CN106206485A - Imageing sensor module and preparation method thereof - Google Patents
Imageing sensor module and preparation method thereof Download PDFInfo
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- CN106206485A CN106206485A CN201610834804.0A CN201610834804A CN106206485A CN 106206485 A CN106206485 A CN 106206485A CN 201610834804 A CN201610834804 A CN 201610834804A CN 106206485 A CN106206485 A CN 106206485A
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- image sensing
- image sensor
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- imageing sensor
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
Abstract
The embodiment of the invention discloses a kind of imageing sensor module, including: image sensor chip and at least one companion chip, described image sensor chip and at least one companion chip described are encapsulated as a chip packing-body by capsulation material, and the circuit face of described image sensor chip and at least one companion chip described is towards same direction；Described image sensor chip includes image sensing cell, and it is arranged on the packaged glass above described image sensing cell incidence surface, described chip packing-body front forms the light hole corresponding with described packaged glass, the back side of described chip packing-body is formed with the rewiring figure that the weld pad with the weld pad of described image sensor chip and at least one companion chip described electrically connects, and described rewiring figure is formed with multiple salient point；Lens bracket, is arranged on the front of described chip packing-body, and described lens bracket and is fixed with lens group.The present invention improves the reliability of imageing sensor module, reduces wiring difficulty.
Description
Technical field
The present invention relates to sensor field, be specifically related to a kind of imageing sensor module and preparation method thereof.
Background technology
Image sensor chip is a kind of semiconductor device can experienced extraneous light and convert thereof into the signal of telecommunication.At figure
After completing as sensing chip, first image sensor chip is carried out a series of packaging technology, then install microscope base support and
Camera lens, forms an imageing sensor module.Imageing sensor module be mainly used in smart mobile phone, panel computer, digital camera,
The electronic equipment such as automobile travel recorder and toy for children.
Existing image sensor chip method for packing is mainly COB (Chip On Board) encapsulation, is conducted electricity by bare chip
Or non-conductive adhesive is attached on interconnection substrate, then carries out wire bonding and realize its electrical connection.The image sensing of prior art
Single image sensing chip is simply encapsulated by device method for packing, and imageing sensor module also includes a lot of peripheral companion chip,
Such as picture processing chip, central processing element and driving chip etc., these chips need to be attached on Rigid Flex, but
Such structure has the disadvantage in that
Rigid Flex has certain flexibility, and therefore, Rigid Flex, when there is bending and collision, is attached to thereon
The easy weld pad of components and parts ruptures so that the reliability of imageing sensor module reduces；And, Rigid Flex to attach peripheral auxiliary
Helping chip, will certainly increase the number of plies of Rigid Flex, wiring difficulty also can increase.
Summary of the invention
In view of this, the present invention proposes a kind of imageing sensor module and preparation method thereof, to solve conventional images sensing
The problem that device module exists, improves the reliability of imageing sensor module, reduces wiring difficulty.
On the one hand, embodiments provide a kind of imageing sensor module, including:
Image sensor chip and at least one companion chip, image sensor chip and at least one companion chip are by plastic packaging material
Material is encapsulated as a chip packing-body, and, the circuit face of image sensor chip and at least one companion chip is towards same
Direction；
Image sensor chip includes image sensing cell, and is arranged on the encapsulation above this image sensing cell incidence surface
Glass, said chip packaging body front forms the light hole corresponding with packaged glass, and its back side is formed and image sensor chip
Weld pad and at least one companion chip weld pad electrical connection rewiring figure, this rewiring figure is formed multiple convex
Point；
Lens bracket, is arranged on the front of said chip packaging body, and this lens bracket and is fixed with lens group, lens group
Including at least one blooming piece.
Exemplarily, above-mentioned capsulation material covers the incidence surface edge of packaged glass, to form light hole.
Exemplarily, this imageing sensor module, also include Rigid Flex, Rigid Flex includes conductive circuit layer,
And be arranged on the multiple weld pads on this Rigid Flex front, the plurality of weld pad respectively with the rewiring at the chip packing-body back side
Multiple salient points electrical connection on figure.
Exemplarily, the Rigid Flex back side is provided with reinforcement steel plate.
