TWI381458B - The sorting apparatus for semiconductor chip - Google Patents

The sorting apparatus for semiconductor chip Download PDF

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Publication number
TWI381458B
TWI381458B TW096140846A TW96140846A TWI381458B TW I381458 B TWI381458 B TW I381458B TW 096140846 A TW096140846 A TW 096140846A TW 96140846 A TW96140846 A TW 96140846A TW I381458 B TWI381458 B TW I381458B
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semiconductor wafer
sorting
wafer
block
rotating
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TW096140846A
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Chinese (zh)
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TW200834755A (en
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Hyeon Sam Jang
Seung Kyu Kim
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Qmc Co Ltd
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Priority to KR1020070010434A priority Critical patent/KR100787627B1/en
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Publication of TWI381458B publication Critical patent/TWI381458B/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67271Sorting devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool

Description

半導體晶片分類裝置Semiconductor wafer sorting device
本發明是有關於一種半導體晶片分類裝置,且特別是有關於一種按照檢測結果對排列在晶圓上的半導體晶片進行分類之半導體晶片分類裝置。The present invention relates to a semiconductor wafer sorting apparatus, and more particularly to a semiconductor wafer sorting apparatus for sorting semiconductor wafers arranged on a wafer in accordance with detection results.
一般,像LED元件那樣的半導體晶片被製造在一定大小的晶圓上,在這樣的晶圓上製造幾千至幾萬個半導體晶片。這種晶圓就由晶圓切割而劃分為各晶片,在出廠前必須經過精密的檢測工序,根據檢測結果及各晶片的性能被分類為一定的等級。這樣被分類為一定等級的晶片需要經過按照等級再排列的分類工序,這裏使用分類裝置(Sorter)。Generally, semiconductor wafers such as LED elements are fabricated on wafers of a certain size, and thousands to tens of thousands of semiconductor wafers are fabricated on such wafers. The wafer is divided into wafers by wafer dicing, and must be subjected to a precise inspection process before leaving the factory, and classified into a certain level according to the detection results and the performance of each wafer. Such a wafer classified as a certain level needs to be subjected to a sorting process which is rearranged according to the rank, and a sorting device (Sorter) is used here.
圖1是傳統中的半導體晶片分類裝置的立體圖。1 is a perspective view of a conventional semiconductor wafer sorting apparatus.
若參照圖1,傳統的半導體晶片分類裝置包括集料塊200(bin block)、晶片載置部300及分類部。Referring to Fig. 1, a conventional semiconductor wafer sorting apparatus includes a bin block 200, a wafer mounting portion 300, and a sorting portion.
在上述集料塊200上,檢測裝置完成檢測的晶圓上的半導體晶片按照檢測結果被分類。上述集料塊200位於晶片載置部300的兩側。在集料塊200上部設有第一視頻攝影機240,以便監視排列在各集料塊200上的半導體晶片的排列狀態。上述集料塊200沿X-Y方向移動,使藉由上述分類部移送的半導體晶片被分類到與等級對應的集料塊200上。On the above-described aggregate block 200, the semiconductor wafer on the wafer on which the detecting means completes the inspection is classified according to the detection result. The aggregate block 200 is located on both sides of the wafer mounting portion 300. A first video camera 240 is disposed on the upper portion of the collecting block 200 to monitor the arrangement state of the semiconductor wafers arranged on the respective collecting blocks 200. The aggregate block 200 is moved in the X-Y direction, and the semiconductor wafer transferred by the sorting unit is sorted into the aggregate block 200 corresponding to the grade.
上述晶片載置部300載置由檢測裝置完成檢測的晶片,再藉由上述分類部按等級對半導體晶片進行分類的期間,設置晶片。上述晶片載置部300在X-Y-θ方向移動,使上述分類部能夠拾取排列在晶圓上的晶片。在上述晶片載置部300的上部設有第二視頻攝影機301,確認晶圓上的半導體晶片的排列狀態,以便上述分類部能夠準確地掌握排列在晶圓上的晶片的位置進行拾取。The wafer mounting unit 300 mounts a wafer that has been detected by the detecting device, and the wafer is placed while the semiconductor wafer is sorted by the sorting unit. The wafer mounting unit 300 moves in the X-Y-θ direction to enable the sorting unit to pick up the wafers arranged on the wafer. A second video camera 301 is provided on the upper portion of the wafer mounting unit 300 to confirm the arrangement state of the semiconductor wafers on the wafer, so that the classification unit can accurately grasp the position of the wafers arranged on the wafer and pick up the wafer.
上述分類部將排列在晶圓上的半導體晶片按照等級從上述晶片載置部300分類到集料塊200上,並且包括旋轉臂400和旋轉電機410。The sorting unit classifies the semiconductor wafers arranged on the wafer from the wafer placing unit 300 to the collecting block 200 in a grade, and includes a rotating arm 400 and a rotating electrical machine 410.
上述旋轉臂400在晶片載置部300和集料塊200之間往復移動,在其端部設有用於拾取半導體晶片的拾取器401。The rotating arm 400 reciprocates between the wafer mounting portion 300 and the aggregate block 200, and a pickup 401 for picking up a semiconductor wafer is provided at an end portion thereof.
上述拾取器401在晶片載置部300中拾取半導體晶片,將拾取到的半導體晶片向上述集料塊200運送,在上述集料塊200中按等級將半導體晶片分類。The pickup 401 picks up a semiconductor wafer in the wafer mounting portion 300, transports the picked semiconductor wafer to the stack block 200, and classifies the semiconductor wafers in the stack block 200.
在此,旋轉臂400不能沿X-Y方向移動,而是在晶片載置部300的規定位置和上述集料塊200的規定位置之間旋轉移動。因此,上述晶片載置部300和集料塊200沿X-Y方向移動,使得上述拾取器401能夠拾取晶片上的半導體晶片,從而將拾取到的半導體晶片分類到相應等級的集料塊200。Here, the swivel arm 400 is not movable in the X-Y direction, but is rotationally moved between a predetermined position of the wafer mounting portion 300 and a predetermined position of the aggregate block 200. Therefore, the wafer placing portion 300 and the sump block 200 are moved in the X-Y direction, so that the pickup 401 can pick up the semiconductor wafer on the wafer, thereby sorting the picked semiconductor wafer into the grading block 200 of the corresponding grade.
上述旋轉電機410與旋轉臂400電性連接,以向上述旋轉臂400提供驅動力。上述旋轉電機410使旋轉臂400在晶片載置部300和集料塊200之間按一定角度旋轉,利用中空電機(Direct Drive Moter)以最高1/1,000,000轉的精度將上述旋轉臂400定位在正確的位置上。The rotating electric machine 410 is electrically connected to the rotating arm 400 to provide a driving force to the rotating arm 400. The rotary electric machine 410 rotates the rotary arm 400 at a certain angle between the wafer mounting portion 300 and the aggregate block 200, and positions the rotary arm 400 at a maximum accuracy of 1/1,000,000 revolutions by a hollow motor (Direct Drive Moter). The location.
若觀察藉由這樣的傳統的半導體晶片分類裝置對半導體晶片進行分類的過程,排列了已完成檢測的半導體晶片的晶圓被載置在上述晶片載置部300上,排列在上述晶圓上的半導體晶片由上述旋轉臂400的拾取器401拾取。When a process of classifying a semiconductor wafer by such a conventional semiconductor wafer sorting apparatus is observed, a wafer in which the semiconductor wafers that have been detected are arranged is placed on the wafer mounting portion 300 and arranged on the wafer. The semiconductor wafer is picked up by the pickup 401 of the above-described rotating arm 400.
並且,上述旋轉臂400藉由旋轉電機410從上述晶片載置部300向集料塊200旋轉移動。藉由上述旋轉臂400旋轉移動的半導體晶片從上述旋轉臂400上脫落,被分類到相應等級的集料塊200上。Further, the rotating arm 400 is rotationally moved from the wafer mounting portion 300 to the aggregate block 200 by the rotary electric machine 410. The semiconductor wafer that is rotationally moved by the above-described rotating arm 400 is detached from the above-described rotating arm 400, and is classified into the corresponding level of the aggregate block 200.
然後,上述旋轉臂400藉由旋轉電機410重新向上述晶片載置部300旋轉移動,拾取位於上述晶圓上的其他半導體晶片,向上述集料塊200移送、分類。Then, the rotating arm 400 is re-rotated to the wafer mounting unit 300 by the rotary electric machine 410, and the other semiconductor wafers on the wafer are picked up and transferred to the aggregate block 200.
重複實施上述的過程,將半導體晶片按等級重新排列進行分類。The above process is repeatedly performed to sort the semiconductor wafers by level rearrangement.
這裏,傳統的半導體晶片分類裝置藉由一個旋轉臂400對排列在晶圓上的半導體晶片進行分類,因此產生作業時間的損失,有增加作業時間的問題。這是因為,上述旋轉臂400要在晶片載置部300拾取半導體晶片,並將拾取到的半導體晶片運送到上述集料塊200進行分類之後,還要向晶片載置部300進行往復移動。Here, the conventional semiconductor wafer sorting apparatus classifies the semiconductor wafers arranged on the wafer by one rotating arm 400, thereby causing a loss of work time and a problem of increasing the working time. This is because the above-described rotating arm 400 picks up the semiconductor wafer on the wafer mounting portion 300, and transports the picked semiconductor wafer to the above-described aggregate block 200 for sorting, and then reciprocates the wafer mounting portion 300.
