TWI380384B - - Google Patents

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Publication number
TWI380384B
TWI380384B TW098107379A TW98107379A TWI380384B TW I380384 B TWI380384 B TW I380384B TW 098107379 A TW098107379 A TW 098107379A TW 98107379 A TW98107379 A TW 98107379A TW I380384 B TWI380384 B TW I380384B
Authority
TW
Taiwan
Prior art keywords
substrate
positioning
glue
liquid glue
liquid
Prior art date
Application number
TW098107379A
Other languages
English (en)
Chinese (zh)
Other versions
TW201034092A (en
Original Assignee
Univ Nat Chiao Tung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Chiao Tung filed Critical Univ Nat Chiao Tung
Priority to TW098107379A priority Critical patent/TW201034092A/zh
Publication of TW201034092A publication Critical patent/TW201034092A/zh
Application granted granted Critical
Publication of TWI380384B publication Critical patent/TWI380384B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Automatic Analysis And Handling Materials Therefor (AREA)
TW098107379A 2009-03-06 2009-03-06 Positioning and constant-amount mounting package method and structure TW201034092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW098107379A TW201034092A (en) 2009-03-06 2009-03-06 Positioning and constant-amount mounting package method and structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098107379A TW201034092A (en) 2009-03-06 2009-03-06 Positioning and constant-amount mounting package method and structure

Publications (2)

Publication Number Publication Date
TW201034092A TW201034092A (en) 2010-09-16
TWI380384B true TWI380384B (https=) 2012-12-21

Family

ID=44855401

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098107379A TW201034092A (en) 2009-03-06 2009-03-06 Positioning and constant-amount mounting package method and structure

Country Status (1)

Country Link
TW (1) TW201034092A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10629454B2 (en) 2017-11-08 2020-04-21 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325694B (zh) * 2012-03-21 2016-08-24 致伸科技股份有限公司 用于覆晶制程的点胶方法
US10217649B2 (en) 2017-06-09 2019-02-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package having an underfill barrier
CN110957992B (zh) * 2019-10-31 2022-08-16 厦门市三安集成电路有限公司 一种声表面波滤波器的封装结构及其制作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10629454B2 (en) 2017-11-08 2020-04-21 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
US11222792B2 (en) 2017-11-08 2022-01-11 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same

Also Published As

Publication number Publication date
TW201034092A (en) 2010-09-16

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