TW200534519A - Probe arrays and method for making - Google Patents

Abstract

Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates.

Description

200534519 IX. Description of the invention: I: The technical field of the inventors 3 Related applications: This application is requested on December 31, 2003, December 5, 31, 2003, January 15, 2004, and 2004 US Provisional Patent Applications Nos. 60 / 533,947, 60 / 533,933, 60 / 533,933, 60 / 536,865, and 60 / 540,511 filed on January 29, This application is part of the US Continuation Application Nos. 10 / 772,943 and 10 / 949,738, filed on February 4, 2004 and September 24, 2004, respectively. All the above 10 applications are hereby incorporated into this case for reference. FIELD OF THE INVENTION The present invention relates generally to microelectronic probes (for example, a microscale or mesoscale interface structure for transferring electrical signals between a first circuit or circuit element and a second circuit or circuit element), And the electrochemical process used to make these probes. C Prior Art 3 Background of the Invention A technique invented by Adam L. Cohen for forming three-dimensional structures (e.g., parts, components, devices, and the like) from a plurality of adhesive layers, and is a well-known electrochemical fabrication technique. Commercially promoted by Microfabrica Inc. (formerly MEMGen®) of Burbank, California, Burbank, California under the name EFAB ™. This technology is described in US Patent No. 6,027,630 issued on February 22, 2000. This electrochemical deposition technique allows the use of a unique light-shielding technique including the use of a photomask to selectively 'selectively deposit the material' by including a patterned harmonizing material on an auxiliary structure that is not related to a substrate which is electroplated in 200534519. When a photomask is required to perform electrodeposition, the harmonized part of the photomask is in contact with a substrate 'and the presence of a plating solution causes the harmonized part of the photomask to contact the substrate, suppressing deposition at a selected location. For convenience, these photomasks are generally referred to as conformable contact masks; this shading technique is generally referred to as the conformal contact mask plating process. More specifically, in the terminology of Microfabrica Inc. (formerly MEMGen⑧) of Burbank, California, these masks are known as instant MASK ™ and well-known processes INSTANT MASKINGTM or INSTANT 10 MASKTM plating . The selective deposition using the harmonic contact mask plating can be used to form a single material layer, or can be used to form a multilayer structure. The technology of 630 patents is hereby incorporated by reference in its entirety as reference material. Since the patent application for the above-mentioned famous patent was filed, different documents related to the harmonized contact mask electroplating (that is, INSTANT MASKING) and electrochemical manufacturing have been published: (l.) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis and P. Will, "EFAB: Batch production of functional, fully-dense metal parts with micro-scale features (EFAB: Batch production of functional, fully-dense metal parts with micro-scale 20 features) ", Proc. 9th Solid Freeform Fabrication, The University of Texas at Austin, pl61, August 1998. (2 ·) Α · Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis, and P. Will, "EFAB: Fast, Low-cost Desktop Micromachining with Real 3D MEMS with High Aspect Ratio (EFAB: Rapid, Low-Cost Desktop 6 200534519

Micromachining of High Aspect Ratio True 3-D MEMS) ,, Proc. 12th IEEE Micro Electro Mechanical Systems Workshop, IEEE, p244, January 1999. (3 ·) Α · Cohen, "3-D 5 Micromachining by Electrochemical Fabrication," Micromachine Devices, March 1999.

(4.) G. Zhang, A. Cohen, U. Frodis, F. Tseng, F. Mansfeld, and P. Will, "EFAB: Rapid Desktop Manufacturing of True 3D Microstructure (EFAB · Rapid Desktop Manufacturing of True 3 -D 10 Microstructures) '', Proc. 2nd International Conference on

Integrated MicroNanotechnology for Space Applications, The Aerospace Co., April 1999.

(5.) F. Tseng, U. Frodis, G. Zhang, A. Cohen, F. Mansfeld, and P. Will, "EFAB: High-aspect ratio of low-cost automated batch processes, 15 arbitrary 3-dimensional metal microstructures ( EFABHigh Aspect Ratio, Arbitrary 3-D

Metal Microstructures using a Low-Cost Automated Batch Process ", 3rd International Workshop on High Aspect Ratio Microstructure Technology (HARMST'99), June 1999. (6 ·) Α. Cohen, U. Frodis, F. Tseng, G Zhang, F. 20 Mansfeld, and P. Will, "EFAB: Low-Cost, Automated, Low-Cost, Automated

Electrochemical Batch Fabrication of Arbitrary 3-D Microstructures) ", Micromachining and Microfabrication Process Technology, SPIE 1999 Symposium on 200534519

Micromachining and Microfabrication, September 1999. (7.) F. Tseng, G. Zhang, U. Frodis, A. Cohen, F. Mansfeld, and P. Will, "EFAB ·· High-aspect-ratio ratio of any low-cost automated batch process, arbitrary 3-dimensional metal microstructure (EFAB: High Aspect Ratio, Arbitrary 3-D 5 Metal Microstructures using a Low-Cost Automated Batch Process) ", MEMS Symposium, ASME 1999 International Mechanical Engineering Congress and Exposition, November 1999. (8 ·) Α Cohen, "Electrochemical Manufacturing (EFABTM) (electrochemical 10 Fabrication (EFABTM))," Chapter 19 of The MEMS Handbook, edited by Mohamed Gad-El-Hak? CRC Press, 2002. (9 ·) 'Microfabrication-Rapid Prototyping's Killer Application ", pages 1-5 of the 15 Rapid Prototyping Report, CAD / CAM Publishingjnc., June 1999. The disclosures of these nine publications are hereby incorporated by reference in their entirety for reference. The electrochemical deposition process can be performed in a number of different ways 20 as proposed in the aforementioned patents and publications. In one form, this process includes performing three individual actions during the formation of each structural layer, which is structured as follows: 1. Selectively at least by electrodeposition on one or more desired areas of the substrate Deposit a material. 2. Then 'cover and deposit at least one additional material by electrodeposition, since 200534519 this additional Hai Hai deposit covers the two areas where the two are selectively deposited on it in advance, and missed any previously applied selectivity Area of the substrates deposited. Finally, the material planes to be deposited during the first and second operations are produced.) The smoothing of the first layer having a desired thickness having an area containing at least one material and at least 3 to v additional material areas. surface. After forming the δ-Hilti-layer, the front layer is formed next to-or more additional layers, and adheres to the smooth surface of the front layer. The additional layers (ii) are constituted by repeating the first to third operations one or more times, wherein each pure layer constituted will previously shape the puppet layer and initially make the substrate processing new and add Thick substrate. -Once all layers have been completed, at least a portion of at least one of the deposited materials is-generally removed by-an epitaxial process for exposure or exposure

The three-dimensional structure intended to be demolded. A preferred method of performing selective electrodeposition, including in the first operation, is through the use of a harmonic contact photomask. In this type of electronic money, first-or more harmonized contact (cc) photomasks are constructed. The harmonic contact calender includes an auxiliary structure to which a patterned harmonic dielectric material is bonded or formed. The blending material used in each photomask is made according to a special cross section of one of the materials used. At least—harmonic contact (cc) masks are needed for each plated unique cross-sectional pattern. Auxiliary structures used in harmonic contact (cc) photomasks are typically one of -selective electro-mineral and metal from which the plating material will dissolve. 200534519 = structure. Yu: In a typical method, the auxiliary structure is used as an anode. In the method of arbitrarily pendulum mi, the auxiliary structure may alternatively be-porous or other perforated _, during the period of power ore filial piety material through the porous or other perforated material from the end anode to A deposition surface. In any method, the harmonized contact (cc) mask can be used together to assist the structure, that is, the pattern of the fresh material of the heavy material layer of the electric shirt. The pattern of the electric material can be located in the difference between the single and auxiliary structure. _In. When each single-auxiliary structure includes multiple replacements, the secret structure is regarded as a ^ harmonic contact (cc) mask, and the individual power mining masks can be regarded as, sub-masks. " In this application, this distinction is only relevant when it relates to a specific location. For the preparation of the first selective deposition, the harmonized portion of the harmonized contact (CC) mask is configured to align and press the -selected portion of the substrate against which it is deposited (or On a previously formed layer or a previously deposited portion of a 15 layer). All openings in the reconciling part of the harmonized contact (CC) reticle contain a battery solution, and in this way, the harmonized contact (CC) reticle is pressed against the substrate. Harmonic contact (CC) mask material used in contact with the substrate is an opening in the harmonic contact (cc) mask used as a barrier for electrodeposition and filled with a plating solution at the same time. When an appropriate potential and / or current is supplied, it is used to transfer material from an anode (for example, a Harmonic Contact (CC) mask auxiliary structure) to a non-contact portion of a substrate (which is used as a cathode during a plating operation). Shown in Figures 1A-1C is an example of a Harmonic Contact (CC) Mask and Harmonic Contact (CC) Mask Clock. Figure 1A is a side view of a harmonic contact (CC) mask δ formed by a harmonic or deformable (e.g., elastomeric) insulator 10 patterned on an anode 200534519 12. The anode has two functions. FIG. 1A also illustrates a substrate 6 separated from the photomask 8. Since the pattern is topologically complex on the surface (for example, an isolated "island" that contains 5, cymbal marginal material), one of the functions is as a patterned insulator 10 to maintain its integrity and alignment. Auxiliary materials used. The other function is to serve as an anode for electroplating operations. As shown in Figure 1B, the Harmonic Contact (CC) photomask plating selectively applies 10 materials 22 by pressing the insulator against the substrate and then electrodepositing the materials through the apertures 26a and 26b in the insulator. Deposited on a substrate 6. After deposition, as shown in FIG. 1c, the harmonized contact (CC) mask is preferably non-destructively separated from the substrate 6. Harmonic contact (CC) mask electroplating process is different from "through-mask" in that private plating is different in that the light-shielding material is separated from the substrate during the process of photomask plating. As far as through photomask plating is concerned, 15 Harmonic Contact (CC) mask plating selectively and simultaneously deposits material to cover the entire layer. The plating area can be composed of one or more isolated plating areas, where the The isolating plated area may be a single structure formed by the same structure, or it may be a multiple structure formed by the same day. As far as harmonic contact (cc) photomask plating is concerned, the individual photomasks are not intentionally destroyed during the removal process, so It is still available in multiple electric 20-ship operations. Shown in Figures 1D-1F is another example of a Harmonic Contact (CC) mask and Harmonic Contact (CC) mask plating. Figure 113 Shows a photomask 8 including a patterned blending material 10 'and an auxiliary structure 20, and an anode 12' separated. Figure id also illustrates the substrate 6 separated from the photomask 8. Figure 3 11 200534519 The photomask 8 'is in contact with the substrate 6. The 1F diagram shows the deposit 22, which is caused by conducting current to the substrate 6 from Yangxian. The first (3 diagram is the deposit 22, which is located on the substrate 6 after being separated from the second, and In this example, an appropriate electrolyte is disposed between the substrate 6 and the anode 12, and an ion current from one or both of the solution and the anode is conducted to the substrate of the deposited material through the opening in the photomask. This type of reticle can be regarded as-insulation MASKTM (aim) or-insulation (anodeless) harmonic contact (ACC) reticle.

