CN206558504U - Imaging sensor module - Google Patents
Imaging sensor module Download PDFInfo
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- CN206558504U CN206558504U CN201621065784.7U CN201621065784U CN206558504U CN 206558504 U CN206558504 U CN 206558504U CN 201621065784 U CN201621065784 U CN 201621065784U CN 206558504 U CN206558504 U CN 206558504U
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Abstract
The utility model embodiment discloses a kind of imaging sensor module, including image sensor chip, at least one first companion chip and at least one second companion chip, wherein, image sensor chip and at least one first companion chip are encapsulated as a chip packing-body by capsulation material, and image sensor chip and at least one companion chip circuit face towards same direction；Second companion chip is attached to the front of chip packing-body, the through hole being provided through on the chip packing-body, and wire is provided with through hole, and the first end of wire is electrically connected with the weld pad of second companion chip, and its second end extends to the back side of chip packing-body；The back side of chip packing-body is formed with the rewiring figure electrically connected with the weld pad at the second end of the weld pad, the weld pad of at least one the first companion chip and wire of image sensor chip；Lens bracket, installed in the front of chip packing-body.The utility model improves the reliability of imaging sensor module, reduces wiring difficulty.
Description
Technical field
The utility model is related to sensor field, and in particular to a kind of imaging sensor module.
Background technology
Image sensor chip is a kind of semiconductor device arrangements that can be experienced extraneous light and convert thereof into electric signal.
After image sensor chip completes, a series of packaging technologies are carried out to image sensor chip first, then microscope base branch is installed
Frame and camera lens, form an imaging sensor module.Imaging sensor module is mainly used in smart mobile phone, tablet personal computer, number
The electronic equipments such as camera, automobile travel recorder and toy for children.
Existing image sensor chip method for packing is mainly COB (Chip On Board) encapsulation, and bare chip is conductive
Or non-conductive adhesive is attached on interconnection substrate, then carries out wire bonding and realize that it is electrically connected.The image sensing of prior art
Device method for packing simply encapsulates single image sensing chip, and imaging sensor module also includes many peripheral companion chips,
Picture processing chip, central processing element and driving chip etc., these chips need to be attached on Rigid Flex, still
Such structure has the following disadvantages：
Rigid Flex has certain flexibility, therefore, and Rigid Flex is attached to thereon when occurring bending and colliding
The easy weld pad fracture of component so that the reliability reduction of imaging sensor module；Moreover, Rigid Flex to attach periphery it is auxiliary
Chip is helped, the number of plies of Rigid Flex will certainly be increased, wiring difficulty can also increase.
Utility model content
In view of this, the utility model proposes a kind of imaging sensor module, deposited with solving conventional images sensor module
The problem of, improve imaging sensor module reliability, reduction wiring difficulty.
The utility model embodiment provides a kind of imaging sensor module, including：
Image sensor chip, at least one first companion chip and at least one second companion chip, wherein, image sensing
Chip and at least one first companion chip are encapsulated as a chip packing-body by capsulation material, and image sensor chip and extremely
The circuit face of few first companion chip is towards same direction, and the image sensor chip includes image sensing cell, and
The packaged glass above image sensing cell incidence surface is arranged on, chip packing-body front forms thang-kng corresponding with packaged glass
Hole；
Second companion chip is attached to the front of chip packing-body, the through hole being provided through on the chip packing-body, leads to
Wire is provided with hole, the first end of wire is electrically connected with the weld pad of the second companion chip, the second end of wire extends to chip
The back side of packaging body；
The back side of chip packing-body is formed with weld pad, the weld pad of at least one the first companion chip with image sensor chip
Multiple salient points are formed with the rewiring figure electrically connected with the weld pad at the second end of wire, the rewiring figure；
Lens bracket, lens group is fixed with installed in the front of chip packing-body, and on lens bracket, and the lens group includes
At least one blooming piece.
Alternatively, capsulation material covers the incidence surface edge of packaged glass, to form light hole.
