TWI391686B - 測量半導體晶圓性質之工作函數控制探針及其使用方法 - Google Patents

測量半導體晶圓性質之工作函數控制探針及其使用方法 Download PDF

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Publication number
TWI391686B
TWI391686B TW094115310A TW94115310A TWI391686B TW I391686 B TWI391686 B TW I391686B TW 094115310 A TW094115310 A TW 094115310A TW 94115310 A TW94115310 A TW 94115310A TW I391686 B TWI391686 B TW I391686B
Authority
TW
Taiwan
Prior art keywords
substance
semiconductor wafer
electronic
contact
coating
Prior art date
Application number
TW094115310A
Other languages
English (en)
Chinese (zh)
Other versions
TW200538748A (en
Inventor
H Howland William Jr
J Hillard Robert
Steven Chi Shin Hung
Original Assignee
Solid State Measurements Inc
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solid State Measurements Inc, Applied Materials Inc filed Critical Solid State Measurements Inc
Publication of TW200538748A publication Critical patent/TW200538748A/zh
Application granted granted Critical
Publication of TWI391686B publication Critical patent/TWI391686B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW094115310A 2004-05-14 2005-05-11 測量半導體晶圓性質之工作函數控制探針及其使用方法 TWI391686B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/845,815 US7023231B2 (en) 2004-05-14 2004-05-14 Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof

Publications (2)

Publication Number Publication Date
TW200538748A TW200538748A (en) 2005-12-01
TWI391686B true TWI391686B (zh) 2013-04-01

Family

ID=34939824

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115310A TWI391686B (zh) 2004-05-14 2005-05-11 測量半導體晶圓性質之工作函數控制探針及其使用方法

Country Status (6)

Country Link
US (1) US7023231B2 (enExample)
EP (1) EP1596212B1 (enExample)
JP (1) JP2005333148A (enExample)
AT (1) ATE408154T1 (enExample)
DE (1) DE602005009603D1 (enExample)
TW (1) TWI391686B (enExample)

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US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
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US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
CA2570886A1 (en) 2004-07-07 2006-02-16 Cascade Microtech, Inc. Probe head having a membrane suspended probe
DE202005021435U1 (de) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Doppelseitige Prüfaufbauten
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7282941B2 (en) * 2005-04-05 2007-10-16 Solid State Measurements, Inc. Method of measuring semiconductor wafers with an oxide enhanced probe
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US20070294047A1 (en) * 2005-06-11 2007-12-20 Leonard Hayden Calibration system
US7619419B2 (en) 2005-06-13 2009-11-17 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7637009B2 (en) * 2006-02-27 2009-12-29 Sv Probe Pte. Ltd. Approach for fabricating probe elements for probe card assemblies using a reusable substrate
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US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
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US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US20080290889A1 (en) * 2007-05-24 2008-11-27 Solid State Measurements, Inc. Method of destructive testing the dielectric layer of a semiconductor wafer or sample
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US20200233033A1 (en) * 2019-01-17 2020-07-23 Intel Corporation Test probe for wafer-level and panel-level testing
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US6181144B1 (en) * 1998-02-25 2001-01-30 Micron Technology, Inc. Semiconductor probe card having resistance measuring circuitry and method fabrication
TW200306425A (en) * 2002-04-11 2003-11-16 Solid State Measurements Inc Non-invasive electrical measurement of semiconductor wafers

Also Published As

Publication number Publication date
EP1596212A1 (en) 2005-11-16
EP1596212B1 (en) 2008-09-10
US20050253618A1 (en) 2005-11-17
ATE408154T1 (de) 2008-09-15
JP2005333148A (ja) 2005-12-02
US7023231B2 (en) 2006-04-04
TW200538748A (en) 2005-12-01
DE602005009603D1 (de) 2008-10-23

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