TWI381458B - The sorting apparatus for semiconductor chip - Google Patents

Description

Semiconductor wafer sorting device

The present invention relates to a semiconductor wafer sorting apparatus, and more particularly to a semiconductor wafer sorting apparatus for sorting semiconductor wafers arranged on a wafer in accordance with detection results.

Generally, semiconductor wafers such as LED elements are fabricated on wafers of a certain size, and thousands to tens of thousands of semiconductor wafers are fabricated on such wafers. The wafer is divided into wafers by wafer dicing, and must be subjected to a precise inspection process before leaving the factory, and classified into a certain level according to the detection results and the performance of each wafer. Such a wafer classified as a certain level needs to be subjected to a sorting process which is rearranged according to the rank, and a sorting device (Sorter) is used here.

1 is a perspective view of a conventional semiconductor wafer sorting apparatus.

Referring to Fig. 1, a conventional semiconductor wafer sorting apparatus includes a bin block 200, a wafer mounting portion 300, and a sorting portion.

On the above-described aggregate block 200, the semiconductor wafer on the wafer on which the detecting means completes the inspection is classified according to the detection result. The aggregate block 200 is located on both sides of the wafer mounting portion 300. A first video camera 240 is disposed on the upper portion of the collecting block 200 to monitor the arrangement state of the semiconductor wafers arranged on the respective collecting blocks 200. The aggregate block 200 is moved in the X-Y direction, and the semiconductor wafer transferred by the sorting unit is sorted into the aggregate block 200 corresponding to the grade.

The wafer mounting unit 300 mounts a wafer that has been detected by the detecting device, and the wafer is placed while the semiconductor wafer is sorted by the sorting unit. The wafer mounting unit 300 moves in the X-Y-θ direction to enable the sorting unit to pick up the wafers arranged on the wafer. A second video camera 301 is provided on the upper portion of the wafer mounting unit 300 to confirm the arrangement state of the semiconductor wafers on the wafer, so that the classification unit can accurately grasp the position of the wafers arranged on the wafer and pick up the wafer.

The sorting unit classifies the semiconductor wafers arranged on the wafer from the wafer placing unit 300 to the collecting block 200 in a grade, and includes a rotating arm 400 and a rotating electrical machine 410.

The rotating arm 400 reciprocates between the wafer mounting portion 300 and the aggregate block 200, and a pickup 401 for picking up a semiconductor wafer is provided at an end portion thereof.

The pickup 401 picks up a semiconductor wafer in the wafer mounting portion 300, transports the picked semiconductor wafer to the stack block 200, and classifies the semiconductor wafers in the stack block 200.

Here, the swivel arm 400 is not movable in the X-Y direction, but is rotationally moved between a predetermined position of the wafer mounting portion 300 and a predetermined position of the aggregate block 200. Therefore, the wafer placing portion 300 and the sump block 200 are moved in the X-Y direction, so that the pickup 401 can pick up the semiconductor wafer on the wafer, thereby sorting the picked semiconductor wafer into the grading block 200 of the corresponding grade.

The rotating electric machine 410 is electrically connected to the rotating arm 400 to provide a driving force to the rotating arm 400. The rotary electric machine 410 rotates the rotary arm 400 at a certain angle between the wafer mounting portion 300 and the aggregate block 200, and positions the rotary arm 400 at a maximum accuracy of 1/1,000,000 revolutions by a hollow motor (Direct Drive Moter). The location.

When a process of classifying a semiconductor wafer by such a conventional semiconductor wafer sorting apparatus is observed, a wafer in which the semiconductor wafers that have been detected are arranged is placed on the wafer mounting portion 300 and arranged on the wafer. The semiconductor wafer is picked up by the pickup 401 of the above-described rotating arm 400.

Further, the rotating arm 400 is rotationally moved from the wafer mounting portion 300 to the aggregate block 200 by the rotary electric machine 410. The semiconductor wafer that is rotationally moved by the above-described rotating arm 400 is detached from the above-described rotating arm 400, and is classified into the corresponding level of the aggregate block 200.

Then, the rotating arm 400 is re-rotated to the wafer mounting unit 300 by the rotary electric machine 410, and the other semiconductor wafers on the wafer are picked up and transferred to the aggregate block 200.

The above process is repeatedly performed to sort the semiconductor wafers by level rearrangement.

Here, the conventional semiconductor wafer sorting apparatus classifies the semiconductor wafers arranged on the wafer by one rotating arm 400, thereby causing a loss of work time and a problem of increasing the working time. This is because the above-described rotating arm 400 picks up the semiconductor wafer on the wafer mounting portion 300, and transports the picked semiconductor wafer to the above-described aggregate block 200 for sorting, and then reciprocates the wafer mounting portion 300.

