramic tube, and a rotating seat is disposed on the circumferential surface of the positioning seat, so that the positioning seat can rotate relative to the rotating base Movement, a bottom plate is disposed at a bottom end of the rotating base, a ground electrode is disposed on an inner wall of the chassis, a low temperature unbalanced plasma region is formed between the ground electrode and the high voltage metal electrode, and a nozzle is disposed at a bottom end of the chassis The head is used to eject the low temperature unbalanced plasma. 如申請專利範圍第1或2項所述之電漿噴流電極裝置,其中該高壓金屬電極與該陶瓷管之間所形成的介電質放電電漿區域具有一間距,其中,通入該高壓金屬電極之電壓與該間距的比值範圍為1至5之間。 The plasma jet electrode device according to claim 1 or 2, wherein a dielectric discharge plasma region formed between the high voltage metal electrode and the ceramic tube has a pitch, wherein the high voltage metal is introduced The ratio of the voltage of the electrodes to the spacing ranges between 1 and 5. 如申請專利範圍第1或2所述之電漿噴流電極裝置,其中該高壓金屬電極與該接地電極之間所形成的低溫非平衡式電漿區域具有一間距,通入該高壓金屬電極之電壓與該間距的比值範圍為1至5之間。 The plasma jet electrode device according to claim 1 or 2, wherein a low temperature unbalanced plasma region formed between the high voltage metal electrode and the ground electrode has a pitch, and a voltage of the high voltage metal electrode is passed. The ratio to this spacing ranges from 1 to 5. 如申請專利範圍第1或2項所述之電漿噴流電極裝置,其中該定位座上設置一頂蓋,該頂蓋中設置一螺孔,該螺孔中設置一氣管,該高壓金屬電極之頂端設置一接頭,該接頭處接續設置一電線,該電線由該氣管穿出且接續至一高壓電端,該氣管與該電線間形成空隙,使外界空氣以及電漿製程氣體可由該氣管進入該陶瓷管中進行反應。 The plasma jet electrode device of claim 1 or 2, wherein the positioning seat is provided with a top cover, a screw hole is disposed in the top cover, and a gas pipe is disposed in the screw hole, and the high pressure metal electrode is disposed A connector is arranged at the top end, and a wire is connected to the connector, the wire is passed out of the air pipe and connected to a high voltage end, and a gap is formed between the air pipe and the wire, so that outside air and plasma process gas can enter through the air pipe. The reaction is carried out in the ceramic tube. 如申請專利範圍第1或2項所述之電漿噴流電極裝置,其中該圓盤中設置一內螺紋,以及該高壓金屬電極之頂端周面設置一外螺紋,使該高壓金屬電極之外螺紋螺設在該圓盤之內螺紋中。 The plasma jet electrode device according to claim 1 or 2, wherein an internal thread is disposed in the disk, and an external thread is disposed on a peripheral surface of the top end of the high-voltage metal electrode to make the high-voltage metal electrode externally threaded. The screw is disposed in the internal thread of the disc. 如申請專利範圍第6項所述之電漿噴流電極裝置,其中該圓盤上佈設複數個傾斜貫穿的斜孔係呈同方向45度的傾斜角度。 The plasma jet electrode device of claim 6, wherein the disk is provided with a plurality of obliquely penetrating oblique holes that are inclined at an angle of 45 degrees in the same direction. 如申請專利範圍第2項所述之電漿噴流電極裝置,其中該定位座之周面設置一外環槽,於外環槽處設置一軸承,該旋轉座之內壁設置一內環槽,該旋轉座之內環槽套設在該軸承上,使該定位座可以相對於該旋轉座進行旋轉運動。 The plasma jet electrode device of claim 2, wherein an outer ring groove is disposed on a circumferential surface of the positioning seat, a bearing is disposed at the outer ring groove, and an inner ring groove is disposed on an inner wall of the rotating seat. The inner ring groove of the rotating seat is sleeved on the bearing, so that the positioning seat can perform a rotational movement relative to the rotating base. 