10 15

Different from the photomask-type electric mine, the harmonic contact (cc) mask electric key capacity is the final type of the harmonious contact (cc) mask and the production of the substrate of the electric mine. The red 3-dimensional puppet structure is separated). The harmonized contact (cc) reticle can be constructed in several ways, for example, the Shiguang lithography process can be used. Before the structure is manufactured, but not during manufacturing, all the photomasks can be formed identically. Such a separation can be achieved. Simple, ======================================================= ?? where the table-making factory is used to manufacture a three-dimensional structure; «彡 __ Any required clean room process. Figures 2A and 2F are not examples of the electrochemical process described above. These diagrams show that the process includes deposition of a sacrificial material. Material 2 ′ W and a fourth material 4 which is a structural material. In this example, a “circumferential contact (CC) photomask 8 includes—patterned blending material (for example, a bow early body dielectric material). ) 1 () and an auxiliary structure made of deposition material 2. The reconciling part of the seek-type contact (CC) reticle is pressed against the base plate 6 with the electric power solution 14 disposed in the opening 16 of the reconciling material 12 200534519. Following the bag from the power source 18, the claws pass through the bond solution 14 via the substrate 6 which is (a) the auxiliary structure a which is also the anode and (b) the cathode which is also the cathode. Figure 2A illustrates the passage of current to cause material 2 and material 2 in the ore / valley fluid to be selectively transferred from the anode 12 and plated on the cathode 6. After the first contact material (CC) mask 8 is used to electroplat the first substrate 2 on the substrate 6, as shown in FIG. 2B, the withered contact (CC) mask 8 is removed. FIG. 2C illustrates that the second deposition material 4 has covered (ie, not selectively deposited) covering the previously deposited first deposition material 乂 and the rest of the substrate 6. Overlay deposition is performed by passing an anode (not shown) made of a second material through a suitable plating solution and plating onto the cathode / substrate 6. As shown in Figure 2D, the entire two material layers are then planarized to achieve precise thickness and flatness. As shown in the second figure, after repeating this process for all layers, the multilayer structure 20 composed of the second material 4 (ie, the structural material) is embedded in the first material 2 (ie, the sacrificial 15 material). . As shown in Figure 2F, the embedded structure is etched to produce the desired component, i.e., the structure 20. As shown in Figures 3A-3C, the various components of an exemplary manual electrochemical manufacturing system 32 are shown. The system 32 is composed of several subsystems 34, 36, 38, and 40. Shown in each upper part of Figures 3A to 3C is a substrate holding 20 subsystem 34 and includes a plurality of components: (1) a bracket 48 (2) a metal on which the layers are deposited The base plate 6 and (3) a linear slide 42 can move the base plate 6 up and down relative to the bracket 48 in response to the driving force obtained from the dynamic force 44. The subsystem 34 also includes an indicator 46 for measuring the difference in the vertical position of the substrate, which can be used to set or determine the thickness of the layer and / or the thickness of the deposit 13 200534519 which can be accurate. The subsystem 34 further includes a bracket 48 mounted on the subsystem 36 with feet 68. The harmonic contact (CC) mask subsystem 36 'shown in the lower part of FIG. 3A includes a plurality of elements: a harmonic contact (cc) mask 8 which is actually 5 shared by a common auxiliary Structure / Harmonic contact (CC) reticle (ie, sub-reticle) of the structure / anode 12, (2) Precision X stage 54, (3) Precision Y stage 56, (4) Footware 68 of subsystem 34 A frame D mounted thereon, and (5) a groove 58 for containing the electrolyte 16. The subsystems also include appropriate electrical connections (not shown) for connecting to an appropriate power source, and 10 to drive the harmonized contact (CC) shading process. Shown in the lower part of FIG. 3B is an overlay deposition subsystem 38, and includes a plurality of components: (1) an anode 62 '(2)-an electrolyte tank 64 for holding the plating solution 66, and (3 The frame 74 on which the feet 68 of the subsystem 34 are placed. Subsystem 38 also includes appropriate electrical connections (not shown) for connecting the 15 anode to a suitable power source to drive the overlay deposition process. Shown in the lower part of Figure 3C is a planarization subsystem 40 and includes an overlay plate 52 and a combined movement and control system (not shown) for planarizing the sediment. Another method of forming microstructures from bonded metal (ie, using electrochemical 20 manufacturing technology) is based on US Patent No. 5J90 637 issued to Henry Guckel, entitled "Multilevel Deep X by Using Sacrificial Metal Layer 1. formation of microstructures by multiple lithography

Level Deep X-ray Lithography with Sacrificial Metal layers) ". This patent teaches the use of photomask exposure to form a metal. 14 200534519, the first structure of the main metal is electroforged on an exposed electric ship substrate , ,,-are located in the gap in the photoresist, and then the photoresist is removed and the auxiliary force is plated to the first layer and the substrate is covered. Then the exposed surface of the auxiliary metal is directed downward. Processed to a height where the first metal is exposed, 5 is used to produce ^ extending the two main and auxiliary metals—a flat uniform sentence list, and then begins to form a first by covering the first layer with a photoresist layer Layer, and then repeating the process for generating the first layer. Then repeating 3 steps until the entire structure is formed, and the auxiliary metal is removed by etching, and the photoresist composition is covered by the fabrication method to cover the key substrate or It is the previous layer and exposes the photoresist through a patterned photomask through X-ray or ultraviolet radiation to form a void in the photoresist. Electrochemical manufacturing provides micro-objects and components at reasonable cost and time. , Prototyping, structures, components, and similar prototypes and commercial mass production capabilities. "Electrochemical manufacturing is an enabler that is used to form most structures that have not been produced so far. Electrochemical manufacturing opens in most industries. The range of new designs and products in the field. Even if electrochemical manufacturing provides this novel capability, it should be understood that electrochemical manufacturing technology can be combined with well-known designs and structures in different fields to produce new structures, and technology is under development. In terms of the current level of advancement, the special use of electrochemical manufacturing that provides design, structure, capability, and / or characteristics is not widely known or significant. In the plural field, there are improvements to improve characteristics and reduce manufacturing time. , The need to reduce manufacturing costs, streamlined manufacturing processes, and / or micro-components that are more independent between geometric configuration and customized processes. In the field of micro (ie, meso-scale and micro-scale) component manufacturing, also There is a need for improved manufacturing methods and devices. 15 200534519. In the field of electrochemical manufacturing, there are also enhancements and supplements. Equal to the technology already known in the field to allow more uses in component design, improved material selection, improved material characteristics, more cost-effective and less risky and similar factors for manufacturing these components [Meichi 3 Summary of the Invention An object of some aspects of the present invention is to provide an electrochemical manufacturing technique capable of manufacturing an improved probe array structure. 10 15 20 Some of the aspects of the present invention are to provide a capable of manufacturing Improved electrochemical manufacturing technology of probe array structure. Once those who are familiar with this technology have reviewed the teaching content here, it is obvious that the plural view of the present invention is related to other purposes and advantages. The plural view of the present invention is in This expressly proposes or is otherwise identified by the teaching content here, the above-mentioned or more purposes may be proposed alone or in combination, or the present invention identified by the teaching content is optionally proposed. For other purposes. Even if there are situations with some viewpoints, it is not necessarily intended that all purposes are raised by any one-of-a-kind viewpoint of the present invention. & A first aspect of the present invention provides a method for manufacturing a probe array, comprising: manufacturing at least a portion of each of a plurality of probes on a temporary substrate; and transferring the probes from the temporary substrate to A second aspect of the present invention provides a method for manufacturing a microprobe = including at least a method of manufacturing a microprobe on a temporary substrate.

The probe is transferred from the temporary substrate to a permanent substrate. 1 knife, U 16 200534519 A third aspect of the present invention provides a method for manufacturing an compliant electrical contact element array, which includes: manufacturing at least a portion of a compliant electrical contact element on a temporary substrate; The electrical contact element is transferred from the temporary substrate to a permanent substrate. 5 A fourth aspect of the present invention provides a method for manufacturing a compliant electrical contact element adhered to a permanent substrate, comprising: manufacturing at least a part of a compliant electrical contact element on a temporary substrate; The component is transferred from the temporary substrate to a permanent substrate. # Those who are familiar with this art should understand the viewpoints of the present invention once they have reviewed the teaching content presented here. Other viewpoints of the present invention may include the viewpoints mentioned above in combination. Other aspects of the invention include means that can be used to perform one or more of the method aspects of the invention described above. These other perspectives of the present invention can provide different combinations of the above perspectives and provide other configurations, structures, functional relationships, and processes not specifically mentioned above. 15 Schematic illustrations 1A-1C is a schematic side view of a harmonic contact mask electroplating process at different stages. At the same time, 1D-1G is a schematic view of a different type of harmonic contact mask. Schematic side view of the different stages of the harmonic contact mask plating process. 20 Figures 2A-2F are schematic side views of an electrochemical process used to form a specific structure at different stages, in which a sacrificial material is selectively deposited while a structural material is deposited overlying. Figures 3A-3C are schematic side views of different exemplary sub-assemblies, which can be used to manually perform the electrochemical fabrication methods shown in Figures 2A-2F. 17 200534519 Figure 4A-4I is a diagrammatic illustration of the first layer of a structure constructed using an adhesive mask electroplating, in which the overlay deposition of a second material will be between the deposition position of the first material and the first material itself Covered between the openings. FIG. 5 is a process for forming at least a part 5 of a plurality of probes on a temporary substrate and then transferring it to a permanent substrate, which is one of the viewpoints of the present invention, one of the first generalized embodiments. A block diagram. Figure 6 is a block diagram of a process in a first variation of the first generalized embodiment, where the probes are transferred to the permanent substrate one at a time. 10 FIG. 7 is a block diagram of a process of a second variation of the first generalized embodiment, in which the probes are simultaneously transferred to a permanent substrate in an array manner. Fig. 8 is a block diagram of a process of a third variation of the first generalized embodiment, in which the probes are transferred to a permanent substrate in a series of separately arranged 15 arrays. Fig. 9 is a block diagram of a process of a fourth variation of the first generalized embodiment, in which the probes first form the contacts and finally the installation area, and then they are transferred to The permanent substrate is then removed. 20 FIG. 10 is a block diagram of a process of a fifth variation of the first generalized embodiment, in which the probes first constitute a contact and finally an installation area, and then the temporary substrate is removed, and then Perform transfer to a permanent substrate. FIG. 11 is a sixth process form 18200534519 of the first generalized embodiment of the present invention, wherein the scale probe first constitutes an installation area and finally a contact, and then a temporary substrate is removed, and then Attach a permanent substrate. Figure 12 is the first process of the first generalized embodiment-the square amount, in which the probes are first formed into the installation area and the last contact, and then attached-the second temporary substrate, then The first temporary substrate is removed and a permanent substrate is placed in its place. FIG. 13 is a block diagram of the second process of an eighth variation 10 15 20 of the first generalized embodiment, in which the probes are only partially constructed after being transferred to a permanent substrate, and are completed thereafter Probe making. Figure 14 is a block diagram of a seventh variation of the first generalized embodiment, in which the probes are at least partially demolded from a sacrificial material when transferred to a permanent substrate. ^ The figure is the ninth generalized embodiment of the ninth variation 1 and the block diagram is removed. The probes are not demolded from at least one sacrificial material when transferred to the permanent substrate. Afterwards, these probes are from at least one of the tenth variation of the first generalized embodiment, a block diagram of Yiqiu, where the control of the red ^, 13 temple ^ needles includes Before contacting the permanent substrate, a conductive adhesive material is selectively placed on the mounting area of the probe.苐 17 is a block diagram of a process of an eleventh variation of the first generalized rendering of the 我, ”, and 施 examples,. /, A conductive adhesive material is selectively arranged. At these positions 水 on the Mizuhisa substrate, the attachment to the probe 19 200534519 is completed, and then the probe and the permanent substrate are attached. FIG. 18 is a twelfth variation of the first generalized embodiment. A block diagram of a form of a process, wherein the formation of the probes includes selectively placing a first conductive adhesive material on the probe mounting area 5 before contacting the probes with a permanent substrate, and wherein A second conductive adhesive material is selectively disposed at these positions on the permanent substrate, where the attachment to the probe is completed and then the probe and the permanent substrate are attached with the first and second adhesive materials. 19 is a block diagram of a process of a thirteenth variation 10 of the first generalized embodiment, in which at least a part of the sacrificial material is not removed before the transfer, and the permanent substrate and the probe During combined operation One of the protective materials is arranged between the adhesive material and any sacrificial material. FIG. 20 is a block diagram of a process of the first extension part of the thirteenth variation 15 of the first generalized embodiment. , Which includes removing the sacrificial material and the protective material after the bonding operation. Figure 21 is a block diagram of a process of a second extension of a thirteenth variation of the first generalized embodiment, which includes The sacrificial material is removed but the protective material is retained after the bonding operation. 20 FIG. 22 is a block diagram of a process of a fourteenth variation of the first generalized embodiment, in which the probe is heat-treated before the bonding operation. Improve the adhesion between the structural material layers that have constituted the probes. Figure 23 is a fifteenth variation of the first generalized embodiment 20 200534519 of the formula-process-block diagram, where Heat treatment of the probes after the bonding operation is used to improve the adhesion between the layers of structural materials that have formed the probes. Figures 24A-24C are schematic diagrams of the three stages of an example of a process The multi-probe array formed by Toshiba 2 is reversed, cut and concatenated, as shown in the block diagram of Figure 8, and transferred to a permanent substrate to form a larger array group. 25A-25J The figure is a schematic side view of different states of an example of a _process used to construct a multilayer two-tau probe array on a temporary substrate, where the constructed structure is then transferred and combined with a permanent substrate. The substrate is composed of sacrificial materials and the process includes the components illustrated in the block diagrams of Figures 9 and 15. Figures 26A-26E are used to form multiple, multilayer, and multiple components on a temporary substrate. 15 is a schematic side view of an example of a manufacturing process of an example of a probe array in which the structure is transferred and combined with a permanent substrate, and the contacts of the probe element are molded in a patterned substrate. The diffusion bonding process is performed before the demolding operation but after the transfer and bonding operations. The process includes the components illustrated in the block diagrams of Figures 9, 15 and 23. Figures 27A-27C are schematic side views of the different states of a process of increasing the probe contacts on the probes of Figures 26A-26E.苐 28A-28I is a schematic side view of different states of an example of a process for forming a multilayer, multi-element probe array on a temporary substrate, which then transfers the formed structure and combines it with a permanent substrate The probe 21 200534519 contact of the pin element is molded in a patterned substrate that is one of the contact materials different from the structural material, and is selected for high-yield possibility analysis before the transfer operation and later for use or non-use A unique probe array, and the process includes the 5 elements illustrated in the block diagrams of Figures 9, 15 and 23. Figures 29A-29L are schematic side views of different states of one example of a process for constructing a multilayer, multi-element probe array on a temporary substrate, which then transfers the constructed structure and combines it with a permanent substrate , Where > the probe contact is made through a mold made of a sacrificial material, 10 where the probe element is separated from the temporary substrate by a meltable material, and where the process is included in the ninth, These elements are illustrated in the block diagrams of Figures 15 and 22. Figures 30A-30H are schematic side views 15 of different states of one example of a process for forming a multilayer, multi-element probe array on a temporary substrate, which are shown in Figures 29A-29L Similarly, the difference is that the first metal is replaced by a dielectric material. • Figures 31A-31W are schematic side views of different states of another example of a process for forming a multi-layer, multi-element probe array on a temporary substrate. 20 Figure 32A-32Z is a schematic side view of the different states of an exemplary process, which is similar to the process of Figure 31A-31W but additionally includes a coating probe operation. Figures 33A-33T show schematic side views of different states of an exemplary process similar to Figures 32A-32T, except that it uses only a single sacrificial material 22 200534519 626 to replace one sacrificial material 626 and 6i6, and the% u_33W The drawing shows other states of the process. [Embodiment] Detailed description of the preferred embodiment 5 The first 1A to 1G, 2A_2F & 3A-3C diagrams show different characteristics of the well-known electrochemical ascending y formula. Other electrochemical manufacturing technologies are proposed in the above-referenced 630 patent, previously different combined publications, different other patents, and patent applications incorporated herein as reference materials, but there are still other technologies that can be incorporated in These publications, patents, and the methods described in Application 10 are derived, or are known or ascertainable from other teachings proposed by those skilled in the art. All of these techniques can be combined with different embodiments of different aspects of the present invention to produce enhanced embodiments. There are still these other specific embodiments derived from the combination of the different specific embodiments explicitly set forth herein. 15 Figures 4A-41 are diagrams illustrating different stages of forming a single layer of a multi-layer process, in which a second metal system is deposited on a first metal and in an opening located in the first metal, and its deposits Layers of components. In FIG. 4A, a side view of a substrate 82 is shown. As shown in FIG. 4B, a patternable photoresist 84 is cast on the substrate. In Fig. 4C, the photoresist pattern resulting from curing, exposing, and developing the photoresist is shown. The patterning of the photoresist 84 results in openings or apertures 92A-92C, which extend from one surface 86 of the photoresist through the thickness of the photoresist to the surface 88 of the substrate 82. In Figure 4D, a metal 94 (eg, nickel) has been plated into the openings 92A-92C as shown. In FIG. 4E, the photoresist has been removed from the substrate (that is, stripped chemically 23 200534519) to expose the areas of the substrate 82 that are not covered with the first metal 94. In FIG. 4F, the second metal 96 (for example, silver) has been plated to cover the entire exposed portion of the substrate 82 (which is conductive) and the first metal 94 (which is also Conductive). Fig. 4 (3) is the first layer of the completed structure shown in Fig. 5, which is formed by planarizing the first and second metals downward to a height where the first metal is exposed and setting the thickness of the first layer. Figure 4H is the result of repeating the process steps shown in Figures 4B-4G several times to form a multilayer structure, and each layer in the multilayer structure is composed of two materials. For most applications As shown in Fig. 41, one of the materials is divided by 10 to generate a desired three-dimensional structure 98 (for example, a component or a component). Different specific embodiments disclosed herein Optional schemes and technologies can use a single patterning technique on all layers or use different patterning techniques on different layers to form a multilayer structure. For example, on some layers, 15 different types of patterned light can be used Masks and shading techniques, while direct selective deposition can be used during formation of other layers. For example, harmonized contact masks and / or irreconcilable contact masks and shading operations can be used on some layers, while other techniques can be used Make up other layers. Proximity mask and shading operations (that is, using a mask, even if it is not in contact, it is brought close to the substrate and at least partially protects a substrate), and an adhesive mask and light shielding can be used Operation (photomasks and operations using photomasks, which are either adhered to a substrate with selective deposits on them, or are engraved with money opposite to those that are only in contact with them). Figure 5 shows the A temporary substrate constitutes at least one 24 200534519 portion of a plurality of probes and then is transferred to a permanent substrate, which is a block diagram of a process of a first generalized embodiment of an aspect of the present invention required. 100 refers to the construction of at least a portion of at least each probe of a plurality of probes on a temporary substrate. The construction operations of block 5 100 can be performed in a number of different ways. For example, the construction operations may include issues such as those described earlier herein. 'Hai Xun operation' and the electrochemical manufacturing operations described in different patents and the patent application which is incorporated herein by reference for this patent application. Construction operations This may include the use of more than one structural material on some layers, or the use of more than one sacrificial material on some layers. 10 Such construction techniques may include the use of more than one planarization operation per layer for 15 layers, Industry, and under some conditions, no planarization operation is used on some layers. These deposition operations may be selective and / or cover types, and etching operations are performed under selective or cover types. The deposition operations may include Plating operations, electro-ice / child product operations, electroless plating operations, different physical and chemical vapor depositions can be all conductive types or some can be dielectric f. Further sinking spray metal deposition operations and similar Operation: deposited materials (g 〇ver), spreading, spraying, inkjet distribution