In order to shorten the time during which the rotating arm 400 reciprocates, the wafer mounting portion 300 and the aggregate block 200 are respectively located in front of and behind the rotating arm 400, and the rotating arm 400 reciprocates while rotating by 90 degrees. However, as described above, the wafer placing unit 300 and the collecting block 200 are required to secure a space that moves in the X-Y direction, and it is necessary to separate the distances that do not interfere with each other. Therefore, the length of the above-described rotating arm 400 can be increased, and the inertial force at the time of the movement and the stop of the rotating arm 400 increases, and the load applied to the rotating electrical machine 410 increases.

If the load applied to the rotating electric machine 410 increases, the rotating electric machine 410 is slightly damaged due to continuous use, so that it is difficult to precisely control the rotating electric machine 410, and there is a problem that power consumption due to a large load is increased more than necessary. .

Further, if the length of the above-described rotating arm 400 is increased, the amplitude of vibration generated when the high-speed rotation and the sudden stop of the above-described rotating arm 400 are also increased correspondingly, so that the semiconductor wafer picked up by the above-mentioned pickup 401 is arbitrarily twisted or peeled off. The problem of performing the correct classification process.

The present invention provides a semiconductor wafer sorting apparatus capable of performing an effective sorting process, which reduces the work time required for the sorting process and also reduces the load applied to the rotary electric machine. In this way, the rotary electric machine can be precisely controlled during continuous use, so that the correct sorting process of the semiconductor wafer can be performed.

Further, the semiconductor wafer sorting apparatus of the present invention can reduce the vibration generated when the rotating arm is rotated at a high speed and suddenly stops, and can prevent the semiconductor wafer from being detached arbitrarily, and can accurately rearrange the semiconductor wafer at a position corresponding to the level. This enables an accurate classification process to be performed.

A semiconductor wafer sorting apparatus for realizing the above advantages has the following structure.

A semiconductor wafer sorting apparatus according to the present invention includes: a plurality of rotating arms that are simultaneously located on a wafer mounting portion and a collecting block; and a plurality of pickers that are respectively coupled to the plurality of rotating arms up and down, the plurality of picking The semiconductor wafer is picked up at the wafer mounting portion, the picked semiconductor wafer is transferred to a corresponding level of the aggregate block for sorting, and the rotating portion is rotated by the driving force provided by the rotating electrical machine to rotate the plurality of rotating arms in one direction .

Since the rotating arm can be located above the wafer mounting portion and the aggregate block at the same time, the rotating arm picks up the semiconductor wafer in the wafer mounting portion, and the other rotating arm makes another semiconductor on the collecting block. The wafers are detached for sorting by level.

Thereby, the work time required for the sorting process can be shortened, and the above-described rotating arms provided with the plurality of pick-ups can be moved up and down to prevent damage of the semiconductor wafer, thereby performing a stable sorting process.

In the semiconductor wafer sorting apparatus according to the present invention, the wafer placing portion and the aggregate block are disposed to face each other.

Therefore, the wafer placing portion and the aggregate block can be provided close to the rotating arm without hindering the movement therebetween, and the length of the rotating arm can be shortened. Therefore, the load applied to the rotating electrical machine is reduced. In this way, the rotary electric machine can maintain precise control during continuous use, and reduce the vibration generated when the rotating arm is rotated at a high speed and suddenly stopped, thereby preventing the picked semiconductor wafer from being arbitrarily twisted or peeled off.

In order to make the above-mentioned contents of the present invention more comprehensible, a preferred embodiment will be described below, and in conjunction with the drawings, a detailed description is as follows:

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the structure of a semiconductor wafer sorting apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view of a semiconductor wafer sorting apparatus according to the present invention, and FIG. 3 is an enlarged view of a part of the semiconductor wafer sorting apparatus according to the present invention.

As shown in FIGS. 2 and 3, the semiconductor wafer sorting apparatus 1 of the present invention includes a wafer mounting portion 2, a collecting block 3, a rotating portion 4 (shown in FIG. 4), a rotating arm 5, and a driving portion 6 (shown in FIG. 4) The third video camera 7 (shown in Fig. 6) further includes a main body 11 and a support frame 12 provided with the above-described structural elements.

The wafer mounting unit 2 mounts a wafer (not shown) that has been detected by a detecting device (not shown), and supports the wafer so that the semiconductor wafer attached to the wafer is picked up. The wafer carrier 2 further includes a first video camera 21 and a first moving portion 22.

The first video camera 21 is disposed on the support frame 12, and the arrangement state of the semiconductor wafer attached to the wafer can be confirmed on the upper side (the direction of the arrow A) of the wafer mounting portion 2, so that the semiconductor wafer can be accurately picked up.

The first moving portion 22 moves the wafer mounting portion 2 such that the rotating arm 5 is accurately positioned at a position of the semiconductor wafer to be picked up, and the wafer mounting portion 2 is moved so that the semiconductor wafer is in a certain arrangement state. Pick up. This is to enable the semiconductor wafers to be classified in a certain arrangement state in the above-described aggregate block 3.