為了縮短上述旋轉臂400往復移動的時間,上述晶片載置部300和集料塊200分別位於上述旋轉臂400的前方和側方,上述旋轉臂400一邊旋轉90°一邊進行往復移動。但是,上述晶片載置部300和集料塊200如上所述要確保沿X-Y方向移動的空間,需要隔開不妨礙相互之間移動的距離。因此,只能使上述旋轉臂400的長度變大,存在上述旋轉臂400的移動和停止時的慣性力增加、施加在旋轉電機410上的負載增加的問題。In order to shorten the time during which the rotating arm 400 reciprocates, the wafer mounting portion 300 and the aggregate block 200 are respectively located in front of and behind the rotating arm 400, and the rotating arm 400 reciprocates while rotating by 90 degrees. However, as described above, the wafer placing unit 300 and the collecting block 200 are required to secure a space that moves in the X-Y direction, and it is necessary to separate the distances that do not interfere with each other. Therefore, the length of the above-described rotating arm 400 can be increased, and the inertial force at the time of the movement and the stop of the rotating arm 400 increases, and the load applied to the rotating electrical machine 410 increases.
如果施加在上述旋轉電機410上的負載增加,上述旋轉電機410因持續的使用而發生微細的損傷,因此難以精密地控制旋轉電機410,存在因大負載導致的電力消耗增大到必要以上的問題。If the load applied to the rotating electric machine 410 increases, the rotating electric machine 410 is slightly damaged due to continuous use, so that it is difficult to precisely control the rotating electric machine 410, and there is a problem that power consumption due to a large load is increased more than necessary. .
此外,如果上述旋轉臂400的長度增加,則上述旋轉臂400的高速旋轉和突然停止時產生的振動幅度也相應地增大,從而產生上述拾取器401拾取的半導體晶片任意地扭曲或脫落而不能執行正確的分類工序的問題。Further, if the length of the above-described rotating arm 400 is increased, the amplitude of vibration generated when the high-speed rotation and the sudden stop of the above-described rotating arm 400 are also increased correspondingly, so that the semiconductor wafer picked up by the above-mentioned pickup 401 is arbitrarily twisted or peeled off. The problem of performing the correct classification process.
本發明是提供一種半導體晶片分類裝置,其能夠執行有效的分類工序,在減少分類工序所需的作業時間的同時,亦減少施加在旋轉電機上的負載。如此,旋轉電機在持續的使用中也能夠進行精密的控制,從而能夠執行半導體晶片的正確的分類工序。The present invention provides a semiconductor wafer sorting apparatus capable of performing an effective sorting process, which reduces the work time required for the sorting process and also reduces the load applied to the rotary electric machine. In this way, the rotary electric machine can be precisely controlled during continuous use, so that the correct sorting process of the semiconductor wafer can be performed.
另外,本發明的半導體晶片分類裝置,係可減少旋轉臂的高速旋轉和突然停止時發生的振動,能夠防止半導體晶片任意脫落,能夠使半導體晶片準確地再排列在對應於等級的位置上,由此能夠執行準確的分類工序。Further, the semiconductor wafer sorting apparatus of the present invention can reduce the vibration generated when the rotating arm is rotated at a high speed and suddenly stops, and can prevent the semiconductor wafer from being detached arbitrarily, and can accurately rearrange the semiconductor wafer at a position corresponding to the level. This enables an accurate classification process to be performed.
用於實現上述的優點的半導體晶片分類裝置具有如下的結構。A semiconductor wafer sorting apparatus for realizing the above advantages has the following structure.
本發明涉及的半導體晶片分類裝置包括:多個旋轉臂,可同時位於晶片載置部和集料塊上;多個拾取器,分別上下移動地結合在上述多個旋轉臂上,上述多個拾取器在晶片載置部拾取半導體晶片,將拾取的半導體晶片移送到對應等級的集料塊,以進行分類;以及旋轉部,利用由旋轉電機提供的驅動力使上述多個旋轉臂向一個方向旋轉。A semiconductor wafer sorting apparatus according to the present invention includes: a plurality of rotating arms that are simultaneously located on a wafer mounting portion and a collecting block; and a plurality of pickers that are respectively coupled to the plurality of rotating arms up and down, the plurality of picking The semiconductor wafer is picked up at the wafer mounting portion, the picked semiconductor wafer is transferred to a corresponding level of the aggregate block for sorting, and the rotating portion is rotated by the driving force provided by the rotating electrical machine to rotate the plurality of rotating arms in one direction .
由於上述旋轉臂能夠同時位於晶片載置部和集料塊之上方,因此上述旋轉臂在上述晶片載置部中拾取半導體晶片的同時,另一上述旋轉臂在上述集料塊上使另一半導體晶片脫落以便按等級分類。Since the rotating arm can be located above the wafer mounting portion and the aggregate block at the same time, the rotating arm picks up the semiconductor wafer in the wafer mounting portion, and the other rotating arm makes another semiconductor on the collecting block. The wafers are detached for sorting by level.
由此,可以縮短分類工序所需的作業時間,在設有多個上述拾取器的上述旋轉臂中分別上下移動並防止半導體晶片的損傷,從而執行穩定的分類工序。Thereby, the work time required for the sorting process can be shortened, and the above-described rotating arms provided with the plurality of pick-ups can be moved up and down to prevent damage of the semiconductor wafer, thereby performing a stable sorting process.
在本發明涉及的半導體晶片分類裝置中,上述晶片載置部和集料塊配置成彼此相對置。In the semiconductor wafer sorting apparatus according to the present invention, the wafer placing portion and the aggregate block are disposed to face each other.
因此,上述晶片載置部和集料塊能夠不妨礙彼此之間的移動並設置為與上述旋轉臂接近,能夠縮短上述旋轉臂的長度。因此,減少施加在旋轉電機上的負載。如此,旋轉電機在持續的使用中也能維持精密的控制,並且,減少旋轉臂的高速旋轉和突然停止時產生的振動,防止被拾取的半導體晶片任意地扭曲或脫落。Therefore, the wafer placing portion and the aggregate block can be provided close to the rotating arm without hindering the movement therebetween, and the length of the rotating arm can be shortened. Therefore, the load applied to the rotating electrical machine is reduced. In this way, the rotary electric machine can maintain precise control during continuous use, and reduce the vibration generated when the rotating arm is rotated at a high speed and suddenly stopped, thereby preventing the picked semiconductor wafer from being arbitrarily twisted or peeled off.
為讓本發明之上述內容能更明顯易懂,下文特舉一較佳實施例,並配合所附圖式,作詳細說明如下:In order to make the above-mentioned contents of the present invention more comprehensible, a preferred embodiment will be described below, and in conjunction with the drawings, a detailed description is as follows:
以下,參照附圖詳細說明本發明涉及的半導體晶片分類裝置的結構的較佳實施例。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the structure of a semiconductor wafer sorting apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
圖2是本發明涉及的半導體晶片分類裝置的立體圖,圖3是將本發明涉及的半導體晶片分類裝置的一部分放大表示的圖。2 is a perspective view of a semiconductor wafer sorting apparatus according to the present invention, and FIG. 3 is an enlarged view of a part of the semiconductor wafer sorting apparatus according to the present invention.
如圖2和圖3所示,本發明的半導體晶片分類裝置1包括晶片載置部2、集料塊3、旋轉部4(示於圖4)、旋轉臂5、驅動部6(示於圖4)、第三視頻攝影機7(示於圖6),還包括設置了上述結構要素的主體11和支承框架12。As shown in FIGS. 2 and 3, the semiconductor wafer sorting apparatus 1 of the present invention includes a wafer mounting portion 2, a collecting block 3, a rotating portion 4 (shown in FIG. 4), a rotating arm 5, and a driving portion 6 (shown in FIG. 4) The third video camera 7 (shown in Fig. 6) further includes a main body 11 and a support frame 12 provided with the above-described structural elements.
上述晶片載置部2載置在檢測裝置(未圖示)中完成檢測的晶圓(未圖示),並支承上述晶圓,使得附著在上述晶圓上的半導體晶片被拾取。晶片承載部2還包括第一視頻攝影機21及第一移動部22。The wafer mounting unit 2 mounts a wafer (not shown) that has been detected by a detecting device (not shown), and supports the wafer so that the semiconductor wafer attached to the wafer is picked up. The wafer carrier 2 further includes a first video camera 21 and a first moving portion 22.
上述第一視頻攝影機21設置在支承框架12上,可以在上述晶片載置部2的上側(箭頭A的方向)確認附著在晶圓上的半導體晶片的排列狀態,使得半導體晶片準確地被拾取。The first video camera 21 is disposed on the support frame 12, and the arrangement state of the semiconductor wafer attached to the wafer can be confirmed on the upper side (the direction of the arrow A) of the wafer mounting portion 2, so that the semiconductor wafer can be accurately picked up.
上述第一移動部22移動上述晶片載置部2,以便上述旋轉臂5準確地位於要拾取的半導體晶片的位置上,並且使上述晶片載置部2移動,使得半導體晶片以一定的排列狀態被拾取。這是為了使半導體晶片能夠在上述集料塊3中以一定的排列狀態被分類。The first moving portion 22 moves the wafer mounting portion 2 such that the rotating arm 5 is accurately positioned at a position of the semiconductor wafer to be picked up, and the wafer mounting portion 2 is moved so that the semiconductor wafer is in a certain arrangement state. Pick up. This is to enable the semiconductor wafers to be classified in a certain arrangement state in the above-described aggregate block 3.
在晶片切割過程中,半導體晶片有可能以互不相同的間隔距離和排列狀態分離,並發生半導體晶片旋轉的情況,因此,為了確保半導體晶片的長度方向X、寬度方向Y、和傾斜方向θ符合預定之方向,上述第一移動部22使上述晶片載置部2沿X-Y-θ方向移動。In the wafer dicing process, the semiconductor wafers may be separated by mutually different separation distances and alignment states, and the semiconductor wafer may be rotated. Therefore, in order to ensure that the semiconductor wafer has the length direction X, the width direction Y, and the tilt direction θ. In the predetermined direction, the first moving unit 22 moves the wafer placing unit 2 in the X-Y-θ direction.
