TWI384564B - And a method for producing a self-forming structure of a viscose formed in a wafer - Google Patents

Description

Method for manufacturing adhesive self-forming structure formed on wafer

The present invention relates to a method for manufacturing a viscous cloth, and more particularly to a method for manufacturing a self-forming structure of a viscous film formed on a wafer using a semiconductor process.

A method for fabricating a wafer to a plurality of electronic components includes first preparing a substrate and forming a plurality of circuit units on a top surface of the substrate.

A further cutting step is performed to cut the wafer into a plurality of chips corresponding to the circuit unit formed on the substrate.

Then, a solid crystal step is performed, the adhesive is spotted on a lead pad of a lead frame, and then a single wafer is placed on the adhesive, and the wafer is fixed by the adhesive. On the wafer pad.

As can be seen from the above description, the process from the uncut wafer to the die bonding requires a lot of man-hours because the glue is applied between the single wafer pad and the single wafer.

In addition to appearing in earlier leadframe packaging, such a deficiency also presents similar problems in ball grid array (BGA), wafer size package ball placement processes.

The above-described grid array assembly and wafer size packaging are in response to the increasing function of the wafer, so that the number of external contacts of the wafer needs to be increased to meet the increasing transmission signal flow rate.

Corresponding to the large number of contacts, it is required to plant a ball Array for subsequent electrical connection on the contacts of the wafer one by one, so that the process of implanting the solder balls one by one on the contacts of the wafer is In other words, it highlights the shortcomings of working hours.

Regardless of the manufacturing process, how to provide a manufacturing method that can reduce the steps of dispensing, crystallizing, etc. of the die bonding process, and reduce the man-hours of placing solder balls on the contacts of the wafers, The focus of academic research.

Accordingly, it is an object of the present invention to provide a method of manufacturing a self-forming structure of a viscose formed on a wafer that can improve the efficiency of coating.

Therefore, in the manufacturing method of the self-molded structure of the adhesive formed on the wafer of the present invention, first, a plurality of regularly arranged circuit units are formed on a top surface of a substrate, and a plurality of circuit units are defined on a bottom surface of the substrate. The corresponding first zone, and the plurality of second zones respectively surrounding the first zone.

Further, a hydrophilic material layer is formed on the bottom surface of the substrate, and the constituent material of the hydrophilic material layer tends to cover the entire surface when a liquid adhesive cloth is coated.

Then, the hydrophilic material layer on the second regions is removed to expose the bottom surface of the substrate, and the hydrophilic material layer on the first regions is retained.

And forming a hydrophobic material layer on the bottom surface of the bare second region substrate and the first regions, the hydrophobic material layer has a substantial thickness and the The hydrophilic material layer is the same, and the constituent material tends to be polycondensed into beads when the liquid adhesive cloth is covered.

Finally, the layer of hydrophobic material on the first regions is removed, and the layer of hydrophobic material on the second regions is retained to complete the self-forming structure of the adhesive.

Wherein, the viscose auto-molded structure is provided for self-correction of the liquid glue to the first regions, and self-forming a substantially hemispherical viscose bead.

Further, another method of manufacturing the viscose auto-formed structure formed on the wafer includes the following steps.

The circuit units are first formed on the top surface of the substrate.

A material layer is further formed on the bottom surface of the substrate.

Then, the first regions corresponding to the circuit cells are defined in the material layer, and the second regions surrounding the first regions respectively.

Finally, a hydrophobic column having a complex average height of 32 um is defined in each of the material layers of the second region, and the hydrophobic columns are spaced apart from each other by 30 um to 80 um; the liquid viscose tends to be in the second due to the hydrophobic columns The regions are condensed into beads, and in the first regions tend to cover the surface.

The effect of the invention is that after the self-forming structure of the adhesive is made, the cohesive force of the adhesive itself interacts with the surface properties of the first and second regions, so that the adhesive contacts the self-forming structure and is positioned in the pair. Should wait for the first zone of the circuit unit and be a hemispherical adhesive bead. The adhesive can be coated at one time to effectively improve the adhesive efficiency of the coating.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of FIG.

Referring to Figure 1, a first preferred embodiment of a method of fabricating a self-forming structure 3 of a paste formed on a wafer of the present invention comprises the following steps.

First, a step 81 is performed to form a plurality of regularly arranged circuit units 2 by using a semiconductor process on the top surface of a substrate 1.

Further, a plurality of first regions 31 corresponding to the circuit units 2 and a plurality of second regions 32 respectively surrounding the first regions 31 are defined on the bottom surface of the substrate 1.

A further step 82 is performed to form a hydrophilic material layer 4 on the bottom surface of the substrate 1.