In the wafer dicing process, the semiconductor wafers may be separated by mutually different separation distances and alignment states, and the semiconductor wafer may be rotated. Therefore, in order to ensure that the semiconductor wafer has the length direction X, the width direction Y, and the tilt direction θ. In the predetermined direction, the first moving unit 22 moves the wafer placing unit 2 in the X-Y-θ direction.

That is, the first moving portion 22 not only moves the semiconductor wafer in the longitudinal direction X and the width direction Y, but also rotates the semiconductor wafer to ensure that the oblique direction θ also conforms to a predetermined direction so that the semiconductor wafer is picked up in a certain arrangement state. Therefore, the first moving unit 22 moves the wafer mounting unit 2.

The semiconductor wafers picked up and transferred in the above-mentioned aggregate block 3 are sorted by rank and sorted. A plurality of the aggregate blocks 3 are provided in accordance with a classification desired by the user, and the aggregate block 3 includes a second video camera 31 and a second moving portion 32.

The second video camera 31 is disposed on the support frame 12, and the arrangement state of the wafers arranged on the aggregate block 3 is confirmed on the upper side (the direction of the arrow A) of the aggregate block 3, so that the semiconductor wafer is accurately carried classification.

The second moving portion 32 moves the aggregate block 3 such that the rotating arm 5 is accurately positioned at a position where the semiconductor wafer is to be rearranged and classified, and the moving block 3 is moved so that the semiconductor wafers are sorted in a certain arrangement state.

In the above-described wafer mounting portion 2, there is a case where the semiconductor wafer is not picked up in a certain arrangement state, or the semiconductor wafer to be picked up is transferred to the above-mentioned collecting block 3, and the semiconductor wafer is shaken, vibrated, or the like. In the case of movement, in order to ensure that the longitudinal direction X, the width direction Y, and the oblique direction θ of the semiconductor wafer conform to a predetermined direction, the second moving portion 32 is also preferably such that the aggregate block 3 is along the X-Y- Move in the θ direction.

As shown in FIG. 2, the wafer mounting portion 2 and the aggregate block 3 are disposed to face each other on both sides of the support frame 12, and the wafer mounting portion 2 and the aggregate block 3 are placed in different spaces as described above. Moving, this is to be placed close to the above-described rotating arm 5 while not hindering movement between each other.

Therefore, the length of the above-described rotating arm 5 can be shortened, the load thus applied to the rotating electrical machine can be reduced, precise control can be maintained in continuous use, and vibration generated at the time of high-speed rotation and sudden stop of the rotating arm 5 can be reduced. Thereby, the semiconductor wafer to be picked up is prevented from being arbitrarily twisted or peeled off.

Fig. 4 is an enlarged view showing a swivel arm, a driving portion, and a rotating portion of the present invention.

As shown in FIG. 2 and FIG. 4, the entire rotating portion 4 has a cylindrical shape, and is rotated about a rotating shaft 41 by a driving force supplied from a rotary electric machine (not shown), and is transmitted to the rotating arm 5 coupled to the outside. The driving force provided by the rotating motor rotates together. The above rotary electric machine preferably uses a DD motor (hollow motor).

The above-described rotating portion 4 is rotated in one direction, that is, in one of a clockwise direction or a counterclockwise direction, and picking up and sorting of the semiconductor wafer is performed, and the process thereof will be briefly described as follows.

When the plurality of rotating arms 5 are simultaneously positioned on the wafer placing portion 2 and the aggregate block 3, the rotation of the rotating portion 4 is stopped. In this state, the rotating arm 5 located in the wafer mounting unit 2 picks up a semiconductor wafer, and the rotating arm 5 located in the collecting block 3 sorts the semiconductor wafer. When the pickup and sorting of the semiconductor wafer are completed, the rotating portion 4 is rotated in the same direction again. If the plurality of rotating arms 5 are simultaneously positioned on the wafer placing portion 2 and the collecting block 3, the rotation is stopped to perform picking and sorting, and the repetition is repeated. This process completes the classification process.

Therefore, the semiconductor wafer sorting apparatus 1 reduces the waste of work time while rotating and reciprocating, thereby realizing an efficient sorting process and shortening the work time required for the sorting process.

The rotating arm 5 receives the driving force from the rotary electric machine, rotates around the rotating shaft 41 of the rotating portion 4, and picks up the semiconductor wafer on the wafer mounting portion 2 to the collecting block. 3 Transfer and sorting, and a plurality of the above-described rotating arms 5 are provided so as to be simultaneously positioned on the wafer placing portion 2 and the collecting block 4.

If the plurality of rotating arms 5 are to be disposed at equal angles around the rotating shaft 41 and rotated at the same angle by the rotating portion 4, the wafer placing portion 2 and the aggregate block 3 are simultaneously positioned. On the top, two, four, six, eight, and twelve rotating arms 5 can be provided.