Product technology can include overflow (floWin and similar operations. By selective fusion operations and similar operations, 25 200534519. Hai and other needles can be formed into plural forms, the form of which is based on

Arat et al. Described in US Patent Application No. 60 / 533,933, filed on December 31, 2GG3, U.K., entitled "Electically Fabricated Microprobes". … The probes may include these contacts that are constructed in any of a plurality of different ways and may adopt a plurality of different shapes. A statement was made by Kim et al. Pin contact and its manufacturing method (MicmF〇be

Tips and Methods for Making) "U.S. Patent Application No. 60 / 533,975 includes examples of the contact forms and construction methods. In some embodiments, these probes can be composed of composite materials. Cohen et al. An application was filed on December 31, 2003 under the heading "Electrochemicai

Fabrication Process for Forming Multilayer Multimaterial Microprobe structures), US Patent Application No. 60 / 533,897 15 provides these examples of the technology used to construct these composite probes. In some embodiments, the formation of the probe may include different layer formation operations before or after being transferred and combined with the permanent substrate. Some of these operations include diffusion bonding techniques that help enhance interlayer adhesion. Some embodiments use a diffusion bonding process or a similar method to enhance adhesion between successive layers of material. Application by Cohen et al. On December 31, 2003, entitled "Method for Fabricating Tree-Dimensional Structures

Including Surface Treatment of a First Material in 26 200534519

“Preparation for Deposition of a Second Material)” in US Patent Application No. 60 / 534,204 proposes different teaching content related to the use of diffusion bonding in electrochemical processes, which is hereby incorporated by reference in its entirety for reference. 5 As mentioned above, the construction of the probe may include the use of a structure or a sacrificial dielectric material, which may be combined with specific embodiments of the present invention in a plurality of different ways. And the structure and / or structure on the dielectric substrate Among them, the additional lectures # that incorporate dielectric materials into the manufacturing process and may be related to the final structure are filed in a number of Patent Application 10 applications filed on December 31, 2003. The first case is US Patent Application No. 60 / 534,184, entitled "Electrochemical Fabrication Methods Combining Dielectric Materials and / or Using Dielectric Substrates"

Incorporating Dielectric Materials and / or Using Dielectric Substrates ". The second of these documents is US Patent Application No. 60 / 533,932, entitled" Electrochemical Fabrication Using Dielectric Substrates (Electrochemical Fabrication Methods Using Dielectric 0 Substrates ". The third file in these files is US Patent Application No. 60 / 534,157, entitled" Electrochemical Fabrication Methods Incorporating 20 Dielectric Materials ". The fourth slot in these documents is US Patent Application No. 60 / 533,891, entitled" Electrochemistry Incorporating Dielectric Sheets and / or Seed Layers Partially Removed by Planarization " Methods of Manufacturing Structures> (Methods for Electrochemically Fabricating Structures

Incorporating Dielectric sheets and / or Seed layers That Are 27 200534519

Partially Removed Via Planarization ". The fifth file in these files is US Patent Application No. 60 / 533,895, entitled" Electrochemical Manufacturing Method for the Production of Multilayer Three-Dimensional Structures on a Porous Dielectric (Electrochemical Fabrication Method for Producing 5 Multi-layer Three-Dimensional Structures on a Porous Dielectric) ''. Each of these patent document files is hereby incorporated by reference in its entirety for the sake of lack of reference. Further lectures related to planarizing the layers and setting the thickness of the layers and similar operations are presented in the following 10 US patent applications filed on December 31, 2003: (1) by Cohen et al. Application entitled "Electrochemical Fabrication Methods for Producing Multilayer Structures Including the use of Diamond Machining in the Planarization 15 〇f Deposits of Material) "U.S. Patent Application No. 60 / 534,159 and (2) U.S. Patent Application No. 60 / 534,183 filed by Cohen et al., Entitled" for the retention of layers during electrochemical fabrication of structures Method and Apparatus for Maintaining Parallelism of Layers and / or 20 Archieving Desired Thicknesses of Layers During the

Electrochemical Fabrication of Structures ". These patent document files are hereby incorporated by reference in their entirety as references. Each patent application filed in the above paragraph is hereby incorporated by reference in their entirety as references. 28 200534519 Figure 6 is a block diagram of a process of a first variation of the first generalized embodiment of the first generalized embodiment, in which the probes are transferred to the permanent substrate one by one at a time. Figure 6 of Block 110 is similar to block 100 in Figure 5 and is used to construct at least a portion of a plurality of probes on a -5 temporary substrate. Block 112 in Figure 6 is to transfer a single probe on a permanent substrate. And combined with a desired position, and the block 114 is to repeat the transfer and the treacherous operation multiple times until the multiple probes required for the transfer have been made. The figure 7 is a second variation of the first generalized embodiment. A block diagram of a process of Xingqi 10, in which the probes are simultaneously transferred to a permanent substrate in an array. Block 120 in Figure 7 is in contrast to blocks 11 and 100 in Figures 6 and 5, respectively. Similarly, it is to construct at least a part of at least a plurality of probes on a temporary substrate. 15 Block 122 is to simultaneously transfer and combine a probe array with a permanent substrate. Figure 8 shows the first generalized implementation. A block diagram of a process in a third variation of the example, in which the probes are transferred to a permanent substrate in a series of separately arranged arrays. 2 Box 130 in Figure 8 is to construct at least a temporary substrate At least a part of each of the plurality of probes. Block 132 in FIG. 8 is similar to the operation in block 122 in FIG. 7 in that a probe array is simultaneously transferred and combined with a permanent substrate. The process of block 134 in Figure 8 repeats the transfer and combination operations of block 132 29 200534519-or more, until all required probe arrays have been moved to the permanent substrate to form one or more probe array groups. Fig. 9 is a block diagram of the -process-a fourth variation 5 of the first generalized embodiment, in which the probes first form the contacts and finally the installation area, and After that, it is transferred to the permanent substrate, and then the temporary substrate is removed. Block 140 in FIG. 9 is a plurality of probes, each of which includes a permanent substrate mounting area and a contact area. The contact area The system 10 is placed on the temporary substrate near the probe, and the installation area is located at a position on the end of the temporary substrate. After forming the probes, the process proceeds to block 142, which is The plurality of probes are transferred and bonded to the desired position on the permanent substrate, and then the process proceeds to block 142, which removes the temporary substrate. 15 FIG. 10 is a fifth variation of the first generalized embodiment. A block diagram of a form of manufacturing, in which the probes first form the contacts and finally the installation area and then the temporary substrate is removed and then transferred to the permanent substrate. The process of Fig. 10 is similar to that of Fig. 9, except that a plurality of 20 彳 needles are transferred and bonded to the permanent substrate (block 154) before removing the temporary substrate (block 152). FIG. 11 is a block diagram of a process of a sixth variation of the first generalized embodiment, in which the probes first constitute an installation area and finally a contact, and then a temporary substrate is removed, and then attached Install the permanent 30 200534519 substrate. The process of Figure 11 is similar to Figure 10 in many respects. After the probes (block 160) are formed, the probes are removed from the temporary substrate (block 162), and then bonded to the permanent substrate (block 164). ). The difference between Fig. 10 and Fig. 5 is that the process of constructing the probe (block 160) in the process of Fig. 11 includes the part of the permanent substrate mounting area constituting the probes close to the temporary substrate. The contacts of the isoprobe are located at these positions on the end of the temporary substrate, however, it is also correct and feasible to reverse the process of FIG. 10. • Of course, in the further variations of the processes in Figures 10 and 11, it should be understood that there are other differences between processes. FIG. 12 is a block diagram of a process of a seventh variation of the first generalized embodiment, in which the probes first constitute an installation area and finally a contact, and a second temporary substrate is attached afterwards Then, the first temporary substrate is removed and a permanent substrate is attached at its position. 15 The process in Figure 12 starts with block Π0, and it constructs a plurality of probes. Each probe includes a permanent substrate mounting area and a contact area. • The mounting area is located close to the probes. The needle is formed on a first temporary substrate, and the contact area is located at an end position. After forming the probes, the process proceeds to block 172, where a second temporary substrate is attached. On some executions of this process, the first temporary sunscreen substrate may be attached to the probes in a plane that is substantially parallel and opposite to the mounting plane of the first temporary substrate. In other executions, the auxiliary substrate may be mounted to one or more sides of the material that makes up the individual layers of the probes. 31 200534519 The process proceeds from block 172 to block 174, which removes the first temporary substrate. The process then proceeds to block 176, which is a process of transferring and adhering a plurality of probes to a desired location on a permanent substrate. The temporary substrate must be removed (block 174) before being transferred and bonded to the permanent substrate, with at least some overlap in the positioning operations of the first 5 temporary substrates and the locations where the permanent substrates are attached. Figure 13 is a block diagram of a process of an eighth variation of a generalized embodiment of the younger brother, in which the probes are only partially formed before being transferred to the permanent substrate, and the probes are completed afterwards. 10 The process of Figure 13 begins with block 180, which involves constructing at least a portion of each-plurality of probes on a temporary substrate. After the construction operation is partially completed, the process proceeds to block 182, where a plurality of probes are transferred and bonded to a permanent substrate. After the transfer operation is completed, the process proceeds to block 184, where 15 is completed making the probes.