Exemplarily, packaged glass is infrared filter glass；
Or, at least one blooming piece in lens group is infrared filtering blooming piece；
Or, it being provided with infrared filtering blooming piece between lens group and packaged glass, this infrared filtering blooming piece is solid
It is scheduled on lens bracket.
Exemplarily, companion chip include picture processing chip, central processing element, lens group driving chip and passively unit
One or more in device.
Exemplarily, image sensing cell and packaged glass are bonded by glue and are integrated.
On the other hand, embodiments provide the manufacture method of a kind of imageing sensor module, including:
Image sensor chip and at least one companion chip are encapsulated as a chip packing-body, Qi Zhongtu by capsulation material
As sensing chip includes image sensing cell, and it is arranged on the packaged glass above this image sensing cell incidence surface, at core
Sheet packaging body front forms the light hole corresponding with packaged glass；
The weld pad electricity of the weld pad with image sensor chip and at least one companion chip is formed at the back side of chip packing-body
The rewiring figure connected, this rewiring figure is formed with multiple salient point；
The front of chip packing-body install lens bracket, this lens bracket is fixed with lens group, lens group include to
A few blooming piece.
Exemplarily, the manufacture method of this imageing sensor module, also include:
Thering is provided Rigid Flex, this Rigid Flex includes conductive circuit layer, and is arranged on Rigid Flex front
Multiple weld pads；
Multiple weld pads of Rigid Flex are electric with the multiple salient points rerouted on figure at the chip packing-body back side respectively
Connect.
Exemplarily, above-mentioned image sensor chip and at least one companion chip are encapsulated as a chip by capsulation material
Packaging body includes:
There is provided and support substrate, image sensor chip and at least one companion chip；
Attach to support on substrate by image sensor chip and at least one companion chip；
Utilizing capsulation material is a chip packing-body by image sensor chip and at least one companion chip plastic packaging；
Peel off and support substrate.
Exemplarily, it is provided that an image sensor chip includes:
Thering is provided packaged glass and image sensing wafer, image sensing wafer includes multiple image sensing cell, at encapsulation glass
Form box dam on glass, and be bonded with image sensing cell and be integrated；
Make silicon through hole at image sensing wafer rear, and expose pad in silicon via bottoms；
Depositing insulating layer in image sensing wafer rear and silicon through hole；
By drilling technique, the pad of silicon via bottoms is come out；
Depositing metal level in image sensing wafer rear and silicon through hole, row metal of going forward side by side thickens；
Photoetching process is used to remove unnecessary metal level and form the weld pad of image sensor chip, with described image sensing list
Unit senses wafer to obtain independent image sensor chip for unit cutting image.
Exemplarily, the above-mentioned rewiring figure that makes at the back side of chip packing-body includes:
At the backside deposition metal level of chip packing-body, row metal of going forward side by side thickens；
Use photoetching process that metal level is processed and reroute figure to be formed；
Carrying out nickel gold process rerouting patterned surface, and encapsulate solder mask, being exposed by exposure imaging needs to plant ball
Weld pad；
Stannum ball is made, to form the multiple salient points rerouted on figure on weld pad surface.
Embodiments providing a kind of imageing sensor module and preparation method thereof, this imageing sensor module passes through
Image sensor chip and at least one companion chip are encapsulated as a chip packing-body, it is achieved that image sensor chip and at least
The system in package of one companion chip, effectively prevent the weld pad fracture of companion chip, and improve image sensing module can
By property, decrease the wiring number of plies of companion chip simultaneously, reduce wiring difficulty.
Accompanying drawing explanation
The structural representation of the imageing sensor module that Fig. 1 provides for the embodiment of the present invention one；
The structural representation of the imageing sensor module that Fig. 2 provides for the embodiment of the present invention two；
The manufacture method flow chart of the imageing sensor module that Fig. 3 provides for the embodiment of the present invention three；
The image sensor chip manufacture method process figure that Fig. 4 a to Fig. 4 r provides for the embodiment of the present invention four；
The process figure of the chip packing-body manufacture method that Fig. 5 a to Fig. 5 l provides for the embodiment of the present invention four；
The assembling procedure block diagram of the imageing sensor module that Fig. 6 a to Fig. 6 d provides for the embodiment of the present invention four.
Detailed description of the invention
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that, in order to just
Part related to the present invention is illustrate only and not all in description, accompanying drawing.