即,上述第一移動部22不僅使半導體晶片沿長度方向X和寬度方向Y移動,還使半導體晶片旋轉來確保傾斜的方向θ亦符合預定之方向,以便半導體晶片以一定的排列狀態被拾取。為此,上述第一移動部22使晶片載置部2移動。That is, the first moving portion 22 not only moves the semiconductor wafer in the longitudinal direction X and the width direction Y, but also rotates the semiconductor wafer to ensure that the oblique direction θ also conforms to a predetermined direction so that the semiconductor wafer is picked up in a certain arrangement state. Therefore, the first moving unit 22 moves the wafer mounting unit 2.
上述集料塊3中被拾取並移送的半導體晶片,按等級重新排列進行分類。根據使用者希望的等級分類設有多個上述集料塊3,上述集料塊3具備第二視頻攝影機31及第二移動部32。The semiconductor wafers picked up and transferred in the above-mentioned aggregate block 3 are sorted by rank and sorted. A plurality of the aggregate blocks 3 are provided in accordance with a classification desired by the user, and the aggregate block 3 includes a second video camera 31 and a second moving portion 32.
上述第二視頻攝影機31設置在支承框架12上,在上述集料塊3的上側(箭頭A方向)確認排列在上述集料塊3上的晶片的排列狀態,從而使半導體晶片隨其準確地被分類。The second video camera 31 is disposed on the support frame 12, and the arrangement state of the wafers arranged on the aggregate block 3 is confirmed on the upper side (the direction of the arrow A) of the aggregate block 3, so that the semiconductor wafer is accurately carried classification.
上述第二移動部32移動上述集料塊3,使得上述旋轉臂5準確地位於半導體晶片要重新排列進行分類的位置,並且,移動集料塊3使得半導體晶片以一定的排列狀態分類。The second moving portion 32 moves the aggregate block 3 such that the rotating arm 5 is accurately positioned at a position where the semiconductor wafer is to be rearranged and classified, and the moving block 3 is moved so that the semiconductor wafers are sorted in a certain arrangement state.
在上述晶片載置部2中,存在半導體晶片不按一定的排列狀態被拾取的情況、或者被拾取的半導體晶片在移送到上述集料塊3的過程中因搖晃或振動等而使上述半導體晶片移動的情況,因此,為了確保半導體晶片的長度方向X、寬度方向Y及傾斜方向θ係符合預定之方向,上述第二移動部32同樣較佳地係使上述集料塊3沿X-Y-θ方向移動。In the above-described wafer mounting portion 2, there is a case where the semiconductor wafer is not picked up in a certain arrangement state, or the semiconductor wafer to be picked up is transferred to the above-mentioned collecting block 3, and the semiconductor wafer is shaken, vibrated, or the like. In the case of movement, in order to ensure that the longitudinal direction X, the width direction Y, and the oblique direction θ of the semiconductor wafer conform to a predetermined direction, the second moving portion 32 is also preferably such that the aggregate block 3 is along the X-Y- Move in the θ direction.
如圖2所示,上述晶片載置部2及集料塊3在支承框架12的兩側配置成彼此相對置,如上所述,使上述晶片載置部2及集料塊3在不同的空間移動,這是為了在不妨礙彼此間移動的同時設置成與上述旋轉臂5接近。As shown in FIG. 2, the wafer mounting portion 2 and the aggregate block 3 are disposed to face each other on both sides of the support frame 12, and the wafer mounting portion 2 and the aggregate block 3 are placed in different spaces as described above. Moving, this is to be placed close to the above-described rotating arm 5 while not hindering movement between each other.
因此,能夠縮短上述旋轉臂5的長度,減少由此施加在旋轉電機上的負載,在持續的使用中也可以維持精密的控制,並且減少在旋轉臂5的高速旋轉和突然停止時產生的振動,從而防止被拾取的半導體晶片任意的扭曲或脫落。Therefore, the length of the above-described rotating arm 5 can be shortened, the load thus applied to the rotating electrical machine can be reduced, precise control can be maintained in continuous use, and vibration generated at the time of high-speed rotation and sudden stop of the rotating arm 5 can be reduced. Thereby, the semiconductor wafer to be picked up is prevented from being arbitrarily twisted or peeled off.
圖4是放大表示本發明的旋轉臂、驅動部及旋轉部的圖。Fig. 4 is an enlarged view showing a swivel arm, a driving portion, and a rotating portion of the present invention.
如圖2及圖4所示,上述旋轉部4整體呈圓筒形狀,利用從旋轉電機(未圖示)提供的驅動力以旋轉軸41為中心旋轉,向結合在外側的旋轉臂5傳遞由旋轉電機提供的驅動力並一起旋轉。上述旋轉電機係較佳地使用DD電機(中空電機)。As shown in FIG. 2 and FIG. 4, the entire rotating portion 4 has a cylindrical shape, and is rotated about a rotating shaft 41 by a driving force supplied from a rotary electric machine (not shown), and is transmitted to the rotating arm 5 coupled to the outside. The driving force provided by the rotating motor rotates together. The above rotary electric machine preferably uses a DD motor (hollow motor).
上述旋轉部4向一個方向旋轉、即順時針方向或逆時針方向中的某一個方向旋轉,並且執行半導體晶片的拾取和分類,如下所述地簡要描述其過程。The above-described rotating portion 4 is rotated in one direction, that is, in one of a clockwise direction or a counterclockwise direction, and picking up and sorting of the semiconductor wafer is performed, and the process thereof will be briefly described as follows.
若多個旋轉臂5同時位於上述晶片載置部2和集料塊3上,則上述旋轉部4的旋轉停止。該狀態下,位於上述晶片載置部2的上述旋轉臂5拾取半導體晶片,位於上述集料塊3的上述旋轉臂5對半導體晶片進行分類。當結束半導體晶片的拾取和分類時,上述旋轉部4重新向同一方向旋轉,若多個旋轉臂5同時位於上述晶片載置部2和集料塊3,則停止旋轉而執行拾取和分類,重複這樣的過程,完成分類工序。When the plurality of rotating arms 5 are simultaneously positioned on the wafer placing portion 2 and the aggregate block 3, the rotation of the rotating portion 4 is stopped. In this state, the rotating arm 5 located in the wafer mounting unit 2 picks up a semiconductor wafer, and the rotating arm 5 located in the collecting block 3 sorts the semiconductor wafer. When the pickup and sorting of the semiconductor wafer are completed, the rotating portion 4 is rotated in the same direction again. If the plurality of rotating arms 5 are simultaneously positioned on the wafer placing portion 2 and the collecting block 3, the rotation is stopped to perform picking and sorting, and the repetition is repeated. This process completes the classification process.
因此,半導體晶片分類裝置1在旋轉往復移動的同時,減少了浪費作業時間的情況,以實現高效的分類工序,並可以縮短分類工序所需的作業時間。Therefore, the semiconductor wafer sorting apparatus 1 reduces the waste of work time while rotating and reciprocating, thereby realizing an efficient sorting process and shortening the work time required for the sorting process.
藉由上述旋轉部4,上述旋轉臂5接受從旋轉電機提供的驅動力,以上述旋轉部4的旋轉軸41為中心旋轉,在上述晶片載置部2中拾取半導體晶片,向上述集料塊3移送進行分類,並且設有多個上述旋轉臂5,以便同時位於上述晶片載置部2和集料塊4上。The rotating arm 5 receives the driving force from the rotary electric machine, rotates around the rotating shaft 41 of the rotating portion 4, and picks up the semiconductor wafer on the wafer mounting portion 2 to the collecting block. 3 Transfer and sorting, and a plurality of the above-described rotating arms 5 are provided so as to be simultaneously positioned on the wafer placing portion 2 and the collecting block 4.
若欲使上述多個旋轉臂5以旋轉軸41為中心按相同角度相隔地設置,並且藉由上述旋轉部4以相同的角度旋轉,以同時位於上述晶片載置部2和上述集料塊3上,則可設置2個、4個、6個、8個、12個旋轉臂5。If the plurality of rotating arms 5 are to be disposed at equal angles around the rotating shaft 41 and rotated at the same angle by the rotating portion 4, the wafer placing portion 2 and the aggregate block 3 are simultaneously positioned. On the top, two, four, six, eight, and twelve rotating arms 5 can be provided.
即,在2個旋轉臂5的情況下,各旋轉臂5間隔的角度是180°,藉由上述旋轉部4每進行一次拾取和分類時旋轉的角度為180°;在4個旋轉臂5的情況下,各旋轉臂5間隔的角度是90°;在6個旋轉臂5的情況下,各旋轉臂5間隔的角度是為60°;在8個旋轉臂5的情況下,各旋轉臂5間隔的角度是為45°;在12個旋轉臂5的情況下,各旋轉臂5間隔的角度是30°。That is, in the case of the two rotating arms 5, the angle at which the respective rotating arms 5 are spaced is 180°, and the angle of rotation by the rotation portion 4 for each picking and sorting is 180°; in the four rotating arms 5 In this case, the angle at which the respective rotating arms 5 are spaced is 90°; in the case of the six rotating arms 5, the angle at which the respective rotating arms 5 are spaced is 60°; in the case of the eight rotating arms 5, the respective rotating arms 5 The angle of the interval is 45°; in the case of 12 rotating arms 5, the angle at which each of the rotating arms 5 is spaced is 30°.
