TW201034092A - Positioning and constant-amount mounting package method and structure - Google Patents

Positioning and constant-amount mounting package method and structure Download PDF

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Publication number
TW201034092A
TW201034092A TW098107379A TW98107379A TW201034092A TW 201034092 A TW201034092 A TW 201034092A TW 098107379 A TW098107379 A TW 098107379A TW 98107379 A TW98107379 A TW 98107379A TW 201034092 A TW201034092 A TW 201034092A
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TW
Taiwan
Prior art keywords
substrate
positioning
liquid
metal
glue
Prior art date
Application number
TW098107379A
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English (en)
Chinese (zh)
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TWI380384B (https=
Inventor
jun-cheng Qiu
Guan-Zhou Hou
jun-ying Lin
zhi-wei Zhang
Original Assignee
Univ Nat Chiao Tung
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Publication date
Application filed by Univ Nat Chiao Tung filed Critical Univ Nat Chiao Tung
Priority to TW098107379A priority Critical patent/TW201034092A/zh
Publication of TW201034092A publication Critical patent/TW201034092A/zh
Application granted granted Critical
Publication of TWI380384B publication Critical patent/TWI380384B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

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  • Automatic Analysis And Handling Materials Therefor (AREA)
TW098107379A 2009-03-06 2009-03-06 Positioning and constant-amount mounting package method and structure TW201034092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW098107379A TW201034092A (en) 2009-03-06 2009-03-06 Positioning and constant-amount mounting package method and structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098107379A TW201034092A (en) 2009-03-06 2009-03-06 Positioning and constant-amount mounting package method and structure

Publications (2)

Publication Number Publication Date
TW201034092A true TW201034092A (en) 2010-09-16
TWI380384B TWI380384B (https=) 2012-12-21

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ID=44855401

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098107379A TW201034092A (en) 2009-03-06 2009-03-06 Positioning and constant-amount mounting package method and structure

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TW (1) TW201034092A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325694A (zh) * 2012-03-21 2013-09-25 致伸科技股份有限公司 用于覆晶制程的点胶方法
US10217649B2 (en) 2017-06-09 2019-02-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package having an underfill barrier
CN110957992A (zh) * 2019-10-31 2020-04-03 厦门市三安集成电路有限公司 一种声表面波滤波器的封装结构及其制作方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10629454B2 (en) 2017-11-08 2020-04-21 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325694A (zh) * 2012-03-21 2013-09-25 致伸科技股份有限公司 用于覆晶制程的点胶方法
CN103325694B (zh) * 2012-03-21 2016-08-24 致伸科技股份有限公司 用于覆晶制程的点胶方法
US10217649B2 (en) 2017-06-09 2019-02-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package having an underfill barrier
CN110957992A (zh) * 2019-10-31 2020-04-03 厦门市三安集成电路有限公司 一种声表面波滤波器的封装结构及其制作方法
CN110957992B (zh) * 2019-10-31 2022-08-16 厦门市三安集成电路有限公司 一种声表面波滤波器的封装结构及其制作方法

Also Published As

Publication number Publication date
TWI380384B (https=) 2012-12-21

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