That is, in the case of the two rotating arms 5, the angle at which the respective rotating arms 5 are spaced is 180°, and the angle of rotation by the rotation portion 4 for each picking and sorting is 180°; in the four rotating arms 5 In this case, the angle at which the respective rotating arms 5 are spaced is 90°; in the case of the six rotating arms 5, the angle at which the respective rotating arms 5 are spaced is 60°; in the case of the eight rotating arms 5, the respective rotating arms 5 The angle of the interval is 45°; in the case of 12 rotating arms 5, the angle at which each of the rotating arms 5 is spaced is 30°.

Increasing the number of the above-described rotating arms 5 can shorten the time required for the sorting process, but the load applied to the rotating electrical machine is increased in proportion to the above, and therefore, it is necessary to consider the time required for the sorting process and apply to the rotating electrical machine. The appropriate number of rotating arms 5 are provided for the load, preferably by four, six, and eight rotating arms 5.

As described above, the conventional semiconductor wafer sorting apparatus operates as follows: the rotating arm picks up the semiconductor wafer, stops after the rotation, and sorts the semiconductor wafer, and picks up the other semiconductor wafer, stops after re-spinning; therefore, the process is as follows: for a semiconductor The wafer ends the picking and sorting of the rotating arm, in order to move to the position where the semiconductor wafer is picked up again, including two rotations and stops.

On the other hand, when the two rotating arms 5 are provided in the semiconductor wafer sorting apparatus 1 according to the present invention, the semiconductor wafer can be picked up by the one rotating arm 5 on the wafer mounting portion 2, and the other rotating arm 5 classifies the semiconductor wafer. Go to the above aggregate block 3. Therefore, picking and sorting can be performed simultaneously at each rotation and stop, so that the sorting process can be shortened as compared with the conventional semiconductor wafer sorting apparatus.

At this time, the two rotating arms 5 are preferably arranged to be spaced apart from each other by 180°, whereby the rotating portion 4 is stopped every 180°, and the time required for one picking and sorting of the semiconductor wafer is rotated by 180° by the rotating arm 5 described above. Time composition.

Further, in the case where four rotating arms 5 are provided, when the two rotating arms 5 perform picking and sorting and sorting of the semiconductor wafer, the other two rotating arms 5 are simultaneously positioned on the wafer placing portion 2 and the collecting block 3. Since the rotation of the semiconductor wafer is stopped and the semiconductor wafer is picked up and sorted, the sorting process can be further shortened as compared with the case where the two rotating arms 5 are provided.

At this time, preferably, the four rotating arms 5 are disposed to be apart from each other by 90°, whereby the rotating portion 4 is stopped every 90°, and the time required for one picking and sorting of the semiconductor wafer is rotated by 90° by the rotating arm 5 described above. Since the time is configured, the time required for the sorting process can be further shortened compared to the case where the two rotating arms 5 are provided.

Therefore, the more the number of the above-described rotating arms 5 is increased, the shorter the time required for the sorting process can be shortened. Therefore, it is preferable to set the appropriate number of rotating arms 5 in consideration of the time required for the sorting process and the load applied to the rotating electrical machine. .

Fig. 5 is a view showing, in an enlarged manner, a swivel arm of the present invention.

The specific structure of the above-described rotating arm 5 will be described with reference to Figs. 2, 4 and 5, and the rotating arm 5 includes a pickup 51 and a fixing block 52. Since the plurality of the above-described rotating arms 5 have the same structure, the description of the structure of one rotating arm 5 is used instead of the description of the other rotating arms 5.

The pickup 51 picks up a semiconductor wafer on the wafer mounting unit 2, and causes the semiconductor wafer to fall off onto the aggregate block 3 for sorting.

The number of the pickups 51 is the same as the number of the above-described rotating arms 5, and each of the pickups 51 moves up and down on the above-described rotating arm 5, thereby picking up or dropping the semiconductor wafer to perform a sorting process, which includes the pickup body 511. The moving block 512, the buffer 513, the elastic member 514, and the signal generating unit 515.

Here, the reason why the plurality of the above-described pickups 51 are configured to move up and down separately from each other will be briefly described. The semiconductor wafer sorting apparatus 1 described above has various setting specifications according to different needs of users. Therefore, the distance between the pickup 51 and the wafer mounting portion 2 and the pickup 51 and the aggregate block 3 is different, and each of the above-described wafer placement portions 2 is placed in accordance with the manufacturing process that the wafer passes. The distance between the wafers and the pickup 51 is also different.

Therefore, if the two pickers 51 located at the wafer placing portion 2 and the lumping block 3 simultaneously operate and move the same distance, although the pickup 51 provided in the wafer mounting portion 2 picks up the semiconductor wafer, the generation cannot be performed. In the case where the stable sorting step is performed, the pickup 51 located in the aggregate block 3 is detached from the semiconductor wafer in a state of being separated by a predetermined distance, or the semiconductor wafer is excessively pressed against the aggregate block 3 to cause damage or the like.