Figure 14 is a block diagram of a seventh variation of the -generalized embodiment, where the probes are at least partially demolded from a sacrificial material before being transferred to a permanent substrate. The process of FIG. 14 begins at block 190, which involves constructing at least a portion of each of the plurality of probes on a temporary substrate. After the construction operation has been performed to the required level, the process proceeds forward. At least partly, the special needle is decoupled from the sacrifices. This operation is used during the construction of the probes. It is used for plural exploration. Next, the process proceeds to block 194, 32 200534519. The needle is transferred and bonded to a permanent substrate. FIG. 15 is a block diagram of the ninth generalized embodiment of the ninth variation of the second embodiment of the process. The probes have not been demolded from at least one sacrificial material before being transferred to the permanent substrate. The probes are demolded from at least one 5 sacrificial material. The process of FIG. 15 begins with block 200, which involves constructing at least a portion of each of the plurality of probes on a temporary board. After the construction operation has reached the required level, the probes are transferred and bonded to a permanent substrate as shown in block 202. 10 After the transfer and adhesion operation, as shown in block 204, the probes are demolded from at least a portion of a sacrificial material during the construction operation. FIG. 16 is a block diagram of a process of a tenth variation of the first generalized embodiment, wherein the constitution of the probes includes the probes selectively contacting the permanent substrate before contacting them. A conductive adhesive material is arranged on the mounting area 15 of the probe. The manufacturing process of FIG. 16 starts with block 210, which is to construct at least a part of each of a plurality of probes on a temporary substrate, wherein the constituting operation of the probe includes forming an installation area including a The probes are bonded to a bonding material of a permanent substrate. After the 20-probe configuration operation including the placement of the adhesive material, the process proceeds to block 212, which uses adhesive material to transfer and adhere the plurality of probes to a permanent substrate.苐 17 is a block diagram of a process of the eleventh generalized embodiment of the eleventh generalized embodiment of the brother, in which a conductive adhesive material is selectively arranged at the positions on the permanent substrate , Which completes the attachment to the probe 33 200534519 and then attaches the probe and the permanent substrate. The process of FIG. 17 starts with block 220, which constructs at least a portion of each of the plurality of probes on a temporary substrate, and then the process proceeds to block 222, which transfers the plurality of probes and Adhering to a permanent substrate, the permanent substrate includes an adhesive material selectively configured to adhere a plurality of probes to the permanent substrate. Figure 18 is a block diagram of a process in the twelfth variation of the first generalized embodiment. The formation of the probes includes selectively before contacting the probes with the permanent substrate. A first conductive adhesive material is disposed on the mounting area 10 of the probe, and one of the second conductive adhesive materials is selectively disposed at the positions on the permanent substrate, where the attachment to the probe is completed and the The first and second adhesive materials are then used to attach the probe and the permanent substrate. In fact, the process of Figure 18 is a combination of Process 15 proposed in Figures 16 and 17. The process of FIG. 18 starts with block 230, which is to construct at least a part of each of the plurality of probes, which also constitutes a mounting area for the probes and includes a first adhesive material. Next, the process proceeds to block 232, which transfers and bonds a plurality of probes to a permanent substrate, wherein the permanent substrate is selectively arranged with a second adhesive material through a 20-fold, 20-fold U-folded package. In these areas, the first to second bonding materials are used to bond the probe and the permanent substrate together. In some implementations of this variation, the first and second materials may be the same, while in other implementations, these materials may be the materials of the village. 34 200534519 10 15 FIG. 19 is a block diagram of a process of a thirteenth to thirteenth variation of the first generalized embodiment, in which at least a part of the sacrificial material has not been removed before the transfer, and One of the protective materials is disposed between the adhesive material and the sacrificial material 'between the permanent substrate and the probe warrior operation. The process of Figure 19 starts with block 240. You construct a plurality of probes on a temporary substrate. One of the probes is used to make a mounting area, including an adhesive material, and a protective material is arranged on the substrate. Adhesive material for toileting: between animal materials. The exploration of the inclusion of the bonded material and the sacrifice pin and the attachment to the permanent multiple is based on the use of the bonded material, and n, where at least part of the material is kept in place. ) During the bonding process, the protection figure 20 is a system of the first extension of the first method, and the sacrificial material is removed after the implementation of the thirteenth modification. The block diagram includes: Working together —… easing materials. The process of Figure 20 starts with blocks 240 and 242. ^ The party described above with reference to Figure 19 moves forward to this block after moving to block 244 ^ 20 Material removal and protective material = line operations In block 244, the sacrificial material is removed. . It is possible to remove the sacrificial material before removing the sacrificial material in other execution operations, and to remove the sacrificial material before removing the protective material. In the further execution operation, the sacrificial material and the prevention material can be simultaneously removed. Fig. 21 is a block diagram of a process of a first extension of a thirteenth variation of the first generalized embodiment, which includes removing the sacrificial material but retaining the protective material after the business is completed. 5 The process of Fig. 21 starts with blocks 240 and 242 described above 'and proceeds to block 244-2. Block 244_2 is for removing the sacrificial material and retaining the protective material. This reserved protective material is useful in one or more ways, for example, it can be used to stabilize the positions of the probes relative to each other, and can also be used to enhance the adhesion between the 10th array of probe arrays and the substrate. . FIG. 22 is a block diagram of a fourteenth variation of the first generalized embodiment, in which the probes are heat-treated to improve the structures that constitute the probes before the bonding operation. Adhesion between material layers. 15 帛 22® system starts with block 250, which constructs a plurality of probes on a temporary substrate. After the probe is constructed, the process proceeds to block 252, where the probe is heat treated to improve the adhesion between the layers of structural materials that have formed the probes. After the heat treatment, the process proceeds to block M, which transfers and sub-bonds a plurality of 20 needles to a permanent substrate. In the first and second execution operations of the process of FIG. ^, Heat treatment may be performed before the sacrificial material is removed and / or the probes are separated from the temporary substrate. In other execution operations, the separation of the probe from the sacrificial material and the domain substrate can be performed after heat treatment but before the transfer and bonding operation. Material and temporary substrate separation operation. FIG. 23 is a block diagram of a process of a fifteenth variation of the first generalized embodiment, in which the heat treatment of the probe is used to improve the Adhesion between layers of structural materials. The process of FIG. 23 starts at block 260, which constructs a plurality of probes on a temporary substrate, and then proceeds to block 262, which transfers and bonds the plurality of probes to a permanent substrate. 10 After the transfer and bonding operations, the process proceeds to block 264, where the probes are heat treated to improve interlayer adhesion. In some of the execution operations of the process of Figure 23, the probes can be separated from the sacrificial material and / or the temporary substrate in the middle of operations 26, 262, 262, and 264, or after operation 264. operation. 15 Figure 24A_24C is a schematic three-stage perspective view of an example of a process. 'The multiple probe array is constructed upside down, cut and then transferred to a permanent as illustrated in the block diagram of Figure 8. The substrate is used to form a larger array group. FIG. 24A illustrates a state in which a plurality of probes 302 including an adhesive material 304 have been constructed from a plurality of layers of adhesive 20 on a temporary substrate, and then cut into chips 300. FIG. 24B is a diagram showing a state after a process in which a different die 300 has been transferred to a permanent substrate 310 and contact between the probes 300 through the bonding material 300 is made. 37 200534519 Figure 24C is a diagram showing the state of the process after a plurality of operations have been performed. These operations include demolding the probe 30 from the sacrificial material 30, separating the probe from the temporary π substrate 3G6, and bonding a plurality of probe arrays to a permanent substrate 310. 5 帛 25Α_25ΙΚΙ is a schematic side view of different states of an example of a process for forming a multi-layer one-component plate pin array on a temporary substrate, where the constructed structure is then transferred and combined with a permanent substrate. The substrate is made of a sacrificial material and the process includes the components illustrated in the block diagrams of Figures 9 and 15. 10 FIG. 25A illustrates a state of the process after a substrate 352 is disposed. The substrate 352 is preferably made of a sacrificial material, which is used during the construction of the structure. In some embodiments, for example, the substrate may be copper. Figure 25B is a diagram illustrating the state of the process after completion of the 15-layer constituting operation of the layers of a multilayer probe. In Fig. 25B, the probe is made of a first layer 354 and a second layer 356. Each layer is composed of a structural material 358 ® and a sacrificial material 352. Those skilled in the art should understand that, in practice, the probe can be composed of more than two layers illustrated in this diagram. Fig. 25C is a diagram illustrating a state of the manufacturing process after a light-shielding material 362 is in contact with or adhered to a layer 356 having an opening 364 therein. The openings 364 corresponding to the position of one of the last layers of the structural material will be arranged with the same adhesive material. Figure 25D shows the process in which the opening 364 and the photomask 362 have accepted the structure 38 200534519 Material 358 deposits and adhesive materials. The state after the deposit of 366. In some variations of this process, the structural material may be nickel and the bonding material may be tin. Figure 25E shows the state of the process after the light-shielding material 362 has been removed, revealing the state of the third layer 36 of the structural material 358 which has been deposited and covered with the adhesive material 366. In some variations of this process, for example, the light-shielding material may be a positive or negative liquid photoresist or a dry film photoresist. Figure 25F shows the state of the process after the bonding material 366 has flowed back so that it has a circular or spherical shape. 10 Figure 25G shows the state of the manufacturing process after a cutting operation has been performed to isolate individual crystal grains, and after a slicing operation has been performed to trim the thickness of the substrate 35 °. In a variation of this process, before the cutting operation and the slicing operation, the exposed part of the probe and the adhesive material can be covered with a protective material, which can be immediately separated from the structure, which is in the slicing operation and 15 cutting operation. This protective material can then be removed (as shown in Figure 25G). Figure 25H shows that the process has been reversed in the entire structure and the cut substrate 37, and a permanent substrate including a permanent substrate 382, an adhesive layer material 384, a crystal layer material 380, and a pad material 388. Laminate 3 80 was in contact. 20 In some variations of the specific embodiments, the pad material 388 and the structural material 358 may be the same material. In other variations of these embodiments, the pad material 388 is covered with an adhesive material before the laminate 380 contacts the structure 370. The selective position of the bonding layer, seed layer, and pad material on the permanent substrate 382 is selected to correspond to the special position on the structure 370 for contact with the bonding material. The alignment between the structure 370 and the pad position 380 may be a preliminary alignment (r0Ugh alignment) at the beginning. Figure 251 shows the state of the process after the second return of the bonding material 366, which can cause further alignment of the probe and pad positions and also cause the probe to adhere to the permanent substrate. Figure 25J shows the process of removing the temporary substrate along with the layers that make up these probes. The sacrificial material of P points-the state after removal. Figure M] shows the completed state of the process, in which the probe elements 392 and 394 are arranged on the substrate 382 and adhered thereto. As shown in Figure VII, all probe structures in the #array need to be the same size, or even the same structured or oriented. 15