增加上述旋轉臂5的設置數量,可以縮短分類工序所需的時間,但是,與其成正比地施加在上述旋轉電機的負載增大,因此,需要考慮分類工序所需的時間和施加在旋轉電機上的負載而設置適當數量的旋轉臂5,較佳地係由4個、6個、8個旋轉臂5構成。Increasing the number of the above-described rotating arms 5 can shorten the time required for the sorting process, but the load applied to the rotating electrical machine is increased in proportion to the above, and therefore, it is necessary to consider the time required for the sorting process and apply to the rotating electrical machine. The appropriate number of rotating arms 5 are provided for the load, preferably by four, six, and eight rotating arms 5.
如上所述,傳統的半導體晶片分類裝置按如下工序工作:旋轉臂拾取半導體晶片,旋轉之後停止並對半導體晶片進行分類,為了拾取其他半導體晶片,重新旋轉後停止;因此其工序如下:對一個半導體晶片結束拾取和分類的旋轉臂,為了移動到再拾取半導體晶片的位置,包括兩次旋轉和停止。As described above, the conventional semiconductor wafer sorting apparatus operates as follows: the rotating arm picks up the semiconductor wafer, stops after the rotation, and sorts the semiconductor wafer, and picks up the other semiconductor wafer, stops after re-spinning; therefore, the process is as follows: for a semiconductor The wafer ends the picking and sorting of the rotating arm, in order to move to the position where the semiconductor wafer is picked up again, including two rotations and stops.
與此不同,在本發明涉及的半導體晶片分類裝置1中設有2個旋轉臂5時,能夠用一個旋轉臂5在上述晶片載置部2拾取半導體晶片,另一個旋轉臂5將半導體晶片分類到上述集料塊3上。因此,每次旋轉和停止時,可以同時執行拾取和分類,從而與傳統的半導體晶片分類裝置相比,可以縮短分類工序。On the other hand, when the two rotating arms 5 are provided in the semiconductor wafer sorting apparatus 1 according to the present invention, the semiconductor wafer can be picked up by the one rotating arm 5 on the wafer mounting portion 2, and the other rotating arm 5 classifies the semiconductor wafer. Go to the above aggregate block 3. Therefore, picking and sorting can be performed simultaneously at each rotation and stop, so that the sorting process can be shortened as compared with the conventional semiconductor wafer sorting apparatus.
這時,2個旋轉臂5較佳地配置成彼此間隔180°,由此上述旋轉部4每旋轉180°就停止,半導體晶片的一次拾取和分類所需的時間由上述旋轉臂5旋轉180°的時間構成。At this time, the two rotating arms 5 are preferably arranged to be spaced apart from each other by 180°, whereby the rotating portion 4 is stopped every 180°, and the time required for one picking and sorting of the semiconductor wafer is rotated by 180° by the rotating arm 5 described above. Time composition.
另外,設有4個旋轉臂5的情況下,若2個旋轉臂5執行半導體晶片的拾取和分類並旋轉時,另外2個旋轉臂5同時位於上述晶片載置部2和集料塊3上並停止旋轉,進行半導體晶片的拾取和分類,因此,與設有2個旋轉臂5的情況相比,能夠進一步縮短分類工序。Further, in the case where four rotating arms 5 are provided, when the two rotating arms 5 perform picking and sorting and sorting of the semiconductor wafer, the other two rotating arms 5 are simultaneously positioned on the wafer placing portion 2 and the collecting block 3. Since the rotation of the semiconductor wafer is stopped and the semiconductor wafer is picked up and sorted, the sorting process can be further shortened as compared with the case where the two rotating arms 5 are provided.
這時,較佳地4個旋轉臂5配置成彼此相隔90°,由此上述旋轉部4每旋轉90°就停止,半導體晶片的一次拾取和分類所需的時間由上述旋轉臂5旋轉90°的時間構成,因此,與設有2個旋轉臂5的情況相比,能夠進一步縮短分類工序所需的時間。At this time, preferably, the four rotating arms 5 are disposed to be apart from each other by 90°, whereby the rotating portion 4 is stopped every 90°, and the time required for one picking and sorting of the semiconductor wafer is rotated by 90° by the rotating arm 5 described above. Since the time is configured, the time required for the sorting process can be further shortened compared to the case where the two rotating arms 5 are provided.
因此,設置上述旋轉臂5的數量越增加,就越能縮短分類工序所需的時間,所以較佳地考慮分類工序所需的時間和施加在旋轉電機上的負載來設置適當數量的旋轉臂5。Therefore, the more the number of the above-described rotating arms 5 is increased, the shorter the time required for the sorting process can be shortened. Therefore, it is preferable to set the appropriate number of rotating arms 5 in consideration of the time required for the sorting process and the load applied to the rotating electrical machine. .
圖5是放大表示本發明的旋轉臂的圖。Fig. 5 is a view showing, in an enlarged manner, a swivel arm of the present invention.
參照圖2、圖4及圖5說明上述旋轉臂5的具體結構,上述旋轉臂5包括拾取器51和固定塊52。多個上述旋轉臂5具有相同的結構,所以用對一個旋轉臂5的結構說明來代替對其他旋轉臂5的說明。The specific structure of the above-described rotating arm 5 will be described with reference to Figs. 2, 4 and 5, and the rotating arm 5 includes a pickup 51 and a fixing block 52. Since the plurality of the above-described rotating arms 5 have the same structure, the description of the structure of one rotating arm 5 is used instead of the description of the other rotating arms 5.
上述拾取器51在晶片載置部2拾取半導體晶片,使半導體晶片脫落到集料塊3上進行分類。The pickup 51 picks up a semiconductor wafer on the wafer mounting unit 2, and causes the semiconductor wafer to fall off onto the aggregate block 3 for sorting.
上述拾取器51的設置數量與上述旋轉臂5的設置數量相同,各拾取器51在上述旋轉臂5上分別上下移動,從而拾取半導體晶片或使其脫落而執行分類工序,其包括拾取器主體511、移動塊512、緩衝件513、彈性部件514、及信號產生部515。The number of the pickups 51 is the same as the number of the above-described rotating arms 5, and each of the pickups 51 moves up and down on the above-described rotating arm 5, thereby picking up or dropping the semiconductor wafer to perform a sorting process, which includes the pickup body 511. The moving block 512, the buffer 513, the elastic member 514, and the signal generating unit 515.
在此,簡要說明多個上述拾取器51構成為彼此之間分別上下移動的理由。上述半導體晶片分類裝置1根據使用者的不同需求具有多種設置規格。因此,上述拾取器51和晶片載置部2以及上述拾取器51和集料塊3之間的間隔距離不同,且根據晶片所經過的製造工序,放置在上述晶片載置部2上的上述每個晶片與拾取器51的距離亦會不同。Here, the reason why the plurality of the above-described pickups 51 are configured to move up and down separately from each other will be briefly described. The semiconductor wafer sorting apparatus 1 described above has various setting specifications according to different needs of users. Therefore, the distance between the pickup 51 and the wafer mounting portion 2 and the pickup 51 and the aggregate block 3 is different, and each of the above-described wafer placement portions 2 is placed in accordance with the manufacturing process that the wafer passes. The distance between the wafers and the pickup 51 is also different.
因此,如果同時位於上述晶片載置部2和集料塊3的2個拾取器51同時工作、移動相同距離,雖然設置在上述晶片載置部2的拾取器51拾取了半導體晶片,但是產生不能進行穩定的分類工序的如下情況:位於上述集料塊3的拾取器51在相隔規定距離的狀態下脫落半導體晶片,或將半導體晶片向上述集料塊3過度施壓,從而產生損傷等。Therefore, if the two pickers 51 located at the wafer placing portion 2 and the lumping block 3 simultaneously operate and move the same distance, although the pickup 51 provided in the wafer mounting portion 2 picks up the semiconductor wafer, the generation cannot be performed. In the case where the stable sorting step is performed, the pickup 51 located in the aggregate block 3 is detached from the semiconductor wafer in a state of being separated by a predetermined distance, or the semiconductor wafer is excessively pressed against the aggregate block 3 to cause damage or the like.
由此,為了實現更加穩定的分類工序,位於晶片載置部2側的拾取器51和位於集料塊3側的拾取器51都要以相互不同的距離上下移動,以便不損傷半導體晶片。因此,多個上述拾取器51相互之間分別以不同距離上下移動來拾取並脫落半導體晶片,從而進行分類。Thus, in order to achieve a more stable sorting process, the picker 51 on the side of the wafer mounting portion 2 and the picker 51 on the side of the collecting block 3 are moved up and down at different distances so as not to damage the semiconductor wafer. Therefore, a plurality of the above-described pickups 51 are moved up and down at different distances to pick up and peel off the semiconductor wafer, thereby performing classification.
上述拾取器主體511與半導體晶片直接接觸,進行半導體晶片的拾取及脫落,進行分類工序,並且,可上下移動地結合在上述移動塊512上。The pickup main body 511 is in direct contact with the semiconductor wafer, picks up and detaches the semiconductor wafer, performs a sorting process, and is coupled to the moving block 512 so as to be movable up and down.
為了拾取半導體晶片,在上述拾取器51向下方移動時,上述拾取器主體511會一起向下方移動而與半導體晶片接觸,此時,上述拾取器主體511會受到壓力而向上方移動,從而防止半導體晶片的損傷。In order to pick up the semiconductor wafer, when the pickup 51 moves downward, the pickup main body 511 moves downward together to come into contact with the semiconductor wafer. At this time, the pickup main body 511 is moved upward by pressure, thereby preventing the semiconductor from being removed. Damage to the wafer.