Embodiment one
The structural representation of the imageing sensor module that Fig. 1 provides for the embodiment of the present invention one.The embodiment of the present invention provides
Imageing sensor module can apply to smart mobile phone, panel computer, digital camera, automobile travel recorder and toy for children
Deng electronic equipment.
As it is shown in figure 1, the imageing sensor module that the present embodiment provides, including:
Image sensor chip 110 and at least one companion chip 120, image sensor chip 110 and at least one auxiliary wick
Sheet 120 is encapsulated as a chip packing-body 100 by capsulation material 101, and, image sensor chip 110 and at least one auxiliary
The circuit face of chip 120 is towards same direction；
Image sensor chip 110 includes image sensing cell 111, and is arranged on this image sensing cell 111 incidence surface
The packaged glass 112 of top, said chip packaging body 100 front forms the light hole 102 corresponding with packaged glass 112, its back of the body
Face is formed with the rewiring figure that the weld pad of the weld pad with image sensor chip 110 and at least one companion chip 120 electrically connects,
Multiple salient point 103 it is formed with on this rewiring figure；
Lens bracket 130, is arranged on the front of said chip packaging body 100, and this lens bracket 130 and is fixed with camera lens
Group 140, lens group 140 includes at least one blooming piece 141.
Blooming piece 141 can be sheet glass, or resin plastic tablet.
Plastic packaging is a kind of technology replacing the encapsulating electronic components such as metal, glass, pottery with plastics, with prior art phase
Ratio, in the imageing sensor module that the embodiment of the present invention one provides, image sensor chip 110 and at least one companion chip 120
Being encapsulated as a chip packing-body 100 by capsulation material 101, it is to avoid in prior art, imageing sensor module is by outward
During portion's active force, the situation of the companion chip generation weld pad fracture of its periphery.
Alternatively, capsulation material can be epoxy-plastic packaging material, and the imageing sensor module that the present embodiment provides passes through plastic packaging
Image sensor chip 110 and at least one companion chip 120 are encapsulated as a chip packing-body 100 by technique, it is achieved system-level
Encapsulation, wherein, image sensor chip 110 and at least one companion chip 120 in chip packing-body 100 are to put down in two dimensions
Paving, its circuit face is towards same direction.Preferably, the circuit face of image sensor chip 110 and at least one companion chip 120
Weld pad can at grade, and such structure is conducive to carrying out at the back side of chip packing-body 100 rerouting technique.Due to
At least one companion chip 120, is rerouted with image sensor chip 110 by plastic packaging in chip packing-body 100 simultaneously, because of
This decreases the wiring number of plies, reduces wiring difficulty.
Alternatively, if companion chip 120 mounts too much, when the one side of chip packing-body 100 fails to lay down, it is also possible to
Opening hole, and filler metal in through-holes in plastic packaging layer, then the another side at chip packing-body 100 mounts companion chip 120.
In the imageing sensor module that the embodiment of the present invention one provides, image sensor chip 110 includes image sensing cell
111, and it is arranged on the packaged glass 112 above this image sensing cell 111 incidence surface, wherein, chip packing-body 100 front
Form the light hole 102 corresponding with packaged glass.Exemplarily, this light hole 102 is covered at packaged glass by capsulation material 101
The incidence surface edge of 112 is formed so that extraneous light is radiated on image sensing cell 111 through packaged glass 112.
Alternatively, embedded structure is formed at the incidence surface edge of packaged glass 112 with capsulation material 101 contact position so that
Plastic packaging layer clenches packaged glass 112, improves the Mechanical Reliability of imageing sensor module.
The embodiment of the present invention one provides a kind of imageing sensor module, and this imageing sensor module is by by image sensing
Chip and at least one companion chip are encapsulated as a chip packing-body, it is achieved that image sensor chip and at least one auxiliary wick
The system in package of sheet, effectively prevent the weld pad fracture of companion chip, improves the reliability of image sensing module, subtract simultaneously
Lack the wiring number of plies of companion chip, reduce wiring difficulty.
Embodiment two
The structural representation of the imageing sensor module that Fig. 2 provides for the embodiment of the present invention two.As in figure 2 it is shown, further
Ground, the imageing sensor module that the present embodiment provides also includes Rigid Flex 150, and wherein, Rigid Flex 150 includes conduction
Line layer, and be arranged on the multiple weld pads on this Rigid Flex 150 front, multiple weld pads respectively with chip packing-body 100
The multiple salient points 103 rerouted on figure at the back side electrically connect.