20 The picture is a side view of a different state of an example of a process for forming a multi-layer, multi-layer, and multi-element probe array on a temporary substrate. A side view of the towel is then transferred to at least-part of the structure. Shuijiu The substrate, and her pin components are molded in-pattern seven = Γ :: before the industry but after the transfer and bonding operations, & operation 'where the process includes the 9th, 15th and the And other components. In the 26A-26E picture, the process of the case is as follows, including the following main operations1. Multi-probe squatting in an upside-down orientation on a substrate ==? Substrate-line two… probe array can-electrochemical state 40 200534519 2. Selective deposition-pad material. The solder material, for example, may be composed of gold, gold and metal, or other metals or metal combinations. The solder joints or junctions can be formed, for example, by the electric ore passing through the openings in a patterned photoresist layer, and are typically connected to the probes in 5 rows of probe arrays in number and location. The needle positions correspond to the bonding pads on the permanent substrate to which the probe array will be transferred. 3. Perform a cutting operation to separate individual probe arrays. 4. Bond the probe array to the permanent substrate. The substrate, for example, can be a polymer or ceramic package with internal and / or external circuit structures, which can be used for signal routing from a component, where the probe contacts are in contact with other components connected to the substrate. This operation typically involves aligning and positioning the probe array at a selected location on the substrate. Those skilled in the art are familiar with the methods used in the bonding of solder pads and permanent substrates on probes, including, for example, gold-gold diffusion bonding, using gold _ 15 tin eutectic alloy, or using lead-tin Solder adhesion. For example, moderate heat (for example, ~ 40 (TC) and pressure (for example, ~ 100 lbs / pad)) can be used for diffusion bonding. 5 · For example, 'using the last name etchants sensitive to the sacrificial metal to dissolve the array structure. The sacrificial metal component of the monolayer (for example, copper). During this operation, 20 also removes the temporary substrate. This operation completes the construction of the fully assembled probe package. Figure 26A shows that the process has completed a probe array. The state of the package after completion of the operation. The completed package 402 includes one or more electrochemical arrays of 404 consisting of a plurality of probes 404-1 to 404-7. Each 41 200534519 one The pin-pin component is combined with a permanent substrate 4 which is also a functional base via solder pads 408 ~ 1 to 408-7. The substrate includes electrical leads 412-1 to 412-7. In this example It extends to the contact pads 414-1 to 414-7 arranged on the back side of the substrate. 5

10 15

20 In alternative embodiments, the substrate may include additional components such as capacitors, resistors, and inductors and / or shielded conductors, as appropriate, to reduce signal loss and improve signal integrity. FIG. 26B shows a state in which the process is configured with a temporary substrate 422 and electrochemically constitutes a re-array correction, immortalization, and immortalization with probe contacts 424 facing but not in contact with the temporary substrate 422. Also, as shown in the figure above, the / probe,, and port structures are surrounded by, for example, copper, a sacrificial material, which is deposited during layer-by-layer construction to form the probe arrays. In some execution towels, the probe structures may be composed of nickel. FIG. 26C shows a state in which the process is performed on the pad 408, which has been formed on the back side of each probe in the probe array * ⑽. Fig. 26D shows the state of the manufacturing process after the probe arrays 404a, 404b, and 404c have been cut into a temporary substrate 422, and the sacrificial material appears to be in combination with the individual array portions of the probes and pads. Fig. 26E shows the state of the process in a non-disengaged needle array as shown in Fig. 26] through the pad side _i to the purchase and a permanent substrate 4, "". To complete the process, The sacrificial material appears to have been carved from the fellow to cause the removal of the sacrificial material and the cut portion of the temporary substrate 422. Figure 2 | The figure shows the final probe array package of the mold. Figure A 27C is shown in Figure 26A-26E The probe is a schematic side view of the different states of a process of forming a contact of 200534519 probe contact. If a special probe contact form or material is required, the above and the 26th and 26th 26_ 26E__ can be enhanced by adding-initial operations. This initial operation consists of a pattern of ㈣ and other holes, which will temporarily pattern the substrate. The positions of the holes correspond to the positions of the formed probes, and the shape is the required shape of the probe contact. Correspondingly, these openings can then be accepted after the probe fabrication by the electrochemical manufacturing operation is continued—the required probe contact material

Figure 27A shows the state of the process 10, in which the holes in the temporary substrate 42: have been filled with the required probe transfer milk and the table is frankized. The second rule _ ㈣ 以 以 秘 秘 ㈣㈣ ㈣㈣ 塾 塾 塾 塾 塾 塾 塾 material rights, the state after. The state of the process in Figure 27B is similar to the state of the process shown in the figure. 15

20 The energy-saving process shows that the completed probe array is sealed carefully, in which the end-plate needles have increased contact points Lp. Included-polymeric materials, such as a light beam :: polyimide . In these situations, the polymer material is removed after the combined operations, such as tritium, chemical removal, or phase wealth methods. The party retains the final structure as part. It is also equipped with a composite material, which is shown in Figure Π: 81. It is a schematic side view of the different states of the example used to form multiple layers on a temporary substrate. The constructed structure is then transferred and combined with a permanent substrate. The contacts of the probe element are molded in a patterned substrate of one of the contact materials different from the structural material 'and targeted at high-yield possibilities before the transfer operation. Analyze and later select a different probe array for use or not, and 5 where the system includes the components illustrated in the block diagrams of Figures 9, 15 and 23. FIG. 28A shows the state of the process after a temporary substrate 2 is selectively etched to form voids 454 at the positions constituting the probe contacts, wherein the shape of the patterned voids is The contact needs to be 10-shaped. In some executions of this process, the substrate 452 can be silicon and can be sharpened or wedge-shaped by anisotropic etching, but hemispherical or other circular shapes can be obtained by isotropic etching. FIG. 28B illustrates the state of the process after a light-shielding material 456 is applied to the substrate 452 and patterned to generate an opening 458 to cover the void regions 454 constituting the probe contact 15. In some operations, before applying the light-shielding material and patterning it, a crystal layer is applied to the surface of the substrate and enters the gap 454. Additionally or alternatively, if necessary, a release layer material may be applied to the surface of the substrate and enters the gap, which helps to release the probe and probe contacts from the 20 substrate. In other variations, if necessary, a seed layer material may be applied after the light-shielding material is applied and the light-shielding material is patterned. Similarly, if necessary, a release material may be applied to cover the light-shielding material and enter the space of the substrate 452. FIG. 28C illustrates a state where the manufacturing process of a probe contact material 462 has been deposited into 44 200534519, such as the opening 458 of the light-shielding material and the substrate ^ and the working gap 454. ^ There are products (for example, in the specific implementation JΎ seed layer or release layer covering the light-shielding material), the contact material 462 ^ ^ and the light-shielding material 456 can be planarized to a thickness greater than the thickness of the first layer, ^, / Ah. If the flattening operation is used to remove the species B ”^ from the sacrificial material or the depolarizing layer material, then the height of the ::: is still greater than the thickness of the layer or equal to the thickness of the layer but less than the deposition shading The thickness of the material. Figure 4 shows the state of the process after the shading material has been removed and the sacrificial material has been deposited, and the deposits of the contact material and the sacrificial material have been planarized to a height of the 10th layer. In a variation of this process, the light-shielding material initially used can cover the gap 454, and the sacrificial material has been selectively deposited, the light-shielding material is removed, and then the structural material is plated, so that the same results as shown in the figure can be obtained. The 28E diagram illustrates the state of the process after the probe has multiple layers of sacrificial material 464 and structural material 15 466. In some of the operations of this process, the probe contact deviation and the structural material deviation can be- And the same material, but in other operations, it can be a different material. Figure 28F is a diagram showing the process of adding a selective deposit of an additional layer of structural material Yang to the height of the probe And the state after a pad material is selectively deposited on the structure material. The selective deposition of the structure material and the welding material can be performed through a patterned photomask, wherein after the deposition operation, Remove the light-shielding material. In a variation of this process, solder bumps can be optionally applied to the structural material, instead of depositing soldering material and additional layers of possible structural material. 45 200534519 Figure 28G shows the process in progress The state after cutting individual array portions, which results in an array pattern of the desired form transferred to a permanent substrate. Figure 28G also illustrates one possible variation of this process, where one or more of the sacrificial materials 464 are shown. The first layer 472 may be different from the sacrificial 5 material used on the connection layer. Figure 28H illustrates the state of the process after the unmolded probe arrays 4 transfer tiles have been bonded to a permanent substrate 476. 10 15 20 FIG. 281 illustrates a process in which the first constituent layer 472 of the sacrificial material 464 and the remaining layers of the sacrificial material 464 are removed from the substrate on the temporary substrate 452 to generate a substrate attached to a permanent substrate. The state after the final probe array. A demolding probe array attached to a permanent substrate can be considered as a probe array package. It should be understood that although not shown in this example and other real money presented here Specific probe structure forms, but including helical forms, cantilevered forms, and other possible forms of plural pin sightings are not suitable. Examples of these forms are in the United States of America previously filed on December 31, 1998. It is proposed in the patent application No. 60 / 533,933. It should also be understood that in the variation of this process, other probe contact forms are suitable and other probe contacts can be used to constitute the process. Others The probe contact form and the processes used to form the probe contacts are proposed in a previous reference: US Patent Application No. 533,975. In other variants of this item, the final probe array package may include an array of recording needles ①, which can be attached separately or simultaneously to the permanent substrate 476 'and if the probe element fails, the entire set can be replaced Or individual probe arrays. 46 200534519 In some variations of this process, the permanent substrate can be-space converted,-a circuit board, or even-a programmable stellar array. After the package is formed, or more specifically, after the probe contacts are released from the temporary substrate, the probe contact form can be modified, for example, by using chemical or electrochemical processes or deposition processes and Similar processes are used to sharpen or flatten these contacts. Sections 29A-29L® are schematic side views of different states of an example of a process for forming a multilayer, multi-element probe array on a temporary substrate. It then transfers the formed structure and combines it with a permanent substrate Among them, 10 probe contacts are made through a mold made of a sacrificial material, wherein the probe element is separated from the temporary substrate by a refinable material and wherein the process is included in the 9th, 15th, and These elements are illustrated in the block diagram of FIG. 22. The process exemplified in Figures 29A-29L includes the following operations: 15 制作 Before the probe fabrication process begins, the -first-metal layer is deposited on the substrate surface and planarized. The melting point of the selected first metal is the temperature used in different construction operations (that is, the photolithography process, the deposition process, etc.), but it is lower than any combination based on fusion or The temperature required for the bonding material (such as 'solder or tin'). In performing the operation π one by one, for example, the first metal may be indium.旦 -Den deposition of the first metal also deposits i-materials (for example, a thick layer and planarizes it. (3) On a planarized surface, the construction of a plurality of layers is carried out first. Then the probe is formed.) The main body (for example, the spiral impeachment structure and similar structures of 47 200534519) where each layer of the structure includes-a structural material (for example, a recording) and a sacrificial material (for example, copper) or more than each of these materials and Eight (4) After forming the final finish, selectively deposit additional structural materials of the same or different types to form a welding pad and add an adhesive or bonding material (eg, Tin or solder). (5) Then 'the first material is deposited on the temporary substrate and the construction operation is completed thereon'. The temporary substrate is sliced and thinned to have a more wafer-like form. (Singulated). 10 (6) Next, heat-treating the grains to enhance interlayer adhesion (for example, by promoting low temperature diffusion bonding). During this process, the temperature may or may not be raised to as low as The melting point of the metal, but if At the melting point, the surface tension of the molten first metal will keep the die-backing in place. In the variation of the process, the diffusion bonding process can be delayed until 15 to transfer to the permanent substrate operation (7) Next, the individual dies are arranged (that is, transferred to) the permanent substrate and adhered to it. In some variations of the process, an underfill is used when the sacrificial material is decoupled. The material is embedded between the permanent substrate and the probe. The use of back fill material helps to prevent the bonding material from negatively affecting the sacrificial material or the etchant used in the removal of the sacrificial material. Among other changes In the form, an intermediate material can be added instead of the last layer or two sacrificial materials used to form the probe. (8) Next, the die / package is subjected to thermal cycling, only the temperature is raised to the south enough to melt the first metal. At this temperature, potentially remove the temporary 48 200534519 substrate together with some or all of the first metal. If necessary, another job can be used to remove any Residual first material (for example, a planarization operation, a selective etching operation, or the like). These operations result in exposing the sacrificial material (for example, copper) on the construction die that is now bonded to the permanent substrate. 5 ( 9) Finally, the sacrificial material is etched in a demolding process, and a complete probe package is produced. Figure 29A shows that the process is to cover a substrate 502 with a crystal layer 504 (if necessary) and a first The metal 506 is plated, planarized, plated and planarized with a sacrificial material 508 (eg, copper), and then coated with a photoresist 512. 10 The plating stop portions in those areas where the probe contacts are configured will be Photoresist patterned state. FIG. 29B shows the state of the process after the additional sacrificial material 508 is deposited, wherein the patterned photoresist 512 is plated up from the previously deposited sacrificial material and simultaneously mushroomed. 15 Figure 29C shows the state of the process after a thin film of a crystalline layer material 514 is deposited to bridge the dielectric portion of the electroplating stop portion. For example, the seed layer material can be deposited by a physical vapor deposition method. In some variations of this process, the seed layer material can be deposited before depositing an adhesive layer material. 20 Figure 29D shows the state of the process after the overlay deposition of a contact material 518. In a variation of this process, a suitable patterned mask can be used to selectively deposit the contact material, and it can be the same material as the structural material 516 described briefly. In a further variation of this process, after the seed layer 514 is deposited 49 200534519 and before the contact material 518 is deposited, the contact coating material or the contact material may be covered or selectively deposited. Compared with the total height of the contact, the coating or contact material of this contact is extremely thin. Fig. 29E shows the state of the manufacturing process after a grinding piate 5205 has been moved into an appropriate position, & the cap-deposited contact material is ground and then polished. Figure 29F shows the state of the manufacturing process after completing the planarization operation, which results in a surface composed of these areas of the sacrificial material 508, the contact material 518, and the seed layer material 514 φ. The 10 帛 29G diagram shows the state of the process after a plurality of layers of sacrificial and conductive materials have been used to construct most probe structures. The electrochemical > pediatric technology described here, the electrochemical deposition technology described in the patent or patent application, which is incorporated herein as reference, or some Other techniques of the patterned layers of materials are required to make each of the plurality of layers. Figure 29H shows the process of applying a thick layer of a photoresist 524 (for example, a cured liquid-based photoresist or a dry film photoresist) and patterning it, and depositing a structural material 523 into the patterning. In the photoresist, the openings are used to form the bonding pads, and the bonding adhesive material 522 is deposited to cover the welding pads. In some of the operations performed by the clothing, the pad material may be tin, and in other embodiments, a tin alloy may be used and / or some other materials may be used. Figure 291_shows that after the process has removed the patterned photoresist material 50 of Level 29, 200534519 524, and after the substrate 502 is sliced and thinned to form the substrate 502 ', and the cutting operation is performed (not distinguished) It is used to divide the structure into individual grains. Before or after the cutting operation, the structure is subjected to a heat treatment that enhances the adhesion between the layers 5 to form a structure with more uniform properties. FIG. 29J shows the state of the manufacturing process after bonding the die 526 to a permanent substrate 532 in a flip-chip manner by using the pad material 532 and a second pad material 534 disposed on the substrate 532.