Thus, in order to achieve a more stable sorting process, the picker 51 on the side of the wafer mounting portion 2 and the picker 51 on the side of the collecting block 3 are moved up and down at different distances so as not to damage the semiconductor wafer. Therefore, a plurality of the above-described pickups 51 are moved up and down at different distances to pick up and peel off the semiconductor wafer, thereby performing classification.

The pickup main body 511 is in direct contact with the semiconductor wafer, picks up and detaches the semiconductor wafer, performs a sorting process, and is coupled to the moving block 512 so as to be movable up and down.

In order to pick up the semiconductor wafer, when the pickup 51 moves downward, the pickup main body 511 moves downward together to come into contact with the semiconductor wafer. At this time, the pickup main body 511 is moved upward by pressure, thereby preventing the semiconductor from being removed. Damage to the wafer.

In order to detach the semiconductor wafer for classification, when the pickup 51 moves downward, the pickup main body 511 moves downward together, and the semiconductor wafer is in contact with the sump 3, and at this time, the pickup main body 511 is subjected to pressure. The upper side is moved to prevent damage of the semiconductor wafer.

The pickup main body 511 is vertically moved up and down in each of the pickups 51, whereby a stable sorting process is performed without damaging the semiconductor wafer, and a stable sorting process can be performed on the semiconductor wafer which has not been subjected to the encapsulation process.

The moving block 512 and the pickup main body 511 are movably coupled, and are coupled to the fixed block 52 so as to be movable up and down, so that the pickup 51 and the pickup main body 511 are moved up and down, respectively.

In the above relationship of the moving block 512 and the fixed block 52, preferably, the moving block 512 includes a linear guiding block, and the fixed block 52 includes a linear guide rail corresponding thereto. In the above relationship of the moving block 512 and the pickup body 511, preferably, the moving block 512 includes a linear guide rail, and the pickup body 511 includes a linear guide block.

The linear guide block and the linear guide rail may also be arranged oppositely, that is, the moving block 512 includes a linear guide rail, and the fixed block 52 includes a linear guide block. In addition, the moving block 512 includes a linear guiding block, and the picker body 511 includes a linear guiding rail, but is not limited thereto. It should be understood by those skilled in the art that, for example, a sliding block and a guiding groove can be used to make the moving block and the fixed block move relative to each other. The moving block and the pickup main system can be Move relative to each other.

The buffer member 513 is disposed between the pickup main body 511 and the moving block 512, and buffers the pressure applied to the semiconductor wafer when the pickup main body 511 picks up and peels off the semiconductor wafer for sorting, thereby assisting in preventing damage of the semiconductor wafer. .

The cushioning member 513 is housed inside the pickup main body 511, and is supported by the pickup main body 511 on one side and supported by the moving block 512 on the other side.

In the wafer mounting portion 2, the buffer member 513 is compressed when the pickup main body 511 comes into contact with the semiconductor wafer, and is restored after picking up; on the aggregate block 3, when the semiconductor wafer is in contact with the aggregate block 3, the buffer is provided. The piece 513 is compressed and restored after being detached for classification. Preferably, the cushioning member 513 is a spring.

The elastic member 514 is elastically coupled to the moving block 512 and the fixed block 52. When the pickup 51 moves up and down in order to perform picking or detaching classification of the semiconductor wafer, if the pressure is applied to the pickup 51, the elastic member 514 is The pickup 51 is moved to extend, and when the pressure is removed, the elastic member 514 is compressed, and the pickup 51 is returned to the original position. Preferably, the elastic member 514 is a spring.

The signal generation unit 515 detects the moving distance at which the pickup 51 can stably pick up, detach, and separate the semiconductor wafer. The signal generating unit 515 includes a first contact portion 5151 attached to the pickup body 511 and a second contact portion 5152 attached to the moving block 512, and moves the pickup main body 511 to make the first contact portion 5151 and the When the two contact portions 5152 have a space, an electrical signal is generated to detect a stable moving distance of the pickup 51.

The first contact portion 5151 and the second contact portion 5152 can be spaced apart because the moving direction of the pickup body 511 is opposite to the moving direction of the moving block 512. If the pickup body 511 is in contact with the semiconductor wafer in the wafer mounting portion 2, or the pickup body 511 is in contact with and moved with the semiconductor wafer in the aggregate block 3, the first contact 5151 and the second contact portion 5152. The signal generating unit 515 generates an electrical signal at this instant, and detects that the pickup 51 can perform the moving distance of picking and sorting without damaging the semiconductor wafer, so that a more stable sorting process can be realized.

One side of the fixing block 52 is coupled and fixed to the rotating portion 4, and the other side is coupled so that the pickup 51 can be moved up and down. The fixing block 52 is elastically coupled by the elastic member 514 and the moving block 512.