Rigid Flex, i.e. flexible circuit board (FPC) and rigid wiring board (PCB), through operations such as pressings, by relevant work
Skill requires to combine, the wiring board with FPC characteristic and PCB characteristic of formation.The image that the embodiment of the present invention two provides
Sensor module is attached on Rigid Flex 150, the existing certain flexure region of Rigid Flex 150, also has certain firm
Property region, contribute to save imageing sensor module internal space, improve imageing sensor module performance.
Alternatively, Rigid Flex 150 back side is provided with reinforcement steel plate 160.
For filtering infrared light, improve the image quality of imageing sensor, typically arrange red in imageing sensor module
Outer optical filtering blooming piece.Infrared filtering blooming piece position in imageing sensor module does not limits, alternatively, and lens group
Being provided with infrared filtering blooming piece 170 between 140 and packaged glass 112, this infrared filtering blooming piece 170 is fixed on camera lens
On support 130.
Alternatively, packaged glass 112 is infrared filter glass, or, at least one blooming piece in lens group 140
141 is infrared filtering blooming piece.
Alternatively, the companion chip 120 in the embodiment of the present invention can include picture processing chip, central processing element,
One or more in lens group driving chip and Passive components, wherein, passive device includes electric capacity, resistance and inductance etc..
Alternatively, image sensing cell 111 and packaged glass 112 are bonded by glue and are integrated.
Alternatively, packaged glass 112 is formed with box dam, in order to during image sensing cell 111 pressing formed cavity.
The embodiment of the present invention two provides a kind of imageing sensor module, and this imageing sensor module is by by image sensing
Chip and at least one companion chip are encapsulated as a chip packing-body, and are attached on Rigid Flex, save image and pass
Sensor module internal space, it is achieved that image sensor chip and the system in package of at least one companion chip, effectively prevent
The weld pad fracture of companion chip, improves the reliability of image sensing module, decreases the wiring number of plies of companion chip simultaneously, fall
Low wiring difficulty.
Embodiment three
The manufacture method flow chart of the imageing sensor module that Fig. 3 provides for the embodiment of the present invention three.The present embodiment provides
A kind of manufacture method of imageing sensor module, including:
S110, image sensor chip and at least one companion chip are encapsulated as a chip packing-body by capsulation material,
Wherein image sensor chip includes image sensing cell, and is arranged on the encapsulation glass above this image sensing cell incidence surface
Glass, forms the light hole corresponding with packaged glass in chip packing-body front；
S120, formed at the back side of chip packing-body and the weld pad of image sensor chip and the weldering of at least one companion chip
The rewiring figure of pad electrical connection, this rewiring figure is formed with multiple salient point；
S130, the front of chip packing-body install lens bracket, this lens bracket is fixed with lens group, lens group bag
Include at least one blooming piece.
Exemplarily, the manufacture method of this imageing sensor module, also include:
S140, offer Rigid Flex, this Rigid Flex includes conductive circuit layer, and is just arranged on Rigid Flex
Multiple weld pads on face, by multiple weld pads of Rigid Flex respectively with the chip packing-body back side reroute on figure multiple
Salient point electrically connects.
The embodiment of the present invention three provides the manufacture method of a kind of imageing sensor module, by by image sensor chip and
At least one companion chip is encapsulated as a chip packing-body, and is attached on Rigid Flex, saves imageing sensor mould
Group inner space, it is achieved that image sensor chip and the system in package of at least one companion chip, effectively prevent auxiliary wick
The weld pad fracture of sheet, improves the reliability of image sensing module, decreases the wiring number of plies of companion chip simultaneously, reduce cloth
Line difficulty.
Embodiment four
On the basis of above-described embodiment, the manufacture method of the imageing sensor that the embodiment of the present invention four provides can include
Three parts, Part I: make image sensor chip.
The image sensor chip manufacture method process figure that Fig. 4 a to Fig. 4 r provides for the embodiment of the present invention four.Such as Fig. 4 a
Shown in, it is provided that image sensing wafer, this image sensing wafer includes on multiple image sensing cell 111, i.e. image sensing wafer
Sub-box, each image sensing cell 111 is identical.In order to hereafter state conveniently, take two of which and carry out profile
Literary composition is introduced.