Younger brother shows that the process is in progress 10 15

20. 7. After the gap 538 between the plate 532 and the sacrificial material 508, and after the structure is heated to a temperature sufficient to melt the first metal and the structure is removed from the temporary substrate 502, | FIG. 29L shows the state of the process after removing the sacrificial material 508 and the plating stop material 512, thereby demolding the completed probe and forming the probe package 538. Those who are familiar with this technique-once reviewing the teaching content here-the above process can have multiple additional variations, and these variations are hereby incorporated into this case as tea test materials. 3013_ is a process chart for forming a multilayer, ^ -element probe on a temporary substrate, a process, and a solid wire, which is similar to that shown in the 29A-29L diagram, except that The first genus is replaced by a dielectric material. β The process illustrated by households in Figures 30A-30H includes the following operations: ⑴ Coating with a -dielectric material-a substrate (for example, a surface material or 51 200534519 other materials), which can be used from a temporary substrate and deposition The structures are demolded between the layers of material (eg, the dielectric material may be a polyimide material). If desired, the dielectric material may be spin-coated, cured, and adhered to a surface on a substrate. 5 ⑺For ⑽ operation, application-seed layer covering dielectric material for power connection. # (3) Deposit (e.g., by money) a thick layer of sacrificial material (e.g., copper) and then grind and polish it. In a similar manner as described above in relation to 29A-29LS), 10 contacts, a probe body, a pad, and a bump are formed. (5) Slice and cut the structure and temporary substrate. (6) Mount and bond the die to a permanent substrate as described in relation to Figures 29A-29L. (7) Release the temporary substrate. For example, if the first dielectric material is polyimide and the temporary substrate is glass, the structure and the temporary substrate may be immersed in boiling water. Water can affect the adhesion of polyimide to glass and cause delamination of polyimide. This will effectively allow the glass to be removed and then the polyimide layer can be manually peeled off or etched away using plasma or wet etching. This will cause exposure of the sacrificial material. 20 (8) Therefore, the sacrificial material can be removed by an etching operation to release the structure. FIG. 30A illustrates a process in which the temporary substrate 552 (for example, made of glass) is coated with a dielectric material 554 (for example, polyimide) in the areas constituting the probe contacts, and It is sequentially coated with a crystalline layer material 556, followed by 52 200534519 with a thick layer of a sacrificial material 557 (for example, electroplated copper), and sequentially coated with a patterned photoresist material 559. Fig. 30B shows the state of the process, which is similar to the state shown in Fig. 29D. 5 Figure 30C shows the state of the process, which is similar to the state shown in Figure 29F. Figure 30D shows the state of the process, which is similar to the state shown in Figure 291, and Figure 30E shows the state of the process, which is similar to the state shown in Figure 29j. 10 FIG. 30F illustrates the state of the process after the thin temporary substrate 552 is separated from the dielectric coating 554. As for the glass substrate and polyimide dielectric material, as shown in the figure, the structure is separated by immersing the structure in a boiling water 564 tank 562 as the 30G diagram. The process is illustrated in, for example, by peeling or plasma Or wet 15 type etching, after removing the dielectric material, and after disposing the primer material between the exposed portion of the permanent substrate and the sacrificial material used to form the structural layers. Figure 30H shows the state of the process after the sacrificial material is removed leaving probe elements 572 (a) -572 (c), where the probe elements are made of adhesive materials 20 576 and 578 and potentially by primer Material 580 is adhered to a permanent prosthesis. A specific embodiment of the present invention relates to a method for fabricating a microprobe using electrochemical fabrication, which includes manufacturing (with contacts), transfer and translation, a space converter or Other substrates and (optionally) coating operators 53 200534519 The different methods for making contact geometries are available and are hereby incorporated by reference into this patent application Proposed in No. 60 / 533,975. For simplicity, in the following specific embodiments, a single contact manufacturing method is selected, but those skilled in the art should understand that other manufacturing techniques can also be used in variations of the specific embodiments. In particular, in the following specific embodiments, a method of covering photoresist features using _mushrooming according to sacrificial materials is used to define the contact geometry.

10 15

20 Figures 31A-31W are overview and—example process phase—these operations do not include probe coating operations. In FIG. 31A, the system is shown as a temporary wafer 604, and it is assumed here that the system is coated with a seed layer 608 and an adhesive layer 606 such as an oxide-dielectric material 1. These metallization layers are not present in the region of 'phase_degree' (for example, because of the last name or peeling: ⑽ '), and are used to expose the surface of the wafer and thus constitute an unplated endpoint detection side. In the material 31B, the thickness of the sacrificial material 616 (for example, copper) has been mined, and in the 31C figure, the “this” has been released. The shape covers the two Si melon shapes and in the 3rd paste, the copper mushroom shape has been continued for a period of time through the recording to control the first training image to form a secret y or a bell. Deposition of copper 622 (usually in the deposition process), and it is better to point the copper film from the end point to the pad 614, or to prevent the deposition of material. Should be ^ =: With 彡, if 彡 54 200534519 is applied by physical vapor deposition (ie, by sputtering or evaporation) to the contact coating material 624 applied to Ai, this can be omitted step. This step can also be omitted if only a single contact material will be applied in the connection step, or if the ^ layer of a 2-layer contact is relatively thick, in this two conditions, the thickness of the 5 points material Electric ore can lead to a full-textured operation from the side walls of copper, which can be used to cover the photoresist without a crystal layer. Finally, if it has been used by Dr. Kieun Kim, the drilling operation (drilHng), the etching technique uses p to perforate the photoresist exposed through copper, and thus makes contact with the underlying material, it can be omitted This step. 10. The continuation pattern assumes that these contacts are actually made of two different materials. In Figure 31G, a contact coating material 624 (e.g., rhodium) is deposited (for example, by electricity> child product). This deposit can be quite thin (for example, __ 3 microns), and the stress-dependent loss phenomenon in ρ == different material groups is minimized. In some situations, it should be noted that these jigsaws are made of contact coating materials without any backing material. ..., and γ is preferably a thin coating for contact coatings that are too soft (e.g., gold) or have excessive residual stress (e.g., baht or rhodium) when deposited, and other materials are preferred Backing. In Fig. 31H, the electric ore-assisted, north contact material 626 is used to form a large number of contacts, and in Fig. 311, 20 planarizes the wafer. In Figure 31J, multiple layers 6282 of a structural material (for example, nickel) have been deposited to form a material probe. It is assumed that the probe base material M: part of the probe, ′, 17 is the uppermost layer (finally the lowermost layer); in this way, it may have a disc shape, with a straight space similar to the diameter of the probe. In Fig. 31K, thick light 55 200534519 resist 634 is deposited and patterned, and in Fig. 31L, solder 636 (for example, tin-boat 'but also pure tin) or similar material power mine has been entered into the light The characteristics of the resist. If a probe substrate is not formed, nickel may be plated to form the substrate before the solder is plated. The substrate, however constructed, provides a wettable pad for solder balls 5 and a stabilizing base for probes. In Fig. 31M, the photoresist is removed, and in Fig. 31N, the solder 636 flows back to form a bump. It should be noted that the flow-back can be performed later (once the wafer is singulated), and it is not strictly required to flow-back before the bonding industry (see Figure 1R-1S). It should also be noted that 10 etch-back operations (or optionally, two etch-back operations can be performed) as shown in Figure 31Q are required before flowing back. The copper surface underneath makes it impossible to wick to cover the copper surface once molten solder. In FIG. 310, the wafer _ has been applied with a protective coating 638 before the dicing operation, and in FIG. 31P, the wafer 604 has been diced. The cutting operation leaves a thorn-like portion 640 on the copper surface, which interferes with the subsequent adhesion industry. By judiciously and carefully selecting a protective layer (preferably a hard material such as crystaibon (j) 509 which is a hard material that can dissolve insects such as the one produced by Lu Arernco), this burr The size of the portion 64 can be kept small. In Fig. 31Q, the copper etch-back operation has been performed. This etch-back operation has a variety of eye-shaped hooks to remove the burr-like portion; b) the recess is in the solder Copper surface below the surface. Completing the latter operation is for two reasons: 丨) As mentioned above, the risk of wicking of copper to cover copper and shortening with adjacent probes is eliminated; the material is separated from copper to allow solder to be embedded in the primer. Protected during copper release. 56 200534519 If a permanent primer is used, the rest of the work is better done to a level where the copper surface is not lower than the bottom of the probe substrate, as the copper surface will define the top of the primer (see Figure 31T). If no primer is used or only a temporary primer is used, further etching of copper will help and reduce the time required for complete demolding in the future; in this regard, this demolding operation can be more than just this It is necessary to limit the shown further-continuous continuous operation to a) maintain all probes in good alignment until they are combined; b) minimize the risk to the probes until they are combined; c) prevent the bottom The gel polymer (if used) will not cover the probe and interfere with its compliance (of course, if the gap is too large, the capillary pressure will not be properly wicked if the gap is too large). In addition to the etch-back operation to remove burr-like parts, electropolishing or machining (sanding, grinding GaPPing, polishing, sandblasting) can be used. In addition to the bribe operation shown in Figure 31Q, diffusion bonding (not shown) has been performed before or after the operation. The latter is preferred because it has less copper and therefore has a lower risk of stress due to differences in the coefficient of thermal expansion (CTE) between copper and other materials. Furthermore, the copper has been recessed relative to nickel due to the etching, so the solder bumps on the surface are more likely to remain in place during the flow-back during diffusion bonding. It should be noted that anyway, since the bumps may flow back during the expansion cohesion (for example, at 250 °), the earlier step of causing them to flow back can be skipped (Figure 31N). It should also be noted that although the stress is too great to allow this operation, unless the wafer is first shot by partially cutting through (for example, cutting through all the deposited layers but only slightly into the temporary wafer), mark "⑽red" ), But at the wafer level can and needs to spread the adhesion industry (for example, after Figure 3U). It should also be noted that 57 200534519 If the space converter can withstand the temperature, it can be in the step of Figure 31S Or after the simultaneous steps, the diffusion bonding industry is performed. In Figure 31R, the die 646 has been flipped and initially (for example, up to +/- 5 microns) with an in-space converter, IC package, or other The bumps 642 on the substrate 648 (e.g., a printed circuit board) are aligned. It should be noted that most of the dies fabricated on the temporary wafer 604 are very close, so they can be widely spread to cover a larger Substrates, for example, used to make probe cards for memory (characterized by large area but relatively low probe density). Well known in the industry such as those produced by Palomar Technologies (for example, model 6500) or 10 SSemicond UCtor Equipment (for example, System 850 with a hot gas heater stage) is used for die bonding equipment to perform alignment operations. When face to face, the equipment uses multiple cameras, for example, to Photograph and capture the die and space converter, align the die and space converter together and heat them to perform the bonding industry. As shown in the figure, the dummy converter includes bumps or other isolated metal contacts. The fake right third contact is composed of solder. As already explained, it does not require additional solder to be applied to the probe pin. Among them, the material can be directly stuck to the wooden needle base from the space converter 648. A liquid flux or solder paste M4 has been applied to either or both of the die 646 or the space converter (a) for a) temporarily, and the xuan one is fully bonded together to Keep the alignment state until the bonding, b) will minimize the chance of oxide formation that affects the good bonding operation. For the latter, it is helpful, "active, and soldering is better. In the figure, solder 636 has flowed back, the die 646 is self-aligned, and flux 644 is removed by Shida's flux. In the 31st Ding diagram, 58 200534519 wicking a primer material 652 is used to fill the space under the die. If a permanent primer is needed to provide additional strength to the final component, this can be a material such as epoxy or flip-chip primer. Alternatively, the primer may be a material such as wax (e.g.,