As described above, it is desirable that in the above relationship between the fixed block 52 and the above-described moving block 512, the moving block 512 includes a linear guiding block, and correspondingly, the fixed block 52 includes a linear guide rail. The linear guide block and the linear guide rail may also be respectively disposed on the fixed block 52 and the moving block 512, so that the fixed block 52 and the moving block 512 can move relative to each other. Of course, it is obvious to those skilled in the art that a structure such as a slider and a guide groove can be utilized to move the fixed block 52 and the moving block 512 relative to each other.

As shown in FIGS. 2 and 4, the plurality of driving units 6 vertically move the pickups 51 located on the wafer placing unit 2 and the collecting block 3 among the plurality of pickups 51, respectively.

The drive unit 6 includes a pressure applying unit 61 and a control unit.

The pressing portion 61 applies pressure to the moving block 512 to move the pickup 51 up and down.

The pressing portion 61 applies pressure to the moving block 512 of the pickup 51 located at the wafer mounting portion 2, so that the pickup main body 511 picks up the semiconductor wafer, and after the pickup main body 511 picks up the semiconductor wafer, the pressure is removed, so that the pickup is performed. The device 51 returns to its original position.

The pressing portion 61 applies pressure to the moving block 512 of the pickup 51 located on the collecting block 3, causes the pickup main body 511 to detach the semiconductor wafer for sorting, and removes the pressure after the semiconductor main wafer is detached from the pickup main body 511. The pickup 51 is returned to the original position.

The pressing portion 61 moves the pickups 51 located at the wafer placing portion 2 and the aggregate block 3 up and down, respectively.

The pressing portion 61 may be constituted by an eccentric cam that rotates around the rotation axis thereof and applies pressure to the moving block 512 to move at a distance corresponding to the eccentric distance. The distance that the pickup 51 moves for picking and sorting can be controlled by the rotation angle of the eccentric cam described above.

At this time, in order to control the rotation angle of the pressing portion 61, a control portion (not shown) may be provided.

The control unit receives the electrical signal generated by the signal generating unit 515, controls each moving distance based on the received electrical signal, and calculates a rotation angle of the eccentric cam corresponding to the moving distance so that the pickup 51 is stabilized without damaging the semiconductor wafer. The semiconductor wafers are picked up and dropped for sorting.

The control unit can control the pressing portion 61 on the side of the wafer mounting portion 2 and the pressing portion 61 on the side of the collecting block 3, respectively. The control unit controls the pressing portion 61 so that the pressing portion 61 corresponds to the rotation angle corresponding to the moving distance of the pickup 51 located at the wafer mounting portion 2 and the moving distance of the pickup 51 located at the collecting block 3. The rotation angle is rotated.

Further, the control unit is configured to calculate an appropriate rotation angle of each of the pressing portions 61 on the wafer mounting portion 2 side and the collecting block 3 side, and is preferably set in accordance with the installation specifications of the semiconductor wafer sorting device 1. After that, it is only implemented at the time of initial picking and sorting. This is because, as long as the setting specifications are not changed, the control may be performed at the same rotation angle as the initially calculated rotation angle.

Fig. 6 is a view showing a state in which the third video camera of the present invention is provided in Fig. 3;

As shown in FIGS. 2 and 6, the third video camera 7 is provided on a path in which the semiconductor wafer picked up by the wafer mounting unit 2 is transferred to the aggregate block 3.

The third video camera 7 described above is disposed on the lower side of the pickup main body 511 to confirm the pickup state and damage of the semiconductor wafer during the transfer of the semiconductor wafer, and to confirm the semiconductor wafer picked up by the pickup main body 511.

When the semiconductor wafer is damaged during the pickup process, the third video camera 7 confirms the damage of the semiconductor wafer during the transfer process, and prevents the damaged semiconductor wafer from being arranged on the aggregate block 3. Further, in the process of transferring the semiconductor wafer, when the pickup state of the semiconductor wafer is changed, the third video camera 7 moves the aggregate block 3 in accordance with the changed state so that the semiconductor wafers are sorted in a certain arrangement state.

The third video camera 7 is preferably disposed at 90 degrees with respect to the wafer mounting portion 2 and the aggregate block 3, respectively, between the opposite wafer mounting portion 2 and the sump 3.

In this manner, each time the rotating arm 5 stops rotating, the rotating arm 5 which can be simultaneously positioned at the wafer mounting portion 2, the aggregate block 3, and the third video camera 7 can be interchanged according to the user's setting specifications.