Alternatively, the imaging sensor module that the utility model embodiment is provided also includes Rigid Flex, the soft or hard knot
Plywood include conductive circuit layer, and be arranged on Rigid Flex front on multiple weld pads, the plurality of weld pad respectively with chip
The multiple salient points electrical connection rerouted on figure at the back side of packaging body.
Alternatively, the Rigid Flex back side is provided with reinforcement steel plate.
Alternatively, packaged glass is infrared filter glass；
Or, at least one blooming piece in lens group is infrared filtering blooming piece；
Or, infrared filtering blooming piece is provided between lens group and packaged glass, the infrared filtering blooming piece is consolidated
It is scheduled on lens bracket.
Alternatively, the first auxiliary companion chip and the second companion chip include picture processing chip, central processing element, mirror
One or more in head group driving chip and Passive components.
Alternatively, image sensing cell is bonded by glue with packaged glass and is integrated.
The utility model embodiment provides a kind of imaging sensor module, and the imaging sensor module is by the way that image is passed
Sense chip and at least one first companion chip are encapsulated as a chip packing-body, and are attached at least in the front of chip packing-body
One the second companion chip, realizes image sensor chip, at least one first companion chip and at least one second auxiliary wick
The system in package of piece, effectively prevent the weld pad fracture of the first companion chip and the second companion chip, improves image sensing
The reliability of module, while reducing the wiring number of plies of the first companion chip and the second companion chip, reduces wiring difficulty.
Brief description of the drawings
Fig. 1 is the structural representation for the imaging sensor module that the utility model embodiment one is provided；
Fig. 2 is the structural representation for the imaging sensor module that the utility model embodiment two is provided；
Fig. 3 is the preparation method flow chart for the imaging sensor module that the utility model embodiment three is provided；
The process step diagram for the image sensor chip preparation method that Fig. 4 a to Fig. 4 r provide for the utility model example IV；
The process step diagram for the chip packing-body preparation method that Fig. 5 a to Fig. 5 n provide for the utility model example IV；
The assembling procedure block diagram for the imaging sensor module that Fig. 6 a to Fig. 6 c provide for the utility model example IV.
Embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is used only for explaining the utility model, rather than limits of the present utility model.Further need exist for
It is bright, it illustrate only the part related to the utility model for the ease of description, in accompanying drawing and not all.
Embodiment one
Fig. 1 is the structural representation for the imaging sensor module that the utility model embodiment one is provided.The utility model is real
Apply example offer imaging sensor module can apply to smart mobile phone, tablet personal computer, digital camera, automobile travel recorder and
The electronic equipments such as toy for children.
As shown in figure 1, the imaging sensor module that the present embodiment is provided, including：
Image sensor chip 110, at least one first companion chip 120 and at least one second companion chip 130, its
In, image sensor chip 110 and at least one first companion chip 120 are encapsulated as a chip packing-body by capsulation material 101
100, and image sensor chip 110 and at least one companion chip 120 circuit face towards same direction, image sensing core
Piece 110 includes image sensing cell 111, and is arranged on the packaged glass 112 above the incidence surface of image sensing cell 111, core
The front of piece packaging body 100 forms light hole 102 corresponding with packaged glass；
Second companion chip 130 is attached to what is be provided through on the front of chip packing-body 100, chip packing-body 100
Wire 132 is provided with through hole 131, through hole 131, the first end of wire 132 is electrically connected with the weld pad of the second companion chip 130,
Second end of wire 132 extends to the back side of chip packing-body 100；
The back side of chip packing-body 100 is formed with weld pad, at least one first companion chip with image sensor chip 110
It is formed with 120 weld pad and the rewiring figure of the weld pad at the second end of wire 104 electrical connection, the rewiring figure multiple convex
Point 103；
Lens bracket 140, is fixed with lens group 150 on the front of chip packing-body 100, and lens bracket 140,
Lens group 150 includes at least one blooming piece.
Blooming piece can be sheet glass, or resin plastic tablet.