As shown in Figure 4 b, it is provided that packaged glass 112, in order to map conveniently, the dotted line in Fig. 4 b represents symmetrical.
Alternatively, packaged glass 112 can be simple glass, it is also possible to for infrared filter glass, infrared filter glass
Effect is filtering infrared light, improves the image quality of imageing sensor.
As illustrated in fig. 4 c, packaged glass 112 forms box dam 113, in order to be formed with during image sensing cell 111 pressing
Cavity.
As shown in figure 4d, packaged glass 112 and image sensing cell 111 are bonded and are integrated, alternatively, this packaged glass
112 and image sensing cell 111 by glue bonding be integrated.
As shown in fig 4e, carry out thinning at image sensing cell 111 back side, in order to make product thickness reduce, lower simultaneously
The difficulty of silicon via process and time.
As shown in Fig. 4 f and Fig. 4 g, wherein Fig. 4 g is the partial enlarged drawing of Fig. 4 f circled, carries on the back at image sensing cell 111
Face makes silicon through hole 114, alternatively, uses dry method etch technology to make silicon through hole 114.Go out in this silicon through hole 114 bottom-exposed
Wafer pad 115.
As shown in Fig. 4 h and Fig. 4 i, wherein Fig. 4 i is the partial enlarged drawing of Fig. 4 g circled, carries on the back at image sensing cell 111
Face depositing insulating layer 116, in order to open subsequent technique with silicon through hole 114 electric insulation.Alternatively, spraying coating process deposition insulation is used
Layer 116.
As shown in Fig. 4 j and Fig. 4 k, wherein Fig. 4 k is the partial enlarged drawing of Fig. 4 j circled, by the crystalline substance bottom silicon through hole 114
The metal level of circle pad 115 comes out, and alternatively, uses laser drilling processes.
As shown in Fig. 4 l and Fig. 4 m, wherein Fig. 4 m is the partial enlarged drawing of Fig. 4 l circled, deposition gold on insulating barrier 116
Belong to layer 117, be used for connecting wafer pad 115.And metal level 117 is thickened so that it is reach the thickness of demand.Alternatively,
By the mode deposited seed layer metal such as magnetron sputtering, evaporation, and plated metal on Seed Layer metal, to realize metal increasing
Thick.
As shown in Fig. 4 n and Fig. 4 o, wherein Fig. 4 o is the partial enlarged drawing of Fig. 4 n circled, is coated with lighting on metal level 117
Photoresist 118 carries out photoetching process.Alternatively, by coating process spin coating photoresist 118, and exposure imaging is carried out, it would be desirable to protect
The metal level 117 stayed 118 covers with photoresist.
As shown in Fig. 4 p and Fig. 4 q, wherein Fig. 4 q is the partial enlarged drawing of Fig. 4 p circled, is removed many by etch process
Remaining metal level, to form the weld pad 117a of image sensing cell 111, and removes photoresist.
As shown in Fig. 4 r, obtain independent image sensing with image sensing cell 111 for unit cutting image sensing wafer
Chip 110.Preferably, mechanical bit or laser mode is used to cut.
Part II: image sensor chip and companion chip are encapsulated as a chip packing-body.
The process figure of the chip packing-body manufacture method that Fig. 5 a to Fig. 5 l provides for the embodiment of the present invention four.
As shown in Figure 5 a, it is provided that support substrate 104, image sensor chip 110 and at least one companion chip 120, will figure
As sensing chip 110 and at least one companion chip 120 attach to support on substrate 104.
Preferably, support on substrate 104 and be equipped with ephemeral key condensation material 105, in order to attach image sensor chip 110 and extremely
A few companion chip 120.And, ephemeral key condensation material 105 can make to prop up by laser, UV light, machinery or mode of heating
Support group plate 104 is separated.
As shown in Figure 5 b, utilize capsulation material 101 by image sensor chip 110 and at least one companion chip 120 plastic packaging
It is a chip packing-body 100, it is achieved system in package, and forms light hole 102 in the front of chip packing-body 100.