為了脫落半導體晶片進行分類,在上述拾取器51向下方移動時,上述拾取器主體511會一起向下方移動,而半導體晶片與上述集料塊3接觸,此時,上述拾取器主體511會受到壓力而向上側移動,從而防止半導體晶片的損傷。In order to detach the semiconductor wafer for classification, when the pickup 51 moves downward, the pickup main body 511 moves downward together, and the semiconductor wafer is in contact with the sump 3, and at this time, the pickup main body 511 is subjected to pressure. The upper side is moved to prevent damage of the semiconductor wafer.
上述拾取器主體511在各拾取器51中分別上下移動,由此在不損傷半導體晶片的同時進行穩定的分類工序,並且對沒有經過封膠製程的半導體晶片也能夠進行穩定的分類工序。The pickup main body 511 is vertically moved up and down in each of the pickups 51, whereby a stable sorting process is performed without damaging the semiconductor wafer, and a stable sorting process can be performed on the semiconductor wafer which has not been subjected to the encapsulation process.
上述移動塊512和拾取器主體511可移動地結合,並且可上下移動地結合在上述固定塊52上,使上述拾取器51和拾取器主體511分別上下移動。The moving block 512 and the pickup main body 511 are movably coupled, and are coupled to the fixed block 52 so as to be movable up and down, so that the pickup 51 and the pickup main body 511 are moved up and down, respectively.
在上述移動塊512與固定塊52的關係中,較佳地,上述移動塊512包括線性導向塊,與此對應地上述固定塊52包括線性導向軌。在上述移動塊512與拾取器主體511的關係中,較佳地,上述移動塊512包括線性導向軌,上述拾取器主體511包括線性導向塊。In the above relationship of the moving block 512 and the fixed block 52, preferably, the moving block 512 includes a linear guiding block, and the fixed block 52 includes a linear guide rail corresponding thereto. In the above relationship of the moving block 512 and the pickup body 511, preferably, the moving block 512 includes a linear guide rail, and the pickup body 511 includes a linear guide block.
線性導向塊和線性導向軌亦可相反地設置,也就是說,上述移動塊512包括線性導向軌,與此對應地上述固定塊52包括線性導向塊。另外,上述移動塊512包括線性導向塊,上述拾取器主體511包括線性導向軌,但不以此為限。此技術領域中具有通常知識者應明瞭此處亦可採用例如是滑動塊和導向槽等相互配合之結構,使得上述移動塊及固定塊係可相對彼此移動,上述移動塊及拾取器主體係可相對彼此移動。The linear guide block and the linear guide rail may also be arranged oppositely, that is, the moving block 512 includes a linear guide rail, and the fixed block 52 includes a linear guide block. In addition, the moving block 512 includes a linear guiding block, and the picker body 511 includes a linear guiding rail, but is not limited thereto. It should be understood by those skilled in the art that, for example, a sliding block and a guiding groove can be used to make the moving block and the fixed block move relative to each other. The moving block and the pickup main system can be Move relative to each other.
上述緩衝件513設置在拾取器主體511和移動塊512之間,在上述拾取器主體511拾取並脫落半導體晶片進行分類時,緩衝施加在半導體晶片上的壓力,由此輔助地防止半導體晶片的損傷。The buffer member 513 is disposed between the pickup main body 511 and the moving block 512, and buffers the pressure applied to the semiconductor wafer when the pickup main body 511 picks up and peels off the semiconductor wafer for sorting, thereby assisting in preventing damage of the semiconductor wafer. .
上述緩衝件513收容在拾取器主體511的內部,一側被上述拾取器主體511支承,另一側被上述移動塊512支承。The cushioning member 513 is housed inside the pickup main body 511, and is supported by the pickup main body 511 on one side and supported by the moving block 512 on the other side.
在晶片載置部2中,上述緩衝件513在拾取器主體511與半導體晶片接觸時被壓縮,在拾取後復原;在集料塊3上,在半導體晶片與集料塊3接觸時,上述緩衝件513被壓縮,在脫落進行分類後復原,較佳地,緩衝件513採用彈簧。In the wafer mounting portion 2, the buffer member 513 is compressed when the pickup main body 511 comes into contact with the semiconductor wafer, and is restored after picking up; on the aggregate block 3, when the semiconductor wafer is in contact with the aggregate block 3, the buffer is provided. The piece 513 is compressed and restored after being detached for classification. Preferably, the cushioning member 513 is a spring.
上述彈性部件514彈性地連接移動塊512和固定塊52,上述拾取器51為了對半導體晶片實施拾取或脫落分類而上下移動時,若在上述拾取器51上施加了壓力,則上述彈性部件514被延長而使上述拾取器51移動,若消除了壓力則上述彈性部件514被壓縮,而使上述拾取器51復原到原來的位置,較佳地,彈性部件514係使用彈簧。The elastic member 514 is elastically coupled to the moving block 512 and the fixed block 52. When the pickup 51 moves up and down in order to perform picking or detaching classification of the semiconductor wafer, if the pressure is applied to the pickup 51, the elastic member 514 is The pickup 51 is moved to extend, and when the pressure is removed, the elastic member 514 is compressed, and the pickup 51 is returned to the original position. Preferably, the elastic member 514 is a spring.
上述信號產生部515檢測拾取器51能夠穩定地拾取、脫落並分離半導體晶片的移動距離。上述信號產生部515包括安裝在上述拾取器主體511的第一接觸部5151和安裝在上述移動塊512上的第二接觸部5152,在移動上述拾取器主體511使上述第一接觸部5151和第二接觸部5152具有間隔時,產生電性信號來檢測上述拾取器51的穩定的移動距離。The signal generation unit 515 detects the moving distance at which the pickup 51 can stably pick up, detach, and separate the semiconductor wafer. The signal generating unit 515 includes a first contact portion 5151 attached to the pickup body 511 and a second contact portion 5152 attached to the moving block 512, and moves the pickup main body 511 to make the first contact portion 5151 and the When the two contact portions 5152 have a space, an electrical signal is generated to detect a stable moving distance of the pickup 51.
上述第一接觸部5151和第二接觸部5152能夠隔開是因為上述拾取器主體511的移動方向與上述移動塊512的移動方向相反。如果在晶片載置部2中上述拾取器主體511與半導體晶片接觸,或者在上述集料塊3中上述拾取器主體511與半導體晶片接觸並移動時,上述第一接觸5151和第二接觸部5152隔開,上述信號產生部515在這瞬間產生電性信號,檢測上述拾取器51能夠在不損傷半導體晶片的情況下執行拾取和分類的移動距離,以便能夠實現更穩定的分類工序。The first contact portion 5151 and the second contact portion 5152 can be spaced apart because the moving direction of the pickup body 511 is opposite to the moving direction of the moving block 512. If the pickup body 511 is in contact with the semiconductor wafer in the wafer mounting portion 2, or the pickup body 511 is in contact with and moved with the semiconductor wafer in the aggregate block 3, the first contact 5151 and the second contact portion 5152. The signal generating unit 515 generates an electrical signal at this instant, and detects that the pickup 51 can perform the moving distance of picking and sorting without damaging the semiconductor wafer, so that a more stable sorting process can be realized.
上述固定塊52的一側被結合固定在上述旋轉部4上,另一側被結合為使上述拾取器51可上下移動。上述固定塊52藉由彈性部件514和移動塊512彈性連接。One side of the fixing block 52 is coupled and fixed to the rotating portion 4, and the other side is coupled so that the pickup 51 can be moved up and down. The fixing block 52 is elastically coupled by the elastic member 514 and the moving block 512.
如上所述,希望在上述固定塊52與上述移動塊512的關係中,上述移動塊512包括線性導向塊,對應於此,上述固定塊52包括線性導向軌。線性導向塊與線性導向軌亦可分別設置於上述固定塊52與上述移動塊512,使得上述固定塊52與上述移動塊512可相對彼此移動。當然,此技術領域中具有通常知識者應明瞭亦可利用滑動塊和導向槽等結構來讓上述固定塊52與上述移動塊512可相對彼此移動。As described above, it is desirable that in the above relationship between the fixed block 52 and the above-described moving block 512, the moving block 512 includes a linear guiding block, and correspondingly, the fixed block 52 includes a linear guide rail. The linear guide block and the linear guide rail may also be respectively disposed on the fixed block 52 and the moving block 512, so that the fixed block 52 and the moving block 512 can move relative to each other. Of course, it is obvious to those skilled in the art that a structure such as a slider and a guide groove can be utilized to move the fixed block 52 and the moving block 512 relative to each other.
如圖2及圖4所示,多個驅動部6使上述多個拾取器51中位於上述晶片載置部2和集料塊3上的拾取器51分別上下移動。As shown in FIGS. 2 and 4, the plurality of driving units 6 vertically move the pickups 51 located on the wafer placing unit 2 and the collecting block 3 among the plurality of pickups 51, respectively.
上述驅動部6包括施壓部61和控制部。The drive unit 6 includes a pressure applying unit 61 and a control unit.
上述施壓部61對移動塊512施加壓力,使上述拾取器51上下移動。The pressing portion 61 applies pressure to the moving block 512 to move the pickup 51 up and down.
上述施壓部61對位於晶片載置部2的上述拾取器51的移動塊512施加壓力,以便上述拾取器主體511拾取半導體晶片,在上述拾取器主體511拾取半導體晶片之後消除壓力,使上述拾取器51回到原來的位置。The pressing portion 61 applies pressure to the moving block 512 of the pickup 51 located at the wafer mounting portion 2, so that the pickup main body 511 picks up the semiconductor wafer, and after the pickup main body 511 picks up the semiconductor wafer, the pressure is removed, so that the pickup is performed. The device 51 returns to its original position.