如申請專利範圍第1或2項所述之電漿噴流電極裝置,其中該 噴嘴頭上設置至少一個斜孔。 A plasma jet electrode device according to claim 1 or 2, wherein the At least one inclined hole is provided on the nozzle head. 如申請專利範圍第1或2項所述之電漿噴流電極裝置,其中該噴嘴頭上設置複數個斜孔,並以擴散狀或是放射線狀分佈。 The plasma jet electrode device according to claim 1 or 2, wherein the nozzle head is provided with a plurality of inclined holes and distributed in a diffuse or radial manner. 如申請專利範圍第1或2項所述之電漿噴流電極裝置,其中該噴嘴頭之出口為一字形。 The plasma jet electrode device according to claim 1 or 2, wherein the outlet of the nozzle head is in a shape of a line. 如申請專利範圍第1或2項所述之電漿噴流電極裝置,該裝置更進一步包含一磁性體,位於該噴嘴頭之周圍,提供一磁場給該噴嘴頭。 The plasma jet electrode device of claim 1 or 2, further comprising a magnetic body located around the nozzle tip to provide a magnetic field to the nozzle tip. 如申請專利範圍第1或2項所述之電漿噴流電極裝置,其中該高壓金屬電極係為一中空圓柱體。 The plasma jet electrode device of claim 1 or 2, wherein the high voltage metal electrode is a hollow cylinder. 如申請專利範圍第1或2項所述之電漿噴流電極裝置,該裝置更進一步包含一前驅物流量控制器,係用以提供並控制一前驅物至該低溫非平衡式電漿區域中,使該裝置可以應用於鍍膜或蝕刻製程。 The plasma jet electrode device of claim 1 or 2, further comprising a precursor flow controller for providing and controlling a precursor to the low temperature unbalanced plasma region, The device can be applied to a coating or etching process. 如申請專利範圍第14項所述之電漿噴流電極裝置,其中該前驅物係為有機、無機或金屬有機等鍍膜製程氣體或蝕刻製程氣體。 The plasma jet electrode device according to claim 14, wherein the precursor is a coating process gas or an etching process gas such as organic, inorganic or metal organic. 一種電漿噴流電極系統,其至少包含一如申請專利範圍第1或2項所述之電漿噴流電極裝置,以及一支架,該支架具有至少一與該電漿噴流電極裝置相容之容置空間,用以固定該電漿噴流電極裝置。 A plasma jet electrode system comprising at least one plasma jet electrode device according to claim 1 or 2, and a bracket having at least one accommodating compatibility with the plasma jet electrode device Space for fixing the plasma jet electrode device. 如申請專利範圍第16項所述之電漿噴流電極系統,其中更包含複數個電漿噴流電極裝置,該等複數個電漿噴流電極裝置以線性或是面狀排列,並設置在該支架上。 The plasma jet electrode system of claim 16, further comprising a plurality of plasma jet electrode devices, wherein the plurality of plasma jet electrode devices are arranged in a linear or planar manner and disposed on the bracket . 如申請專利範圍第16項所述之電漿噴流電極系統,其中更包含一冷卻裝置,設置於該支架之一側端,用以冷卻該電漿噴流電極系統所處理之工件。 The plasma jet electrode system of claim 16, further comprising a cooling device disposed at one side of the bracket for cooling the workpiece processed by the plasma jet electrode system. 如申請專利範圍第16項所述之電漿噴流電極系統,其中該冷卻裝置係為一氣冷式冷卻裝置。 The plasma jet electrode system of claim 16, wherein the cooling device is an air cooled cooling device. 如申請專利範圍第16項所述之電漿噴流電極系統,其中更包含一導引裝置,連接於該支架下方,用以導引該支架沿著一預定方向移動。 The plasma jet electrode system of claim 16, further comprising a guiding device coupled to the underside of the bracket for guiding the bracket to move in a predetermined direction. 如申請專利範圍第20項所述之電漿噴流電極系統,其中該導引裝置係為一滾輪。 The plasma jet electrode system of claim 20, wherein the guiding device is a roller. 如申請專利範圍第20項所述之電漿噴流電極系統,其中該導引裝置係以一可調整之連接件連接於該支架下方。The plasma jet electrode system of claim 20, wherein the guiding device is coupled to the underside of the bracket by an adjustable connecting member.
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