Therefore, when the third video camera 7 is installed at the position as described above, it is possible to interchangeably use the four rotating arms 5 that stop rotating every 90 degrees, and the eight rotating arms 5 that stop rotating every 45 degrees, every other time. A rotating arm 5 composed of a plurality of four, such as 12 rotating arms 5 that stop rotating at 30°.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the operational relationship of the semiconductor wafer sorting apparatus of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIGS. 2 to 6, when the wafer on which the detection is completed is placed on the wafer mounting portion 2, the rotating portion 4 is rotated by the driving force supplied from the driving motor. At this time, the rotating arm 5 rotates together, and when the plurality of rotating arms 5 are simultaneously positioned on the wafer mounting portion 2 and the aggregate block 3, the rotating arm 5 is stopped by the rotating portion 4.

When the rotating arm 5 is stopped, the pressing portion 61 applies pressure to the moving block 512 of the pickup 51 in the rotating arm 5 located on the side of the wafer mounting portion 2, and accordingly, the pickup 51 is placed toward the wafer. The wafer of the portion 2 moves downward, and the pickup main body 511 moves downward together.

When the pickup main body 511 moving downward is in contact with the semiconductor wafer, the pickup main body 511 is moved upward by the pressure to eliminate the pressure applied by the pressing portion 61, and the pickup 51 and the pickup main body 511 are returned. Go to the original location and pick up the semiconductor wafer.

In the rotating arm 5 on the side of the collecting block 3, the pressing portion 61 applies pressure to the moving block 512 of the pickup 51, and accordingly, the pickup 51 faces the collecting block 3 corresponding to the level of the semiconductor wafer to be picked up. Moving downward, the pickup main body 511 moves downward together.

When the semiconductor wafer picked up by the pickup main body 511 comes into contact with the aggregate block 3, the pickup main body 511 moves upward by pressure to eliminate the pressure applied by the pressing portion, and the pickup 51 and the pickup main body 511 returns to the original position, and the semiconductor wafer is peeled off for classification.

Thus, when the operation of picking up the semiconductor wafer by the rotating arm 5 on the side of the wafer mounting portion 2 and the operation of sorting the semiconductor wafer on the side of the collecting block 3 by the picked up semiconductor wafer are completed, the rotating portion 4 is The rotating motor obtains the driving force to re-rotate.

Here, when the rotating arm 5 that picks up the semiconductor wafer is located on the upper side of the third video camera 7, the above-described rotating portion 4 stops rotating, so that the third video camera 7 confirms the pickup state of the semiconductor wafer and the re-rotation after the damage.

On the other hand, the above-described rotating arm 5 is provided in multiples of four, and preferably, when four rotating arms 5 constitute 90°, when the rotating arm 5 that picks up the semiconductor wafer is located on the side of the third video camera 7, the other two The rotating arms 5 are respectively located on the wafer mounting portion 2 and the collecting block 3, and perform picking and sorting of the semiconductor wafer.

Therefore, the above-described rotating portion 4 is repeatedly rotated and stopped every 90 degrees, and the rotating arm 5 on the wafer mounting portion 2 side picks up the semiconductor wafer at the time of one rotation and stop, and the rotating arm 5 located on the collecting block 3 side picks up the semiconductor. The wafers are sorted by gradation, and the rotating arm 5 on the side of the third video camera 7 confirms the pick-up state and damage of the semiconductor wafer by the third video camera 7, thereby enabling an effective sorting process and shortening the sorting process. Time required.

The invention described above is not limited to the above-described embodiments and the drawings, and various substitutions, modifications, and adjustments may be made without departing from the spirit and scope of the invention.

The present invention can achieve the following effects by the structure, the embodiment, and the operational relationship described above.

According to the present invention, a plurality of rotating arms that move up and down respectively are provided on one rotating portion, and the effect of shortening the working time required for the sorting process, shortening the length of the rotating arm, and reducing the load applied to the rotating electrical machine are continued. It is also possible to perform precise control during use, and it is possible to improve the efficiency of the sorting process of the semiconductor wafer.

The present invention reduces vibration generated at the time of high-speed rotation and sudden stop of the rotating arm, and has an effect of preventing the semiconductor wafer to be picked up from being arbitrarily twisted or peeled off, and sorting in a certain arrangement state without damaging the semiconductor wafer. The change of the semiconductor wafer generated during the picking up and transfer of the semiconductor wafer is confirmed before sorting, and the accuracy of the sorting process can be improved.

In view of the above, the present invention has been disclosed in a preferred embodiment, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

1. . . Semiconductor wafer sorting device

11. . . main body

12. . . Support frame

2, 300. . . Wafer placement

21, 240. . . First video camera

twenty two. . . First moving department

3,200. . . Aggregate block

31, 301. . . Second video camera

32. . . Second moving part

4. . . Rotating part

41. . . Rotary axis

5,400. . . Rotating arm

51, 401. . . Picker

511. . . Picker body

512. . . Moving block

513. . . Buffer

514. . . Elastic part

515. . . Signal generation unit

5151. . . First contact

5152. . . Second contact

52. . . Fixed block

6. . . Drive department

61. . . Pressure department

7. . . Third video camera

410. . . Rotary motor

A. . . Arrow pre

1 is a perspective view of a conventional semiconductor wafer sorting apparatus; FIG. 2 is a perspective view of a semiconductor wafer sorting apparatus according to the present invention; FIG. 3 is an enlarged view of a part of the semiconductor wafer sorting apparatus according to the present invention; 5 is a view showing a rotating arm, a driving portion, and a rotating portion of the present invention; FIG. 5 is an enlarged view showing a rotating arm of the present invention; and FIG. 6 is a view showing a state in which the third video camera of the present invention is provided in FIG.

