TWI383151B - Cantilever probe card for image sensing wafer testing - Google Patents

Description

Cantilever probe card for image sensing wafer testing

The invention relates to the technical field of probe cards, in particular to a probe testing device for testing image sensing wafers, and can form more test working areas under a limited area of the circuit board.

The probe card of the semiconductor chip is generally tested, mainly as a connection object between the test machine and the semiconductor wafer, and the test machine provides voltage to test the semiconductor wafer to generate a relative electrical signal. However, if it is a test of an image sensing chip (such as CCD or CMOS), the test light is irradiated onto the optical sensing area of the image sensing chip, and the wafer is electrically changed by the irradiation of the light, and generates an electrical signal to Connected probe card and test machine. Since the requirements of the conventional probe card are different, a probe card dedicated to the image sensing chip has been designed.

In terms of test efficiency, if there is only one set of test work areas on the probe card, it means that only one test can be performed at a time, and the efficiency is naturally poor. If a complex array test work area can be formed on the probe card, the relative test efficiency is naturally increased several times. However, each test work area on the probe card is composed of a plurality of probes. If a cantilever probe is used, plus a fixed structure and a connection wire limit, each test area is required for the test area. The large area is basically unable to effectively reduce the area. Therefore, the inventors thought about designing another type to overcome this disadvantage.

The main object of the present invention is to provide a test work area capable of forming the largest number on a cantilever type probe card, and the test work area can be distributed on the cantilever type probe card in an array manner, thereby improving the single test industry. The number of test wafers can be tested to improve overall test efficiency.

A secondary object of the present invention is to provide a cantilever probe card that can be used for high frequency testing of image sensing wafers, and electrically connected to the circuit board by using an improved probe and a spring type probe connection, thereby eliminating the conventional The shortcomings of the cantilever springs that must be welded to the wires greatly increase the ease of assembly and reduce the area of the entire test work area.

To achieve the above object, the present invention is mainly composed of a circuit board, at least one fixed module, at least one lens group, and a complex array probe set. Each test work area formed on the board is constructed by a set of lens sets and a complex array of probe sets. The fixing module is coupled to the underside of the circuit board and fixes the position of the lens group and the probe set. Each set of probe sets includes at least one spring type probe and an improved probe. The improved probe has a contact portion and at least one extension portion extending upward from one end of the contact portion. The spring-loaded probe is connected between the top of the extension and the circuit board such that each set of probe sets is electrically connected to the circuit board.

The detailed structure of the present invention and its connection relationship will be described in conjunction with the following figures, so that those skilled in the art can implement the present invention after studying the present specification.

Please refer to the first and second figures for the exploded view and structural section of the present invention. intention. The probe test card A of the present invention mainly comprises a circuit board 1, at least one fixed module 2, at least one lens group 3, and a complex array probe set 4.

As shown in the first and second figures, the upper and lower surfaces of the circuit board 1 have associated lines. The test work area formed on the circuit board 1 is composed of one lens group 3 and a plurality of probe groups 4. The circuit board 1 is not shielded from the lens group 3, and the light source can be focused and projected on the wafer to be tested via the lens group 3.

The fixing module 2 is assembled to be coupled to the lower surface of the circuit board 1 while fixing the positions of the lens group 3 and the probe set 4. The fixing module 2 can distribute the probe set 4 in the surrounding area of the lens group 3 and electrically connect to the circuit board 1 . In the embodiment, the fixing module 2 is composed of a first fixing member 21 and a second fixing member 22. The first fixing member 21 is located on the upper surface of the second fixing member 22 , and is disposed on the plurality of positioning holes 211 and at least one lens coupling hole 212 . The lens coupling hole 212 is for the lens group 3 to be coupled thereto. A plurality of coupling holes 221 are also formed in the second fixing member 22, and the positions of the coupling holes 221 and the positioning holes 211 are mutually corresponding, and the purpose is to provide the components of the probe group 4 disposed therein.

Each set of probe sets 4 includes at least one spring type probe 41 and a modified probe 42. The modified probe 42 is shaped like an abstract U-shape and is composed of a contact portion 421 and at least one extension portion 422. The extending portion 422 extends upward from one end of the contact portion 421. When assembled, most of the structure of the contact portion 421 is exposed and has appropriate elasticity, and the tip portion 4211 formed at the bottom end can be in contact with the wafer to be tested during the test. In addition, the spring type probe 41 has a retractable ejector pin at both ends.

As shown in the second figure, when assembled, the lens group 3 is coupled to the lens coupling hole 212 of the first fixing member 21 in a threaded manner (not shown), so that the lens group 3 can be used as an axial focal length. Adjustment. The modified probe 42 of the probe set 4 is fixed at the bonding hole 221 of the second fixing member 22 and the vicinity thereof, and the bonding manner of the two can be fixed by curing glue, epoxy resin 5, or the like. When the first fixing member 21 and the second fixing member 22 are locked together, a partial portion of the extending portion 422 of the modified probe 42 near the top end protrudes into the positioning hole 211 of the first fixing member 21. The spring-type spring 41 is placed in the positioning hole 211. When the fixing module 2 is locked under the circuit board 1, the two ends of the spring-type probe 41 are pressed to ensure that the two ends of the spring-type probe 41 are respectively It is in contact with the bottom surface of the circuit board 1 and the top of the extension 422 of the modified probe 42. In this way, each set of probe sets 4 is electrically connected to the circuit board 2, and is not short-circuited during the test of the high-frequency image sensor.