Plastic packaging is a kind of technology that the encapsulating electronic component such as metal, glass, ceramics is replaced with plastics, with prior art phase
In the imaging sensor module provided than, the utility model embodiment one, image sensor chip 110 and at least one is first auxiliary
The chip 120 is helped to be encapsulated as a chip packing-body 100 by capsulation material 101, it is to avoid in the prior art, imaging sensor module
When by applied external force, the situation of weld pad fracture occurs for its peripheral companion chip.
Alternatively, capsulation material can be epoxy-plastic packaging material, and the imaging sensor module that the present embodiment is provided passes through plastic packaging
Image sensor chip 110 and at least one first companion chip 120 are encapsulated as a chip packing-body 100 by technique, and near
Few second companion chip 130 is attached to the front of chip packing-body 100, realizes system in package, wherein, chip packing-body
Image sensor chip 110 and at least one first companion chip 120 in 100 are to tile in two dimensions, its circuit face direction
Same direction.Preferably, the weld pad of the circuit face of image sensor chip 110 and at least one the first companion chip 120 and lead
The weld pad at the end of line 104 second can at grade, and such structure is conducive to the back side in chip packing-body 100 to be weighed
Wiring technique.Due at least one first companion chip 120 and at least one second companion chip 130 by plastic packaging in chip package
In body 100, rerouted simultaneously with image sensor chip 110, therefore reduce the wiring number of plies, reduce wiring difficulty.
In the imaging sensor module that the utility model embodiment one is provided, image sensor chip 110 includes image sensing
Unit 111, and the packaged glass 112 above the incidence surface of image sensing cell 111 is arranged on, wherein, chip packing-body 100
Front forms light hole 102 corresponding with packaged glass 112.Alternatively, light hole 102 is covered in encapsulation by capsulation material 101
The incidence surface edge of glass 112 is formed so that extraneous light is radiated on image sensing cell 111 through packaged glass 112.
Alternatively, embedded structure is formed at the incidence surface edge of packaged glass 112 and the contact position of capsulation material 101 so that
Plastic packaging layer clenches packaged glass 112, improves the Mechanical Reliability of imaging sensor module.
In the imaging sensor module that the utility model embodiment one is provided, there is at least one second companion chip 130 to paste
Be attached to the front of chip packing-body 100, solve the quantity of the first companion chip 120 it is excessive when, the back side of chip packing-body 100 is put not
The problem of lower.
The utility model embodiment one provides a kind of imaging sensor module, and the imaging sensor module is by by image
Sensing chip and at least one first companion chip are encapsulated as a chip packing-body, and are pasted in the front of chip packing-body
Few second companion chip, realizes image sensor chip, at least one first companion chip and at least one second auxiliary
The system in package of chip, effectively prevent the weld pad fracture of the first companion chip and the second companion chip, improves image biography
Feel the reliability of module, while reducing the wiring number of plies of the first companion chip and the second companion chip, reduce wiring difficulty.
Embodiment two
Fig. 2 is the structural representation for the imaging sensor module that the utility model embodiment two is provided.As shown in Fig. 2, enter
One step, the imaging sensor module that the present embodiment is provided also includes Rigid Flex 160, wherein, Rigid Flex 160 includes
Conductive circuit layer, and the multiple weld pads being arranged on the front of Rigid Flex 160, multiple weld pads respectively with chip packing-body
Multiple salient points 103 on the rewiring figure at 100 back sides are electrically connected.
Rigid Flex, i.e. FPC (FPC) and rigid wiring board (PCB), by processes such as pressings, by related work
Skill requirement is combined, the wiring board with FPC characteristics and PCB characteristics of formation.What the utility model embodiment two was provided
Imaging sensor module is attached on Rigid Flex 160, the existing certain flexure region of Rigid Flex 160, also there is certain
Rigid region, help to save imaging sensor module internal space, improve imaging sensor module performance.
Alternatively, the back side of Rigid Flex 160 is provided with reinforcement steel plate 170.
For filtering infrared light, the image quality of imaging sensor is improved, typically sets red in imaging sensor module
Outer filter glass.Position of the infrared filter glass in imaging sensor module is not limited, alternatively, lens group 150 and envelope
Infrared filter glass 180 can be provided between glaze 112, the infrared filter glass 180 is fixed on lens bracket 140.