上述施壓部61對位於集料塊3上的上述拾取器51的移動塊512施加壓力,使上述拾取器主體511脫落半導體晶片進行分類,在上述拾取器主體511脫落半導體晶片進行分類後消除壓力,使上述拾取器51回到原來的位置。The pressing portion 61 applies pressure to the moving block 512 of the pickup 51 located on the collecting block 3, causes the pickup main body 511 to detach the semiconductor wafer for sorting, and removes the pressure after the semiconductor main wafer is detached from the pickup main body 511. The pickup 51 is returned to the original position.
上述施壓部61使同時位於晶片載置部2和集料塊3的拾取器51分別上下移動。The pressing portion 61 moves the pickups 51 located at the wafer placing portion 2 and the aggregate block 3 up and down, respectively.
上述施壓部61可以由偏心凸輪構成,上述偏心凸輪以其之旋轉軸為中心旋轉,同時對上述移動塊512施加壓力,使其以對應於偏心距離的的距離移動。可以藉由上述偏心凸輪的旋轉角,控制上述拾取器51為了拾取和分類而移動的距離。The pressing portion 61 may be constituted by an eccentric cam that rotates around the rotation axis thereof and applies pressure to the moving block 512 to move at a distance corresponding to the eccentric distance. The distance that the pickup 51 moves for picking and sorting can be controlled by the rotation angle of the eccentric cam described above.
這時,為了控制上述施壓部61的旋轉角,可以設置控制部(未圖示)。At this time, in order to control the rotation angle of the pressing portion 61, a control portion (not shown) may be provided.
上述控制部接收上述信號產生部515產生的電性信號,根據接收的電性信號控制各移動距離,計算出對應於移動距離的偏心凸輪的旋轉角,以便上述拾取器51不損傷半導體晶片而穩定地拾取並脫落半導體晶片進行分類。The control unit receives the electrical signal generated by the signal generating unit 515, controls each moving distance based on the received electrical signal, and calculates a rotation angle of the eccentric cam corresponding to the moving distance so that the pickup 51 is stabilized without damaging the semiconductor wafer. The semiconductor wafers are picked up and dropped for sorting.
上述控制部可以分別對位於晶片載置部2側的施壓部61和位於集料塊3側的施壓部61進行控制。上述控制部分別控制施壓部61,以便施壓部61按照與位於晶片載置部2的拾取器51的移動距離對應的旋轉角和與位於集料塊3的拾取器51的移動距離對應的旋轉角旋轉。The control unit can control the pressing portion 61 on the side of the wafer mounting portion 2 and the pressing portion 61 on the side of the collecting block 3, respectively. The control unit controls the pressing portion 61 so that the pressing portion 61 corresponds to the rotation angle corresponding to the moving distance of the pickup 51 located at the wafer mounting portion 2 and the moving distance of the pickup 51 located at the collecting block 3. The rotation angle is rotated.
並且,上述控制部用於計算出位於晶片載置部2側和集料塊3側的各施壓部61的適當旋轉角的工作,較佳地在上述半導體晶片分類裝置1按照設置規格進行設定後,僅在最初的拾取和分類時實施。這是因為,只要設置規格沒有變化,按照與最初計算出的旋轉角相同的旋轉角進行控制即可。Further, the control unit is configured to calculate an appropriate rotation angle of each of the pressing portions 61 on the wafer mounting portion 2 side and the collecting block 3 side, and is preferably set in accordance with the installation specifications of the semiconductor wafer sorting device 1. After that, it is only implemented at the time of initial picking and sorting. This is because, as long as the setting specifications are not changed, the control may be performed at the same rotation angle as the initially calculated rotation angle.
圖6是表示在圖3中設有本發明的第三視頻攝影機的狀態的圖。Fig. 6 is a view showing a state in which the third video camera of the present invention is provided in Fig. 3;
如圖2及圖6所示,上述第三視頻攝影機7設置於在晶片載置部2拾取的半導體晶片被移送到上述集料塊3的路徑上。As shown in FIGS. 2 and 6, the third video camera 7 is provided on a path in which the semiconductor wafer picked up by the wafer mounting unit 2 is transferred to the aggregate block 3.
上述第三視頻攝影機7設置在上述拾取器主體511的下側,以便在半導體晶片的移送過程中確認半導體晶片的拾取狀態和損傷與否,並且確認由上述拾取器主體511拾取的半導體晶片。The third video camera 7 described above is disposed on the lower side of the pickup main body 511 to confirm the pickup state and damage of the semiconductor wafer during the transfer of the semiconductor wafer, and to confirm the semiconductor wafer picked up by the pickup main body 511.
半導體晶片在拾取過程中發生損傷時,上述第三視頻攝影機7在移送過程中確認半導體晶片的損傷與否,可以防止損傷的半導體晶片排列在上述集料塊3上。並且,在移送半導體晶片的過程中,半導體晶片的拾取狀態變化時,上述第三視頻攝影機7根據變化狀態使上述集料塊3移動,以便半導體晶片以一定的排列狀態被分類。When the semiconductor wafer is damaged during the pickup process, the third video camera 7 confirms the damage of the semiconductor wafer during the transfer process, and prevents the damaged semiconductor wafer from being arranged on the aggregate block 3. Further, in the process of transferring the semiconductor wafer, when the pickup state of the semiconductor wafer is changed, the third video camera 7 moves the aggregate block 3 in accordance with the changed state so that the semiconductor wafers are sorted in a certain arrangement state.
在相對設置的晶片載置部2和集料塊3之間,上述第三視頻攝影機7較佳地設置成與上述晶片載置部2及集料塊3分別成90°。The third video camera 7 is preferably disposed at 90 degrees with respect to the wafer mounting portion 2 and the aggregate block 3, respectively, between the opposite wafer mounting portion 2 and the sump 3.
如此,每當上述旋轉臂5停止旋轉時,可以根據使用者的設置規格互換可同時位於晶片載置部2、集料塊3及第三視頻攝影機7處的旋轉臂5。In this manner, each time the rotating arm 5 stops rotating, the rotating arm 5 which can be simultaneously positioned at the wafer mounting portion 2, the aggregate block 3, and the third video camera 7 can be interchanged according to the user's setting specifications.
因此,在第三視頻攝影機7被設置在如上所述的位置時,係可互換使用每隔90°停止旋轉的4個旋轉臂5、每隔45°停止旋轉的8個旋轉臂5、每隔30°停止旋轉的12個旋轉臂5等以4的倍數構成的旋轉臂5。Therefore, when the third video camera 7 is installed at the position as described above, it is possible to interchangeably use the four rotating arms 5 that stop rotating every 90 degrees, and the eight rotating arms 5 that stop rotating every 45 degrees, every other time. A rotating arm 5 composed of a plurality of four, such as 12 rotating arms 5 that stop rotating at 30°.
以下,參照附圖詳細說明本發明的半導體晶片分類裝置的工作關係的較佳實施例。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the operational relationship of the semiconductor wafer sorting apparatus of the present invention will be described in detail with reference to the accompanying drawings.
參照圖2至圖6時,如果完成檢測的晶片載置在上述晶片載置部2,上述旋轉部4藉由由驅動電機提供的驅動力進行旋轉。這時,上述旋轉臂5一起旋轉,若多個旋轉臂5同時位於上述晶片載置部2和集料塊3上,則藉由上述旋轉部4停止旋轉臂5。Referring to FIGS. 2 to 6, when the wafer on which the detection is completed is placed on the wafer mounting portion 2, the rotating portion 4 is rotated by the driving force supplied from the driving motor. At this time, the rotating arm 5 rotates together, and when the plurality of rotating arms 5 are simultaneously positioned on the wafer mounting portion 2 and the aggregate block 3, the rotating arm 5 is stopped by the rotating portion 4.
當上述旋轉臂5停止時,在位於上述晶片載置部2側的旋轉臂5中,施壓部61對拾取器51的移動塊512施加壓力,隨之,拾取器51朝著位於晶片載置部2的晶片向下方移動,上述拾取器主體511一起向下方移動。When the rotating arm 5 is stopped, the pressing portion 61 applies pressure to the moving block 512 of the pickup 51 in the rotating arm 5 located on the side of the wafer mounting portion 2, and accordingly, the pickup 51 is placed toward the wafer. The wafer of the portion 2 moves downward, and the pickup main body 511 moves downward together.
當向下方移動的上述拾取器主體511與半導體晶片接觸時,上述拾取器主體511會因壓力而向上方移動,消除由上述施壓部61施加的壓力,上述拾取器51和拾取器主體511回到原來的位置並拾取半導體晶片。When the pickup main body 511 moving downward is in contact with the semiconductor wafer, the pickup main body 511 is moved upward by the pressure to eliminate the pressure applied by the pressing portion 61, and the pickup 51 and the pickup main body 511 are returned. Go to the original location and pick up the semiconductor wafer.
在位於集料塊3側的旋轉臂5中,施壓部61向拾取器51的移動塊512施加壓力,隨之,上述拾取器51朝向與被拾取的半導體晶片的等級對應的集料塊3向下方移動,上述拾取器主體511一起向下方移動。In the rotating arm 5 on the side of the collecting block 3, the pressing portion 61 applies pressure to the moving block 512 of the pickup 51, and accordingly, the pickup 51 faces the collecting block 3 corresponding to the level of the semiconductor wafer to be picked up. Moving downward, the pickup main body 511 moves downward together.
當被上述拾取器主體511拾取的半導體晶片與上述集料塊3接觸時,上述拾取器主體511因壓力而向上方移動,消除由上述施壓部施加的壓力,上述拾取器51和拾取器主體511回到原來的位置,脫落半導體晶片進行分類。When the semiconductor wafer picked up by the pickup main body 511 comes into contact with the aggregate block 3, the pickup main body 511 moves upward by pressure to eliminate the pressure applied by the pressing portion, and the pickup 51 and the pickup main body 511 returns to the original position, and the semiconductor wafer is peeled off for classification.