1. . . Semiconductor wafer sorting device

11. . . main body

12. . . Support frame

2. . . Wafer placement

twenty one. . . First video camera

twenty two. . . First moving department

3. . . Aggregate block

31. . . Second video camera

32. . . Second moving part

5. . . Rotating arm

A. . . arrow

Claims (13)

A semiconductor wafer sorting apparatus comprising: a plurality of rotating arms simultaneously located on a wafer mounting portion and a collecting block; a plurality of pickers respectively coupled to the plurality of rotating arms up and down, the plurality of pickers Picking up a semiconductor wafer at a wafer mounting portion, transferring the picked semiconductor wafer to a corresponding level of the aggregate block for sorting; and rotating the portion to rotate the plurality of rotating arms in one direction by a driving force provided by the rotating electrical machine; a plurality of driving portions for moving the plurality of pickers up and down, one of the driving portions respectively corresponding to one of the picking devices, so that the picking device located above the wafer mounting portion and the collecting block are located The upper pickers move up and down respectively. The semiconductor wafer sorting apparatus according to claim 1, wherein the wafer placing portion and the aggregate block are disposed to face each other. The semiconductor wafer sorting apparatus of claim 1, wherein the plurality of rotating arms comprise a plurality of fixed blocks that are movable up and down in combination with the plurality of pickers, each of the plurality of pickers comprising: a picker body, Directly contacting the semiconductor wafer; and moving the block, the pickup body is coupled to the moving block in a vertically movable manner, and the moving block is coupled to the one of the plurality of fixed blocks in a vertically movable manner; wherein The pickup main body is movable up and down on each of the plurality of the above pickups. The semiconductor wafer sorting apparatus according to claim 3, wherein each of the plurality of pickers has a buffer member that buffers a pressure applied to the semiconductor element by the pickup main body. The semiconductor wafer sorting apparatus according to claim 3, wherein each of the plurality of driving units has a pressing portion that applies pressure to the moving block to move the picking device up and down, and each of the plurality of pickers has a connection Moving the block and the elastic members of each of the plurality of fixed blocks. The semiconductor wafer sorting apparatus according to claim 5, wherein the pressing portion is constituted by an eccentric cam, and the eccentric cam rotates about a rotation axis thereof to move the moving block by a distance corresponding to an eccentric distance. The semiconductor wafer sorting apparatus according to claim 6, wherein the pickup includes a signal generating portion having a first contact portion mounted on the pickup body and a first surface mounted on the moving block a second contact portion; wherein the signal generating portion generates an electrical signal when the pickup body is moved to separate the first contact portion and the second contact portion; wherein the driving portion includes receiving power from the signal generating portion The control unit that controls the rotation angle of the pressing portion by the sexual signal. The semiconductor wafer sorting apparatus according to claim 1, wherein the wafer mounting portion includes: a first video camera that confirms an arrangement state of a semiconductor wafer attached to the wafer; The first moving portion moves the wafer placing portion to ensure that the longitudinal direction, the width direction, and the oblique direction of the semiconductor wafer conform to a predetermined direction, and the semiconductor wafer is picked up in a predetermined arrangement state. The semiconductor wafer sorting apparatus according to claim 1, wherein the aggregate block includes: a second video camera that confirms an arrangement state in which the semiconductor wafers are classified according to a level; and a second moving portion that moves the aggregate block In order to ensure that the length direction, the width direction, and the oblique direction of the semiconductor wafer conform to a predetermined direction, the semiconductor wafers are sorted in a predetermined arrangement state. The semiconductor wafer sorting apparatus according to claim 1, wherein the semiconductor wafer sorting apparatus further includes: a third video camera disposed to transfer the picked semiconductor wafer from the wafer mounting portion to the aggregate block On the path. The semiconductor wafer sorting apparatus according to claim 10, wherein the plurality of rotating arm systems are disposed at the same angle from each other so as to be simultaneously located on the wafer placing portion, the aggregate block, and the third video camera. . The semiconductor wafer sorting apparatus according to any one of claims 1 to 10, wherein the plurality of rotating arms are provided so as to be simultaneously positioned on the wafer placing portion and the aggregate block. The semiconductor wafer sorting apparatus according to any one of claims 1 to 10, wherein the rotating arm is provided at a plurality of the same angle so as to be located at the wafer mounting portion and the aggregate at the same time. Piece on.