Wherein, the hydrophilic material layer 4 is a hydrophilic material selected from the group consisting of ruthenium, gallium arsenide (GaAs), sapphire, gold, titanium, copper, etc., and one of these is combined to form a conductive film, and a liquid adhesive 6 is covered. In the hydrophilic material layer 4, the contact angle with the hydrophilic material layer 4 is small, and tends to cover the entire surface, that is, the interfacial tension between the hydrophilic material layer 4 and the adhesive 6 is greater than the cohesive force of the adhesive 6 itself. .

Next, a step 83 is performed to remove the hydrophilic material layer 4 on the second regions 32 to expose the bottom surface of the substrate 1.

And in this step 83, the hydrophilic material layer 4 on the first regions 31 is retained.

Then, a step 84 is performed to form a hydrophobic material layer 5 on the bottom surface of the bare second region 32 substrate 1 and the first regions 31.

The thickness of the hydrophobic material layer 5 is substantially the same as that of the hydrophilic material layer 4.

The hydrophobic material layer 5 is selected from the group consisting of photosensitive polymer materials, and the micro-columnar structure formed therein, so that when the liquid adhesive 6 is coated on the hydrophobic material layer 5, it tends to be polycondensed into beads, that is, the adhesive. The self-cohesion of 6 is greater than the interfacial tension with the layer 5 of hydrophobic material, so that the adhesive 6 is easily rolled and is not easily attached to the layer 5 of hydrophobic material.

Finally, a step 85 is performed to remove the layer of hydrophobic material 5 on the first regions 31 and to retain the layer of hydrophobic material 5 on the second regions 32.

Since the hydrophobic material layer 5 is equivalent to the thickness of the hydrophilic material layer 4, the finished product of the adhesive auto-molded structure 3 is a flat surface, and the hydrophobic material layer 5 and the hydrophilic material layer 4 correspond to a circuit. The unit 2 is regularly distributed on the bottom surface of the substrate 1.

The self-forming structure 3 of the adhesive formed on the wafer, which is completed by the above steps, is automatically positioned when the liquid adhesive 6 contacts the adhesive self-forming structure 3.

If the adhesive 6 contacts the second regions 32, since the hydrophobic material layer 5 is formed on the second regions 32, the adhesive 6 can automatically correct the position and is positioned to form the hydrophilic material layer 4. On the first zone 31, a substantially hemispherical viscose bead 6 is formed by itself.

Referring to FIG. 2, it is worth mentioning that a step 86 can be performed to roughen the hydrophobic material layer 5 to an average roughness of 32 um to improve the hydrophobic property of the hydrophobic material layer 5, so that the positioning of the adhesive 6 is more precise. .

Referring to FIG. 3, the second preferred embodiment of the present invention is substantially the same as the manufacturing method of the first preferred embodiment, except that the hydrophilic material layer 4 and the hydrophobic material in the first preferred embodiment are different. Layer 5 is formed in the reverse order.

In a second preferred embodiment, the layer of hydrophobic material 5 is first formed in a step 82'.

The hydrophobic material layer 5 on the first regions 31 is removed again in a step 83'.

A step 84' is then performed to form the hydrophilic material layer 4 on the bare first regions 31 and the second regions 32.

Finally, a step 85' is performed to remove the hydrophilic material layer 4 on the second regions 32, that is, to complete the adhesive self-forming structure 3, and the finished product of the second preferred embodiment and the first preferred The examples are no different.

Referring to Figure 4, a third preferred embodiment of the present invention comprises the following steps.

Similarly, a step 91 is first performed to form the regularly arranged circuit units 2 on the top surface of the substrate 1.

Next, a step 92 is performed to form a material layer 7 on the bottom surface of the substrate 1 by spin coating.

And the material layer 7 is selected from a photosensitive polymer material, and one of these is combined to form a micro-columnar structure.

The first layer 31 corresponding to the circuit units 2 and the second regions 32 respectively surrounding the first regions 31 are defined in the material layer 7.

Then, a step 93 is performed to form a plurality of hydrophobic columns 71 in the material layer 7 of each of the second regions 32 by a thin film deposition process, that is, the adhesive automorphic structure is completed.

The average height of the hydrophobic columns 71 is 32 um, and the spacing between the two hydrophobic columns 71 is 60 um. The shape of the single hydrophobic column 71 may be a pyramidal column, a conical column, a bee groove, and a truncated cone.

Due to the structural characteristics of the hydrophobic columns 71, the liquid glue 6 does not easily stay on the second regions 32.

In contrast, the adhesive 6 is more easily covered on the first regions 31, so the adhesive 6 is positioned in the first region 31 by the self-forming structure 3 of the adhesive, and is self-formed into a glue. Bead 6.