這樣,位於上述晶片載置部2側的旋轉臂5拾取半導體晶片的工作和位於上述集料塊3側的旋轉臂5脫落被拾取的半導體晶片進行分類的工作都結束時,上述旋轉部4從旋轉電機獲得驅動力重新旋轉。Thus, when the operation of picking up the semiconductor wafer by the rotating arm 5 on the side of the wafer mounting portion 2 and the operation of sorting the semiconductor wafer on the side of the collecting block 3 by the picked up semiconductor wafer are completed, the rotating portion 4 is The rotating motor obtains the driving force to re-rotate.
在此,當拾取半導體晶片的旋轉臂5位於第三視頻攝影機7的上側時,上述旋轉部4停止旋轉,以便第三視頻攝影機7確認半導體晶片的拾取狀態和損傷與否之後重新旋轉。Here, when the rotating arm 5 that picks up the semiconductor wafer is located on the upper side of the third video camera 7, the above-described rotating portion 4 stops rotating, so that the third video camera 7 confirms the pickup state of the semiconductor wafer and the re-rotation after the damage.
另一方面,上述旋轉臂5設有4的倍數個,較佳地是4個旋轉臂5構成90°的情況下,拾取半導體晶片的旋轉臂5位於上述第三視頻攝影機7側時,其他2個旋轉臂5分別位於晶片載置部2和集料塊3上,執行半導體晶片的拾取和分類。On the other hand, the above-described rotating arm 5 is provided in multiples of four, and preferably, when four rotating arms 5 constitute 90°, when the rotating arm 5 that picks up the semiconductor wafer is located on the side of the third video camera 7, the other two The rotating arms 5 are respectively located on the wafer mounting portion 2 and the collecting block 3, and perform picking and sorting of the semiconductor wafer.
因此,上述旋轉部4每隔90°重複旋轉和停止,在一次旋轉和停止時位於晶片載置部2側的旋轉臂5拾取半導體晶片,位於集料塊3側的旋轉臂5將拾取的半導體晶片按等級脫落進行分類,位於第三視頻攝影機7側的旋轉臂5藉由第三視頻攝影機7確認半導體晶片的拾取狀態和損傷與否,能夠進行有效的分類工序的同時,可以縮短分類工序所需的時間。Therefore, the above-described rotating portion 4 is repeatedly rotated and stopped every 90 degrees, and the rotating arm 5 on the wafer mounting portion 2 side picks up the semiconductor wafer at the time of one rotation and stop, and the rotating arm 5 located on the collecting block 3 side picks up the semiconductor. The wafers are sorted by gradation, and the rotating arm 5 on the side of the third video camera 7 confirms the pick-up state and damage of the semiconductor wafer by the third video camera 7, thereby enabling an effective sorting process and shortening the sorting process. Time required.
以上說明的本發明不限於上述的實施例及附圖,對本發明所屬技術領域中具有通常知識者而言,在不脫離本發明的技術思想的範圍內可以進行各種置換、變形及調整。The invention described above is not limited to the above-described embodiments and the drawings, and various substitutions, modifications, and adjustments may be made without departing from the spirit and scope of the invention.
本發明藉由上面所述的結構和實施例及工作關係,可以實現如下的效果。The present invention can achieve the following effects by the structure, the embodiment, and the operational relationship described above.
本發明在1個旋轉部上設置了分別上下移動的多個旋轉臂,實現如下效果:可以縮短分類工序所需的工作時間,並縮短旋轉臂的長度,減少施加在旋轉電機上的負載,持續的使用中也可以進行精密的控制,可以提高半導體晶片的分類工序的效率。According to the present invention, a plurality of rotating arms that move up and down respectively are provided on one rotating portion, and the effect of shortening the working time required for the sorting process, shortening the length of the rotating arm, and reducing the load applied to the rotating electrical machine are continued. It is also possible to perform precise control during use, and it is possible to improve the efficiency of the sorting process of the semiconductor wafer.
本發明減少在旋轉臂的高速旋轉和突然停止時產生的振動,具有如下效果:可以防止被拾取的半導體晶片任意扭曲或脫落,在不損傷半導體晶片的情況下也能夠以一定的排列狀態進行分類,在分類之前確認在半導體晶片的拾取和移送過程中產生的半導體晶片的變化,可以提高分類工序的準確性。The present invention reduces vibration generated at the time of high-speed rotation and sudden stop of the rotating arm, and has an effect of preventing the semiconductor wafer to be picked up from being arbitrarily twisted or peeled off, and sorting in a certain arrangement state without damaging the semiconductor wafer. The change of the semiconductor wafer generated during the picking up and transfer of the semiconductor wafer is confirmed before sorting, and the accuracy of the sorting process can be improved.
綜上所述,雖然本發明已以一較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In view of the above, the present invention has been disclosed in a preferred embodiment, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
1...半導體晶片分類裝置1. . . Semiconductor wafer sorting device
11...主體11. . . main body
12...支承框架12. . . Support frame
2、300...晶片載置部2, 300. . . Wafer placement
21、240...第一視頻攝影機21, 240. . . First video camera
22...第一移動部twenty two. . . First moving department
3、200...集料塊3,200. . . Aggregate block
31、301...第二視頻攝影機31, 301. . . Second video camera
32...第二移動部32. . . Second moving part
4...旋轉部4. . . Rotating part
41...旋轉軸41. . . Rotary axis
5、400...旋轉臂5,400. . . Rotating arm
51、401...拾取器51, 401. . . Picker
511...拾取器主體511. . . Picker body
512...移動塊512. . . Moving block
513...緩衝件513. . . Buffer
514...彈性部件514. . . Elastic part
515...信號產生部515. . . Signal generation unit
5151...第一接觸部5151. . . First contact
5152...第二接觸部5152. . . Second contact
52...固定塊52. . . Fixed block
6...驅動部6. . . Drive department
61...施壓部61. . . Pressure department
7...第三視頻攝影機7. . . Third video camera
410...旋轉電機410. . . Rotary motor
A...箭預A. . . Arrow pre
圖1是傳統中的半導體晶片分類裝置的立體圖;圖2是本發明涉及的半導體晶片分類裝置的立體圖;圖3是將本發明涉及的半導體晶片分類裝置的一部分放大表示的圖;圖4是放大表示本發明的旋轉臂、驅動部及旋轉部的圖;圖5是放大表示本發明的旋轉臂的圖;及圖6是表示在圖3中具備本發明的第三視頻攝影機的狀態的圖。1 is a perspective view of a conventional semiconductor wafer sorting apparatus; FIG. 2 is a perspective view of a semiconductor wafer sorting apparatus according to the present invention; FIG. 3 is an enlarged view of a part of the semiconductor wafer sorting apparatus according to the present invention; 5 is a view showing a rotating arm, a driving portion, and a rotating portion of the present invention; FIG. 5 is an enlarged view showing a rotating arm of the present invention; and FIG. 6 is a view showing a state in which the third video camera of the present invention is provided in FIG.
1...半導體晶片分類裝置1. . . Semiconductor wafer sorting device
11...主體11. . . main body
12...支承框架12. . . Support frame
2...晶片載置部2. . . Wafer placement
21...第一視頻攝影機twenty one. . . First video camera
22...第一移動部twenty two. . . First moving department
3...集料塊3. . . Aggregate block
31...第二視頻攝影機31. . . Second video camera
32...第二移動部32. . . Second moving part
5...旋轉臂5. . . Rotating arm
A...箭頭A. . . arrow

Claims (13)

  1. 一種半導體晶片分類裝置,包括:多個旋轉臂,可同時位於晶片載置部和集料塊上;多個拾取器,可分別上下移動地結合在上述多個旋轉臂上,上述多個拾取器在晶片載置部拾取半導體晶片,將拾取的半導體晶片移送到對應等級的集料塊,以進行分類;旋轉部,利用由旋轉電機提供的驅動力使上述多個旋轉臂向一個方向旋轉;以及多個使上述多個拾取器上下移動的驅動部,該些驅動部其中之一係分別對應該些拾取器其中之一配置,使位於晶片載置部之上方的拾取器和位於集料塊之上方的拾取器分別上下移動。 A semiconductor wafer sorting apparatus comprising: a plurality of rotating arms simultaneously located on a wafer mounting portion and a collecting block; a plurality of pickers respectively coupled to the plurality of rotating arms up and down, the plurality of pickers Picking up a semiconductor wafer at a wafer mounting portion, transferring the picked semiconductor wafer to a corresponding level of the aggregate block for sorting; and rotating the portion to rotate the plurality of rotating arms in one direction by a driving force provided by the rotating electrical machine; a plurality of driving portions for moving the plurality of pickers up and down, one of the driving portions respectively corresponding to one of the picking devices, so that the picking device located above the wafer mounting portion and the collecting block are located The upper pickers move up and down respectively.
  2. 如申請專利範圍第1項所述之半導體晶片分類裝置,其中上述晶片載置部和上述集料塊配置成彼此相對置。 The semiconductor wafer sorting apparatus according to claim 1, wherein the wafer placing portion and the aggregate block are disposed to face each other.
  3. 如申請專利範圍第1項所述之半導體晶片分類裝置,其中上述多個旋轉臂包括多個可上下移動地結合上述多個拾取器的固定塊,上述多個拾取器各包括:拾取器主體,與半導體晶片直接接觸;以及移動塊,在上述移動塊上可上下移動地結合有上述拾取器主體,並且上述移動塊可上下移動地結合在上述多個固定塊之其中一者上;其中,上述拾取器主體在各多個上述拾取器上可上下移動。 The semiconductor wafer sorting apparatus of claim 1, wherein the plurality of rotating arms comprise a plurality of fixed blocks that are movable up and down in combination with the plurality of pickers, each of the plurality of pickers comprising: a picker body, Directly contacting the semiconductor wafer; and moving the block, the pickup body is coupled to the moving block in a vertically movable manner, and the moving block is coupled to the one of the plurality of fixed blocks in a vertically movable manner; wherein The pickup main body is movable up and down on each of the plurality of the above pickups.