Crystalbond 509), quick-drying paint and other materials, which are removed after removing copper from the mold. In either case, in order to allow the copper to be etched without damaging the solder, it is generally necessary to use a substrate. Because the solder is easily etched in the copper etchant, it is used as a sacrificial anode. It should be noted that the etch-back step shown in Figure 31Q is difficult to complete because it tends to etch the exposed solder without etching copper; this condition is operated by the following two operations i) temporarily The solder (for example, a tan material is spin-coated in a thin polymer layer on a flat plate); 2) the tan material is coated with gold (for example, immersion of gold through immersion). Kepi 15-20 sections of the above-mentioned low glue use-coating (such as' electroless plating or immersion gold), in order to coat the solder chip on the die 646 and / or the space converter _, and keep the last name engraved Qi m moment. The thin layer of this coating can also be deposited on the surface of copper ^ Since -denier_copper has no mechanical cuts, it can be easily removed (for example, by ultra " —)) . "Bo Zhenfeng ⑻i, β in the first figure, the grains have been completely demolded from the steel. Should be 'keep these probes at least part of the human Ren copper until two solidity is provided, and in the bonding During the operation and all the social structure 2: Wu's 6-axis alignment conditions. In this production room, typically earlier: the characteristics of the woodized copper-coated photoresist have disappeared or are dissolved. For example, ^ Tusuo Qian,-59

200534519 5 10 15

Once the photoresist has been exposed enough to stop the field molding such as and then Emei. In the end, you can make good use of a recording agent, and you can choose other materials, such as picking up, removing, etc. to remove any foreign materials. Another effect of this engraver is the removal of the "present_" region from the probe contacts. The contact made by the above description of "single-shaped" material should have the number 4 and 31 shown in Figure 31, and the top of the contact should be higher than the middle part between the top and the bottom). The effect of the sigmoidal expansion expands the effective contact area between the ~ and k-pin inspection surfaces. If there is an etchant, the corners of the contacts can be smoothed. It should be noted that the solder is used to bond the crystals to the space conversion. The first and second squares of the device are bonded using thermal compression, such as gold. In this case, 'the figure has a gold-to-solder solder, and the converter contacts are also coated with 2 gold. The two gold surfaces were brought into contact, and heat and pressure were applied to make the inter-crystals not soldered. No matter what, the tree surface is often not affected by the further expansion of the Bronze Brothers 31A-31W1. 20 = dagger leopard system, two = transfer / adhesion probe other structures and components, useful for the final 2 Also useful for space converters. These examples include devices (traces, microwave transmission belts, coaxial transmission lines), switching elements, electrical ports, resistors, and inductors. 60 200534519 (for example, a gold or copper coating to reduce the probe resistance, or a nickel coating (for example, a nickel coating of copper or gold ^ wooden needles) to increase the mechanical stiffness of the probe No coating is applied to the contacts. The same coating is applied to the contacts. It is challenging to apply a coating on the sides, but the contacts are not coated. However, this specific embodiment provides this solution. Example of the scheme. The 32A-32T diagram is similar to the 31A-31T diagram (it should be noted that the cut thorn-shaped portion is not shown in the 32Q diagram). However, a release layer 654 is provided in the process flow ( (Figure 32A), in order to consider the part of the copper at the beginning of the probe release, allow it to accept coating 656 as shown in Figure 32W. This 10-layer layer 654 is preferably a conductive material (such as "Indium" which can be melted to release the temporary construction wafer. In Figure 32u, the release layer 654 has been removed (after melting, there will be residues in this layer, which need to be etched, polished / polished, etc. Method to remove). In the 32V picture, the copper is partially etched to expose the contact 658. In the 32W picture, then Coating by dipping, spin coating, spraying, or other suitable methods with a polymer (for example, copper post-etch compatible photoresist (such as Shipley BPR 100) or wax (for example, Crystalbn) 656 These contacts 658. These contacts can also be coated with a non-polymeric material, as long as the coating applied in Figure 32χ when removing the material (for example, a peel-off process) does not accumulate on the material The deposits do not adhere or detach. 20 In Figure 32X, the copper has been etched around the probe. It should be noted that because of the polymer, it can only be etched from the side. In Figure 32, the probe 664 has been coated 662 (for example, by electroless plating, or possibly by chemical vapor deposition, physical vapor deposition, or electro-mineralization.) Finally, in Figure 32Z The polymer has been removed from the contact 658 so that it does not have a 61 200534519 coating. In order to improve the adhesion of the coating to the probe, heat treatment is required after depositing the coating (not shown). If not before the coating operation Expansion and dispersal cooperation can be performed at the same time For bulk adhesion and coating adhesion, 0, /, and 5 10 15 20 converters 648 can withstand the temperature required for diffusion adhesion (the temperature may be higher than the temperature required to enhance coating adhesion). Figure 32 Shown is a six-car specific embodiment (not shown) of a variant of this specific embodiment, which is as follows: instead of applying the polymer as shown in Figure 32w, only the contacts are polymerized Polymer, leaving a polymer-free area between the probes. One way to do this is to spin-coat a thin layer of polymer on a flat plate and carefully contact the contacts with this layer ^ Next It is pulled off. This method can be performed at any time before the coating operation step shown in Fig. 32Y, so there is no need to first perform partial demolding as shown in Fig. 32V (and therefore it is not necessary to use a permissible Release layer for temporary wafer removal). Only the joints are coated and not formed as shown in Figure 32. The advantage of a continuous polymer film is that if the steel surface has not been finished, it can be engraved from top to bottom and from the side. Operation; 2) no continuous film interferes with the coating process (for example, in order to reduce the exposure of the probe to the plating bath and thus reduce the vibration surplus under the condition of no money deposit). In another embodiment (not shown), the coating is allowed to be deposited. Then, one of a plurality of methods is used to remove the ^ contact, such as: 1) to protect the rest of the probe (for example,仏, Ersijia. And then remove the coating self-contact by chemical surname engraving; 'know and-cover with-agent thin layer of the board touch, pour paint: 62 200534519 ° and the side of the upper probe The coating material is also removed from the contacts while removing the coating method there (for example, in the example (not shown), by forming a power supply, it is not possible to connect by the coating electrode). ", Zhan Zhiyan's coating is deposited on these contacts to test") to prevent the sheet! Physical vapor deposition of copper. This material is miscellaneous ... / It is conductive, but it does not need to be conducted strictly. Sex; if Putian Bing ^

Sticky so it's not easy &layer); 3) mechanically remove it by polishing or grinding). I., Yiyuan material and then physical vapor phase A crystal layer (for example, steel) 戋 Jiji; ^) ^ Direct physical vapor deposition of the contact material can be further processed without difficulty. Τ. After planarization (picture 321)-a ring of insulating material combined with each contact separates the metal inside the ring from the outer ring; however,-but the first layer is plated to cover this planarized surface, 2 Mushrooming covers the thin insulating ring and reaches the inner metal, quickly: its coating. 15 In a related embodiment, a copper etch barrier material (for example, nickel) is deposited before the contact material is deposited, which is after thin copper and after the contact material that is a tone. In the final demolding operation in the 32X picture, the copper thin layer of the cold cloth contact was not completely carved because it was covered with nickel. Therefore, when a coating is applied in Fig. 32Y, the coating is coated with nickel covering the contacts as 20 uncoated contacts themselves. Utilizing the additional copper etching operation, the copper of the remaining sea contact ’s nickel ’cover (now also coated with electric money) is finally demolded, and the + contact material is exposed. In another specific embodiment, the temporary wafer 604 can be demolded from the probe structure after the probe is transferred / adhered to the space converter 648 (Figure 32R), and the condition is the same after 63 200534519 (32U) Figure). Since the probe is packaged in a sacrificial material, the entire structure (typically hundreds of microns thick) can be self-sufficient and the temporary wafer 604 can be eliminated earlier. Figure 33A-33T is a schematic side view of the different states of the different process. This process is similar to the process of Figure 32A-32T, except that only one sacrificial material 626 is used instead of the two 626 and 616. Figure 33U illustrates the removal of the sacrificial material 626. A coating was applied to the probe in Figure 33V. • Remove the temporary substrate_ and the remaining sacrificial material 10 626 and photoresist 618 in Figure 33W. There are different other specific embodiments of the present invention. The specific embodiments can be based on the combination of the teaching content here and the plural teaching content incorporated herein as a reference. Some embodiments may not use any overlay deposition process, and / or may not use a planarization process. Some specific embodiments may include-a single layer or selectively depositing a plurality of different materials on different layers. Some specific embodiments may use a selective spring process or overlay deposition process on some layers, which is not an electrodeposition process. Some embodiments may use nickel as the structural material, while other embodiments may use different materials. Some embodiments may use copper as a structural material, with or without a material. Some embodiments may remove a sacrificial material, while other embodiments may not remove it. Some embodiments may use a selective masking operation based on a photomask in combination with a blanket deposition operation. -Some specific examples can be constructed on a layer-by-layer substrate (1-γ but cut to base) Ji ', but it is a precise plane stacking construction process that separates the system 64 200534519 process which helps to interweave materials between layers. . These optional construction processes disclose U.S. Patent Application No. 10 / 434,519, filed May 7, 2003, entitled "Electrochemical Manufacturing via Interleaved Layers or Via Selective Etching and Pouring The methods and devices used in the structure (Methods of 5 and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids) "are hereby incorporated by reference in their entirety. In this regard, it is obvious for those who are familiar with the art of 3 'to know the further detailed embodiments of the plural #, the design alternatives, and the specific embodiments using the present invention. As such, the present invention is not intended to be limited to specific illustrative embodiments, alternatives, and uses described above, but is limited only by the scope of patent applications filed thereafter. [Schematic description 3 Figures 1A-1C are schematic side views of a harmonic contact mask electroplating process at 15 stages of different stages, and Figures 1D-1G are schematic views of a different type of harmonic contact mask. # Rough side view of the different stages of a harmonic contact mask plating process. Figures 2A-2F are schematic side views of the electrochemical process used to form a specific structure at different stages. In this structure, a sacrificial material is selectively deposited and a structural material is deposited over it. Figures 3A-3C are schematic side views of different exemplary sub-assemblies, which can be used to manually perform the electrochemical manufacturing method shown in Figures 28A to 28C. Figures 4A-4I are schematic illustrations of the first layer of a structure that is formed using an adhesive mask electroplating, in which the overlay deposition of the second material will be between 65th, 200534519, and the first material itself. Covered between the openings. FIG. 5 is a block of a process of a first generalized embodiment of the present invention, which is required to form at least a part of a plurality of probes on a temporary substrate and then transfer them to a permanent substrate. Illustration. 5 FIG. 6 is a block diagram of a process of a first variation of the first generalized embodiment, in which the probes are transferred to the permanent substrate one at a time. FIG. 7 is a block diagram of a process of a second variation of the first generalized embodiment, in which the probes are transferred to the permanent substrate simultaneously in an array. Fig. 8 is a block diagram of a process of a third variation of the first generalized embodiment, in which the probes are transferred to a permanent substrate in a series of separately arranged arrays. FIG. 9 is a block diagram of a process of a fourth variation 15 of the first generalized embodiment, in which the probes first constitute a contact and finally an installation area, and then they are transferred to The permanent substrate is then removed. FIG. 10 is a block diagram of a process of a fifth variation of the first generalized embodiment, in which the probes first form a contact and the last 20 form a mounting area, and then the temporary substrate is removed, It then proceeds to transfer it to a permanent substrate. FIG. 11 is a block diagram of a process of a sixth variation of the first generalized embodiment, in which the probes first constitute an installation area and finally a contact, and then a temporary substrate is removed, and then attached Install the permanent 66 200534519 substrate. FIG. 12 is a block diagram of a process of a seventh variation of the first generalized embodiment, in which the probes first constitute an installation area and finally a contact, and a second temporary substrate is attached afterwards Then, the 5th-temporary substrate is removed and a permanent substrate is attached at its position. FIG. 13 is a block diagram of a process of an eighth variation of the first generalized embodiment, in which the probes are only partially formed before being transferred to a permanent substrate, and probe fabrication is completed thereafter. FIG. 14 is a block diagram of a process of a seventh variation 10 of the first generalized embodiment, in which the probes are at least partially demolded from a sacrificial material before being transferred to a permanent substrate. FIG. 15 is a block diagram of a process of a ninth variation of the first generalized embodiment, in which the probes are not demolded from at least one sacrificial material before being transferred to a permanent substrate, and then the Wait until the probe is demolded from at least one 15 sacrificial material. FIG. 16 is a block diagram of a process of a tenth variation of the first generalized embodiment, wherein the constitution of the probes includes that the probes are selectively A conductive adhesive is disposed on the mounting area of the probe. 20 FIG. 17 is a block diagram of a process in an eleventh variation of the first generalized embodiment, in which a conductive adhesive material is selectively arranged at the positions on the permanent substrate, where Finish attaching to the probe and attach the probe and permanent substrate afterwards. FIG. 18 is a block diagram of a process of a twelfth variation 67 200534519 formula of the first generalized embodiment, wherein the formation of the probes includes selecting the probes before contacting the permanent substrate. A first conductive adhesive material is disposed on the mounting area of the probe, and one of the second conductive adhesive materials is selectively disposed at the positions on the permanent substrate, of which 5 is attached to the probe. Then, the first and second adhesive materials are used to attach the probe and the permanent substrate. Fig. 19 is a block diagram of a system of red one of a thirteenth variation of the first generalized embodiment, in which at least a portion of the sacrificial material has not been removed before the transfer, and the permanent substrate and the During the probe bonding operation period, one of the protective materials is arranged between the adhesive material and any sacrificial material. FIG. 20 is a block diagram of a process of the first extended embodiment of the thirteenth modified form of the thirteenth modified embodiment, which includes removing the sacrificial material and the protective material after the cooperation. 15 帛 21 is a block diagram of one process of an extension of the thirteenth modified embodiment of the thirteenth broad embodiment, which includes removing the sacrificial material but retaining the protective material after the cooperation. Fig. 22 is a block diagram of the fourteenth modified embodiment of the first generalized embodiment, a block diagram of the fourteenth modification, in which the probe is thermally treated for 20 minutes before the combination operation has been completed to form such probes. The bonding between the structural material layers is shown in FIG. 23, which is a block diagram of a process of a fifteenth variation of the first wide,-, and prosthetic shell example. After the mouth work, the adhesion between the thermal treatment layers of the probes has constituted the structural materials of the probes. The multi-probe array formed therein is reversed, cut and then transferred to a permanent substrate as illustrated in the block diagram of FIG. 8 to form a larger array group.