As shown in Figure 5 c, it is preferable if companion chip 120 mounts too much, and the one side at chip packing-body 100 fails to lay down
Time, it is also possible in plastic packaging layer, open hole 106, and filler metal in through hole 106, then at another of chip packing-body 100
Face attachment companion chip 120.
As fig 5d, support substrate 104 is peeled off.Preferably, by laser, UV light or mechanical system to supporting substrate
104 peel off, and are cleaned ephemeral key condensation material.
Make at the back side of chip packing-body 100 and reroute figure, including:
As shown in figs. 5 e and 5f, wherein Fig. 5 f is the partial enlarged drawing of Fig. 5 e circled, at the back of the body of chip packing-body 100
Face deposition metal level 107, row metal of going forward side by side thickens.Preferably, by magnetron sputtering or evaporation mode at chip packing-body 100
Backside deposition Seed Layer metal, then plated metal on Seed Layer metal, make metal level reach the thickness of demand.
As shown in fig. 5g, in metal level 107 surface coating photoresist 108, by exposure imaging, the metal needing to retain
Layer 107 108 covers with photoresist.
As shown in Fig. 5 h and Fig. 5 i, wherein Fig. 5 i is the partial enlarged drawing of Fig. 5 h circled, removes unnecessary metal level, can
Selection of land, uses wet etching to be removed, and removes photoresist, to form the weld pad 107a of chip packing-body 100, constitutes weight cloth
Line graph.
As shown in Fig. 5 j and Fig. 5 k, wherein Fig. 5 k is the partial enlarged drawing of Fig. 5 j circled, enters rerouting patterned surface
Row nickel gold processes, and encapsulates insulation solder mask 109, is exposed the weld pad 107a needing to plant ball by exposure imaging.
As shown in Fig. 5 l, make stannum ball on weld pad 107a surface, form the multiple salient points 103 rerouting figure.
Part III: the assembling of imageing sensor module
The assembling procedure block diagram of the imageing sensor module that Fig. 6 a to Fig. 6 d provides for the embodiment of the present invention four.
As shown in figures 6 a and 6b, being labelled on Rigid Flex 150 by packaged chip packing-body 100, wherein, this is soft
Scleroma plywood 150 can band reinforcement steel plate 160, or without reinforcement steel plate 160.
As shown in figs. 6 c and 6d, lens bracket 130, wherein, lens bracket are installed in the front of chip packing-body 100
Being fixed with lens group 140 on 130, this lens group 140 includes at least one blooming piece.Preferably, if abovementioned steps is sealed
Glaze 112 does not use infrared filter glass, then assemble infrared filtering blooming piece 170 on lens bracket 130.Image passes
After sensor module group assembling completes, it is possible to achieve camera function of taking pictures.
The embodiment of the present invention four provides the manufacture method of a kind of imageing sensor module, by by image sensor chip and
At least one companion chip is encapsulated as a chip packing-body, it is achieved that image sensor chip with at least one companion chip is
Irrespective of size encapsulates, and effectively prevent the weld pad fracture of companion chip, improves the reliability of image sensing module, decrease auxiliary simultaneously
Help the wiring number of plies of chip, reduce wiring difficulty.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious change,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although by above example, the present invention is carried out
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
Other Equivalent embodiments more can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (12)
1. an imageing sensor module, it is characterised in that including:
Image sensor chip and at least one companion chip, described image sensor chip and at least one companion chip described are by moulding
Closure material is encapsulated as a chip packing-body, the circuit face of described image sensor chip and at least one companion chip described towards
Same direction；
Described image sensor chip includes image sensing cell, and is arranged on the envelope above described image sensing cell incidence surface
Glaze, described chip packing-body front forms the light hole corresponding with described packaged glass, the back side of described chip packing-body
It is formed with the rewiring figure that the weld pad with the weld pad of described image sensor chip and at least one companion chip described electrically connects,
It is formed with multiple salient point on described rewiring figure；
Lens bracket, is arranged on the front of described chip packing-body, and described lens bracket and is fixed with lens group, described camera lens
Group includes at least one blooming piece.
Imageing sensor module the most according to claim 1, it is characterised in that described capsulation material covers described encapsulation glass
The incidence surface edge of glass, to form described light hole.