  4. 如申請專利範圍第3項所述之半導體晶片分類裝置,其中上述多個拾取器各具備緩衝上述拾取器主體施加在半導體元件上的壓力的緩衝部件。 The semiconductor wafer sorting apparatus according to claim 3, wherein each of the plurality of pickers has a buffer member that buffers a pressure applied to the semiconductor element by the pickup main body.
  5. 如申請專利範圍第3項所述之半導體晶片分類裝置,其中上述多個驅動部各具有對上述移動塊施加壓力而使上述拾取器上下移動的施壓部,上述多個拾取器各具備連接上述移動塊和各上述多個固定塊的彈性部件。 The semiconductor wafer sorting apparatus according to claim 3, wherein each of the plurality of driving units has a pressing portion that applies pressure to the moving block to move the picking device up and down, and each of the plurality of pickers has a connection Moving the block and the elastic members of each of the plurality of fixed blocks.
  6. 如申請專利範圍第5項所述之半導體晶片分類裝置,其中上述施壓部由偏心凸輪構成,偏心凸輪以其旋轉軸為中心進行旋轉,使上述移動塊移動與偏心距離相應的距離。 The semiconductor wafer sorting apparatus according to claim 5, wherein the pressing portion is constituted by an eccentric cam, and the eccentric cam rotates about a rotation axis thereof to move the moving block by a distance corresponding to an eccentric distance.
  7. 如申請專利範圍第6項所述之半導體晶片分類裝置,其中上述拾取器包括信號產生部,該信號產生部具有安裝在上述拾取器主體上的第一接觸部和安裝在上述移動塊上的第二接觸部;其中,在移動上述拾取器主體而隔開上述第一接觸部和上述第二接觸部時,上述信號產生部產生電性信號;其中,上述驅動部包括從上述信號產生部接收電性信號來控制上述施壓部的旋轉角的控制部。 The semiconductor wafer sorting apparatus according to claim 6, wherein the pickup includes a signal generating portion having a first contact portion mounted on the pickup body and a first surface mounted on the moving block a second contact portion; wherein the signal generating portion generates an electrical signal when the pickup body is moved to separate the first contact portion and the second contact portion; wherein the driving portion includes receiving power from the signal generating portion The control unit that controls the rotation angle of the pressing portion by the sexual signal.
  8. 如申請專利範圍第1項所述之半導體晶片分類裝置,其中上述晶片載置部包括:第一視頻攝影機,對附著在晶片上的半導體晶片的排列狀態進行確認;以及 第一移動部,移動上述晶片載置部,以便確保半導體晶片的長度方向、寬度方向、傾斜方向符合預定之方向,使半導體晶片按預定的排列狀態被拾取。 The semiconductor wafer sorting apparatus according to claim 1, wherein the wafer mounting portion includes: a first video camera that confirms an arrangement state of a semiconductor wafer attached to the wafer; The first moving portion moves the wafer placing portion to ensure that the longitudinal direction, the width direction, and the oblique direction of the semiconductor wafer conform to a predetermined direction, and the semiconductor wafer is picked up in a predetermined arrangement state.
  9. 如申請專利範圍第1項所述之半導體晶片分類裝置,其中上述集料塊包括:第二視頻攝影機,確認上述半導體晶片按等級被分類的排列狀態;以及第二移動部,移動上述集料塊,以便確保半導體晶片的長度方向、寬度方向、傾斜方向符合預定之方向,使半導體晶片按預定的排列狀態被分類。 The semiconductor wafer sorting apparatus according to claim 1, wherein the aggregate block includes: a second video camera that confirms an arrangement state in which the semiconductor wafers are classified according to a level; and a second moving portion that moves the aggregate block In order to ensure that the length direction, the width direction, and the oblique direction of the semiconductor wafer conform to a predetermined direction, the semiconductor wafers are sorted in a predetermined arrangement state.
  10. 如申請專利範圍第1項所述之半導體晶片分類裝置,其中上述半導體晶片分類裝置更包括:第三視頻攝影機,設置在從上述晶片載置部往上述集料塊移送上述被拾取的半導體晶片的路徑上。 The semiconductor wafer sorting apparatus according to claim 1, wherein the semiconductor wafer sorting apparatus further includes: a third video camera disposed to transfer the picked semiconductor wafer from the wafer mounting portion to the aggregate block On the path.
  11. 如申請專利範圍第10項所述之半導體晶片分類裝置,其中上述多個旋轉臂係彼此隔著相同的角度設置,以便同時位於上述晶片載置部、上述集料塊及上述第三視頻攝影機上。 The semiconductor wafer sorting apparatus according to claim 10, wherein the plurality of rotating arm systems are disposed at the same angle from each other so as to be simultaneously located on the wafer placing portion, the aggregate block, and the third video camera. .
  12. 如申請專利範圍第1項至第10項中之任一項所述的半導體晶片分類裝置,其中上述旋轉臂設有4個,以便同時位於上述晶片載置部和上述集料塊上。 The semiconductor wafer sorting apparatus according to any one of claims 1 to 10, wherein the plurality of rotating arms are provided so as to be simultaneously positioned on the wafer placing portion and the aggregate block.
  13. 如申請專利範圍第1至第10項中之任一項所述的半導體晶片分類裝置,其中上述旋轉臂隔著相同的角度而設有多個,以便同時位於上述晶片載置部和上述集料塊 上。The semiconductor wafer sorting apparatus according to any one of claims 1 to 10, wherein the rotating arm is provided at a plurality of the same angle so as to be located at the wafer mounting portion and the aggregate at the same time. Piece on.
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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5376226B2 (en) * 2009-05-21 2013-12-25 澁谷工業株式会社 Electronic component distributor
WO2011016607A1 (en) * 2009-08-02 2011-02-10 (주)큐엠씨 Pickup apparatus and led chip classification apparatus including same
CN101640244B (en) * 2009-08-20 2011-01-05 张九六 Device for automatic material stripping and automatic Bin splitting for serial flaky LEDs
KR200456673Y1 (en) * 2009-11-09 2011-11-10 (주)티에스이 Multi picker device for transfering a LED chip
JP5413178B2 (en) * 2009-12-18 2014-02-12 澁谷工業株式会社 Electronic component distributor
KR100986248B1 (en) * 2010-03-25 2010-10-07 유병소 Multi arm structure and apparatus for sorting objects including the same
CN101829658A (en) * 2010-04-16 2010-09-15 致茂电子(苏州)有限公司 Quick sorting and arranging machine of crystalline grain and quick sorting and arranging method of crystalline grain
CN102266855A (en) * 2010-06-02 2011-12-07 财团法人精密机械研究发展中心 Classifier taking and placing device
KR101900477B1 (en) * 2012-04-20 2018-09-19 (주)큐엠씨 Apparatus for sorting electronic element
CN102673968A (en) * 2012-04-28 2012-09-19 惠州市得天自动化设备有限公司 Automatic loading and unloading system of light-emitting diode (LED) chip sorting device
CN106311625B (en) * 2015-06-17 2019-02-19 晶元光电股份有限公司 Semiconductor element classification method
EP3615234A1 (en) * 2017-04-28 2020-03-04 Rockwool International A/S A method and apparatus for rejection of defective mineral fibre slabs
TWI631652B (en) * 2017-12-07 2018-08-01 鴻勁精密股份有限公司 Electronic component operating equipment
CN112005356A (en) 2018-05-03 2020-11-27 应用材料公司 Substrate tilt control in high speed rotary sorter

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0917812A (en) * 1995-06-30 1997-01-17 Oki Electric Ind Co Ltd Dies bonder
KR20010063412A (en) * 1999-12-22 2001-07-09 윤종용 Apparatus for bonding CSP dies
KR20040032252A (en) * 2002-10-08 2004-04-17 (주)제이티 Bidirectional Die Sorter Provided with a Rotational Arm
US20040156539A1 (en) * 2003-02-10 2004-08-12 Asm Assembly Automation Ltd Inspecting an array of electronic components
TW200501200A (en) * 2003-01-16 2005-01-01 Koninkl Philips Electronics Nv Chip transfer method and apparatus
KR20060016314A (en) * 2004-08-17 2006-02-22 삼성전자주식회사 Chuck table of apparatus for cutting and sorting chip scale package
KR100656942B1 (en) * 2005-06-14 2006-12-13 (주)큐엠씨 Apparatus for sorting semiconductor chip

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0917812A (en) * 1995-06-30 1997-01-17 Oki Electric Ind Co Ltd Dies bonder
KR20010063412A (en) * 1999-12-22 2001-07-09 윤종용 Apparatus for bonding CSP dies
KR20040032252A (en) * 2002-10-08 2004-04-17 (주)제이티 Bidirectional Die Sorter Provided with a Rotational Arm
TW200501200A (en) * 2003-01-16 2005-01-01 Koninkl Philips Electronics Nv Chip transfer method and apparatus
US20040156539A1 (en) * 2003-02-10 2004-08-12 Asm Assembly Automation Ltd Inspecting an array of electronic components
KR20060016314A (en) * 2004-08-17 2006-02-22 삼성전자주식회사 Chuck table of apparatus for cutting and sorting chip scale package
KR100656942B1 (en) * 2005-06-14 2006-12-13 (주)큐엠씨 Apparatus for sorting semiconductor chip

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