As shown in the third figure, a schematic diagram of a plurality of test work areas is formed on the circuit board 1 of the present invention. Each test work area on the circuit board 1 is composed of a lens group 3 and a plurality of probe sets 4. Since the probe set 4 in the figure is located below the circuit board 1, it cannot be seen. Therefore, a lens group 3 in the figure can represent a test work area. Due to the ingenious and improved design of the probe set 4 of the present invention, the area of the test work area on the circuit board 1 can be reduced, so that a plurality of test work areas can be formed on the circuit board 1 in an array manner, thereby improving the test operation. effectiveness.

As shown in the fourth and fifth figures, a second embodiment of the present invention is shown. In this example, the shape of the probe set 4A is mainly changed, and the purpose is to make the probe set 4A faster and more convenient in assembly and positioning operations. In the present embodiment, the improvement of the probe set 4A The probe 42A is composed of a contact portion 421 and at least two extension portions 422. In the present embodiment, the number of the extension portions 422 is two. The two extensions 422 still extend upward from the rear end of the contact portion 421, but have a gap between the two extension portions 422 and are not closely attached. In addition, the positioning hole 211 of the first fixing member 21A of the fixing module 2A and the coupling hole 221 of the second fixing member 22A are two in a group, which respectively correspond to two spring type probes 41 and modified probes. Two extensions 422 of 42A.

During assembly, the two extension portions 422 of the modified probe 42A are respectively fixed in the two coupling holes 221 of the second fixing member 22, and are respectively in contact with the spring-type probes 41 in the positioning holes 211 at different positions. In this way, the modified probe 42A can be simultaneously positioned in addition to the X-axis and the Y-axis position, and can effectively prevent the modified probe 42A from being deflected in the Z-axis direction. Therefore, when the entire probe set 4 is assembled to the fixed module 2, the position of the probe set 4 is positioned, and the correcting action is not required after assembly, so that the assembly work of the probe is more convenient and fast.

In summary, the present invention utilizes a complex array of probe sets combined with a lens set to be coupled to a circuit board, and still allows light to be focused by the lens group and projected onto an optimal area during testing to perform image sensing on the wafer. test. The innovative probe set can reduce the area of the test work area on the circuit board, which is convenient for the designer to form more test work areas on the circuit board to improve the test efficiency.

However, the above description is only for the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent variation and modification of the patent application scope of the present invention should still belong to the present invention patent. Within the scope of coverage.

A‧‧‧ probe card

1‧‧‧ boards

2‧‧‧Fixed modules

21‧‧‧First fixture

211‧‧‧Positioning holes

212‧‧‧ lens joint hole

22‧‧‧Second fixture

221‧‧‧bond hole

3‧‧‧ lens group

4‧‧‧ probe set

41‧‧‧Spring probe

42‧‧‧Modified probe

421‧‧‧Contacts

422‧‧‧Extension

4211‧‧‧ pointed

5‧‧‧Epoxy resin

The first drawing is an exploded view of a first embodiment of the present invention; the second drawing is a schematic cross-sectional view of a first embodiment of the present invention; and the third drawing is a plurality of test operations formed on the circuit board of the present invention. The fourth drawing is an exploded view of a second embodiment of the present invention; and the fifth drawing is a schematic cross-sectional view of a second embodiment of the present invention.

A‧‧‧ probe card

1‧‧‧ boards

2‧‧‧Fixed modules

21‧‧‧First fixture

211‧‧‧Positioning holes

212‧‧‧ lens joint hole

22‧‧‧Second fixture

221‧‧‧bond hole

3‧‧‧ lens group

4‧‧‧ probe set

41‧‧‧Spring probe

42‧‧‧Modified probe

421‧‧‧Contacts

422‧‧‧Extension

Claims (3)

A cantilever probe card for image sensing wafer testing, comprising: a circuit board; at least one fixed module, combined with the lower position of the circuit board; at least one lens group, each lens group is The fixed module is fixed under the circuit board; and the plurality of probe sets each of the probe sets includes at least one spring type probe and an improved probe, and each set of probe sets is fixed by the foregoing The module is fixed under the circuit board and electrically connected to the circuit board. The improved probe has a contact portion and at least one extension portion, and the extension portion extends upward from one end rear portion of the contact portion. The probe is connected between the top of the extension and the circuit board. The cantilever probe card for image sensing wafer testing as described in claim 1, wherein the improved probe has a contact contact with at least two extensions, and the at least two extensions are The contact portion extends upward at one end. The cantilever probe card for image sensing wafer testing according to claim 1, wherein the fixing module comprises a first fixing member and a second fixing member, wherein the first fixing member is located at the second fixing member In the above, the first fixing member has a plurality of positioning holes, the spring type probe is disposed in the positioning hole, and the second fixing member has a plurality of coupling holes, and the extension of the modified probe is coupled through the combination The hole extends into the positioning hole to be in contact with the spring type probe.