Referring to FIG. 5, it is worth mentioning that a step 94 can also be performed to remove the material layer 7 on the first regions 31, and expose the bottom surface of the substrate 1 of the first regions 31, which also has a hydrophilic effect.

By using the manufacturing method of the self-forming structure 3 of the adhesive formed on the wafer of the present invention, after the self-forming structure 3 of the adhesive is completed, when the invention is applied to the solid-crystal manufacturing process, the wafer is first matched with the circuit. The unit 2 is cut into a plurality of wafers, but the wafers are still gathered into the wafer, and the liquid glue 6 is applied to the bottom surface of the wafer at a time, thereby saving the working time of the adhesive 6 and using the same. The self-forming structure 3 on the wafer, the liquid glue 6 is positioned in the first region 31 to form a glue Bead 6.

Thereby, the subsequent process reuses the adhesive beads 6 formed on the wafers, and the wafers are initially adhered to the wafer pads, and then the heat treatment process is performed to dissolve the viscose beads 6 and then consolidated. On the wafer pad, the solid crystal process is completed quickly.

Since the adhesive 6 is coated on all the wafers on the wafer at one time, and the self-forming structure is used, the adhesive 6 can be automatically positioned at the first region 31 while being covered, instead of once. The process of dispensing only a single wafer can greatly reduce the man-hours of the glue 6 and simplify the process.

In addition, since the grid array structure and the crystal scale structure are required to implant a large number of solder balls on a wafer having a plurality of pins.

Therefore, when the adhesive self-molding structure 3 obtained by the invention is applied to the array assembly, the self-molding structure 3 is grown at the pin position of the wafer, so that the liquid solder can be coated. Automatically correcting the position and positioning it on the pins allows the liquid solder to be positioned once.

Therefore, it is not necessary to spend working hours at each pin point, which also simplifies the ball processing process and reduces the working hours.

In addition to the above advantages, the viscose auto-formed structure 3 produced by the present invention has the advantage of being quantitative of the viscose 6. With the above process of the present invention, the area of each of the first regions 31 can be precisely defined, and the amount of the glue 6 covered by each of the first regions 31 can be fixed to improve the overall flatness of the wafer.

In summary, the liquid viscose 6 has different wetting ability for the first region 31 and the second regions 32, so that the liquid adhesive 6 tends to be far away when it is coated on the self-forming structure of the wafer. The second regions 32 are converge on the first regions 31 and are self-formed into the beads 6 on the first regions 31, thereby improving the efficiency of the coating of the adhesive 6, so that the present invention can be achieved. The purpose.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

1‧‧‧Substrate

2‧‧‧ circuit unit

3‧‧‧Viscose auto-formed structure

31‧‧‧First District

32‧‧‧Second District

4‧‧‧Hydrophilic material layer

5‧‧‧Water-repellent material layer

6‧‧‧Viscos

7‧‧‧Material layer

71‧‧‧Drained column

81‧‧‧Steps

82‧‧‧Steps

83‧‧‧Steps

84‧‧‧Steps

85‧‧‧Steps

86‧‧‧Steps

81'‧‧‧Steps

82'‧‧‧Steps

83'‧‧‧ steps

84'‧‧‧ steps

85'‧‧‧Steps

91‧‧‧Steps

92‧‧‧Steps

93‧‧‧Steps

94‧‧‧Steps

1 is a schematic flow chart showing a first preferred embodiment of a method for manufacturing a self-forming structure of a viscose formed on a wafer according to the present invention; and FIG. 2 is a schematic view showing a thick portion of the first preferred embodiment. FIG. 3 is a view similar to FIG. 1 illustrating a second preferred embodiment of the method for fabricating a self-forming structure of a viscose formed on a wafer according to the present invention; FIG. 4 is a flow diagram illustrating the present invention. A third preferred embodiment of a method of fabricating a self-forming structure of a glue formed on a wafer; and FIG. 5 is a schematic view showing a material layer of the first preferred embodiment removed from the third preferred embodiment.

1‧‧‧Substrate

2‧‧‧ circuit unit

3‧‧‧Viscose auto-formed structure

31‧‧‧First District

32‧‧‧Second District

6‧‧‧Viscos

7‧‧‧Material layer

71‧‧‧Drained column

91‧‧‧Steps

92‧‧‧Steps

93‧‧‧Steps

Claims (14)