Alternatively, packaged glass 112 is infrared filter glass, or, at least one blooming piece in lens group 150 is
Infrared filtering blooming piece.
Alternatively, the first companion chip 120 and the second companion chip 130 in the utility model embodiment can include figure
As the one or more in process chip, central processing element, lens group driving chip and Passive components, wherein, passive device
Part includes electric capacity, resistance and inductance etc..
Alternatively, image sensing cell 111 is bonded by glue with packaged glass 112 and is integrated.
Alternatively, box dam is formed with packaged glass 112, cavity is formed during being pressed with image sensing cell 111.
The utility model embodiment two provides a kind of imaging sensor module, and the imaging sensor module is by by image
Sensing chip and at least one first companion chip are encapsulated as a chip packing-body, are attached at least in the front of chip packing-body
One the second companion chip, and chip packing-body is attached on Rigid Flex, save imaging sensor module internal empty
Between, the system in package of image sensor chip, at least one first companion chip and at least one the second companion chip is realized,
The weld pad fracture of the first companion chip and the second companion chip is effectively prevent, the reliability of image sensing module is improved, together
When reduce the wiring number of plies of the first companion chip and the second companion chip, reduce wiring difficulty.
Embodiment three
Fig. 3 is the preparation method flow chart for the imaging sensor module that the utility model embodiment three is provided.The present embodiment
A kind of preparation method of imaging sensor module is provided, including：
S110, image sensor chip and at least one first companion chip by capsulation material be encapsulated as a chip package
The circuit face of body, image sensor chip and at least one the first companion chip is towards same direction, wherein image sensor chip
Including image sensing cell, and the packaged glass above image sensing cell incidence surface is arranged on, in chip packing-body front
Form light hole corresponding with packaged glass；
S120, the through hole run through is formed on chip packing-body, wire is formed in the through hole, and in chip packing-body
Front attach the second companion chip, the first end of wire electrically connected with the weld pad of the second companion chip, and the second end of wire is prolonged
Extend the back side of chip packing-body；
S130, the back side formation in chip packing-body and weld pad, at least one first companion chip of image sensor chip
Weld pad and wire the second end weld pad electrical connection rewiring figure, be formed with multiple salient points on the rewiring figure；
Lens group, lens group bag are fixed with S140, the front installation lens bracket in chip packing-body, the lens bracket
Include at least one blooming piece.
Alternatively, the preparation method of the imaging sensor module, in addition to：
S150, offer Rigid Flex, the Rigid Flex includes conductive circuit layer, and is arranged on Rigid Flex just
Multiple weld pads on face are more on figure with rerouting for the back side of chip packing-body respectively by multiple weld pads of Rigid Flex
Individual salient point electrical connection.
The utility model embodiment three provides a kind of preparation method of imaging sensor module, by by image sensing core
Piece and at least one first companion chip are encapsulated as a chip packing-body, attached in the front of chip packing-body at least one the
Two companion chips, and chip packing-body is attached on Rigid Flex, imaging sensor module internal space is saved, is realized
The system in package of image sensor chip, at least one first companion chip and at least one the second companion chip, effectively keeps away
The weld pad fracture of the first companion chip and the second companion chip is exempted from, has improved the reliability of image sensing module, reduce simultaneously
The wiring number of plies of first companion chip and the second companion chip, reduces wiring difficulty.
Example IV
On the basis of above-described embodiment, the preparation method for the imaging sensor that the utility model example IV is provided can be with
Including three parts, Part I：Make image sensor chip.
The process step diagram for the image sensor chip preparation method that Fig. 4 a to Fig. 4 r provide for the utility model example IV.
As shown in fig. 4 a there is provided image sensing wafer, the image sensing wafer includes multiple images sensing unit 111, i.e. image sensing
Sub-box on wafer, each image sensing cell 111 is identical.In order to hereafter state conveniently, two of which is taken to carry out
Section picture and text are introduced.