Figures 25A-25J are schematic side views of the different states of an example used to construct a multi-layer, element-needle array of needles on a temporary substrate-'where the structure is then transferred and compared with -Permanent substrate bonding, the substrate is composed of a sacrificial material and wherein the process includes the components illustrated in the block diagrams of Figures 9 and 15. Figures 26A-26E are schematic side views of different states of an example of a process for forming a multi-layer, multi-layer, and multi-element probe array on a temporary substrate. 'The structure is then transferred and combined with a permanent Substrate bonding, the contacts of the probe element are molded in a patterned substrate, and the diffusion bonding process is carried out in the month of denuclearization operation but after the transfer and bonding operation, which process includes the 9th, 15th and 23rd These elements are illustrated in the block diagram of the figure. Figures 27A-27C are schematic side views of different states of a process of increasing the needle contact on the probe of Figures 26A-26E. Figure 28A_28I is a schematic side view of the different states of the "making system" example for forming a multilayer, multi-element probe array on a temporary substrate, which then transfers the constructed structure and combines it with a permanent substrate, The contacts of the probe element are molded in a patterned substrate that is one of the I-point materials different from the structural material, and a high-yield possibility analysis is performed before the transfer operation. 69 200534519 and then selected for use or not. Individual probe arrays, and the processes in which the elements are illustrated in the block diagrams of Figures 9, 15 and 23. Figures 29A-29L are schematic side views of different states of one example of a process for forming a multi-layer, multi-element five-piece probe array on a temporary substrate, which then transfers the constructed structure to a permanent substrate Combination, wherein the probe contact is made by a mold made of a sacrificial material, wherein the probe element is separated from the temporary substrate by a meltable material, and wherein the process is included in the 9th, 15th And the 10th class element is illustrated in the block diagram of FIG. 22. 30A-30H are schematic side views of different states of an example of a process for forming a multi-layer, multi-piece probe array on a temporary substrate, and are shown in the same manner as the household diagrams in FIGS. 29A-29L. Similarly, the difference is that the first metal is replaced by a dielectric material. 15 f 31A_31W is a schematic side view of a different state of an example of a manufacturing process for forming a multilayer, multi-element probe array on a temporary substrate. Figures 32A-32Z are schematic side views of different states of an exemplary process, which are similar to the processes of Figures 31A-31W but additionally include a coating probe operation. Figures 33A-33T show several schematic side views of different examples of exemplary powers similar to Figure 32A_32T, except that it uses only a single sacrificial material 626 to replace the two sacrificial materials 626 and 616, and the 33U_33W The drawing shows other states of the process. 70 25 200534519 [Description of main component symbols] 2 ... First material / auxiliary structure 56 ... Precision Y platform 4 ... Fourth material / Second deposition material 58 ... Slot

6 ... substrate 8, 8 '... Harmonic contact mask 10 ... Insulator 10' ... Patterned harmonic material 12, 12 '... Anode 14 ... Plating solution 16 ... Opening / electrolyte 18 ... Power source 20 ... Auxiliary structure 22 ... material 22 '... deposits 26a, 26b ... aperture 32 ... electrochemical manufacturing system 34, 36, 38, 40 ... subsystem 40 ... planarization subsystem 42 ... linear slider 44 ... actuator 46 ... indicator 48 ... bracket 52 ... overlay plate 54 ... accuracy X stage 62 ... anode 64 ... electrolyte tank 66 ... plating solution 68 ... foot 72 ... frame 74 ... frame 82 ... substrate 84 ... photoresist 86 ... light Resist surface 88 ... Surface 92A-92C of the substrate ... Opening or aperture 94 ... First metal 96 ... Second metal 98 ... 3-dimensional structure 300 ... Die / probe array 302 ... Probe 304 ... Adhesive material 306 ... Temporary substrate 308 ... Sacrificial material 310 ... Permanent substrate 350 ... Substrate 71 200534519 352 ... Substrate / Sacrificial material 354 ... First layer 356 ... Second layer 358 ... · Structure material 360 ··· Third layer 362… Shading material 364 ·· Opening 366 ·· Adhesive material 370… Substrate 380… Permanent base Laminate 382 ... Permanent substrate 384 ... Adhesive layer material 386 ... Seed layer material 388 ... Pad material 392, 394 ... Probe element 402 ... Package 404 ... Probe array 404a, 404b, 404c ... Probe array 404-1 to 404-7 ... Probe 406 ... Permanent substrate 408-1 to 408-7 ... Pad 408 '... Pad 408-1 to 408-7 ... Pad 412-1 to 412-7 · ·· Electric wires 414-1 to 414-7 ... Contact pads 422 ... Temporary substrates 424 ... Probe contacts 426 ... Sacrificial materials 432 ... Probe contact materials 434 ... Probe array packages 436-1 to 436 -7 ... Contact 452 ... Temporary substrate 454 ... Gap 456 ... Light-shielding material 458 ... Opening 462 ... Probe contact material 464 ... Sacrificial material 466 ... Structural material 468. · First layer 474 ... Unreleased probe array 476 ... Permanent substrate 502, 502 '... Substrate 504 ... Seed layer 506 ... First metal 508 ... Sacrificial material 509 ... Single crystal glue 512 ... Light Resistor / Plating stop material 72 200534519

514 ... Seed layer material 516 ... Structural material 518 ... Contact material 520 ... Grinding disc 522 ... Adhesive material 523 ... Structural material 524 ... Photoresist 526 ... Grain 532 ... Substrate / Pad material 534 ... Second pad material 538 ... Gap / probe package 552 ... Temporary substrate 554 ... Dielectric material 556 ... Seed layer material 557 ... Sacrificial material 559 ... Agent material 562 ... Slot 564 ... Boiling water 572 (a) -572 (c) ... Probe element 574 ... Permanent substrate 576,578 ... Adhesive material 580 ... Primer material 604 ... Temporary wafer 606 ... Adhesive layer 608 ... Seed layer 614 ... Unplated endpoint detection pad 616 ... Sacrificial material 618 ... Photoresist 622 ... Copper 624 ... Contact coating material 626 ... Auxiliary backing contact material 628 ... Multiple layers of structural material 632 ... probe substrate 634 ... thick photoresist 636 ... solder 638 ... protective coating 640 ... burr-shaped portion 642 ... bump 644 ... liquid flux or solder paste 646 ... Grain 648 ... Substrate / space converter 652 ... Primer material 654 ... Release layer 656 ... Coating / coating 658 ... Contact 662 ... Coating 664 ... Probe 73

Claims (1)

200534519 'Scope of patent application: 1. A method for manufacturing a micro-probe array, comprising: manufacturing at least a portion of each of a plurality of probes on a temporary substrate to transfer the probes from the temporary substrate to A permanent substrate. 2. The method according to item 1 of the application, wherein the probe group located on the temporary substrate is maintained in a spatial relationship when it is transferred to the permanent substrate. 10 15 20 The method of applying for the second item in the patent of the month, wherein a selectively arranged adhesive material is arranged at the positions attached to the probes of the selected group on the permanent substrate. Man claimed that the method of the second item of the patent dry encirclement, in which a selectively arranged adhesive material is formed on the temporary substrate of these probes, and then the ten revolutions & to the permanent substrate are arranged on the probe- On the end. 5 The method of the second item of interest, in which a selectively arranged adhesive is attached to the -selected group of prospecting materials / material locations on the permanent substrate, and the -selectively arranged adhesion The material is arranged on the -end portion of the probe after the probe is formed on a temporary substrate, and then the needle is transferred to the permanent substrate. 10 !: The method of item 1 of the patent scope ', wherein the probes are transferred to a permanent substrate before being demolded from the 7-1 plate. The method of 7 'scope item 6' wherein the probes are removed from at least a part of any sacrificial material surrounding the sacrifice material during the mold operation, moxibustion, and transferred to the permanent substrate. 74 200534519 8. If you applied for the item 6 in the scope of patent application, you can use the probes in Table 1 as a guide to the task of forming the _____ such as ^ T 目 &, μ before demoulding the sacrificial material. To transfer to the permanent substrate. 9. If you apply for the item 1 in the scope of the patent, Feng Youyou will transfer the probes to the permanent US board after demolding the probes from the temporary substrate. These probes are moved from the task that surrounds them during the formation operation—the sacrificing job m㈣ to the permanent substrate. # 10 15 η. The method of claim 1, wherein the probes are transferred to a permanent substrate after forming the probes from at least one part of any sacrificial material that surrounds them during the operation. Knife 12. The method according to item 1 of the scope of patent application, wherein the probes are transferred from the temporary substrate to a permanent substrate, the operation includes: a. Transferring the probes from the-temporary substrate to-the second plate, And then; b. Transfer the probes from the second temporary substrate to the permanent substrate. • If the oldest method of applying for a patent, in which the operation of constituting the material probe on the temporary substrate results in the probe being only partially formed, # the probes are attached to the Mizuhisa substrate to complete the constitution of the probes . 20 14. The oldest method in Chinese patent, in which the probes are subjected to a heat treatment process prior to transferring the probes to the Mizuhisa substrate, which can choose to have strong adhesion between the layers of the materials that make up the probes. " 15. If the method of applying for the patent No. W, wherein after the probes ~ to the water long substrate, the probes are subjected to a heat treatment process, which can be ^ 75 200534519 5 10 15 Strong adhesion between the layers of these materials that make up the probe. 16. The method of claim 1 in which the probes are embedded in a conductive sacrificial material that is removed after the transfer operation during the transfer of the probes to a permanent substrate. 17. A method for manufacturing a microprobe, comprising: fabricating at least a portion of a microprobe on a temporary substrate; and transferring the microprobe from the temporary substrate to a permanent substrate. 18. A method for manufacturing a compliant electrical contact element array, comprising: manufacturing at least a portion of a compliant electrical contact element on a temporary substrate; transferring the compliant electrical contact element from the temporary substrate to a Permanent substrate. 19. A method for manufacturing a compliant electrical contact element adhered to a permanent substrate, comprising: fabricating at least a portion of a compliant electrical contact element on a temporary substrate; and removing the compliant electrical contact element from the temporary substrate Transfer to a permanent substrate. 76