A method for manufacturing a self-forming structure of a viscose formed on a wafer, comprising: (a) forming a plurality of regularly arranged circuit units on a top surface of a substrate, and defining a plurality of circuit elements on the bottom surface of the substrate Corresponding first region, and a plurality of second regions respectively surrounding the first regions; (b) forming a hydrophilic material layer on the bottom surface of the substrate, the constituent material of the hydrophilic material layer tends to cover a liquid adhesive tape Covering the entire surface; (c) removing the hydrophilic material layer on the second regions to expose the bottom surface of the substrate, retaining the hydrophilic material layer on the first regions; (d) the bare second region substrates The bottom surface and the first regions form a hydrophobic material layer having a thickness substantially the same as the hydrophilic material layer, and the constituent material tends to be polycondensed into beads when the liquid adhesive cloth is coated; and (e) In addition to the hydrophobic material layers on the first regions, the hydrophobic material layers on the second regions are retained to complete the self-forming structure of the adhesive, wherein the adhesive self-forming structure is provided for self-correction of the liquid adhesive to The first zone, and self-forming a substance Hemispherical bead of glue. The method for producing a wafer-formed viscose auto-molded structure according to claim 1, wherein the hydrophilic material layer is selected from the group consisting of ruthenium, gallium arsenide, sapphire, gold, titanium, copper, and the like. Water, and a combination of these, is made into a film. Wafer-formed self-body formed on wafer according to item 1 of the patent application scope A method for producing a molded structure, wherein the hydrophobic material layer is a micro-columnar structure selected from a photosensitive polymer. The method for manufacturing a wafer-formed viscose auto-formed structure according to claim 1, further comprising a step (f) of roughening the hydrophobic material layer to an average roughness of 32 μm. A method for manufacturing a self-forming structure of a viscose formed on a wafer, comprising: (a) forming a plurality of regularly arranged circuit units on a top surface of a substrate, and defining a plurality of circuit elements on the bottom surface of the substrate Corresponding first region, and a plurality of second regions surrounding the first regions respectively; (b) forming a hydrophobic material layer on the bottom surface of the substrate, the constituent material of the hydrophobic material layer tending to cover the liquid adhesive tape Polycondensing into beads; (c) removing the hydrophobic material layer on the first regions to expose the bottom surface of the substrate, retaining the hydrophobic material layer on the second regions; (d) the bare first region substrates Forming a hydrophilic material layer on the bottom surface and the second regions, the hydrophilic material layer having substantially the same thickness as the hydrophobic material layer, and the constituent material tends to cover the entire surface when the liquid adhesive cloth is covered; and (e) Removing the hydrophilic material layer on the second regions, and retaining the hydrophilic material layer on the first regions to complete the self-forming structure of the adhesive, wherein the adhesive self-forming structure is provided for self-correction of the liquid adhesive To the first district and self-forming On the hemispherical glue beads. The method for manufacturing a wafer-formed viscose auto-formed structure according to claim 5, wherein the hydrophilic material layer is selected from the group consisting of A hydrophilic water material such as gallium arsenide, sapphire, gold, titanium or copper, and a combination thereof is used to form a film. The method for producing a self-forming structure of a wafer-formed viscose according to claim 5, wherein the hydrophobic material layer is a micro-columnar structure selected from a photosensitive polymer. The method for manufacturing a wafer-formed viscose auto-formed structure according to claim 5, further comprising a step (f) of roughening the hydrophobic material layer to an average roughness of 32 μm. A method for manufacturing a self-forming structure of a viscose formed on a wafer, comprising: (a) forming a plurality of regularly arranged circuit units on a top surface of a substrate; (b) forming a material layer on a bottom surface of the substrate; The material layer defines a plurality of first regions corresponding to the circuit elements, and a plurality of second regions respectively surrounding the first regions; and (c) defining a complex average height for the material layers of each of the second regions a 32 um hydrophobic column, and the hydrophobic columns are spaced apart from each other by a range of 30 μm to 80 μm to complete the self-forming structure of the adhesive, wherein the hydrophobic columns tend to condense a liquid adhesive on the second regions. Beaded, and in the first region, tend to cover the surface, and the adhesive self-forming structure is used for the liquid glue to self-correct the position to the first regions, and is self-formed into a substantially hemispherical shape. Viscose beads. The method for manufacturing a self-forming structure of a wafer-formed adhesive according to claim 9 further comprises a step (d) of removing the first A layer of material on a zone. The method for producing a self-forming structure of a wafer-formed viscose according to claim 9, wherein the material layer is a micro-columnar structure selected from the group consisting of photosensitive polymer materials. According to the manufacturing method of the wafer-formed viscose self-molding structure according to claim 9, in the step (b), the material layer is formed on the bottom surface of the substrate by spin coating. The method for manufacturing a self-forming structure of a wafer-formed viscose according to claim 9, wherein the hydrophobic columns may be in the shape of a pyramidal column, a conical column, a bee, and a truncated cone. The method for manufacturing a wafer-formed viscose auto-molded structure according to claim 9, wherein the step (c) is to form the hydrophobic columns by a yellow light process.