As shown in Figure 4 b there is provided packaged glass 112, in order to map conveniently, the dotted line in Fig. 4 b represents symmetrical.
Alternatively, packaged glass 112 can be simple glass, or infrared filter glass, infrared filter glass
Effect is filtering infrared light, improves the image quality of imaging sensor.
As illustrated in fig. 4 c, box dam 113, shape during being pressed with image sensing cell 111 are formed on packaged glass 112
Into cavity.
As shown in figure 4d, packaged glass 112 and the bonding of image sensing cell 111 are integrated, alternatively, the packaged glass
112 and image sensing cell 111 by glue bonding be integrated.
As shown in fig 4e, it is thinned at the back side of image sensing cell 111, so that product thickness is reduced, while lowering silicon
The difficulty of via process, reduces the time of silicon hole technique.
As shown in Fig. 4 f and Fig. 4 g, wherein Fig. 4 g are the partial enlarged drawing of Fig. 4 f circleds, are carried on the back in image sensing cell 111
Face makes silicon hole 114, alternatively, and silicon hole 114 is made using dry method etch technology.Go out crystalline substance in the bottom-exposed of silicon hole 114
Circle pad 115.
As shown in Fig. 4 h and Fig. 4 i, wherein Fig. 4 i are the partial enlarged drawing of Fig. 4 g circleds, are carried on the back in image sensing cell 111
Face depositing insulating layer 116, subsequent technique to be opened with the electric insulation of silicon hole 114.Alternatively, deposited and insulated using spraying coating process
Layer 116.
As shown in Fig. 4 j and Fig. 4 k, wherein Fig. 4 k are the partial enlarged drawing of Fig. 4 j circleds, by the bottom of silicon hole 114
The metal level of wafer pad 115 is exposed, alternatively, using laser drilling processes.
As shown in Fig. 4 l and Fig. 4 m, wherein Fig. 4 m are the partial enlarged drawing of Fig. 4 l circleds, are deposited on insulating barrier 116
Metal level 117, for connecting wafer pad 115.And metal level 117 is thickened, reach the thickness of demand.It is optional
Ground, by the mode deposited seed layer metal such as magnetron sputtering, evaporation, and electroplates metal, to realize metal on Seed Layer metal
Thicken.
As shown in Fig. 4 n and Fig. 4 o, wherein Fig. 4 o are the partial enlarged drawing of Fig. 4 n circleds, are coated with metal level 117
Photoresist 118 carries out photoetching process.Alternatively, by coating process spin coating photoresist 118, and exposure imaging is carried out, it would be desirable to
The metal level 117 of reservation 118 is covered with photoresist.
As shown in Fig. 4 p and Fig. 4 q, wherein Fig. 4 q are the partial enlarged drawing of Fig. 4 p circleds, are removed by etch process many
Remaining metal level, to form the weld pad 117a of image sensing cell 111, and removes photoresist.
It is that unit cutting image senses the independent image sensing of wafer acquisition with image sensing cell 111 as shown in Fig. 4 r
Chip 110.Preferably, cut using mechanical bit or laser mode.
Part II：Image sensor chip and the first companion chip are encapsulated as a chip packing-body, and in chip envelope
The front for filling body attaches the second companion chip.
The process step diagram for the chip packing-body preparation method that Fig. 5 a to Fig. 5 n provide for the utility model example IV.
As shown in Figure 5 a there is provided supporting substrate 104, image sensor chip 110 and at least one first companion chip 120,
Image sensor chip 110 and at least one first companion chip 120 are attached to 104 on supporting substrate.
Preferably, ephemeral key condensation material 105 is equipped with supporting substrate 104, to attach the He of image sensor chip 110
At least one first companion chip 120.Moreover, interim bonding material 105 can pass through laser, UV light, machinery or heating
Mode separates supporting substrate 104.
As shown in Figure 5 b, using capsulation material 101 by image sensor chip 110 and at least one first companion chip 120
Plastic packaging is a chip packing-body 100, and forms light hole 102 in the front of chip packing-body 100.