Imageing sensor module the most according to claim 1, it is characterised in that also include Rigid Flex, described soft or hard
Board includes conductive circuit layer, and is arranged on the multiple weld pads on described Rigid Flex front, and the plurality of weld pad divides
Do not electrically connect with the multiple salient points rerouted on figure at the described chip packing-body back side.
Imageing sensor module the most according to claim 3, it is characterised in that the described Rigid Flex back side is provided with benefit
Strong steel plate.
Imageing sensor module the most according to claim 1, it is characterised in that described packaged glass is infrared filtering glass
Glass；
Or, at least one blooming piece in described lens group is infrared filtering blooming piece；
Or, between described lens group and described packaged glass, it is provided with infrared filtering blooming piece, described infrared filtering optics
Diaphragm is fixed on described lens bracket.
6. according to the arbitrary described imageing sensor module of claim 1-5, it is characterised in that described companion chip includes image
Process one or more in chip, central processing element, lens group driving chip and Passive components.
7. according to the arbitrary described imageing sensor module of claim 1-5, it is characterised in that described image sensing cell and institute
State packaged glass to be integrated by glue bonding.
8. the manufacture method of an imageing sensor module, it is characterised in that including:
By capsulation material, image sensor chip and at least one companion chip are encapsulated as a chip packing-body, and described image passes
The circuit face of sense chip and at least one companion chip described is towards same direction, and wherein said image sensor chip includes figure
As sensing unit, and it is arranged on the packaged glass above described image sensing cell incidence surface, described chip packing-body front
Form the light hole corresponding with described packaged glass；
The weld pad with described image sensor chip and at least one companion chip described is formed at the back side of described chip packing-body
Weld pad electrical connection rewiring figure, described rewiring figure is formed with multiple salient point；
Lens bracket is installed in the front of described chip packing-body, described lens bracket is fixed with lens group, described lens group
Including at least one blooming piece.
The manufacture method of imageing sensor module the most according to claim 8, it is characterised in that also include:
Thering is provided Rigid Flex, described Rigid Flex includes conductive circuit layer, and is arranged on described Rigid Flex front
On multiple weld pads；
By multiple weld pads of described Rigid Flex respectively with the back side of described chip packing-body reroute on figure multiple
Salient point electrically connects.
The manufacture method of imageing sensor module the most according to claim 8, it is characterised in that described by described image
Sensing chip and at least one companion chip described are encapsulated as a chip packing-body by capsulation material and include:
There is provided and support substrate, image sensor chip and at least one companion chip；
Described image sensor chip and at least one companion chip described are attached on described support substrate；
Utilizing capsulation material is a chip packing-body by described image sensor chip and at least one companion chip plastic packaging described；
Peel off described support substrate.
The manufacture method of 11. imageing sensor modules according to claim 10 a, it is characterised in that image sensing is provided
Chip includes:
Thering is provided packaged glass and image sensing wafer, described image sensing wafer includes multiple image sensing cell, in described envelope
Form box dam on glaze, and be bonded with described image sensing cell and be integrated；
Make silicon through hole at described image sensing wafer rear, and expose pad in described silicon via bottoms；
Depositing insulating layer in described image sensing wafer rear and described silicon through hole；
By drilling technique, the described pad of described silicon via bottoms is come out；
Depositing metal level in described image sensing wafer rear and described silicon through hole, row metal of going forward side by side thickens；
Photoetching process is used to remove unnecessary metal level and form the weld pad of described image sensor chip, with described image sensing list
Described image sensing wafer cuts to obtain independent described image sensor chip for unit in unit.
The manufacture method of 12. imageing sensor modules according to claim 10, it is characterised in that described at chip package
The back side of body makes rewiring figure and includes:
At the backside deposition metal level of described chip packing-body, row metal of going forward side by side thickens；
Use photoetching process that described metal level is processed and reroute figure to be formed；
Carrying out nickel gold process at described rewiring patterned surface, and encapsulate solder mask, being exposed by exposure imaging needs to plant ball
Weld pad；
Stannum ball is made, to form the multiple salient points on described rewiring figure on described weld pad surface.
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| CN201610834804.0A CN106206485A (en) | 2016-09-20 | 2016-09-20 | Imageing sensor module and preparation method thereof |
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| CN201610834804.0A CN106206485A (en) | 2016-09-20 | 2016-09-20 | Imageing sensor module and preparation method thereof |
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