As shown in Figure 5 c, the through hole 131 run through is formed in capsulation material 101, through hole 131 touches interim bonding material
105。
As fig 5d, metal, such as copper metal are filled in through hole 131, to form wire 132.Alternatively, by changing
Method is filled.Alternatively, chemical nickel and gold processing is carried out at the top of through hole 131, is that the surface mount device of through hole 131 does standard
It is standby.
As depicted in fig. 5e, nickel Jin Chu is being passed through by surface mounting technology (Surface Mount Technology, SMT)
The top of through hole 131 after reason attaches the second companion chip 130, the first end of wire 132 and the weld pad of the second companion chip 130
Electrical connection, the second end of wire 132 extends to the back side of chip packing-body 100.
As shown in figure 5f, supporting substrate 104 is peeled off.Preferably, by laser, UV light or mechanical system to supporting substrate
104 are peeled off, and interim bonding material is cleaned.
Made at the back side of chip packing-body 100 and reroute figure, including：
As shown in Fig. 5 g and Fig. 5 h, wherein Fig. 5 h are the partial enlarged drawing of Fig. 5 g circleds, in the back of the body of chip packing-body 100
Face deposited metal layer 106, row metal of going forward side by side is thickened.Alternatively, in chip packing-body 100 by way of magnetron sputtering or evaporation
Backside deposition Seed Layer metal, then electroplate metal on Seed Layer metal, metal level is reached the thickness of demand.
As shown in figure 5i, in the surface coating photoresist 107 of metal level 106, by exposure imaging, the metal for needing to retain
Layer 106 107 is covered with photoresist.
As shown in Fig. 5 j and Fig. 5 k, wherein Fig. 5 k are the partial enlarged drawing of Fig. 5 j circleds, remove unnecessary metal level, can
Selection of land, is removed using wet etching, and removes photoresist, to form the weld pad 106a of chip packing-body 100, constitutes weight cloth
Line graph.Wherein, the weld pad of chip packing-body 100 includes weld pad, at least one first companion chip of image sensor chip 110
120 weld pad and the weld pad at the end of wire 132 second.
As shown in Fig. 5 l and Fig. 5 m, wherein Fig. 5 m are the partial enlarged drawing of Fig. 5 l circleds, are entered rerouting patterned surface
The gold processing of row nickel, and insulation solder mask 108 is encapsulated, the weld pad 106a for needing to plant ball is exposed by exposure imaging.
As shown in figure 5n, tin ball is made on weld pad 106a surfaces, forms the multiple salient points 103 for rerouting figure.
Part III：The assembling of imaging sensor module
The assembling procedure block diagram for the imaging sensor module that Fig. 6 a to Fig. 6 c provide for the utility model example IV.
As shown in figures 6 a and 6b, packaged chip packing-body 100 is labelled on Rigid Flex 160, wherein, this is soft
Hardening plywood 160 can be with reinforcement steel plate 170, or without reinforcement steel plate 170.
As fig. 6 c, lens bracket 140 is installed in the front of chip packing-body 100, wherein, it is solid on lens bracket 140
Surely there is lens group 150, the lens group 150 includes at least one blooming piece.Preferably, if packaged glass in abovementioned steps
112 do not use infrared filter glass, then in the over-assemble infrared filtering blooming piece 180 of lens bracket 150.Imaging sensor mould
After group is completed, it is possible to achieve camera function of taking pictures.
The utility model example IV provides a kind of preparation method of imaging sensor module, by by image sensing core
Piece and at least one first companion chip are encapsulated as a chip packing-body, attached in the front of chip packing-body at least one the
Two companion chips, realize image sensor chip, at least one first companion chip and at least one the second companion chip is
Irrespective of size is encapsulated, and be effectively prevent the weld pad fracture of the first companion chip and the second companion chip, is improved image sensing module
Reliability, while reducing the wiring number of plies of the first companion chip and the second companion chip, reduces wiring difficulty.
Note, above are only preferred embodiment of the present utility model and institute's application technology principle.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, can carried out for a person skilled in the art various bright
Aobvious change, readjust and substitute without departing from protection domain of the present utility model.Therefore, although pass through above example
The utility model is described in further detail, but the utility model is not limited only to above example, is not departing from
In the case that the utility model is conceived, other more equivalent embodiments can also be included, and scope of the present utility model is by appended
Right determine.
Claims (7)
1. a kind of imaging sensor module, it is characterised in that including：
Image sensor chip, at least one first companion chip and at least one second companion chip, described image sensing chip
One chip packing-body, described image sensing chip and institute are encapsulated as by capsulation material with least one described first companion chip
The circuit face of at least one the first companion chip is stated towards same direction, wherein described image sensing chip includes image sensing
Unit, and be arranged on the packaged glass above described image sensing unit incidence surface, the chip packing-body front formed with
The corresponding light hole of the packaged glass；
Second companion chip is attached to be provided through on the front of the chip packing-body, the chip packing-body logical
Wire is provided with hole, the through hole, the first end of the wire is electrically connected with the weld pad of second companion chip, described to lead
Second end of line extends to the back side of the chip packing-body；
The back side of the chip packing-body is formed with weld pad with described image sensing chip, at least one described first auxiliary wick
It is formed with the rewiring figure of the weld pad electrical connection at the second end of the weld pad of piece and the wire, the rewiring figure multiple
Salient point；
Lens bracket, is fixed with lens group, the camera lens on the front of the chip packing-body, and the lens bracket
Group includes at least one blooming piece.
2. imaging sensor module according to claim 1, it is characterised in that the capsulation material covers the encapsulation glass
The incidence surface edge of glass, to form the light hole.
3. imaging sensor module according to claim 1, it is characterised in that also including Rigid Flex, described soft or hard
Board includes conductive circuit layer, and the multiple weld pads being arranged on the Rigid Flex front, the multiple weld pad point
Do not electrically connected with multiple salient points on the rewiring figure at the back side of the chip packing-body.
4. imaging sensor module according to claim 3, it is characterised in that the Rigid Flex back side is provided with benefit
Strong steel plate.
5. imaging sensor module according to claim 1, it is characterised in that the packaged glass is infrared filtering glass
Glass；
Or, at least one blooming piece in the lens group is infrared filtering blooming piece；
Or, infrared filtering blooming piece, the infrared filtering optics are provided between the lens group and the packaged glass
Diaphragm is fixed on the lens bracket.
6. according to any described imaging sensor modules of claim 1-5, it is characterised in that the first auxiliary companion chip
Include with second companion chip in picture processing chip, central processing element, lens group driving chip and Passive components
One or more.
7. according to any described imaging sensor modules of claim 1-5, it is characterised in that described image sensing unit and institute
Packaged glass is stated to be integrated by glue bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621065784.7U CN206558504U (en) | 2016-09-20 | 2016-09-20 | Imaging sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621065784.7U CN206558504U (en) | 2016-09-20 | 2016-09-20 | Imaging sensor module |
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| Publication Number | Publication Date |
|---|---|
| CN206558504U true CN206558504U (en) | 2017-10-13 |
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ID=60368251
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621065784.7U Active CN206558504U (en) | 2016-09-20 | 2016-09-20 | Imaging sensor module |
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| CN (1) | CN206558504U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571377A (en) * | 2016-09-20 | 2017-04-19 | 苏州科阳光电科技有限公司 | Image sensor module and manufacturing method thereof |
| CN107862269A (en) * | 2017-10-31 | 2018-03-30 | 苏州科阳光电科技有限公司 | Optical finger print module, optical finger print module preparation method and mobile terminal |
-
2016
- 2016-09-20 CN CN201621065784.7U patent/CN206558504U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571377A (en) * | 2016-09-20 | 2017-04-19 | 苏州科阳光电科技有限公司 | Image sensor module and manufacturing method thereof |
| CN107862269A (en) * | 2017-10-31 | 2018-03-30 | 苏州科阳光电科技有限公司 | Optical finger print module, optical finger print module preparation method and mobile terminal |
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